WO2005102871A3 - Wafer container with sealable door - Google Patents

Wafer container with sealable door Download PDF

Info

Publication number
WO2005102871A3
WO2005102871A3 PCT/US2005/013166 US2005013166W WO2005102871A3 WO 2005102871 A3 WO2005102871 A3 WO 2005102871A3 US 2005013166 W US2005013166 W US 2005013166W WO 2005102871 A3 WO2005102871 A3 WO 2005102871A3
Authority
WO
WIPO (PCT)
Prior art keywords
door
seal
head
sealing surface
bridging portion
Prior art date
Application number
PCT/US2005/013166
Other languages
French (fr)
Other versions
WO2005102871A2 (en
Inventor
Anthony Mathius Tieben
John Lystad
Original Assignee
Entegris Inc
Anthony Mathius Tieben
John Lystad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/108,349 external-priority patent/US7578407B2/en
Application filed by Entegris Inc, Anthony Mathius Tieben, John Lystad filed Critical Entegris Inc
Priority to JP2007508628A priority Critical patent/JP4896007B2/en
Priority to EP05736957A priority patent/EP1737762A2/en
Priority to CN2005800198331A priority patent/CN101432202B/en
Publication of WO2005102871A2 publication Critical patent/WO2005102871A2/en
Publication of WO2005102871A3 publication Critical patent/WO2005102871A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Abstract

A wafer container (20) including an enclosure portion (22) with a door frame defining an opening for insertion and removal of wafers and a door (24) finable in the door frame to seal the enclosure portion. A continuous elastomeric seal (94) extends around the door inward of the periphery. The seal is positioned on a sealing surface proximate the perimeter of the door and may be partially inset in a radial groove (92) in the door. In cross-section, the elastomeric seal has an inset portion (96) and a sealing head (97) coupled by a bridging portion (98). The sealing head has a foot portion (108) projecting from the bridging portion toward the sealing surface of the door, and a head portion (106) extending in a direction generally opposite the foot relative to the bridging portion. The door frame has a seal engaging structure so that when the door is seated in the door frame, the bridging portion of the elastomeric seal contacts the seal engaging structure (112) displacing the bridging portion axiaily toward the sealing surface and causing the head of the sealing head to rotate radially and contact the seal engaging structure (118). The displacement action also affirmatively sets the foot of the sealing head in contact with the sealing surface of the door (58).
PCT/US2005/013166 2004-04-18 2005-04-18 Wafer container with sealable door WO2005102871A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007508628A JP4896007B2 (en) 2004-04-18 2005-04-18 Wafer container with sealable door
EP05736957A EP1737762A2 (en) 2004-04-18 2005-04-18 Wafer container with sealable door
CN2005800198331A CN101432202B (en) 2004-04-18 2005-04-18 Wafer container with sealable door

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56352904P 2004-04-18 2004-04-18
US60/563,529 2004-04-18
US11/108,349 2005-04-17
US11/108,349 US7578407B2 (en) 2004-04-18 2005-04-17 Wafer container with sealable door

Publications (2)

Publication Number Publication Date
WO2005102871A2 WO2005102871A2 (en) 2005-11-03
WO2005102871A3 true WO2005102871A3 (en) 2008-10-02

Family

ID=35197528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/013166 WO2005102871A2 (en) 2004-04-18 2005-04-18 Wafer container with sealable door

Country Status (5)

Country Link
EP (1) EP1737762A2 (en)
JP (1) JP4896007B2 (en)
KR (1) KR20070011518A (en)
CN (1) CN101432202B (en)
WO (1) WO2005102871A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953690B2 (en) * 2006-05-18 2012-06-13 信越ポリマー株式会社 Storage container
JP5184198B2 (en) * 2008-05-01 2013-04-17 信越ポリマー株式会社 Substrate storage container
KR20150013654A (en) 2012-05-04 2015-02-05 인티그리스, 인코포레이티드 Wafer container with door interface seal
CN104900568B (en) * 2014-03-05 2018-05-04 耀连科技有限公司 The closed structure of isolated carrier box
WO2016205341A1 (en) * 2015-06-15 2016-12-22 Entegris, Inc. Aseptic pods and load ports
CN107275273B (en) * 2017-06-23 2021-02-26 安徽熙泰智能科技有限公司 Closed wafer box capable of isolating water and oxygen
WO2024029016A1 (en) * 2022-08-04 2024-02-08 ミライアル株式会社 Substrate storage container and lid thereof
CN116825689A (en) * 2023-08-29 2023-09-29 芯岛新材料(浙江)有限公司 Lid and have its wafer box

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020195455A1 (en) * 2001-06-08 2002-12-26 Shin-Etsu Polymer Co., Ltd. Sealing element, hemetic container and sealing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451058A (en) * 1987-08-24 1989-02-27 Gokou Kosan Kk Preparation of devil's tongue jelly steak
JPH0374610A (en) * 1989-04-03 1991-03-29 Sumikura Ind Co Ltd Booster type action direction conversion two-stage operating cylinder
JPH0519283Y2 (en) * 1989-11-21 1993-05-21
US6354601B1 (en) * 1999-01-06 2002-03-12 Fluoroware, Inc. Seal for wafer containers
JP3556185B2 (en) * 2000-06-13 2004-08-18 信越ポリマー株式会社 Seal member, sealed container and sealing method thereof
JP4524971B2 (en) * 2001-08-10 2010-08-18 信越半導体株式会社 Semiconductor substrate storage box, semiconductor substrate manufacturing method
JP3910397B2 (en) * 2001-10-12 2007-04-25 信越ポリマー株式会社 Gasket member for substrate storage container and substrate storage container using the same
EP1453741A1 (en) * 2001-11-14 2004-09-08 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020195455A1 (en) * 2001-06-08 2002-12-26 Shin-Etsu Polymer Co., Ltd. Sealing element, hemetic container and sealing method thereof

Also Published As

Publication number Publication date
JP2008500238A (en) 2008-01-10
KR20070011518A (en) 2007-01-24
WO2005102871A2 (en) 2005-11-03
CN101432202A (en) 2009-05-13
EP1737762A2 (en) 2007-01-03
CN101432202B (en) 2011-12-07
JP4896007B2 (en) 2012-03-14

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