WO2005079125A1 - Carte de circuits imprimes - Google Patents

Carte de circuits imprimes Download PDF

Info

Publication number
WO2005079125A1
WO2005079125A1 PCT/DE2005/000224 DE2005000224W WO2005079125A1 WO 2005079125 A1 WO2005079125 A1 WO 2005079125A1 DE 2005000224 W DE2005000224 W DE 2005000224W WO 2005079125 A1 WO2005079125 A1 WO 2005079125A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
section
module
contacting
Prior art date
Application number
PCT/DE2005/000224
Other languages
German (de)
English (en)
Inventor
Ralf Leipoldt
Jörg Romahn
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2005079125A1 publication Critical patent/WO2005079125A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present invention relates to a printed circuit board with a conductor track structure which is prepared for being equipped with a radio unit or has already been equipped with corresponding electrical and / or electronic components.
  • Printed circuit boards of this type are available, for example, in commercially available GSM telecommunication terminals.
  • circuit board It is increasingly desirable to combine such a circuit board with a further circuit board via an interface or a plug.
  • This task arises, for example, when adapting smaller subassemblies to a larger motherboard.
  • Sub-assemblies are independent functional electronic assemblies that are also built on a circuit board.
  • a so-called motherboard is the circuit board on which the basic functionality of an application is implemented by an electronic circuit.
  • This technology is used when integrating third-party technologies, e.g. a module with a special radio standard, on a circuit board, which realizes the basic functionality of the application.
  • An example is the integration of a GPS module on a GSM / GPRS module.
  • plug-in options for a so-called board-to-board connector (B2B connector), a so-called zero insertion force connector (ZIF connector), a post connector or another connector type can be provided.
  • B2B connector board-to-board connector
  • ZIF connector zero insertion force connector
  • post connector another connector type
  • the two circuit boards to be connected or the modules are contacted with one another by cut-through vias provided on the respective circuit board edges.
  • metallized surface of the via can be used as a contact surface.
  • ball grids A ball grid is understood to be an array of contact points, each contact point being designed as a spherical metallic contact. For example, this is a spherical plumb point.
  • the two printed circuit boards to be connected must have an essentially equal area.
  • This object is achieved by a printed circuit board according to the invention.
  • Advantageous embodiments are set out in the corresponding subclaims.
  • a printed circuit board is provided with a base area, which is equipped with electrical and / or electronic components in a first section and has a contact area for contacting a further printed circuit board in a second section adjoining the first section.
  • the base area is preferably rectangular.
  • the first and the second section are arranged next to one another and are self-contained relative to the other section. This means that the first section does not surround the second section, for example, or vice versa.
  • the first section and the second section preferably each have at least one recess for fastening the printed circuit board to a printed circuit board holding device.
  • the recesses are provided in the respective sections in such a way that they are preferably arranged diagonally to one another, which results in a good and stable mechanical fastening possibility.
  • the recesses are preferably designed in the form of fastening holes.
  • the printed circuit board has a plug-in device for connection to an external electrical device.
  • This plug-in device for connecting an external interface can both on the top and on be arranged on the underside of the circuit board.
  • the upper side is to be understood as the side on which the further printed circuit board is arranged for contacting the contacting region of the second section of the printed circuit board.
  • the printed circuit board is part of a mobile radio module with a mobile radio device or it itself forms such a module.
  • the circuit board according to the invention in the function of such a module is to be referred to as a basic module.
  • Another printed circuit board that can be contacted with the printed circuit board according to the invention will be referred to below as a submodule.
  • the printed circuit board is designed as a GSM module.
  • the contacting area for contacting a further circuit board is designed such that the further circuit board can be part of a GPS, Bluetooth, WLAN or infrared module or itself forms one of these modules.
  • the base module such as a GSM module
  • the technologies can be GPS, Bluetooth, WLAN (Wireless Local Access Network) or infrared.
  • the geometric and electrical design of the contacts is preferably the same.
  • the embodiment of the two opposing contacts (submodule and base module) can be adapted to the specific electrical, thermal, geometric requirements.
  • the high-frequency interface for example antenna interface, may be mentioned as an example. It is advantageously specifically designed so that it corresponds to a standardized 50 ohm environment. According to the prior art, this is realized by a specific geometry of the conductor tracks or printed circuit board.
  • ground connection and thermal contacting Another example is ground connection and thermal contacting.
  • the embodiment is designed in such a way that electrical or thermal contacting that is as loss-free as possible is made possible. This is e.g. achieved through extensive contacting.
  • the base module or the motherboard can therefore, in the case of a selected basic functionality with a specific assembly, form different variants by combining with different submodules without the base module as a whole having to be newly developed. The desired technology is then only adjusted on the submodule.
  • the contacting area has one or more recesses for contacting a further printed circuit board.
  • the provision of such recesses makes it possible for the further printed circuit board or the submodule which is to be contacted with the printed circuit board or the base module to be equipped on both sides, preferably on the underside, that is to say on who the
  • a system consisting of a first printed circuit board according to the invention and a second printed circuit board, the second printed circuit board being contacted with the first printed circuit board via the contact area.
  • the first circuit board is part of a GSM module or it itself forms a GSM module, hereinafter referred to as the basic module, and the second circuit board is part of a GPS, Bluetooth, WLAN or infrared Module or forms one of these modules, hereinafter referred to as a submodule.
  • the second printed circuit board or the submodule is preferably equipped on both sides with electrical and / or electronic components and the contact area of the first printed circuit board or the base module has one or more recesses, so that the components that are connected to the Contacting area of the first printed circuit board or the base module-facing side of the second printed circuit board or sub-module are arranged, through which one or more recesses are received.
  • the height of such components is preferably not or insignificantly higher than the circuit board thickness of the first circuit board or of the base module plus the thickness of the soldering job required for contacting the two circuit boards.
  • the system is preferably flat on the side facing away from the second printed circuit board.
  • an interface to an external unit can be implemented both on the base module and on the submodule.
  • This can be an analog or a digital interface. Examples include an antenna interface and / or an interface to a digital bus. Furthermore, this interface can optionally be provided on the top or the bottom of the submodule or the base module.
  • a great advantage of the system according to the invention can be seen in the fact that such a basic module, for example a GSM module, can be combined in a simple manner with submodules of different technologies, such as GPS, Bluetooth, WLAN or infrared.
  • a basic module for example a GSM module
  • submodules of different technologies such as GPS, Bluetooth, WLAN or infrared.
  • Figure 1 Schematic representation of a top view of an embodiment of a circuit board according to the invention
  • FIG. 1 shows a plan view of a printed circuit board according to the invention or a so-called base module 20.
  • the printed circuit board 20 has a first section 21 and a second section 22.
  • the first section 21 is equipped with a number of components 23.
  • the first section 21 has a recess 24 for fastening the printed circuit board 20 to a printed circuit board holding device, not shown here. In the case shown here, this is a fastening hole.
  • the second section 22 has a rectangular recess 25. Contact points 26 are provided on the peripheral edge of the recess 25, via which contacting is possible with a corresponding second printed circuit board, not shown here, a submodule.
  • the contact points 26 can be round, rectangular, in series or offset.
  • the contact points of the submodule are arranged in the same geometry. Depending on the application, either all contact points are used for contacting the two modules or only a subset.
  • In the second section 22 there is also a further recess 27 for fastening the circuit board 20 to a circuit board holding device, not shown here.
  • the recess 27 is arranged diagonally to the recess 24, so that a solid, secure attachment can be realized.
  • FIG. 2 shows a side view of an embodiment of a system 10 according to the invention, consisting of a first circuit board or a base module 20 and a second circuit board or a submodule 30.
  • the base module 20 has a first section 21 and a second section 22.
  • the first section 21 is equipped with a number of components 23.
  • the second section 22 has a contact area.
  • a recess 25 is provided within this contacting area.
  • contact points 26 are arranged on the peripheral edge of the recess 25.
  • the base module 20 and the submodule 30 are contacted or combined with one another. The contact is made via the contact points 26, for example by soldering.
  • the submodule 30 is equipped with components 31 on both sides.
  • the height of these components is not or is only slightly greater than the thickness or thickness of the base module 20 plus the thickness of the soldering application, so that the underside of the base module 20 is essentially flat.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention vise à réaliser une carte de circuits imprimés (20) dont la mise en contact avec une autre plaquette (30) est simple, rapide et sûre, et à optimiser simultanément, notamment à minimiser l'encombrement de la combinaison ainsi réalisée de ces deux plaquettes. A cet effet, la surface d'une plaquette (20) a une première partie (21) dotée de composants électriques et/ou électroniques (23) et une deuxième partie (22) pourvue d'une zone de contact pour la mise en contact avec une autre carte de circuits imprimés (30).
PCT/DE2005/000224 2004-02-11 2005-02-04 Carte de circuits imprimes WO2005079125A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200420002332 DE202004002332U1 (de) 2004-02-11 2004-02-11 Leiterplatte
DE202004002332.6 2004-02-11

Publications (1)

Publication Number Publication Date
WO2005079125A1 true WO2005079125A1 (fr) 2005-08-25

Family

ID=32186268

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2005/000224 WO2005079125A1 (fr) 2004-02-11 2005-02-04 Carte de circuits imprimes

Country Status (2)

Country Link
DE (1) DE202004002332U1 (fr)
WO (1) WO2005079125A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045148A1 (de) * 2007-09-20 2009-04-09 Continental Automotive Gmbh Elektronisches Bauteil und Verfahren zur Integration einer Kommunikationseinheit
US12002795B2 (en) 2022-04-13 2024-06-04 Google Llc Pluggable CPU modules with vertical power

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058000B4 (de) * 2006-12-08 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Platinenanordnung
DE102007006462A1 (de) * 2007-02-05 2008-08-14 Siemens Ag Elektronische Schaltungsanordnung mit einer ersten und zweiten Leiterplatte
DE102011003377A1 (de) * 2011-01-31 2012-08-02 Zf Friedrichshafen Ag Leiterplattenanordnung
EP2627160A1 (fr) * 2012-02-08 2013-08-14 Harman Becker Automotive Systems GmbH Système de carte de circuit
FR2988976A1 (fr) * 2012-03-28 2013-10-04 Johnson Contr Automotive Elect Ensemble de cartes a circuits imprimes
DE102013212265A1 (de) * 2013-06-26 2014-12-31 Zf Friedrichshafen Ag Elektronische Einheit und Verfahren zur Herstellung einer elektronischen Einheit
WO2015109584A1 (fr) * 2014-01-26 2015-07-30 华为终端有限公司 Structure et terminal de carte principale
DE102020116621A1 (de) * 2020-06-24 2021-12-30 Bayerische Motoren Werke Aktiengesellschaft Telematikvorrichtung und kraftfahrzeug

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999025163A1 (fr) * 1997-11-10 1999-05-20 Caterpillar Inc. Ensemble de plaquettes de circuit modulaires et leur procede de production
DE19816794A1 (de) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Leiterplattenverbund
US6118347A (en) * 1998-01-30 2000-09-12 Mitsumi Electric Co., Ltd. Voltage controlled oscillator mounting assembly
EP1363259A1 (fr) * 2002-05-15 2003-11-19 R.J.M. Kuipers Holding B.V. Système de secours d'urgence
EP1377142A2 (fr) * 2002-06-20 2004-01-02 Nokia Corporation Procédé de fabrication automatique d'une unité électronique d'un système radio, unité électronique d'un système radio, et composant électronique utilisé dans sa fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999025163A1 (fr) * 1997-11-10 1999-05-20 Caterpillar Inc. Ensemble de plaquettes de circuit modulaires et leur procede de production
US6118347A (en) * 1998-01-30 2000-09-12 Mitsumi Electric Co., Ltd. Voltage controlled oscillator mounting assembly
DE19816794A1 (de) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Leiterplattenverbund
EP1363259A1 (fr) * 2002-05-15 2003-11-19 R.J.M. Kuipers Holding B.V. Système de secours d'urgence
EP1377142A2 (fr) * 2002-06-20 2004-01-02 Nokia Corporation Procédé de fabrication automatique d'une unité électronique d'un système radio, unité électronique d'un système radio, et composant électronique utilisé dans sa fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007045148A1 (de) * 2007-09-20 2009-04-09 Continental Automotive Gmbh Elektronisches Bauteil und Verfahren zur Integration einer Kommunikationseinheit
US12002795B2 (en) 2022-04-13 2024-06-04 Google Llc Pluggable CPU modules with vertical power

Also Published As

Publication number Publication date
DE202004002332U1 (de) 2004-04-22

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