WO2005053084A1 - 可変遅延線 - Google Patents
可変遅延線 Download PDFInfo
- Publication number
- WO2005053084A1 WO2005053084A1 PCT/JP2004/017015 JP2004017015W WO2005053084A1 WO 2005053084 A1 WO2005053084 A1 WO 2005053084A1 JP 2004017015 W JP2004017015 W JP 2004017015W WO 2005053084 A1 WO2005053084 A1 WO 2005053084A1
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- WO
- WIPO (PCT)
- Prior art keywords
- fixed
- line
- movable
- conductive line
- variable delay
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/04—Coupling devices of the waveguide type with variable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/184—Strip line phase-shifters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P9/00—Delay lines of the waveguide type
Definitions
- the present invention relates to a variable delay line, and more particularly, to an improvement of an electromagnetic variable delay line.
- variable delay lines built in measuring instruments and the like that are not single electronic components have a function that can adjust the delay time of an ultrahigh-frequency signal of 5 GHz to 10 GHz.
- it is commonly called a trombone configuration as shown in FIG.
- FIG. 7 simplifies a trombone-structured variable delay line built in a measuring instrument or the like so that the principle thereof can be easily divided, and approaches the configuration of the variable delay line of the present application described later. It is different from what is actually provided.
- the variable delay line having the trombone configuration shown in Fig. 7 has a lower dielectric layer 3 on one half in the longitudinal direction and another lower dielectric layer on the other half of the upper surface of the rectangular lower ground conductor 1. 5, a pair of conductive pipe-shaped fixed conductive lines 7, 9 are mounted on the lower dielectric layer 3 at intervals so as to extend in the longitudinal direction.
- the movable conductor 11 with the inner diameter of the fixed conductors 7, 9 added in a U-shape is inserted into the fixed conductors 7, 9 from the lower dielectric layer 5 side.
- the inner diameters of the leading ends of the paths 7 and 9 are made thinner to make contact with the movable conductive line 11, and the leading parts of the fixed conductive lines 7 and 9 are protruded so that the projecting movable conductive line 11 faces the lower dielectric layer 5. Puru.
- an upper dielectric layer 15 is formed on one half in the longitudinal direction, and another upper dielectric layer 17 is formed on the other half.
- the electric conductor layer 15 is superposed on the fixed conductive lines 7 and 9 so as to face the lower dielectric layer 3, and the upper dielectric layer 17 is superposed on the movable conductive line 11 and facing the lower dielectric layer 5.
- the upper ground conductor 13 and the upper dielectric layers 15 and 17 are shown floating above the fixed conductive lines 7 and 9 and the movable conductive line 11, but they are actually superimposed on them. I have.
- the rod-shaped movable conductive line 11 is formed slightly thinner than the pipe-shaped fixed conductive lines 7 and 9, and the lower dielectric layer 5 and the upper dielectric layer 17 are formed of the lower dielectric layer 3 and the upper dielectric layer. It is slightly thicker than 15 and has a higher dielectric constant. As a result, the characteristic impedances of the fixed conductive lines 7, 9 and the movable conductive line 11 match.
- variable delay line having such a principle, the fixed conductive lines 7 and 9 are sandwiched between the lower ground conductor 1 and the upper ground conductor 13 via the lower dielectrics 3 and 5 and the upper dielectric 15. Therefore, if the dielectric constants of the lower dielectrics 3 and 5 and the upper dielectrics 15 and 17 are appropriately selected, a strip line configuration having a characteristic impedance of 50 ⁇ is obtained. On the other hand, since the movable conductive line 11 is sandwiched between the lower ground conductor 1 and the upper ground conductor 13 via the lower dielectric 5 and the upper dielectric 17, a strip of 50 ⁇ equal to the characteristic impedance of the fixed conductive lines 7, 9 is used. It has a line configuration.
- variable delay line based on such a principle can be configured such that the movable conductive line 11 is slid into and out of the fixed conductive lines 7 and 9 by movable means (not shown) so that the fixed conductive lines 7, 9
- the length of the protruding movable conductive line 11 changes, and the delay time of the signal applied from the pulse signal source PG and output to the load RL changes.
- the solid line indicates the maximum delay time state
- the broken line indicates the minimum delay time state. Disclosure of the invention
- variable delay line of trombone configuration as shown in FIG. 7, example would be very expensive, since it is mounted on the apparatus to be incorporated into the rack also its size, a 100 cm 3 even as small It was expected to exceed this, and it could not be mounted together with general small electronic components on a printed circuit board.
- the present invention has been made to solve such a conventional problem, and it is possible to apply mass production technology of general electronic components, and to analyze a 5 GHz to 10 GHz ultra-high frequency pulse signal at high speed. It is an object of the present invention to provide an inexpensive and small variable delay line capable of adjusting the delay time with high performance. Means for solving the problem
- the present invention provides a dielectric layer on which a fixed-side ground conductor is formed, and a band-like pattern formed on the dielectric layer at regular intervals so as to face the fixed-side ground conductor.
- a first and a second fixed conductive line formed, and a strip-shaped movable conductive line formed in a U-shape, both open sides of which are in contact with the first and the second fixed conductive line.
- a movable conductive line supported so as to be slidable in the longitudinal direction of the first and second fixed conductive lines with the bent portion protruding.
- the movable conductor is formed so that the characteristic impedance of the portion protruding from the first and second fixed conductors matches that of the first and second fixed conductors.
- the first and second fixed conductive lines and the movable conductive line are formed in a concentric arc shape around a predetermined central portion, and the movable conductive line is formed around the central portion as an axis. Can be rotatably slidably supported.
- the fixed-side ground conductor is formed by forming the first and second fixed conductive lines at equal intervals in a strip shape on the dielectric layer on which the fixed-side ground conductor is formed.
- the open side of the U-shaped strip-shaped movable conductive line is brought into contact with the first and second fixed conductive lines so that the bent side thereof is projected, and the first and second fixed conductive lines are projected.
- the fixed conductor was slidably supported in the length direction, and the characteristic impedance of the first and second fixed conductors was adjusted to match those of the first and second fixed conductors.
- each component can be formed in a two-dimensional manner and can be assembled in a stacked manner, making it extremely easy to apply microfabrication technology and mass-production technology for general electronic components. A line is obtained.
- the first and second fixed conductive lines have a practical contact characteristic even when a fixed contact is protruded from the end of the side where the movable conductive line protrudes and is brought into contact with the movable conductive line. This makes it possible to use a printed circuit board that is inexpensive and suitable for mass production, and is cheaper and has good mass productivity.
- contact points are protruded from both open ends of the movable conductive line to form first and second fixed conductive lines. In the contact configuration, more practical delay line characteristics can be obtained.
- first and second fixed conductive lines and the movable conductive line are formed in a concentric arc shape around a predetermined central portion, and the movable conductive line is rotatably slidably supported around the central portion.
- the configuration using the movable conductive line having both open sides formed in a zigzag shape has an advantage that the change in the delay time can be increased by sliding the movable conductive line.
- variable delay line Accordingly, embodiments of a variable delay line according to the present invention will be described with reference to the drawings.
- FIG. 1 is a schematic perspective view showing an embodiment of a variable delay line according to the present invention.
- a fixed-side ground conductor 21 is formed on one entire surface (lower surface in the figure) of a thin rectangular dielectric layer 19 that also has a ceramic force.
- the first fixed conductive line 23, the second fixed conductive line 25, and the coplanar ground conductor 27 as a fixed-side ground conductor are formed.
- the first and second fixed conducting lines 23 and 25 are conducting lines having the same thickness as each other, and are formed in parallel from one short side of the dielectric layer 19 to the middle in the longitudinal direction. Dielectric layer 1
- the coplanar ground conductor 27 has a width from both long sides of the dielectric layer 19 to the vicinity of the first and second fixed conductor paths 23 and 25 and the first and second fixed conductor paths 23 and 25. A pair of conductors extending at the same length and an intermediate conductor extending at the same length at a small interval between the first and second fixed conductive lines 23 and 25 are formed.
- the coplanar ground conductor 27 is the first conductor.
- the second fixed conductive lines 23 and 25 have the same thickness and are grounded similarly to the fixed-side ground conductor 21.
- a movable conductive line 31 formed on a movable conductive substrate 29 abuts on the first and second fixed conductive lines 23 and 25. Is slidably supported in the longitudinal direction of the dielectric layer 19 by a support means (not shown).
- the movable conductive line substrate 29 is formed of a dielectric material, such as ceramic, having substantially the same width as the dielectric layer 19 and a shorter (substantially half) longitudinal dimension.
- the movable conductive line 31 has the same force as the first and second fixed conductive lines 23 and 25 and has a slightly narrower width, and the movable conductive line 31 has a width between the first and second fixed conductive lines 23 and 25.
- the movable conductor board 29 (not shown in FIG. 1) is formed on one surface (the lower surface in the figure) of a U-shape with both open sides expanding at intervals. As for the force, the movable conductive line 31 is electrically surface-contacted with both open sides overlapped from the direction in which the first and second fixed conductive lines 23 and 25 are not formed.
- a nut 33 is fixed to the end of the opposing surface (upper surface in the figure) of the movable conductive line board 29, and an adjusting screw 35 is screwed into the nut 33.
- the adjusting screw 35 is rotatably supported by a case member or the like, not shown, so as not to move in the length direction thereof.
- the movable conductive line substrate 29 is formed on the dielectric layer 19 in a state where the movable conductive line 31 is in surface contact with the first and second fixed conductive lines 23 and 25. It can slide linearly in the longitudinal direction. That is, the nut 33 and the adjusting screw 35 function as adjusting means 37 of the movable conductive line 31.
- the movable conductive line substrate 29 is movable through a gap for ensuring the sliding displacement.
- the side ground conductor 39 is supported in parallel with the movable conductive line 31 and the dielectric layer 19 by supporting means (not shown).
- the movable-side ground conductor 39 is shown separately from the movable conductive line 31 for easy viewing.
- the fixed-side ground conductor 21, the first and second fixed conducting lines 23 and 25, the coplanar ground conductor 27 of the dielectric layer 19, the movable conducting line 31 of the movable conducting board substrate 29, and the like are formed by the dielectric layers.
- the conductive film is formed by a conventionally known method such as a conductor film formed by sputtering on the substrate 19 or the movable conductive line substrate 29 and a thicker conductor formed by electrodeposition thereon.
- variable delay line having such a configuration, the materials and thicknesses of the dielectric layer 19 and the movable conductive line board 29, the fixed-side ground conductor 21, the first and second fixed conductive lines 23 and 25, The dimensions of the ground conductor 27 and the movable conductor 31, and the movable conductor 31 and the movable
- the first and second fixed conducting lines 23 and 25 can form a coplanar conducting line with a facing ground having a characteristic impedance of 50 ⁇
- the movable conducting line 31 can have a characteristic
- a strip line with an impedance of 50 ⁇ can be configured.
- the characteristic impedance is lower than 50 ⁇ because the apparent thickness of the conductive line is large. However, it is possible to suppress the change to 1 ⁇ or less to make it hard to affect the characteristics.
- the first and second fixed conductive lines 23 and 25 are preferably processed with high surface accuracy by a known means such as a plane polishing machine.
- variable delay line having the above-described configuration
- the movable conductive line 31 moves relative to the first and second fixed conductive lines 23 and 25 by rotating the adjusting screw 35, and the first and second Since the length of the movable conductor 31 protruding from the fixed conductors 23 and 25 of FIG. 2 changes, the delay time of the signal applied from the pulse signal source PG and output to the load RL changes as shown in FIG. .
- the length of the movable conductive line 31 overlapping the first and second fixed conductive lines 23 and 25 is the shortest, that is, the movable conductive line 31 is the first and second fixed conductive lines.
- the maximum delay time is obtained when the two fixed conductor lines 23 and 25 protrude the longest, and as shown in Fig. 2 (2), when the overlap length is the longest, that is, when the shortest protrudes, the minimum delay time is obtained. It becomes.
- the variable delay line having such a configuration is provided on the upper surface of the rectangular dielectric layer 19 having the fixed-side ground conductor 21 formed on the lower surface, and the first and second fixed conductors in one half region in the longitudinal direction thereof.
- the paths 23 and 25 are formed in parallel at intervals, and on the first and second fixed conductive lines 23 and 25, a movable conductive line 31 formed in a U-shape on the lower surface of the movable conductive board substrate 29 is formed.
- the movable conductor substrate 29 is overlapped so that the open side is in surface contact and the bent portion is projected, and the movable conductor substrate 29 is configured to be linearly displaceable in the longitudinal direction of the dielectric layer 19 by the movable means 37.
- the characteristic impedance of the movable conductive line 31 protruding from the first and second fixed conductive lines 23 and 25 is made equal to that of the first and second fixed conductive lines 23 and 25.
- the work of forming the fixed-side ground conductor 21 and the first and second fixed conductive lines 23 and 25 on the dielectric layer 19 and the work of forming the movable conductive line 31 on the movable conductive board substrate 29 are planar. This makes it very easy to configure individual components. This allows individual The component parts can be easily mass-produced by an automatic machine, and the dielectric layer 19, the movable conductive line board 29 and the movable-side ground conductor 39 can be assembled from a specific direction by using a lamination method. It can be manufactured at low cost.
- the dielectric layer 19, the movable conductive line substrate 29, the fixed-side ground conductor 21, the first and second fixed conductive lines 23 and 25, the movable conductive line 31, and the like are precisely planar ground and cut. Since it is easy to mass-produce, a highly accurate and ultra-small variable delay line can be obtained.
- the movable conductive line substrate 29 the fixed-side ground conductor 21, the first and second fixed conductive lines 23, 25, the movable conductive line 31, etc. It is possible to adjust the delay time of ultra-high frequency pulse signal of 5GHz-10GHz with resolution less than lps.
- the first and second fixed conductive lines 23 and 25 in the variable delay line of the present invention have a coplanar single conductive line configuration with a facing ground conductor as shown in FIG. It is also possible to adopt a microstrip line configuration with a characteristic impedance of 50 ⁇ as shown in Fig. 2, or a coplanar single-line configuration with a characteristic impedance of 50 ⁇ as shown in Fig. 2 (2).
- variable delay line of the present invention can be formed.
- a portion of only the movable conductor 31 that does not overlap the first and second fixed conductors 23 and 25 is a part of the strike between the movable ground conductor 39 and the fixed ground conductor 21. It has been described that a lip conductive line is configured. However, the movable conductive line 31 can be arbitrarily formed as long as it can match the characteristic impedance of the first and second fixed conductive lines 23 and 25 in a state where they do not overlap.
- the movable-side ground conductor 39 can be omitted.
- the characteristic impedance can also be matched, and the dielectric 19 in the portion of only the movable conductive line 31 can be made thinner so that the fixed-side ground conductor 21 is brought closer to the movable conductive line 31 and the like. Is possible.
- the effect can be enhanced by inserting a dielectric having a higher dielectric constant than air into the space between the dielectric layer 19 and the movable conductive line 31 only in the movable conductive line 31. Further, if the movable-side ground conductor 39 is omitted and the dielectric layer 19 of only the movable conductive line 31 projecting from the first and second fixed conductive lines 23 and 25 does not need to be thinned, Although the structure is greatly simplified, in this configuration, the characteristic impedance of only the movable conductive line 31 is increased.
- the width of the movable conductive line 31 is set to the first and second fixed conductive lines 23. , 25 is possible, but instead, the ratio of the characteristic impedance of the overlapping part of the first and second fixed conducting lines 23, 25 and the movable conducting line 31 being lower than 50 ⁇ increases. I do. Whether the structure is simplified or the structure emphasizes characteristics may be selected according to the purpose.
- the first and second fixed conductive lines 23 and 25 are not limited to the configuration in which the dielectric 19 is formed in one half region in the longitudinal direction.
- the size and shape are arbitrary according to the characteristics, and the shape and size of the movable conductive line 31 are the same.
- variable delay line Referring to the present invention.
- the configuration shown in Figs. 4 (1) and (2) is, for example, the one of the first and second fixed conductive lines 23 and 25 shown in Fig. 1 on the side where the movable conductive line 31 protrudes.
- a conical fixed contact 41 is protruded toward the movable conductive line 31 by electrodeposition or the like, and the fixed contact 41 is brought into contact with the movable conductive line 31 in a point contact state.
- a slight gap is formed between the first and second fixed conductive lines 23 and 25 and the movable conductive line 31. Illustration of the variable mechanism is omitted (see Fig. 4 (3)).
- Fig. 4 (1) shows a state in which the movable conductive line 31 protrudes most and a maximum delay time is obtained
- Fig. 4 (2) shows a state in which the movable conductive line 31 is composed of the first and second fixed conductive lines. The state where the minimum delay time is obtained by the longest overlap with the paths 23 and 25 is shown.
- variable delay line compared with the surface contact configuration of the configuration shown in FIG. 1, a signal is transmitted through the fixed contact 41 between the first and second fixed conductive lines 23 and 25 and the movable conductive substrate 29. Although it is transmitted through the loudspeaker and its amplitude characteristics fluctuate by about 1 dB compared to the case of surface contact, good delay characteristics are obtained from DC to 10 GHz high-frequency signals without practical problems.
- variable delay line With such a variable delay line, it is easy to configure the variable delay line using a printed circuit board.
- a printed circuit board generally has plasticity, and it tends to be difficult to precisely maintain the flatness even when the printed board is polished.
- the fixed contact 41 is brought into contact with the movable conductive line 31 in a point-contact state, so that the fixed-side ground conductor 21, the dielectric layer 19, the first and second Even if the fixed conductive lines 23 and 25 are formed, or the movable conductive line substrate 29 and the movable conductive line 31 are formed, a good contact state can be obtained, so that good delay characteristics can be maintained.
- a metal material may be embedded in the first and second fixed conductive lines 23 and 25.
- variable delay line having the configuration shown in FIGS. 4 (3) and (4) has a U-shaped structure in addition to the configuration in which the first and second fixed conductive lines 23 and 25 are provided with fixed contacts 41 protruding therefrom.
- a conical movable contact 43 having the same height as the fixed contact 41 is protruded toward the first and second fixed conductive lines 23 and 25 at both ends of the movable movable line 31 by electrodeposition or the like.
- the fixed contact 41 is brought into contact with the movable conductive line 31 in a point contact state, and the movable contact 43 is brought into contact with the first and second fixed conductive lines 23 and 25 in a point contact state. Also in this configuration, a slight gap is formed between the first and second fixed conductive lines 23 and 25 and the movable conductive line 31.
- variable delay line As compared with the configuration shown in FIGS. 4 (1) and 4 (2), such a variable delay line has a structure in which a signal is transmitted to the movable conductive line 31 through the movable contact 43 and a structure in which the fixed contact 41 , And is transmitted to the movable conductive line 31, and the operation becomes close in the case of surface contact. Therefore, characteristics close to surface contact can be obtained as compared with the configurations of Figs. 4 (1) and (2).
- the configuration shown in FIG. 5 is such that first and second arc-shaped first and second fixed portions centered on the central portion P are provided on the upper surface of a fan-shaped dielectric layer (not shown) with respect to the predetermined central portion P.
- Conducting lines 45 and 47 are formed at equal intervals, and the first and second fixed conducting lines 45 and 47 are formed on the open side of the deformed U-shaped movable conducting line 49 centered on the central portion P.
- a movable conductive line substrate (not shown in FIG. 5) on which the movable conductive line 49 is formed is brought into surface contact, and supported so as to be rotatable and slidable about a central portion P as an axis.
- Reference numeral 51 in the figure is the same as the coplanar ground conductor 27 in FIG.
- the contact state between the first and second fixed conducting lines 45, 47 and the movable conducting line 49 is not limited even when the surface is in contact. Contact is also possible.
- variable delay line having such a configuration, if the movable conductive line 49 is rotated around the center P thereof, the length of the strip conductive line by the movable conductive line 49 changes and the delay time is variable. Wear.
- the movable conductive line substrate (not shown) on which the movable conductive line 49 is formed is rotated by a knob or the like, and the movable conductive line substrate is directly rotatable, the not only the variable mechanism but also the conductive line can be formed. It is possible to have a simpler structure.
- variable delay line Referring to the present invention.
- the configuration shown in FIG. 6 is, for example, a U-shaped movable lead formed on the lower surface of movable movable circuit board 29 (not shown in FIG. 6) in the configuration shown in FIGS. 1 and 2 described above.
- the road 31A is one in which both open sides are formed not in a straight line but in a zigzag shape.
- the zigzag shape includes not only a polygonal line shape but also a curved shape or a rectangular shape.
- the first and second fixed conducting lines 23 and 25 and the coplanar ground conductor 27 are the same as those in FIGS. 1 and 2 whose widths are illustrated for convenience. However, since the movable conductive line 31A is formed in a zigzag shape, it is preferable that the width of the first and second fixed conductive lines 23 and 25 be larger than that of FIG. .
- variable delay line of FIG. 6 when the movable conductive line 31A protruding from the first and second fixed conductive lines 23 and 25 is slid, the length of the strip conductive line portion changes. However, since it is in a zigzag shape, the effective length of the protruding portion of the movable conductive line 31A increases, and the change in the delay time also increases.
- the ratio between the maximum delay time and the minimum delay time does not exceed 2, but in the configuration in FIG. 6, the ratio is increased to 2 or more. It is possible to do.
- the fixed contact 41 and the movable contact 43 may be provided as in the configuration of FIG. 4 without being limited to the configurations of FIG. 1 and FIG. As in the configuration of FIG. 5, it can be configured in an arc shape or a disk shape.
- the width of the first and second fixed conducting lines 23 and 25 is not conical in shape. It is preferred to have a wedge shape with a linear top in the direction.
- variable delay line may have various developed configurations.
- two or more variable delay lines in FIG. 1 are provided as one unit on a single dielectric layer, and each variable delay line is connected in series to form a unit configuration. If the movable lines of all units are integrally and slidably supported with respect to the first and second fixed lines, a large delay time can be varied by moving the movable conductive line with a small amount.
- the present invention is particularly suitable for an electromagnetic variable delay line that adjusts timing skew between signals by varying the delay time of an electric signal in an electronic device such as a computer.
- FIG. 1 is a schematic perspective view showing an embodiment of a variable delay line according to the present invention.
- FIG. 2 is a side view of main parts of the variable delay line shown in FIG. 1.
- FIG. 3 is a fragmentary cross-sectional view showing another embodiment of the variable delay line according to the present invention.
- FIG. 4 is a main part side view showing another embodiment of the variable delay line of the present invention.
- FIG. 5 is a plan view of a principal part showing still another embodiment of the variable delay line of the present invention.
- FIG. 6 is a plan view of a principal part showing still another embodiment of the variable delay line of the present invention.
- FIG. 7 is a schematic perspective view showing a variable delay line as a reference of the variable delay line of the present invention. Explanation of symbols
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Abstract
Description
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-399175 | 2003-11-28 | ||
JP2003399175 | 2003-11-28 |
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WO2005053084A1 true WO2005053084A1 (ja) | 2005-06-09 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008072402A1 (ja) * | 2006-12-15 | 2008-06-19 | Elmec Corporation | 可変遅延線 |
JP2008245252A (ja) * | 2007-02-28 | 2008-10-09 | Mitsubishi Electric Corp | マイクロストリップアレーアンテナ |
US10200216B2 (en) | 2013-01-28 | 2019-02-05 | Artek Kabushiki Kaisha | Variable ISI transmission channel apparatus |
US10666403B2 (en) | 2013-01-28 | 2020-05-26 | Artek Kabushiki Kaisha | Variable ISI transmission channel apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6032801U (ja) * | 1983-08-12 | 1985-03-06 | 日本電信電話株式会社 | 伸縮導波管 |
JPH0514004A (ja) * | 1991-07-03 | 1993-01-22 | Fujitsu Ltd | 位相調整回路 |
JP2003508942A (ja) * | 1999-08-24 | 2003-03-04 | パラテック マイクロウェーブ インコーポレイテッド | 電圧により調整可能なコプレーナ型移相器 |
-
2004
- 2004-11-16 WO PCT/JP2004/017015 patent/WO2005053084A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6032801U (ja) * | 1983-08-12 | 1985-03-06 | 日本電信電話株式会社 | 伸縮導波管 |
JPH0514004A (ja) * | 1991-07-03 | 1993-01-22 | Fujitsu Ltd | 位相調整回路 |
JP2003508942A (ja) * | 1999-08-24 | 2003-03-04 | パラテック マイクロウェーブ インコーポレイテッド | 電圧により調整可能なコプレーナ型移相器 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008072402A1 (ja) * | 2006-12-15 | 2008-06-19 | Elmec Corporation | 可変遅延線 |
JP4849570B2 (ja) * | 2006-12-15 | 2012-01-11 | エルメック株式会社 | 可変遅延線 |
JP2008245252A (ja) * | 2007-02-28 | 2008-10-09 | Mitsubishi Electric Corp | マイクロストリップアレーアンテナ |
US10200216B2 (en) | 2013-01-28 | 2019-02-05 | Artek Kabushiki Kaisha | Variable ISI transmission channel apparatus |
US10666403B2 (en) | 2013-01-28 | 2020-05-26 | Artek Kabushiki Kaisha | Variable ISI transmission channel apparatus |
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