WO2005052371A1 - Dispositif de refroidissement d'un circuit integre - Google Patents
Dispositif de refroidissement d'un circuit integre Download PDFInfo
- Publication number
- WO2005052371A1 WO2005052371A1 PCT/FR2004/050584 FR2004050584W WO2005052371A1 WO 2005052371 A1 WO2005052371 A1 WO 2005052371A1 FR 2004050584 W FR2004050584 W FR 2004050584W WO 2005052371 A1 WO2005052371 A1 WO 2005052371A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cavity
- conductive layer
- insulating
- membrane
- edge
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
- B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/036—Micropumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04805827A EP1687535A1 (fr) | 2003-11-25 | 2004-11-12 | Dispositif de refroidissement d un circuit integre |
US10/580,324 US8164183B2 (en) | 2003-11-25 | 2004-11-12 | Integrated circuit cooling device |
JP2006540554A JP2007512468A (ja) | 2003-11-25 | 2004-11-12 | 集積回路のための冷却装置 |
US13/436,583 US8804300B2 (en) | 2003-11-25 | 2012-03-30 | Method of forming a cooling device for an integrated circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0350910 | 2003-11-25 | ||
FR0350910A FR2862629B1 (fr) | 2003-11-25 | 2003-11-25 | Dispositif de refroidissement d'un circuit integre |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/580,324 A-371-Of-International US8164183B2 (en) | 2003-11-25 | 2004-11-12 | Integrated circuit cooling device |
US13/436,583 Division US8804300B2 (en) | 2003-11-25 | 2012-03-30 | Method of forming a cooling device for an integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005052371A1 true WO2005052371A1 (fr) | 2005-06-09 |
Family
ID=34531395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2004/050584 WO2005052371A1 (fr) | 2003-11-25 | 2004-11-12 | Dispositif de refroidissement d'un circuit integre |
Country Status (5)
Country | Link |
---|---|
US (2) | US8164183B2 (fr) |
EP (1) | EP1687535A1 (fr) |
JP (1) | JP2007512468A (fr) |
FR (1) | FR2862629B1 (fr) |
WO (1) | WO2005052371A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067413A (ja) * | 2005-08-31 | 2007-03-15 | Stmicroelectronics Sa | 可変キャパシタを形成する方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008006832A1 (de) * | 2008-01-30 | 2009-08-13 | Eads Deutschland Gmbh | Elektromagnetischer Membran-Mikroaktor |
US9214622B2 (en) * | 2011-10-17 | 2015-12-15 | Stmicroelectronics, Inc. | Size-controllable opening and method of making same |
EP3523031B1 (fr) * | 2016-10-07 | 2021-05-26 | Boehringer Ingelheim Vetmedica GmbH | Dispositif d'analyse, cartouche et procédé de test d'un échantillon |
TWI626627B (zh) * | 2017-08-31 | 2018-06-11 | 研能科技股份有限公司 | 致動傳感模組 |
WO2022236225A2 (fr) * | 2021-04-23 | 2022-11-10 | The General Hospital Corporation | Transistors fluidiques et utilisations associées |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5367878A (en) * | 1991-11-08 | 1994-11-29 | University Of Southern California | Transient energy release microdevices and methods |
EP0779436A2 (fr) * | 1995-12-13 | 1997-06-18 | Frank T. Hartley | Pompe péristaltique micro-usiné |
US6032923A (en) * | 1998-01-08 | 2000-03-07 | Xerox Corporation | Fluid valves having cantilevered blocking films |
US6106245A (en) * | 1997-10-09 | 2000-08-22 | Honeywell | Low cost, high pumping rate electrostatically actuated mesopump |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US6837476B2 (en) * | 2002-06-19 | 2005-01-04 | Honeywell International Inc. | Electrostatically actuated valve |
SG105459A1 (en) * | 2000-07-24 | 2004-08-27 | Micron Technology Inc | Mems heat pumps for integrated circuit heat dissipation |
DE10054484A1 (de) * | 2000-11-03 | 2002-05-08 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
US6729856B2 (en) * | 2001-10-09 | 2004-05-04 | Honeywell International Inc. | Electrostatically actuated pump with elastic restoring forces |
US7082024B2 (en) * | 2004-11-29 | 2006-07-25 | Stmicroelectronics S.A. | Component comprising a variable capacitor |
-
2003
- 2003-11-25 FR FR0350910A patent/FR2862629B1/fr not_active Expired - Fee Related
-
2004
- 2004-11-12 JP JP2006540554A patent/JP2007512468A/ja not_active Withdrawn
- 2004-11-12 WO PCT/FR2004/050584 patent/WO2005052371A1/fr active Application Filing
- 2004-11-12 US US10/580,324 patent/US8164183B2/en active Active
- 2004-11-12 EP EP04805827A patent/EP1687535A1/fr not_active Withdrawn
-
2012
- 2012-03-30 US US13/436,583 patent/US8804300B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5367878A (en) * | 1991-11-08 | 1994-11-29 | University Of Southern California | Transient energy release microdevices and methods |
EP0779436A2 (fr) * | 1995-12-13 | 1997-06-18 | Frank T. Hartley | Pompe péristaltique micro-usiné |
US6106245A (en) * | 1997-10-09 | 2000-08-22 | Honeywell | Low cost, high pumping rate electrostatically actuated mesopump |
US6032923A (en) * | 1998-01-08 | 2000-03-07 | Xerox Corporation | Fluid valves having cantilevered blocking films |
Non-Patent Citations (1)
Title |
---|
See also references of EP1687535A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067413A (ja) * | 2005-08-31 | 2007-03-15 | Stmicroelectronics Sa | 可変キャパシタを形成する方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070278663A1 (en) | 2007-12-06 |
FR2862629B1 (fr) | 2006-02-17 |
US20120187519A1 (en) | 2012-07-26 |
EP1687535A1 (fr) | 2006-08-09 |
FR2862629A1 (fr) | 2005-05-27 |
US8164183B2 (en) | 2012-04-24 |
US8804300B2 (en) | 2014-08-12 |
JP2007512468A (ja) | 2007-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3702323B1 (fr) | Dispositif comportant un canal fluidique muni d'au moins un systeme micro ou nanoelectronique et procede de realisation d'un tel dispositif | |
EP1027583B1 (fr) | Structure munie de contacts electriques formes a travers le substrat de cette structure et procede d'obtention d'une telle structure | |
FR2992467A1 (fr) | Procede de realisation d'un composant a contact electrique traversant et composant obtenu | |
FR2938970A1 (fr) | Procede pour empiler et interconnecter des circuits integres | |
FR2930840A1 (fr) | Procede de reprise de contact sur un circuit eclaire par la face arriere | |
FR2943177A1 (fr) | Procede de fabrication d'une structure multicouche avec report de couche circuit | |
US20090075415A1 (en) | Method for manufacturing semiconductor device | |
EP2840589A1 (fr) | Procédé améliore de séparation entre une zone activé d'un substrat et sa face arrière ou une portion de sa face arrière | |
US8804300B2 (en) | Method of forming a cooling device for an integrated circuit | |
EP2365741B1 (fr) | Procede de metallisation de vias borgnes | |
EP1421624B1 (fr) | Procede de fabrication de capteur d'image couleur avec ouvertures de contact creusees avant amincissement | |
EP2791969B1 (fr) | Formation d'une connexion electrique du type via | |
EP1572578A2 (fr) | Procede de realisation d une micro-structure suspendue plane , utilisant une couche sacrificielle en materiau polymere et composant obtenu | |
EP3035378B1 (fr) | Procédé de transformation d'un dispositif électronique utilisable dans un procédé de collage temporaire d'une plaque sur une poignée et dispositif électronique fabriqué par le procédé | |
EP2661413B1 (fr) | Procede d'encapsulation d'un microcomposant | |
FR3088109A1 (fr) | Procede de fabrication d'un circuit de refroidissement | |
EP2498287B1 (fr) | Procédé de réalisation d'interconnexions verticales à travers des couches structurées. | |
FR2823377A1 (fr) | Ligne conductrice haute frequence sur un circuit integre | |
US9458011B2 (en) | Scalable self-supported MEMS structure and related method | |
EP2690655A2 (fr) | Procédé de réalisation de vias | |
EP1573805A2 (fr) | Procede de reroutage de dispositifs microelectroniques sans lithographie | |
FR3037439A1 (fr) | Dispositif electronique a plaque arriere evidee. | |
EP4075526A1 (fr) | Dispositif à transduction piézorésistive | |
EP2278613B1 (fr) | Via de connexion électrique tubulaire constitué de plusieurs vias conducteurs élémentaires | |
FR2964791A1 (fr) | Composant electronique comprenant un via conducteur realisant une fonction de dissipation thermique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004805827 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006540554 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWP | Wipo information: published in national office |
Ref document number: 2004805827 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10580324 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 10580324 Country of ref document: US |