WO2005047975A2 - Dispense geometry and conductive template to achieve high-speed filling and throughput - Google Patents

Dispense geometry and conductive template to achieve high-speed filling and throughput Download PDF

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Publication number
WO2005047975A2
WO2005047975A2 PCT/US2004/038088 US2004038088W WO2005047975A2 WO 2005047975 A2 WO2005047975 A2 WO 2005047975A2 US 2004038088 W US2004038088 W US 2004038088W WO 2005047975 A2 WO2005047975 A2 WO 2005047975A2
Authority
WO
WIPO (PCT)
Prior art keywords
droplets
substrate
layer
template
recited
Prior art date
Application number
PCT/US2004/038088
Other languages
English (en)
French (fr)
Other versions
WO2005047975A3 (en
Inventor
Sidlgata V. Sreenivasan
Ian M. Mcmackin
Byung-Jin Choi
Ronald D. Voisin
Original Assignee
Molecular Imprints, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/706,537 external-priority patent/US20050098534A1/en
Priority claimed from US10/714,088 external-priority patent/US20050106321A1/en
Application filed by Molecular Imprints, Inc. filed Critical Molecular Imprints, Inc.
Priority to EP04818716A priority Critical patent/EP1682340A2/en
Priority to JP2006539967A priority patent/JP2007516862A/ja
Publication of WO2005047975A2 publication Critical patent/WO2005047975A2/en
Publication of WO2005047975A3 publication Critical patent/WO2005047975A3/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
PCT/US2004/038088 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput WO2005047975A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04818716A EP1682340A2 (en) 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput
JP2006539967A JP2007516862A (ja) 2003-11-12 2004-11-05 高速充填とスループットを実現するための分配の幾何学的配置および導電性テンプレート

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/706,537 2003-11-12
US10/706,537 US20050098534A1 (en) 2003-11-12 2003-11-12 Formation of conductive templates employing indium tin oxide
US10/714,088 US20050106321A1 (en) 2003-11-14 2003-11-14 Dispense geometery to achieve high-speed filling and throughput
US10/714,088 2003-11-14

Publications (2)

Publication Number Publication Date
WO2005047975A2 true WO2005047975A2 (en) 2005-05-26
WO2005047975A3 WO2005047975A3 (en) 2006-02-02

Family

ID=34595369

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/038088 WO2005047975A2 (en) 2003-11-12 2004-11-05 Dispense geometry and conductive template to achieve high-speed filling and throughput

Country Status (5)

Country Link
EP (1) EP1682340A2 (ko)
JP (1) JP2007516862A (ko)
KR (1) KR20060126967A (ko)
TW (1) TWI292347B (ko)
WO (1) WO2005047975A2 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435979C (zh) * 2005-06-24 2008-11-26 精工爱普生株式会社 液滴喷出方法、电光学装置及电子设备
WO2011108750A1 (en) * 2010-03-03 2011-09-09 Fujifilm Corporation Pattern transfer method and apparatus
US8609006B2 (en) 2009-08-31 2013-12-17 Fujifilm Corporation Pattern transfer apparatus and pattern forming method
US8696969B2 (en) 2009-02-04 2014-04-15 Asml Netherlands B.V. Imprint lithography method and apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8707890B2 (en) * 2006-07-18 2014-04-29 Asml Netherlands B.V. Imprint lithography
US8142702B2 (en) * 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography
US20090212012A1 (en) * 2008-02-27 2009-08-27 Molecular Imprints, Inc. Critical dimension control during template formation
JP5289006B2 (ja) * 2008-11-19 2013-09-11 株式会社東芝 パターン形成方法およびプログラム
JP5377053B2 (ja) * 2009-04-17 2013-12-25 株式会社東芝 テンプレート及びその製造方法、並びにパターン形成方法
JP5281989B2 (ja) * 2009-08-26 2013-09-04 富士フイルム株式会社 パターン転写装置及びパターン形成方法
JP5296641B2 (ja) * 2009-09-02 2013-09-25 東京エレクトロン株式会社 インプリント方法、プログラム、コンピュータ記憶媒体及びインプリント装置
JP5460541B2 (ja) * 2010-03-30 2014-04-02 富士フイルム株式会社 ナノインプリント方法、液滴配置パターン作成方法および基板の加工方法
JP5983218B2 (ja) * 2012-09-11 2016-08-31 大日本印刷株式会社 ナノインプリントリソグラフィ用テンプレートの製造方法
JP6540089B2 (ja) * 2015-02-25 2019-07-10 大日本印刷株式会社 パターン形成方法、パターン形成装置およびパターン形成用プログラム
US11556055B2 (en) 2020-06-19 2023-01-17 Canon Kabushiki Kaisha Systems and methods for generating drop patterns

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244848A (ja) * 1989-03-16 1990-09-28 Fujitsu Ltd バースト通信制御方法
US5817376A (en) * 1996-03-26 1998-10-06 Minnesota Mining And Manufacturing Company Free-radically polymerizable compositions capable of being coated by electrostatic assistance
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
WO2001047003A2 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US20020177319A1 (en) * 2000-07-18 2002-11-28 Chou Stephen Y. Fluid pressure bonding
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US6646662B1 (en) * 1998-05-26 2003-11-11 Seiko Epson Corporation Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244848A (ja) * 1989-03-16 1990-09-28 Fujitsu Ltd バースト通信制御方法
US5817376A (en) * 1996-03-26 1998-10-06 Minnesota Mining And Manufacturing Company Free-radically polymerizable compositions capable of being coated by electrostatic assistance
US6646662B1 (en) * 1998-05-26 2003-11-11 Seiko Epson Corporation Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
WO2001047003A2 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
US20020177319A1 (en) * 2000-07-18 2002-11-28 Chou Stephen Y. Fluid pressure bonding
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435979C (zh) * 2005-06-24 2008-11-26 精工爱普生株式会社 液滴喷出方法、电光学装置及电子设备
US8696969B2 (en) 2009-02-04 2014-04-15 Asml Netherlands B.V. Imprint lithography method and apparatus
US8609006B2 (en) 2009-08-31 2013-12-17 Fujifilm Corporation Pattern transfer apparatus and pattern forming method
WO2011108750A1 (en) * 2010-03-03 2011-09-09 Fujifilm Corporation Pattern transfer method and apparatus
JP2011181829A (ja) * 2010-03-03 2011-09-15 Fujifilm Corp パターン転写方法及びパターン転写装置
US9176376B2 (en) 2010-03-03 2015-11-03 Fujifilm Corporation Pattern transfer method and apparatus

Also Published As

Publication number Publication date
WO2005047975A3 (en) 2006-02-02
TW200523040A (en) 2005-07-16
JP2007516862A (ja) 2007-06-28
TWI292347B (en) 2008-01-11
EP1682340A2 (en) 2006-07-26
KR20060126967A (ko) 2006-12-11

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