WO2005031786A1

WO2005031786A1 - Image display and spacer structural body producing method

Info

Publication number: WO2005031786A1
Application number: PCT/JP2004/013546
Authority: WO
Inventors: Ken Takahashi; Satoshi Ishikawa; Masaru Nikaido
Original assignee: Kabushiki Kaisha Toshiba
Priority date: 2003-09-25
Filing date: 2004-09-16
Publication date: 2005-04-07
Also published as: TW200514113A; TWI246102B; JP2005100843A

Abstract

An image display having a spacer structural body (22) between a first substrate (10) provided with a phosphor screen and a second substrate (12) provided with electron emission sources (18) so as to prevent damage to and contamination of the spacer and to enhance the breakdown voltage characteristic and display definition. The structural body (22) has a plate-shaped grid (24) opposed to the first and second substrates (10, 12) and having electron beam passing holes (26) opposed to the respective electron emission sources (18) and spacers (30) erected at least on one side of the grid (24). The spacer (30) has large-diameter first stages and small-diameter second stages alternated and extended from the grid (24) toward the extension end.

Description

Specification

Image display device and method of manufacturing spacer structure

Technical field

The present invention relates to an image display device such as a flat display device having a spacer structure, and a method of manufacturing a spacer structure used for the image display device.

Background art

[0002] In recent years, various flat-panel image display devices have been attracting attention as next-generation lightweight and thin display devices replacing cathode ray tubes (hereinafter, referred to as CRTs). For example, surface conduction electron-emitting devices (SEDs) are being developed as a type of field emission display (FED) that functions as a flat panel display.

[0003] The SED includes a front substrate and a rear substrate that are arranged to face each other at a predetermined interval, and these substrates are connected to each other through rectangular side walls to form a vacuum envelope. Make up. Phosphor layers of three colors are formed on the inner surface of the front substrate, and a large number of electron-emitting devices corresponding to each pixel are arranged on the inner surface of the rear substrate as electron sources for exciting the phosphor. Each electron-emitting device includes an electron-emitting portion, a pair of electrodes for applying a voltage to the electron-emitting portion, and the like.

[0004] In the SED, it is important that the space between the front substrate and the rear substrate, that is, the inside of the vacuum envelope is maintained at a high degree of vacuum. If the degree of vacuum is low, the life of the electron-emitting device and, consequently, the life of the device will be reduced. In addition, since the space between the front substrate and the rear substrate is empty, atmospheric pressure acts on the front substrate and the rear substrate. Therefore, in order to support the atmospheric pressure load acting on these substrates and maintain the gap between the substrates, a number of plate-shaped or columnar spacers are arranged between the two substrates.

[0005] In order to dispose the spacer over the entire surface of the front substrate and the rear substrate, it is necessary to use an extremely thin plate or an extremely thin plate so as not to contact the phosphor on the front substrate and the electron-emitting devices on the rear substrate. An extremely thin columnar spacer is required. In addition, since these spacers must be installed very close to the electron-emitting device, an insulator material must be used as the spacer. At the same time, when considering thinning of the front and rear substrates, A large number of spacers are required, which further complicates manufacture.

[0006] As a method for producing such a spacer, US Pat. No. 5,704,820 discloses that a glass mold is filled in a spacer mold made of a material soluble in an acid or a base and cured. Later, a method for dissolving the mold was proposed.

[0007] In the production method described above, the spacer mold is melted after the spacer is molded, and is a so-called disposable mold. Inevitable. In addition, since the spacer is a component used in a vacuum environment, damage and contamination to the spacer during the melting process of the spacer mold become a serious problem.

[0008] When the space between the front substrate and the rear substrate is narrow, the secondary electrons and reflected electrons generated on the phosphor screen collide with a spacer provided between the substrates, and the spacer is charged. . In this case, the emitted electron beam is also attracted to the spacer and deviates from the original orbit. As a result, there is a problem that mislanding of the electron beam occurs with respect to the phosphor layer and the color purity of the displayed image is degraded. In addition, there is another problem that a discharge is generated on the spacer surface and the withstand voltage of the entire display device is reduced.

Disclosure of the invention

The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device with improved withstand voltage characteristics and display quality that does not cause damage or contamination of a spacer, and an image display device having the same. It is an object of the present invention to provide a method of manufacturing a spacer structure capable of inexpensively manufacturing a spacer structure used for an image display device.

[0010] In order to achieve the above object, an image display device according to an aspect of the present invention is arranged such that a first substrate on which an image display surface is formed is opposed to the first substrate with a predetermined gap therebetween. A second substrate provided with a plurality of electron emission sources for exciting the image display surface, and an atmospheric pressure load provided between the first and second substrates and acting on the first and second substrates. With a supporting spacer structure,

The spacer structure faces the first and second substrates, and has a plate-like grid having a plurality of electron beam passage holes facing the electron emission source, and at least one of the grids. And a plurality of spacers erected on the surface of the large-diameter first step portion having a large diameter alternately stacked from the grid toward the extending end. And a second step portion having a smaller diameter than the first step portion.

[0011] A method of manufacturing a spacer structure according to another aspect of the present invention includes a plate-like grid having a plurality of beam passage holes, and a grid standing upright on a surface of the grid. And a plurality of spacers having a large-diameter first step portion and a second step portion having a smaller diameter than the first step portion, which are alternately laminated with a force toward the extension end from the first position. The manufacturing method of the spacer structure used in

Prepare a plate-like grid with multiple beam passage holes formed,

A plurality of spacer forming holes and a spacer forming hole which is located around each spacer forming hole and has first and second steps corresponding to the spacers are defined and elastically deformed. A mold having a plurality of hole forming portions formed of a possible ultraviolet transmitting material is prepared, and each spacer forming hole of the mold is filled with a UV-curable spacer forming material. Filling

A mold filled with the spacer forming material is brought into close contact with the surface of the grid to form an assembly including the mold and the grid,

Irradiating ultraviolet light to the spacer forming material through a mold of the assembly, and curing the spacer forming material;

The mold is released from the grid while elastically deforming the hole forming portion, and the hardened spacer forming material is placed on the grid.

Brief Description of Drawings

FIG. 1 is a perspective view showing an SED according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the SED, taken along a line II II in FIG. 1.

FIG. 3 is an enlarged sectional view showing the SED.

FIG. 4 is an enlarged perspective view showing a part of the spacer structure.

FIG. 5 is a cross-sectional view taken along line VV in FIG.

FIG. 6 is a cross-sectional view showing a step of manufacturing the spacer structure.

FIG. 7 is a cross-sectional view showing a step of manufacturing a molding die used for manufacturing the spacer structure.

FIG. 8 is a cross-sectional view showing an assembly in which a mold and a grid are brought into close contact.

FIG. 9 is a cross-sectional view showing a state where the mold is released. FIG. 10 is a cross-sectional view showing a mold and a spacer when the mold is released from the mold.

FIG. 11 is a perspective view showing a partly determined SED according to a second embodiment of the present invention.

FIG. 12 is a sectional view of an SED according to the second embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a first embodiment in which the present invention is applied to a SED as a planar image display device will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 3, the SED includes a first substrate 10 and a second substrate 12 each formed of a rectangular glass plate, and these substrates are spaced apart by about 1.0-2. Opposed. The first substrate 10 and the second substrate 12 are joined to each other via a rectangular frame-shaped side wall 14 made of glass to form a flat vacuum envelope 15 whose inside is maintained in a vacuum. . The side wall 14 functioning as a bonding member is sealed to a peripheral portion of the first substrate 10 and a peripheral portion of the second substrate 12 by a sealing material 20 such as a low-melting glass, a low-melting metal, or the like. Are joined.

[0014] On the inner surface of the first substrate 10, a phosphor screen 16 functioning as an image display surface is formed. This phosphor screen 16 is configured by arranging phosphor layers R, G, and B that emit red, green, and blue light and a light-shielding layer 11, and these phosphor layers are striped, dot-shaped, or rectangular. Is formed. On the phosphor screen 16, a metal knock 17 having a force such as aluminum and a getter film 19 are sequentially formed.

[0015] On the inner surface of the second substrate 12, as an electron source for exciting the phosphor layers R, G, and B of the phosphor screen 16, a large number of surface conduction electron-emitting devices 18 each emitting an electron beam are provided. Have been. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to the pixels. Each electron-emitting device 18 includes an electron-emitting portion (not shown), a pair of device electrodes for applying a voltage to the electron-emitting portion, and the like. On the inner surface of the second substrate 12, a large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix, and the ends of the wirings 21 are projected outside the vacuum envelope 15 to form a bow. .

A spacer structure 22 is provided between the first substrate 10 and the second substrate 12. The spacer structure 22 includes a grid 24 having a rectangular metal plate strength, and a large number of columnar spacers integrally provided on both sides of the grid. Specifically, as shown in FIGS. 2 to 5, the grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, It is arranged parallel to these substrates. A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices.

The grid 24 is formed of, for example, a 0.1-0.3 mm thick iron-nickel metal plate. The surface of the grid 24 is covered with an oxide film made of an element constituting the metal plate, for example, an oxide film made of Fe304 or NiFe204. The surfaces 24a and 24b of the grid 24 and the wall surfaces of the respective electron beam passage holes 26 are covered with a high resistance film having a discharge current limiting effect. This high-resistance film is formed of a high-resistance material whose main component is glass.

On the first surface 24 a of the grid 24, a first spacer 30 a is standing upright, and is located between adjacent electron beam passage holes 26. The tip of the first spacer 30a is in contact with the inner surface of the first substrate 10 via the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16. On the second surface 24b of the grid 24, a second spacer 30b is standing upright, and is located between the adjacent electron beam passage holes 26. The tip of the second spacer 30b is in contact with the inner surface of the second substrate 12. Here, the tip of each second spacer 30 b is located on the wiring 21 provided on the inner surface of the second substrate 12. The first and second spacers 30a and 30b are located in alignment with each other, and are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.

[0019] Each first spacer 30a is formed in a tapered shape having a diameter decreasing from the grid 24 side toward the extending end. Each spacer 30a has a large-diameter first step 50a and a second step 50b having a smaller diameter than the first step 50a, which are alternately stacked with a force from the grid 24 toward the extending end. The surface is formed as an uneven spacer. Each first spacer 30a has two first step portions 50a and one second step portion and is formed in three steps, and the height thereof is, for example, 0.75 mm. The first step portion 50a serving as a convex portion has a substantially elliptical cross-sectional shape, and its diameter is formed to be 1.4 mm X 0.35 mm. The second step portion 50b serving as a concave portion has a substantially elliptical cross-sectional shape, and has a diameter of 1.35 mm × 0.3 mm. First The height of each of the second step portions 50a and 50b is 0.25 mm. In the radial direction of the first spacer 30a, the maximum protrusion amount dl of the first step portion 50a with respect to the second step portion 50b is formed to be 100 m or less.

[0020] Each second spacer 30b is also formed in a tapered taper shape in which the diameter on the grid 24 side also decreases toward the extending end. Each second spacer 30b has a large-diameter first step 51a and a second step 51b smaller in diameter than the first step 51a, which are alternately stacked from the grid 24 toward the extending end. The surface is formed as an uneven spacer. Here, each second spacer 30b has two first step portions 51a and two second step portions 51b and is formed in four steps, and the height thereof is, for example, 1.Omm. ing. The first step portion 51a serving as a convex portion has a substantially elliptical cross-sectional shape, and has a diameter of 1.4 mm X 35 mm. The second step portion 50b serving as a concave portion has a substantially elliptical cross-sectional shape, and has a diameter of 1.35 mm X 0.3 mm. Each height of the first and second steps 51a and 51b is formed to be 0.25 mm. In the radial direction of the second spacer 30a, the maximum protrusion amount d2 of the first step portion 51a with respect to the second step portion 51b is formed to be 100 m or less.

The spacer structure 22 configured as described above is provided between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b contact the inner surfaces of the first substrate 10 and the second substrate 12 to support an atmospheric pressure load acting on these substrates and to set a predetermined distance between the substrates. Maintain to

The SED includes a voltage supply unit (not shown) for applying a voltage to the grid 24 and the metal back 17 of the first substrate 10. The voltage supply unit is connected to the grid 24 and the metal back 17, respectively, and applies, for example, a voltage of 12 kV to the grid 24 and a voltage of 10 kV to the metal back 17. When displaying an image in the SED, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage and collides with the phosphor screen 16. Let it. As a result, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image is displayed.

Next, a method of manufacturing the SED configured as described above will be described. First, a method of manufacturing the spacer structure 22 will be described.

As shown in FIG. 6, when manufacturing the spacer structure 22, first, a grid 24 having a predetermined dimension is formed. A rectangular plate-shaped upper die 36a and lower die 36b having substantially the same dimensions as the grid are prepared. After a 0.15 mm thick metal plate made of Fe-50% M is degreased, washed and dried, an electron beam passage hole 26 is formed by etching to form a grid 24. After that, the entire grid 24 is subjected to oxidation treatment, and then an insulating film is formed on the grid surface including the inner surface of the electron beam passage hole 26. Further, a coating liquid containing glass as a main component is applied on the insulating film, dried, and fired to form a high-resistance film.

[0024] The upper die 36a has a number of spacer forming holes 40a for forming the first spacer 30a. Similarly, the lower die 36b has a plurality of spacer forming holes 40b for forming the second spacer 30b.

Here, the configuration of the upper die 36a and the lower die 36b and the method of manufacturing the same will be described in detail with the upper die 36a as a representative.

As shown in FIG. 6, the upper die 36a as a molding die includes a die main body 52a formed in a rectangular plate shape from stainless steel, polyethylene terephthalate, or the like. Numerous through holes 54a are formed at positions corresponding to the spacers 30a. Each through hole 54a is formed to have a larger diameter than the spacer forming hole. Each through hole 54a is provided with a hole forming portion 56a made of, for example, silicone resin as an elastically deformable ultraviolet light transmitting material. A bottomed spacer forming hole 40a having a shape corresponding to the first spacer 30a is formed in the hole forming portion 56b. Thus, the periphery of the spacer forming hole 40a is surrounded by the silicone. In addition, as the elastically deformable ultraviolet transmitting material used for the hole forming portion 56b, it is possible to use polycarbonate, acrylic or the like, which is not limited to silicon.

When manufacturing such an upper mold 36a, first, as shown in FIG. 7A, a master female mold 60 in which a number of spacer forming holes are formed with high accuracy is prepared. The master female mold 60 is formed by laminating a plurality of, for example, four metal plates, and the metal plates are formed on the metal plates by laser, etching, or the like, in a shape corresponding to the first spacer 30a. The spacer forming hole 61 is formed with high precision. Subsequently, as shown in FIGS. 7 (a) and 7 (b), a spacer forming hole 61 of the master female mold 60 is filled with a mold forming material such as silicone, and a large number of spacers corresponding to the spacer forming holes are filled. A master male mold 62 having a convex portion 63 is formed. Note that the master male mold 62 is formed by cutting. Next, as shown in FIG. 7 (c), a mold body 52a having a large number of through holes 54a is prepared. The master male mold 62 is mounted on the mold main body 52a, and the master male mold 62 is positioned so that the respective convex portions 63 are disposed substantially coaxially in the respective through holes 54a of the mold main body.

In this state, as shown in FIG. 7D, each through-hole 54a of the mold body 52a is filled with a room-temperature curing type silicone. After the silicone has cured, the master male mold 62 is released. As a result, as shown in FIG. 7 (e), an upper die 36a integrally having the hole forming portion 56a defining the spacer forming hole 40a is obtained.

On the other hand, the lower mold 36b has the same structure as the upper mold 36a, and has a mold body 52b having a large number of through holes 54b, a hole forming portion 56b formed of silicone and provided in each through hole, and A bottomed spacer forming hole 40b formed in the hole forming portion and corresponding to the second spacer is provided. The lower mold 36b is manufactured in the same manner as the upper mold 36a.

When a spacer structure is formed using the upper die 36a and the lower die 36b configured as described above, the spacer forming hole 40a of the upper die 36a and the spacer forming hole of the lower die 26b. The spacer forming material 46 is filled in each of the spacers 40b. As the spacer forming material 46, a glass paste containing at least a UV-curable binder (organic component) and a glass filler is used. The specific gravity and viscosity of the glass paste are appropriately selected.

Subsequently, as shown in FIG. 8, the upper die 36 a is moved with respect to the grid 24 so that the spacer forming holes 40 a filled with the spacer forming material 46 are located between the electron beam passing holes 26. And make contact with the first surface 24a of the grid 24. Similarly, the lower die 36b is positioned so that each spacer forming hole 40b is located between the electron beam passing holes 26, and is brought into close contact with the second surface 24b of the grid 24. Thus, an assembly 42 including the grid 24, the upper mold 36a and the lower mold 36b is formed. In the assembly 42, the spacer forming holes 40a of the upper die 36a and the spacer forming holes 40b of the lower die 36b are arranged to face each other with the grid 24 interposed therebetween.

Next, as shown in FIG. 8, the outer surface forces of the upper mold 36a and the lower mold 36b are also changed to ultraviolet (UV) with respect to the filled spacer forming material 46 by using, for example, an ultraviolet lamp or the like. To cure the spacer forming material by UV. At this time, the periphery of the spacer forming holes 40a and 40b filled with the spacer forming material 46 is surrounded by hole forming portions 56a and 56b formed of silicone as an ultraviolet transmitting material. Therefore, ultraviolet rays form spacers. The material 46 is irradiated directly and through the hole forming portions 56a and 56b. Therefore, the filled spacer forming material 46 can be surely cured to the inside thereof.

Thereafter, as shown in FIG. 9, the upper mold 36a and the lower mold 36b are released from the grid 24 so that the hardened spacer forming material 46 is left on the grid 24. The hardened spacer forming material 46, that is, the first and second spacers 30a and 30b are formed in an uneven shape having a first step portion and a second step portion, respectively. The hole forming portions 56a and 56b that define the spacer forming holes 40a and 40b are formed of elastically deformable silicone. Therefore, as shown in FIG. 10, when the upper die 36a is released, the hole forming portion 56a is elastically deformed along the unevenness of the hardened first spacer 30a. Therefore, even when the first spacer 30a is formed unevenly, the upper die 36a can be easily released without damaging the first spacer. Similarly, the lower die 36b can be easily released without damaging the formed second spacer 30b.

Next, the grid 24 on which the spacer forming material 46 is provided is heat-treated in a heating furnace, and the inner force of the spacer forming material is also reduced by blowing off the binder, and then at about 500-550 ° C. for 30 minutes. The spacer forming material is fully baked and vitrified for 1 hour. As a result, a spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.

On the other hand, in the manufacture of the SED, the first substrate 10 on which the phosphor screen 16 and the metal back 17 are provided, the electron-emitting device 18 and the wiring 21 are provided in advance, and the side wall 14 is joined. The second substrate 12 is prepared.

Subsequently, the spacer structure 22 obtained as described above is positioned and arranged on the second substrate 12. In this state, the first substrate 10, the second substrate 12, and the spacer structure 22 are arranged in a vacuum chamber, and the inside of the vacuum chamber is evacuated. To join. As a result, an SED having the spacer structure 22 is manufactured.

[0035] According to the SED configured as described above, the first and second spacers 30a and 30b that form the spacer structure are different in diameter from each other in the first and second steps. And the surface is formed unevenly. Therefore, it is possible to suppress the collision of the reflected electrons and the secondary electrons with the spacer surface, and to suppress the reduction of the discharge withstand voltage and the orbital deviation of the electron beam due to the charging of the spacer. Equipped with spacers with the same height and no steps When the SED according to the present embodiment was compared with the SED according to the present embodiment, the discharge voltage of the SED according to the present embodiment increased by about 20%. In the SED according to the present embodiment, the orbital deviation of the electron beam was reduced by about 30%. Thus, an image display device with improved withstand voltage characteristics and display quality can be obtained.

Further, according to the above-described manufacturing method, even when a spacer having first and second step portions and having an uneven surface is formed, the upper mold is elastically deformed by the hole forming portions 56a and 56b. And The lower mold can be released easily and there is no need to dissolve the mold. Therefore, it is possible to prevent the spacer from being damaged or contaminated by the melting of the mold, and at the same time, the mold can be repeatedly used many times. As described above, the spacer structure used for the image display device can be manufactured at low cost.

In the above-described embodiment, the spacer assembly 22 has a configuration in which the first and second spacers and the grid are integrally provided, but the second spacer is provided on the second substrate 12. It may be configured to be formed. Further, the spacer structure may include only the grid and the second spacer, and the grid may be in contact with the first substrate.

As shown in FIGS. 11 and 12, according to the SED according to the second embodiment of the present invention, the spacer assembly 22 includes a grid 24 having a rectangular metal plate force, and one of the grids. A large number of columnar spacers 30 erected integrally only on the surface. The grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates. A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18, respectively, and transmit the electron beams emitted from the electron-emitting devices.

[0039] The first and second surfaces 24a and 24b of the grid 24 and the inner wall surface of each electron beam passage hole 26 serve as an insulating layer as an insulating material mainly composed of glass, ceramic, or the like, for example, a Li-based alloy. It is covered with a high-resistance film 43 having a thickness of about 10 m, which is also a potassium borosilicate glass. The grid 24 is provided such that the first surface 24a is in surface contact with the inner surface of the first substrate 10 via the getter film, the methanol back 17, and the phosphor screen 16. The electron beam passage holes 26 formed in the grid 24 are provided with phosphor layers R, G, B, and It faces the electron-emitting device 18 on the second substrate 12. Thus, each electron-emitting device 18 faces the corresponding phosphor layer through the electron beam passage hole 26.

A plurality of spacers 30 are erected on the second surface 24b of the grid 24.

The extended end of each spacer 30 is in contact with the inner surface of the second substrate 12, here, the wiring 21 provided on the inner surface of the second substrate 12. Each of the spacers 30 is formed in a tapered taper shape in which the diameter of the grid-side power also decreases toward the extending end.

Each spacer 30 includes a large-diameter first step 50a and a second step 50b having a smaller diameter than the first step 50a, which are alternately stacked from the grid 24 toward the extending end. And the surface is formed as an uneven spacer. Here, each spacer 30 has two first step portions 50a and two second step portions 50b and is formed in four steps, and the height thereof is, for example, 1.4 mm. I have. The first step portion 50a serving as a convex portion has a substantially elliptical cross-sectional shape, and has a diameter of 1.4 mm x 0.35 mm. The second step portion 50b serving as a concave portion has a substantially elliptical cross-sectional shape, and has a diameter of 1.35 mm X 0.3 mm. Each height of the first and second steps 5 Oa and 50 b is formed to 0.35 mm. In the radial direction of the second spacer 30a, the maximum protrusion amount of the first step portion 50a with respect to the second step portion 50b is formed to be 100 m or less.

The spacer structure 22 configured as described above has a grid 24 in surface contact with the first substrate 10, and an extended end of the spacer 30 abutting on the inner surface of the second substrate 12. The atmospheric load applied to these substrates is supported, and the distance between the substrates is maintained at a predetermined value.

In the second embodiment, other configurations are the same as those of the above-described first embodiment, and the same portions are denoted by the same reference characters and detailed description thereof will not be repeated. The SED according to the second embodiment and its spacer structure 22 can be manufactured by the same manufacturing method as the manufacturing method according to the first embodiment. Also, in the second embodiment, the same operation and effect as those in the first embodiment can be obtained.

In the above-described embodiment, an ultraviolet curable material is used as the spacer forming material. However, a thermosetting type spacer forming material may be used. That is, as the spacer forming material 46, for example, a glass paste containing a thermosetting binder and a glass filler can be used. In this case, similarly to the above-described first embodiment, after filling the spacer forming material 46 into the spacer forming holes of the upper die 36a and the lower die 36b, the grid 24, the upper die 36a and the lower die 36a are formed. The assembly 42 is formed using the mold 36b. Subsequently, after the assembly 42 is heated to harden the spacer forming material, the upper mold 36a and the lower mold 36b are separated from the grid 24.

Next, the grid 24 on which the spacer forming material 46 is installed is heat-treated in a heating furnace, and the inner force of the spacer forming material is also reduced by blowing off the binder. Mainly bake the spacer forming material for 1 hour. As a result, a spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.

In the case of this method, when the spacer forming material 46 is heated and hardened, the difference between the temperature distribution and the coefficient of thermal expansion of the grid 24, the upper mold 36a, and the lower mold 36b causes a difference between the grid surface, the upper mold, and the lower surface. The surface is likely to be misaligned in the surface direction. However, according to the present embodiment, in upper die 36a and lower die 36b, hole forming portions 56a and 56b provided around spacer forming holes 40a and 40b are formed of silicone as an elastic material. I have. Therefore, even when the grid and the mold are misaligned in the surface direction, the load acting on the heat-cured spacer forming material 46 is reduced by the elastic deformation of the hole forming portions 56a and 56b. Can be absorbed. Therefore, when heating and curing the spacer-forming material, rapid heating and rapid cooling are possible, and the production efficiency can be improved.

[0048] The present invention is not limited to the above-described embodiment as it is, and may be embodied by modifying the constituent elements in an implementation stage without departing from the scope of the invention. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiment. For example, some components, such as all the components shown in the embodiment, may be deleted. Furthermore, constituent elements over different embodiments may be appropriately combined.

[0049] The diameter, height, number of steps, dimensions, materials, and the like of the spacer can be appropriately selected as required without being limited to the above-described embodiment. The present invention is not limited to the one using a surface conduction electron-emitting device as an electron source, but is also applicable to an image display device using another electron source such as a field emission type or a carbon nanotube.

In the above-described first embodiment, the first and second spacers of the spacer structure are each formed into an uneven shape having first and second step portions. Nozomi Only one of them may have an uneven shape. The cross-sectional shape of the first step portion and the second step portion of the spacer is not limited to the elliptical shape, and may be other shapes.Furthermore, the first step portion and the second step portion may be formed in different cross-sectional shapes. Is also good.

Industrial applicability

According to the present invention, it is possible to suppress the collision of the reflected electrons and the secondary electrons with the spacer surface, and to suppress the reduction of the discharge withstand voltage and the shift of the electron beam orbit due to the charging of the spacer. . Thereby, an image display device with improved withstand voltage characteristics and display quality can be obtained. Further, even when a spacer having the first and second step portions and having an uneven surface is formed, the mold can be easily released by elastic deformation of the hole forming portion, and the mold is melted. No need. Therefore, a spacer structure used for an image display device which does not cause damage or contamination of the spacer can be manufactured at low cost.

Claims

The scope of the claims

[1] a first substrate on which an image display surface is formed,

A second substrate provided with a plurality of electron emission sources that are opposed to the first substrate with a predetermined gap therebetween and excite the image display surface;

A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates,

The spacer structure faces the first and second substrates, and has a plate-like grid having a plurality of electron beam passage holes facing the electron emission source, and at least one of the grids. A plurality of spacers erected on the surface of the first and second spacers, wherein the spacers have a large-diameter first step portion and a second spacer that are alternately stacked from the grid toward the extending end. An image display device having a second step portion having a smaller diameter than the first step portion.

[2] The grid has a first surface facing the first substrate, and a second surface facing the second substrate, and the spacer is erected on the first surface. A plurality of first spacers, and a plurality of second spacers erected on the second surface, wherein at least one of the first and second spacers includes the first and second spacers. 2. The image display device according to claim 1, further comprising a second step portion.

[3] The grid has a first surface in contact with the first substrate, and a second surface facing the second substrate, and the spacer is erected on the second surface. The image display device according to claim 1, wherein

4. The image display device according to claim 1, wherein a maximum protrusion amount of the second step portion with respect to the first step portion is formed to be 100 m or less in a radial direction of the spacer.

[5] A plate-like grid having a plurality of beam passage holes, and a large-diameter second grid erected on the surface of the grid and alternately stacked with a force directed from the grid to an extending end. A plurality of spacers having a first step portion and a second step portion having a smaller diameter than the first step portion, and a method of manufacturing a spacer structure used in an image display device.

Prepare a plate-like grid with multiple beam passage holes formed,

A plurality of spacer forming holes and a spacer forming hole which is located around each spacer forming hole and has first and second steps corresponding to the spacers are defined and elastically deformed. Yes A mold having a plurality of hole forming portions formed of a functional ultraviolet ray transmitting material is prepared, and each spacer forming hole of the mold is filled with a spacer forming material having ultraviolet curability. And

A method of manufacturing a spacer structure, wherein the mold is released from the grid while elastically deforming the hole forming portion, and the hardened spacer forming material is placed on the grid.

6. The method for producing a spacer structure according to claim 5, wherein a glass paste containing at least a UV-curable binder and a glass filler is used as the spacer forming material.

[7] A plate-shaped grid having a plurality of beam passage holes, and a large-diameter second grid which is erected on the surface of the grid and alternately stacked with a force directed from the grid to an extending end. A plurality of spacers having a first step portion and a second step portion having a smaller diameter than the first step portion, and a method of manufacturing a spacer structure used in an image display device.

Prepare a plate-like grid with multiple beam passage holes formed,

A plurality of spacer forming holes and a spacer forming hole which is located around each spacer forming hole and has first and second steps corresponding to the spacers are defined and elastically deformed. Prepare a mold having a plurality of hole forming portions formed of a possible material,

Each spacer forming hole of the mold is filled with a thermosetting spacer forming material, and the mold filled with the spacer forming material is brought into close contact with the surface of the grid to form a mold. And an assembly consisting of a grid and

Heating and curing the filled spacer forming material,

8. The method for producing a spacer structure according to claim 5, wherein the spacer forming material is fired after releasing the mold. The method for producing a spacer structure according to claim 5, wherein a metal plate having an oxide film formed on a surface thereof is used as the grid.