WO2004030010A1

WO2004030010A1 - Image-displaying device, method of producing spacer used for image-displaying device, and image-displaying device with the spacer produced by the method

Info

Publication number: WO2004030010A1
Application number: PCT/JP2003/012248
Authority: WO
Inventors: Shigeo Takenaka; Masaru Nikaido; Satoshi Ishikawa; Satoko Oyaizu
Original assignee: Kabushiki Kaisha Toshiba
Priority date: 2002-09-27
Filing date: 2003-09-25
Publication date: 2004-04-08
Also published as: JP2004119296A; TW200414795A; CN1685463A; EP1544892A1; TWI241147B; KR100691580B1; KR20050053686A

Abstract

An image-displaying device has a first substrate (10) with a fluorescent face and a second substrate. The second substrate is provided spaced apart from and opposite the first substrate, and has electron sources (18) on it. Between the first and second substrates are spacers (30a, 30b) for supporting a load of atmospheric pressure acting on the substrates. The tip portion of the first substrate of and that of the second substrate of each of the spacers are impregnated with an electric conductive material to form electric conductivity-applying portions (31a, 31b), respectively.

Description

Specification

Image display device, method of manufacturing spacer used for image display device, and image display device including spacer manufactured by the manufacturing method

Technical field

The present invention relates to an image display device comprising: a substrate disposed to face, and a plurality of electron sources disposed on an inner surface of one of the substrates; a method of manufacturing a spacer used in the image display device; And image display device provided with a spacer manufactured by the above manufacturing method

In recent years, there has been a demand for a high-definition broadcast or a high-resolution image display device accompanying the high-definition broadcast, and further severe screen display performance has been demanded. To meet these demands, it is necessary to flatten the screen surface and increase the resolution. At the same time, it is necessary to reduce the weight and thickness.

As an image display device that satisfies the above demands, for example, a flat display device such as a field emission display (hereinafter referred to as FED) has been receiving attention. . This FED has a first base plant and a second substrate that are opposed to each other with a predetermined gap. These substrates are joined to each other directly or via a rectangular frame-like side wall to form a vacuum envelope. A phosphor layer for displaying images is formed on the inner surface of the first substrate, and a plurality of electron-emitting devices are provided on the inner surface of the second substrate as electron sources for exciting the phosphor layer to emit light. ing. To support the atmospheric load applied to the first and second substrates In addition, a plurality of spacers are provided as support members between these substrates. In this FED, when displaying an image, an anode voltage is applied to the phosphor layer, and the electron beam emitted from the electron-emitting device is accelerated by the anode voltage to collide with the phosphor layer. Accordingly, the phosphor emits light to display an image.

In such an FED, the size of the electron-emitting device is on the order of micrometer, and the distance between the first substrate and the second substrate can be set on the order of millimeter. . For this reason, FEDs have achieved higher resolution, lighter weight, and thinner image display devices compared to cathode ray tubes (CRTs) used today for televisions and computer displays. It is possible to do it.

In order to obtain practical display characteristics in the above-described image display device, it is desirable to use a phosphor similar to a normal cathode ray tube and set the anode voltage to several kV or more. New However, the gap between the first substrate and the second substrate cannot be made so large from the viewpoint of resolution, characteristics of support members, manufacturability, etc., and needs to be set to about 1 to 3 mm. There is. Therefore, when electrons emitted from the second substrate collide with the phosphor screen formed on the first substrate, secondary electrons and reflected electrons are emitted, and these secondary electrons and reflected electrons are distributed between the substrates. Collide with the installed spacer. As a result, the spacer becomes charged. In general, at the accelerating voltage in the FED, the spacer is positively charged, and the electron beam emitted from the electron-emitting device is attracted to the spacer and deviates from its original orbit. As a result, the electron beam is There is a problem that the image mis-landing occurs and the color purity of the displayed image is degraded.

In order to reduce the attraction of the electron beam by such a spacer, it is conceivable to perform a conductive treatment on all or part of the surface of the spacer to release the charge. For example, U.S. Pat. No. 5,726,529 discloses a structure in which a conductive treatment is applied to an end of an insulating spacer on the second substrate side to release the charge of the spacer. It has been.

However, when conductive treatment is performed on the spacer, the reactive current flowing from the first substrate to the second substrate via the spacer increases, causing an increase in temperature and an increase in power consumption. In addition, it is difficult to avoid an increase in manufacturing cost by the conventional conductive processing method.

Disclosure of the invention

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and its object is to prevent an electron beam from being dislocated and improve an image quality of an image display device, and a method of manufacturing a spacer used in the image display device. Another object of the present invention is to provide an image display device including a spacer manufactured by the above manufacturing method.

In order to achieve the above object, an image display device according to an aspect of the present invention comprises: a first substrate having a phosphor screen; a first substrate having a gap between the first substrate; Between the first substrate and the second substrate, each of which is provided with a plurality of electron sources for emitting light to excite the phosphor surface, and each of which is formed of an insulating material. Atmosphere installed and acting on the first and second substrates A plurality of spacers for supporting a pressure load, and a tip of the spacer on the first substrate side and a tip of the second substrate side are impregnated with a conductive material, and each of the spacers has a conductivity imparting portion. Is formed.

According to the image display device having the above configuration, electrons emitted from the electron source located near the spacer are repelled by the electric field formed by the conductivity imparting portions located at both ends of the spacer. Then, after taking a trajectory away from the spacer, it is sucked by the spacer and follows a trajectory in a direction approaching the spacer. The repulsion and the suction cancel out the orbital deviation of the electrons, and the electrons emitted from the electron source finally reach the target position on the image display surface. As a result, it is possible to obtain an image display device in which deterioration of color purity due to electron mislanding is reduced and image quality is improved. Further, it is possible to suppress an increase in temperature and an increase in power consumption as compared with a case where the spacer is made to have conductivity.

A method of manufacturing a spacer for an image display device according to another aspect of the present invention includes forming a spacer from an insulating material, and forming a conductive component at a tip end of the formed spacer. The paste or the solution containing is adhered, and the paste or the solution is impregnated into the tip of the spacer by a capillary phenomenon, and the spacer impregnated with the paste or the solution is fired. Then, a spacer having a conductivity imparting portion impregnated with a conductive material at a tip portion is formed. Further, in a method for manufacturing a spacer according to another aspect of the present invention, a spacer is formed from an insulating material, and a tip containing a conductive component is provided at a tip end of the formed spacer. And heat-treats the spacer to which the paste has adhered to improve conductivity. The component is thermally diffused into the tip portion of the spacer to form a spacer having a conductivity imparting portion impregnated with a conductive material at the tip portion.

According to still another aspect of the present invention, there is provided a spacer manufacturing method comprising: preparing a mold having a plurality of through holes for forming a spacer; and providing a first base not containing a conductive component. A second paste in which a conductive component is dispersed is superimposed on the first paste and injected into the through-hole, and the first and second pastes are heat-treated. Then, a spacer having a conductivity imparting portion in which a component having conductivity is dispersed is formed at a tip end portion.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing a surface conduction electron-emitting device (hereinafter, referred to as SED) according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the above SED taken along line II_II of FIG.

FIG. 3 is an enlarged sectional view showing the above SED.

FIG. 4 is a cross-sectional view showing a state in which the first and second dies are mounted on a dalid in the manufacturing process of the spacer used for the SED. FIG. FIG. 4 is a cross-sectional view showing a state in which UV irradiation and silver paste have been applied after filling the forming material.

6, in the manufacturing process, cross-sectional view showing a state in which release the upper ¹ Kikin type.

FIG. 7 is a cross-sectional view showing a spacer manufacturing method for an SED according to a second embodiment of the present invention. FIG. 8 is a cross-sectional view showing a step of applying a solution containing a conductive component to the tip of the spacer in the spacer manufacturing method according to the second embodiment.

FIG. 9 is a cross-sectional view showing a spacer manufacturing method for an SED according to a third embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a state in which a mold is filled with a first paste and a second paste in the spacer manufacturing method according to the third embodiment.

FIG. 11 is a cross-sectional view showing a state in which a mold is released and fired in the spacer manufacturing method according to the third embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment in which the present invention is applied to an SED, which is a type of FED, as a planar image display device will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 3, this SED has a first substrate 10 and a second substrate 12 each made of a rectangular glass as a transparent insulating substrate. They are arranged facing each other with a gap of 0.0 to 2.0 mm. The second substrate 12 is formed to have a slightly larger dimension than the first substrate 10. The first substrate 10 and the second substrate 12 are joined to each other via a rectangular frame-shaped side wall 14 made of glass, and are flat, rectangular outer vacuums whose inside is maintained in a vacuum. Enclosure 15 is composed.

On the inner surface of the first substrate 10, a phosphor screen 16 is formed as a phosphor screen. Phosphor screen 16 has phosphor layers R, G, B, and black that emit red, green, and blue light due to the impact of electrons. It is configured by arranging color light-shielding layers 11. The phosphor layers R, G, and B are formed in a strip shape or a dot shape. On the phosphor screen 16, a metal pack 17 made of aluminum or the like is formed. A transparent conductive film or a color filter film made of, for example, ITO may be provided between the first substrate 10 and the phosphor screen 16.

On the inner surface of the second substrate 12, a number of surface conduction type electrons each emitting an electron beam serve as an electron source for exciting the phosphor layers R, G, and B of the phosphor screen 16. An emission element 18 is provided. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each of the electron-emitting devices 1'8 includes an electron-emitting portion (not shown), a pair of device electrodes for applying a voltage to the electron-emitting portion, and the like. On the inner surface of the second substrate 12, a large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix, and the ends of the wirings 21 are provided outside the vacuum envelope 15. Has been withdrawn.

The side wall 14 functioning as a joining member is made of, for example, a sealing material 20 such as a low-melting-point glass or a low-melting-point metal to form a peripheral portion of the first substrate 10 and a peripheral portion of the second substrate 12. The first substrate and the second substrate are bonded to each other.

As shown in FIGS. 2 and 3, the SED includes a spacer assembly 22 disposed between a first substrate 10 and a second substrate 12. In the present embodiment, the spacer assembly 22 includes a plate-shaped grid 24 and a plurality of columnar spacers integrally provided on both sides of the grid. Have. More specifically, the grid 24 has a first surface 24 a facing the inner surface of the first substrate 10 and a second surface 24 b facing the inner surface of the second substrate 12. It is arranged in parallel with the substrate. In the grid 24, a large number of electron beam passage holes 2'6 and a plurality of spacer openings 28 are formed by etching or the like. The electron beam passage holes 26 are arranged to face the electron-emitting devices 18 respectively, and transmit the electron beam emitted from the electron-emitting devices. The spacer openings 28 are located between the electron beam passage holes 26 and are arranged at a predetermined pitch.

The dalide 24 is formed of, for example, an iron-nickel metal plate to a thickness of 0.1 to 0.25 mm. On the surface of the grid 2 4, oxide film consisting of elements constituting the metal plate, for example, F e 3 〇 4, i F e ₂ 〇 oxide film made of 4 that is formed. A high-resistance film is formed on at least the surface of the second substrate on the side of the Darlid 24. The high-resistance film is formed by applying a high-resistance material made of glass, ceramic, or the like to the surface of the dalide and baking it. The resistance of the high resistance film is set to Ε + 8 Ω Ζ or more.

The electron beam passage hole 26 is formed in a rectangular shape of, for example, 0.15 to 0.25 mm X 0.15 to 0.25 mm, and the spacer opening 28 has a diameter of, for example, It is formed in a circular shape of about 0.2 to 0.5 mm. The high-resistance film described above is also formed on the wall surface defining the electron beam passage hole 26.

On the first surface 24 a of the dalid 24, a first spacer 30 a is provided standing upright so as to overlap with each spacer opening 28. The extended end of the first spacer 30a is in contact with the inner surface of the first substrate 10 via the black backing layer 11 of the metal back 17 and the phosphor screen 16. ing. On the second surface 24 b of the grid 24, a second spacer 30 b is physically erected so as to overlap with each spacer opening 28, and its extending end is It is in contact with the inner surface of the second substrate 12. The extending end of each second spacer 3 Ob is located on the wiring 21 provided on the inner surface of the second substrate 12.

The first and second spacers 30a and 30b are formed of an insulating material. The distal end of the first spacer 30a and the distal end of the second spacer 30b are impregnated with a conductive material to form conductive applying sections 31a and 31b, respectively. In each of the conductivity imparting sections 31a and 31b, the concentration of the conductive material gradually increases from the tip of the spacer toward the middle, that is, toward the grid 24. is decreasing.

As described later, the conductivity imparting portions 31 a and 3 lb separate the electron beam emitted from the electron emitting element 18 from the first and second spacers 30 a and 30 b. An electric field is formed to repel in the direction. For example, Ni, In, Ag, Au, PtIr, Ru, W, or the like is used as the conductive material contained in each of the conductivity imparting portions 31a and 3lb. be able to. The height of the conductivity imparting portions 31a and 31b and the concentration of the conductive material are arbitrarily determined in consideration of the repulsive force applied to the electron beam, that is, the amount of orbital correction of the electron beam. Is set.

Each of the first and second spacers 30a, 30b has an extended end from the grid 24 side, that is, the diameter decreases toward the tip. It is formed in a tapered tapered shape. For example, each of the first spacers 30a has a base diameter of about 0.4 mm, a tip diameter of about 0.3 mm, and a height of about 0.6 mm located on the grid 24 side. It is formed in. Each of the second spacers 30b has a base diameter of about 0.4 mm, a tip diameter of about 0.25 mm, and a height of about 0.8 mm located on the grid 24 side. Is formed. As described above, the height of the first spacer 30a is formed to be lower than the height of the second spacer 3Ob.

The surface resistance of the first spacer 30a and the second spacer 30b is 5 × 10 13 Ω. Each spacer opening 28, the first and second spacers 30 a, 30 b are located in alignment with each other, and the first and second spacers are located in this spacer opening 2. 8 and are integrally connected to each other. As a result, the first and second spacers 30a and 30b are formed integrally with the grid 24 with the grid 24 sandwiched from the double-sided force. .

The spacer assembly 22 configured as described above is disposed between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b are brought into contact with the inner surfaces of the first substrate 10 and the second substrate 12 so as to act on these substrates. It supports atmospheric pressure loads and maintains the spacing between substrates at a predetermined value.

As shown in FIG. 2, the SED includes a voltage supply unit (not shown) for applying a voltage to the grid 24 and the metal back 17 of the first substrate 10. This voltage supply is connected to the grid 24 and the metal back 17, respectively. Apply 12 kV to 24 and 12 kV or less to metal pack 17. The voltage applied to the grid 24 is set to be equal to or higher than the voltage applied to the first substrate 10.

In this SED, when displaying an image, the phosphor screen 16 and the metal back 17 apply an anode voltage B to the anode screen, and emit the electron beam B emitted from the electron-emitting device 18 to the anode. It is accelerated by the voltage and collided with the phosphor screen 16. As a result, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image is displayed.

Next, a method of manufacturing the SED configured as described above will be described. When manufacturing the spacer assembly 22, first, a dalid 24 having a predetermined dimension, first and second molds 36 a having a rectangular plate shape having substantially the same dimensions as the dalid, Prepare 36b In this case, Fe_45 to 55% Ni, etc.A thin plate with a thickness of 0.12 mm is degreased, washed, dried, and then passed through an electron beam by etching. A hole 26 and a spacer opening 28 are formed to form a dalide 24. Thereafter, the entire grid 24 is oxidized by an oxidation process, and an insulating film is formed on the grid surface including the inner surfaces of the electron beam passage holes 26 and the spacer openings 28. Further, a liquid in which fine particles of tin oxide and antimony oxide are dispersed is spray-coated on the insulating film, and the liquid is dried and fired to form a high-resistance film.

As shown in FIG. 4, the first and second molds 36a and 36b functioning as molds have through holes 38a and 38b for forming spacers. Each of these holes is a spacer in grid 24 It is arranged corresponding to the opening 28. In the first mold 36a and the second mold 36b, at least the inner surfaces of the through holes 38a and 38b are coated with a resin that is thermally decomposed by heat treatment.

With the first mold 36a positioned so as to be aligned with the spacer opening 28 of each through hole 38a, the first surface 24a of the dalid is positioned. In close contact. Similarly, the second die 36 is positioned so that the second mold 36 b is aligned with the spacer opening 28 of the through hole 38 d of the through hole 38 b. Closely contact 2 4 b. The first mold 36a, the grid 24, and the second mold 36b are fixed to each other using a clamper (not shown).

Next, for example, a paste-shaped spacer forming material 40 is supplied from the outer surface side of the first mold 36 a, and the through holes 38 a and the grid 24 of the first mold are supplied. The spacer forming material 40 is filled in the spacer opening 28 and the through hole 38b of the second mold 36b. As the spacer forming material 40, an insulating glass paste containing a UV-curable binder (organic component) and a glass filler is used.

Subsequently, an ultraviolet ray (hereinafter, referred to as UV) is applied to the filled spacer forming material 40 from the outer surface side of the first and second molds 36a and 36b as radiation. Irradiate to UV cure the spacer forming material. Thereafter, heat curing may be performed as necessary. Next, the resin applied to the through holes 38a, 38b of the first and second molds 36a, 36b is thermally decomposed by heat treatment, as shown in FIG. A gap is created between the spacer forming material 40 and the through hole. At both ends of each spacer forming material 40, that is, the first spacer Only the tip of the portion to be 30a and the tip of the portion to be the second spacer 30b, for example, silver paste as a conductive material by a screen printing method 4 2 To adhere. Thereafter, the first and second molds 36a and 36b are released from the Darido 24 force. Subsequently, the dalide 24 formed with the first and second spacers 30a and 30b by the spacer forming material 40 is heat-treated in a heating furnace, and the spacer is formed. After the binder is blown out of the substrate forming material, the spacer forming material and silver paste 42 are finally fired at about 500 to 550 ° C for 30 minutes to 1 hour. As a result, as shown in FIG. 6, the spacer assembly 22 in which the first and second spacers 30a and 30b are formed on the Darlid 24 is formed. Is obtained. At the same time, the silver component in the silver paste 42 diffuses over a range of about 0.15 mm in the tips of the first and second spacers 30a and 30b. As a result, the first and second spacers 30a, which are provided with the conductivity-imparting portions 3.1a and 31b each containing silver at the tip as a bulda, that is, integrally provided, are provided. 30 b is obtained.

On the other hand, the first substrate 10 on which the phosphor screen 16 and the metal knock 17 are provided, the electron-emitting device 18 and the wiring 21 are provided in advance. And a second substrate 12 to which the side wall 14 is bonded.

Subsequently, the spacer assembly 22 configured as described above is positioned and arranged on the second substrate 12. At this time, the spacer assembly 22 is positioned so that the extending ends of the second spacers 30b are respectively arranged on the wirings 21. In this state, The first substrate 10, the second substrate 12, and the spacer assembly 22 are arranged in a vacuum chamber, and the inside of the vacuum chamber is evacuated. The substrate is bonded to the second substrate. This produces £ 0 with Sussa Assembly 22.

According to the SED configured as described above, as shown in FIG. 3, the electron beam B emitted from the electron-emitting device 18 located near the second spacer 30 b is The electron beam passing hole 2 is repelled by the electric field formed by the conductivity imparting portion 31b constituting the tip of the spacer 30b, and follows an orbit away from the second spacer. Go to 6. The electron beam B is then attracted by the charged second spacer 30 Ob and the first spacer 30a, and orbits in the direction approaching these spacers. The beam B is repelled by the electric field formed by the conductivity imparting portion 31 a constituting the tip of the first spacer 30 a, and takes a trajectory in a direction away from the first spacer 30. Work on screen 16. The repulsion and the suction cancel the orbital deviation of the electron beam B, and the electron beam B emitted from the electron-emitting device 18 finally emits the target fluorescent light of the phosphor screen 16. Reach the light body layer.

The smaller the distance between the electron-emitting device 18 and the spacer, the greater the amount of movement of the electron beam to the spacer side. Conversely, if the distance between the electron-emitting device and the spacer is sufficiently large, The amount of movement of the electron beam to the spacer is negligible. The electron beam movement phenomenon is caused by secondary electrons and reflected electrons generated on the phosphor screen. This occurs when the sensor collides with the sensor and the sensor is charged. In the case of the accelerating voltage used in the SED, the secondary electron emission coefficient on the surface of the spacer becomes 1 or more, the spacer side wall becomes positively charged, and the electron beam is attracted to the spacer side. It will be.

In this SED, rather than letting the spacers escape, the tip of the first spacer 30a on the first substrate 10 side and the second substrate 12b of the second spacer 30b do not. By providing the conductivity imparting portions 31a and 31b at the tip portions on the sides, an electric field is formed that repels the electron beam in a direction away from the spacer. By controlling the height of the conductive imparting portions 31a and 3lb, it is possible to change the strength of the electric field and control the amount of repulsion.

Therefore, according to this SED, the first and second spacers 30a and 30b are charged, and even if the electron beam B is attracted by these spacers, the orbit of the electron beam Displacement can be prevented. As a result, mislanding of the electron beam B is prevented, deterioration in color purity is reduced, and an SED with improved image quality is obtained.

Among the conductivity-imparting portions provided on the spacer, the conductivity-imparting portion 31b on the second substrate 12 side is close to the emission side of the electron beam. The formed electric field has a large effect on the trajectory of the electron beam. That is, the electron beam has high sensitivity to the electric field formed by the conductivity imparting section 31b. Therefore, if the height of the conductivity imparting portion 31b from the second substrate 12 slightly changes, the trajectory of the electron beam greatly changes. For this reason, only the conductivity imparting portion 3 1 b on the second substrate side is used. When trying to control the trajectory of the electron beam, if the height of the conductive portion 31b fluctuates during the manufacturing process, the difference in the amount of movement between the electron beams emitted from the plurality of electron-emitting devices will increase. This makes it difficult to control the electron beam trajectory accurately.

However, according to the SED according to the present embodiment, the conductivity imparting portions 31a are provided at the tip portions of both the first spacer 30a and the second spacer 30b. , 31b to reduce the effect of the conductivity imparting section 31b on the electron beam trajectory, and to compensate for the lack of trajectory correction by the low sensitivity conductivity imparting section 31a. I have. This makes it possible to easily and correctly control the electron beam trajectory.

Thereby, the manufacturing accuracy of the conductivity imparting portions 31a and 31b is reduced, and the conductivity imparting portions 31a and 31b can be easily manufactured. That is, by providing the conductivity imparting portion at both the tip portions of the first and second spacers 30a and 30b, the conductivity imparting portion can be provided only on the second substrate 12 side. It is possible to easily obtain the same effect as in the case where the precision is provided.

When the entire first and second spacers 30a and 30b are subjected to conductive treatment, the reactive current flowing from the first substrate 10 to the second substrate 12 via the spacer increases, and the temperature increases. And power consumption. In addition, during the operation of the SED, the conductive processing portion may be a source of gas, and may cause an ion impact of the electron-emitting device disposed near the spacer.

On the other hand, according to the present embodiment, the conductivity imparting portions 31a, 31b are provided at the tips of the first and second spacers 30a, 30b. Is formed, and the entire spacer is made up of the conductive part, the insulating part, and the conductive part.

It has a three-stage structure. As a result, the electric field around the spacer is changed by the conductivity applying portions 31a and 31b without causing an increase in reactive current, an increase in temperature, an increase in power consumption, and an ion collision. The trajectory of the electron beam can be controlled easily and accurately.

An SED according to the present embodiment and an SED provided with a spacer not having the above-described conductivity imparting portions 31a31b were prepared, and the movement amounts of the electron beams were compared. As a result, the electron beam was suctioned to the spacer side by about 120 μm in the SED without the conductivity imparting portions 31a and 31b, whereas in the SED according to the present embodiment, The movement amount of the electron beam was ± 20 im, and the color purity of the displayed image was also improved.

According to the present SED, the height of the first spacer 30a is equal to the height of the first spacer 30a, even when the daride 24 is disposed between the first substrate 10 and the second substrate 12. It is formed lower than the height of 2 spacer 3 Ob. As a result, the grid 24 is located closer to the first substrate 10 than the second substrate 12 is. Therefore, even if a discharge occurs from the first substrate 10 side, the grid 24 can suppress the discharge damage of the electron-emitting device 18 provided on the second substrate 12. It will be possible. Therefore, it is possible to obtain an SED having excellent withstand voltage against discharge and improved image quality.

According to the SED having the above-described configuration, the height of the first spacer 30a is made lower than that of the second spacer 30b, so that the voltage applied to the Greater than the voltage applied to the first substrate 10 Even when the size is reduced, the electrons generated from the electron-emitting devices 18 can reliably reach the phosphor screen side.

Next, a method of manufacturing the spacer according to the second embodiment of the present invention will be described. A grid 24 of a predetermined size is formed by the same method as in the first embodiment described above, and first and second molds 36a and 36b are prepared. Subsequently, as in the case shown in FIG. 4, the first mold 36a is positioned so that each through hole 38a is aligned with the spacer opening 28 of the grid 24. In this state, it is brought into close contact with the first surface 24a of the dalid. Similarly, with the second mold 36 b positioned so that each through hole 38 b is aligned with the spacer opening 28 of the dalide 24, the second surface of the dalide is positioned. 2 Close to 4 b. Then, the first mold 36a, the grid 24, and the second mold 36b are fixed to each other using a clamper (not shown).

Next, for example, a paste-shaped spacer forming material 40 is supplied from the outer surface side of the first mold 36 a, and the through holes 38 a and the grid 24 of the first mold are supplied. The spacer forming material 40 is filled in the spacer opening 28 and the through hole 38b of the second mold '36b. As the spacer forming material 40, an insulating glass paste containing a UV-curable binder (organic component) and a glass filler is used.

Subsequently, the filled spacer forming material 40 is irradiated with UV from the outer surface side of the first and second molds 36a and 36b, and the spacer forming material is UV-cured. . Thereafter, heat curing may be performed if necessary. Next, the first and second gold The resin applied to the through holes 38a and 38b of the molds 36a and 36b is thermally decomposed, and as shown in Fig. 7, the space between the spacer forming material 40 and the through holes is formed. Make a gap. Thereafter, the first and second molds 36 a and 36 b are released from the darlid 24.

Subsequently, the dalide 24 formed with the first and second spacers 30a and 30b by the spacer forming material 40 is heat-treated in a heating furnace to form a spacer. The binder is removed from the material to form the binder and debinding is performed. Then, as shown in FIG. 8, the spacer forming material 40 is in a porous state before sintering, and the tip of the first spacer 30a and the second spacer 30b are formed. A solution consisting of ultrafine silver particles and an etradecane solution is adhered to only the tip of the solution by, for example, an ink jet. The attached solution permeates about 0.2 mm into the tips of the first and second spacers 30a and 30b by capillary action.

Next, the grid 24 on which the first and second spacers 30a and 30b are formed is placed in a heating furnace, and is heated at about 500 to 550 ° C for 30 minutes to 30 ° C. Main firing for 1 hour. By this firing, the glass particles constituting the spacer forming material are integrated, and the first and second spacers 30a and 30b are formed on the dalide 24. We get the Asa Sempri 22. At the same time, the first and second spacers 30a, 30B having silver-containing conductivity-imparting portions 31a, 31b as tips are obtained.

Then, by assembling the first substrate 10, the spacer assembly 22, and the second substrate by the same method as in the first embodiment, the spacer assembly is assembled. SED force S with 2 2 can get.

An SED according to the present embodiment and an SED provided with a spacer without the above-described conductivity imparting portions 31a and 31b were prepared, and the movement amount of the electron beam was compared. As a result, in the SED without the conductivity imparting sections 31a and 31b, the electron beam was sucked about 120 ni toward the spacer, whereas in the SED according to the present embodiment, The movement amount of the electron beam was ± 20 m, and the color purity of the displayed image was also improved.

The other configuration is the same as that of the first embodiment described above, and the same portions are denoted by the same reference characters and detailed description thereof will not be repeated. The same operation and effect as in the first embodiment can also be obtained in an SED provided with a spacer manufactured by the manufacturing method according to the second embodiment.

Next, a method of manufacturing the spacer according to the third embodiment of the present invention will be described. By the same method as in the first embodiment, a dalide 24 is formed, and first and second molds 36a and 36b are prepared. Subsequently, as shown in FIG. 9, the first mold 36a is positioned so as to be aligned with the spacer opening 28 of each through-hole 38a force S-grid 24. Use to make close contact with the first surface 24a of the dalide. Similarly, the second mold 36 b is positioned so as to be aligned with the spacer opening 28 of each through hole 38 b force S-grid 24, and the second die 36 d is positioned. 2 Adhere to the surface 2 4 b. Then, the first mold 36a, the grid 24, and the second mold 36b are fixed to each other using a clamper (not shown).

Next, for example, a spacer is formed from the outer surface side of the first mold 36a. The first paste 40a is supplied as the material, and the through hole 38a of the first mold, the spacer opening 28 of the dalide 24, and the second mold 36b The spacer forming material 40 is filled in the through holes 38b. At this time, a space is left at the end of the through hole 38a and at the end of the through hole 38b without filling the first paste 40a. As the first paste 40a, an insulating glass paste containing a UV-curable binder and a glass filler is used, and a paste containing no conductive component is used.

Subsequently, a second paste 40b is supplied as a spacer forming material from the outer surface side of the first mold 36a and the second mold 36b, and the paste is superimposed on the first paste. Inject into the ends of the holes 38a, 38b. As the second paste 40b, Au-cured binders (organic components) and Au particles diffuse as glass-filled and conductive components. Use the pasted glass paste.

Subsequently, the filled first and second pastes 40a and 40b are irradiated with UV from the outer surface side force of the first and second molds 36a and 36b, and the first and second molds 36a and 36b are irradiated with UV light. UV curing the second paste. Thereafter, heat curing may be performed if necessary. Next, the resin applied to the through holes 38a38b of the first and second molds 36a, 36b is thermally decomposed by heat treatment, and the first and second molds 36a, 36b are thermally decomposed. Make a gap between the paste 40a, 40b and the through hole. Thereafter, the first and second molds 36 a and 36 b are released from the darlid 24.

After demolding, the first and second pastes 40a and 40b Dali with molded first and second spacers 30a and 30b

24 is heat-treated in a heating furnace, and the binder is removed from the first and second pastes to remove the binder. Further, the first and second pastes 40a and 40b are main-baked at about 500 to 550 ° C for 30 minutes to 1 hour. As a result, as shown in FIG. 11, the first and second spacers 30 a, 3 Ob force S are formed on the dalide 24, and the spacer assembly 22 is formed. Is obtained. At the same time, the conductivity imparting parts 3 1 a, 3

First and second spacers 30a, each having 1b as a parg,

30 b is obtained.

After that, by assembling the first substrate 10, the spacer assembly 22, and the second substrate by the same method as in the first embodiment, the spacer assembly 22 is provided. You get 3 £ 0.

An SED according to the present embodiment and an SED provided with a spacer without the above-described conductivity imparting portions 31a and 31b were prepared, and the movement amounts of the electron beams were compared. As a result, in the SED without the conductivity imparting portions 31a and 31b, the electron beam was sucked about 120 m toward the spacer, whereas in the SED according to the present embodiment. The movement amount of the electron beam became ± 20 μm, and the color purity of the displayed image was improved.

In the third embodiment, other configurations are the same as those of the above-described first embodiment, and the same portions are denoted by the same reference characters and will not be described in detail. Then, an SED provided with a spacer manufactured by the manufacturing method according to the third embodiment is provided. In this case, the same operation and effect as those of the first embodiment can be obtained.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, the present invention can be applied not only to an image display device having a grid but also to an image display device having no grid. In this case, a pillar-shaped or plate-shaped spacer formed integrally is used, and a conductivity imparting portion is integrally formed at the tip of the first substrate and the tip of the second substrate of each spacer. Thus, the same operation and effect as described above can be obtained.

In the present invention, the diameter and height of the spacer and the dimensions and materials of other components can be appropriately selected as needed. In the above-described embodiment, the end of the spacer on the second substrate side is provided on the wiring of the second substrate. However, the end is not limited to the wiring but may be provided on the second substrate at a position avoiding the electron-emitting device. It only has to be provided. The dalider aperture may be omitted.

When the potential of the darlid 24 and the potential of the first substrate are set to the same potential, the entire first spacer is impregnated with a conductive material, and the entire first spacer is used as a conductivity imparting portion. It can also be formed.

Furthermore, in the above-described embodiment, the configuration is such that the conductivity imparting portion is formed at the tip of the first and second spacers. However, according to the above-described manufacturing method, the tip of the second spacer is That is, a conductivity imparting portion may be formed only at the tip of the spacer on the second substrate side, and the SED may be configured using this spacer.

Electron sources are not limited to surface conduction electron-emitting devices, It can be applied to any type of FED using an electron source that emits electrons into a vacuum such as carbon nanotubes.

Industrial applicability

According to the present invention, an image display device having an improved image quality by easily controlling the trajectory of an electron beam without causing a rise in temperature, an increase in power consumption, and an increase in manufacturing cost. A method for manufacturing a spacer used for a display device, and an image display device including a spacer manufactured by the above manufacturing method can be provided.

Claims

The scope of the claims

1. a first substrate having a phosphor screen;

A second substrate provided with a plurality of electron sources for emitting electrons to excite the fluorescent screen while being opposed to the first substrate with a gap therebetween;

A plurality of spacers each formed of an insulating material and disposed between the first substrate and the second substrate and supporting an atmospheric pressure load acting on the first and second substrates; Prepare,

An image display device, wherein a tip of the spacer on the first substrate side and a tip of the second substrate side are impregnated with a conductive material to form a conductivity imparting portion.

2. The image display device according to claim 1, wherein the concentration of the conductive material in each of the conductivity imparting portions decreases from a tip end of the spacer toward an intermediate portion.

3. The spacer is formed of an insulating material including glass, and each of the conductivity imparting portions includes conductive metal particles dispersed in a glass component forming the spacer. The image display device according to claim 1 or 2.

4. The spacer is formed of an insulating material containing glass, and the conductivity imparting portion includes a metal component having conductivity diffused in a glass component forming the spacer. 3. The image display device according to 1 or 2.

5. The image display device according to claim 3, wherein the metal particles include at least one of Ni, In, Ag, Au, Pt, Ir, Ru, and W.

6. A plurality of potential supply wirings provided on the second substrate,

The image display device according to claim 1, wherein an end of each spacer on the second substrate side is arranged on the potential supply wiring.

7. The image display device according to claim 6, wherein the electron source is a surface conduction electron source.

8. The image display device according to claim 7, wherein the potential supply wiring is a wiring for supplying a potential to the electron source.

9. In addition to being provided between the first and second substrates, there is provided a plate-like dalid having a plurality of electron beam passage holes corresponding to the electron sources, respectively.

3. The image display device according to claim 1, wherein each of the spacers is fixed to the dalid.

10. A first substrate having a phosphor screen, and a plurality of electron sources that emit electrons and excite the phosphor screen are provided while being opposed to the first substrate with a gap therebetween. A second substrate, and a plurality of spacers disposed between the first substrate and the second substrate and supporting an atmospheric pressure load acting on the first and second substrates. In the process of producing spacer,

A spacer is formed from an insulating material,

A paste or solution containing a conductive component is attached to the tip of the formed spacer, and the paste or solution is impregnated into the tip of the spacer by a capillary phenomenon. Baking the spacer impregnated with the paste or solution, A method for producing a spacer, which forms a spacer having a tip provided with a conductivity imparting portion impregnated with a conductive material.

11. The paste is adhered to both ends of the molded spacer to form a spacer having a conductive material impregnated with a conductive material at both ends. A method for producing the spacer according to claim 10.

12. A first substrate having a phosphor screen, and a plurality of electron sources that emit electrons and excite the phosphor screen are provided in addition to being opposed to the first substrate with a gap therebetween. For use in an image display device comprising: a second substrate; and a plurality of spacers disposed between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates. In the method for producing a spacer to produce the spacer described above,

A spacer is formed from an insulating material,

Attach a paste containing a conductive component to the tip of the molded spacer,

The spacer to which the paste was adhered was subjected to a heat treatment to thermally diffuse the conductive component into the tip of the spacer, and the tip provided with a conductivity-imparting portion impregnated with a conductive material. A method of manufacturing a spacer that forms a spacer.

13. The spacer according to claim 12, wherein the paste is adhered to both ends of the molded spacer to form a spacer having a conductivity imparting portion impregnated with a conductive material at both ends. Manufacturing method of spacer.

14. A gap between the first substrate having the phosphor screen and the first substrate And a second substrate provided with a plurality of electron sources that emit electrons and excite the fluorescent surface, and are disposed between the first substrate and the second substrate. A plurality of spacers provided to support an atmospheric pressure load acting on the first and second substrates; and a spacer used in an image display device comprising: A mold having a plurality of through holes for

Injecting a first paste containing no conductive component into the through-hole,

A second paste in which a conductive component is dispersed is superimposed on the first paste and injected into the through-hole,

A method for producing a spacer, wherein the first and second pastes are subjected to a heat treatment to form a spacer having a leading end provided with a conductivity imparting portion in which a component having conductivity is dispersed.

15 5. After injecting the first paste into the through-hole, the second paste is injected from both ends of each through-hole on both ends of the first paste, and the conductive component is injected. 15. The spacer manufacturing method according to claim 14, wherein a spacer having dispersed conductive imparting portions at both ends is formed.

1 6. A first substrate having a phosphor screen,

A second substrate provided with a plurality of electron sources for emitting electrons to excite the phosphor screen while being opposed to the first substrate with a gap therebetween;

It is manufactured by the manufacturing method according to any one of claims 10 to 15, and is provided between the first substrate and the second substrate. A plurality of spacers for supporting an atmospheric pressure load acting on the first and second substrates;

An image display device comprising:

17. A plate-like dalid provided between the first and second substrates and having a plurality of electron beam passage holes respectively corresponding to the electron sources,

17. The image display device according to claim 16, wherein each spacer is fixed to the dalid.

18. A first substrate having a phosphor screen;

A plate-shaped grid provided between the first and second substrates and having a plurality of electron beam passage holes respectively corresponding to the electron sources;

It is manufactured by the manufacturing method according to any one of claims 10, 12, and 14, and is disposed between the first substrate and the second substrate. A plurality of spacers having the conductivity imparting portion at a tip portion located on the substrate side and supporting an atmospheric pressure load acting on the first and second substrates;

An image display device comprising: