TW200414795A - Image display device, manufacturing method of spacer used for image display device and image display device equipped with spacer manufactured by this method - Google Patents

Abstract

There are provided: A first substrate (10) having a phosphor screen, and a second substrate arranged in opposition to the first substrate with a gap and with a plurality of electron sources (18) fitted, and a plurality of spacers (30a), (30b) are fitted for supporting an atmospheric pressure load acting on the substrates. A tip part at the first substrate side and a tip part at the second substrate side of each spacer is impregnated with a conductive material, and each forms a conductivity-imparting part (31a), (31b).

Description

200414795 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a substrate having a relative arrangement; and an image display device having a plurality of electron sources arranged on the inner surface of the substrate, and the image display device used by the image display device. A method for manufacturing a spacer, and an image display device including the spacer manufactured by the above-mentioned manufacturing method.

[Prior Art] In recent years, high-definition image display devices for high-definition broadcasting or the like have been desired, and more severe performance is urgently demanded regarding the screen display performance. To meet these expectations, it is necessary to flatten the screen surface and increase the resolution. At the same time, it is necessary to reduce the weight and thickness of the screen.

Flat panel display devices such as field emission displays (hereinafter referred to as FED) that meet the above-mentioned expectations have attracted attention. This FED has a first substrate and a second substrate which are arranged oppositely while maintaining a specific gap. These substrates are connected to each other directly or through rectangular frame-shaped side walls to form a vacuum peripheral. A phosphor layer for image display is formed on the inner surface of the first substrate, and most electron emitting elements are provided on the inner surface of the second substrate as an electron source that excites the phosphor layer to emit light. In order to support the atmospheric pressure load applied to the first substrate and the second substrate, a plurality of spacers serving as a supporting member are arranged between the substrates. In this FED, when an image is displayed, an anode voltage is applied to the phosphor layer, and the anode voltage is used to accelerate the electron beam emitted from the electron emitting element to impinge on the phosphor layer, whereby the phosphor emits light to Display the image. -5- (2) 200414795 In this type of FED, the size of the electron emitting element is in the micron order, and the distance between the first substrate and the second substrate can be set in the micron order. Therefore, compared with a cathode ray tube (C R T) used as a display of a current television or computer in FED, it is possible to achieve higher resolution, lighter weight, and thinner image display devices.

In the video display device described above, in order to obtain practical display characteristics, it is desirable to use a phosphor similar to that of a normal cathode ray tube, and to set the anode voltage to several kV or more. However, the gap between the first substrate and the second substrate cannot be made too large due to the resolution, the characteristics of the supporting member, and the manufacturability, and it needs to be set to about 1 to 3 mm. Therefore, when the electrons emitted from the second substrate impinge on the fluorescent surface formed on the first substrate, secondary electrons and reflected electrons are emitted. These secondary electrons, reflected electrons, and the spacer disposed between the substrates are emitted. Shock. As a result, the spacer is charged. Generally, in the acceleration voltage of the FED, the spacer is positively charged, and the electron beam emitted by the electron emitting element is directed to the spacer and deviates from its original orbit. As a result, erroneous landing of the electron beam occurs in the phosphor layer, and there is a problem that the color purity of a displayed image is deteriorated. In order to reduce the attraction of the electron beam due to such a spacer, it may be considered to conduct a conductive treatment on all or a part of the surface of the spacer to avoid electrification. For example, in the detailed description of US Patent No. 5,726,529, there is disclosed a structure in which a conductive treatment is applied to a second substrate-side end portion of an insulating spacer to prevent the spacer from being charged. However, when the spacer is subjected to a conductive treatment, the reactive current flowing from the first substrate to the second substrate through the spacer increases, which causes a temperature rise or an increase in power consumption of -6-(3) 200414795. In addition, in the conventional conductive processing method, it is difficult to avoid an increase in manufacturing cost. [Summary of the Invention]

The present invention has been made in view of the foregoing points, and an object thereof is to provide an image display device that prevents the orbit of an electron beam from deviating from the “improved image quality”, a method of manufacturing a spacer used in the image display device, and Image display device for manufactured spacers.

In order to achieve the above object, an image display device according to an aspect of the present invention includes: a first substrate having a fluorescent surface; and a first substrate having a gap therebetween and disposed opposite to each other, and emitting electrons to excite the fluorescent surface. The second substrate of most of the electron sources; and an individual material formed of an insulating material, and arranged between the first substrate and the second substrate to support most of the spacers acting on the atmospheric pressure load of the first and second substrates. The front-end | tip part of the said 1st board | substrate side and the front-end | tip part of a 2nd board | substrate side of each spacer are impregnated with a conductive material, and respectively formed the conductive provision part. According to the image display device having the above structure, the electrons emitted from the electron source located near the spacer are repelled by the electric field formed by the conductivity imparting portions located at both ends of the spacer, and move away from the spacer. After obtaining the orbits, this time they are attracted by the spacers, the orbital deviations of the electrons cancel each other out, and the electrons emitted by the electron source finally reach the target position on the image display surface. Thereby, the degradation of color purity due to the erroneous landing of electrons is reduced, and an image display device with improved image quality can be obtained. In addition, it is possible to suppress an increase in temperature or an increase in power consumption as compared to making the spacer (4) 200414795 conductive as a whole.

Regarding the method for manufacturing a spacer of an image display device according to another aspect of the present invention, a spacer is formed by an insulating material, and a conductive paste or a solution containing a conductive component is attached to a front end portion of the formed spacer, and a capillary tube is used. The phenomenon is that the conductive paste or solution is impregnated into the front end portion of the spacer, and the spacer impregnated with the conductive paste or solution is fired to form a spacer having a conductivity imparting portion impregnated with a conductive material at the front end portion. In addition, in the method for manufacturing a spacer of another aspect of the present invention, the spacer is formed of an insulating material, and a conductive paste containing a conductive component is adhered to the front end of the formed spacer. The spacer heat-diffuses a conductive component in the front end portion of the spacer to form a spacer having a front end portion having a conductivity-imparting portion impregnated with a conductive material.

A method for manufacturing a spacer according to another aspect of the present invention is to prepare a mold having a plurality of through holes for forming a spacer, inject a first paste containing no conductive component into the through holes, and disperse the conductive material. The second conductive paste of the component is superimposed on the first paste and injected into the through hole, and the first and second pastes are heat-treated to form a spacer having a tip portion having a conductive imparting portion having a conductive component dispersed therein. [Embodiment] Hereinafter, an embodiment of an SED in which the present invention is applied to a FED as a flat-type image display device will be described in detail with reference to the drawings. (8) 200414795 > 〇 >,

As shown in Figs. 1 to 3, this SED system has a first substrate 10 and a second substrate 12 formed of rectangular glass, respectively, as transparent insulating substrates, and these substrates have about 1.0 ~ Relatively arranged with a gap of 2.0mm. The second substrate 12 is formed to be slightly larger than the second substrate 12. The first substrate 10 and the second substrate 12 pass through the rectangular frame-shaped side walls 14 formed of glass, the outer edge portions are joined to each other, and the interior forms a flat rectangular vacuum peripheral 15 that maintains a vacuum. A phosphor screen 16 is formed on the inner surface of the first substrate 10 as a phosphor surface. The phosphor screen 16 is configured by arranging phosphor layers R, G, and B, and a black light-shielding layer 11 that emit red, green, and blue light by electron impact. The phosphor layers R, G, and B are formed in stripes or dots. A metal back plate 17 made of aluminum or the like is formed on the phosphor screen 16. A transparent conductive film or a color filter film made of, for example, ITO or the like may be provided between the first substrate 10 and the phosphor screen 16.

As an electron source for exciting the phosphor layers R, G, and B of the phosphor screen 16, a surface-conduction electron emission element 18 for emitting a large number of electron beams is provided on the inner surface of the second substrate 12 respectively. These electron emitting elements 18 are arranged in a plurality of columns and a plurality of rows in accordance with each pixel. Each electron emitting element 18 is constituted by an electron emitting portion (not shown), a pair of element electrodes to which a voltage is applied to the electron emitting portion, and the like. On the inner surface of the second substrate 12, a plurality of wirings 21, which supply potential to the electron emitting elements 18, are arranged in a matrix, and the ends thereof are led out of the vacuum peripheral 15. The side wall 14 serving as a joining member is sealed to the outer edge portion of the first substrate 10 and the second substrate 1 with a sealing material 20 such as low melting point glass, low -9- (6) 200414795 melting point metal, and the like. As shown in FIGS. 2 and 3, the outer edge portion of 2 is used to join the first substrate and the second substrate. The SED system includes a spacer combination 22 disposed between the first substrate 10 and the second substrate 12. . In this embodiment, the 'spacer combination 22' includes: a plate-shaped skeleton 24; and a plurality of columnar spacers integrally standing on both sides of the bone frame.

As described above, the 'skeleton 2 4 system has a first surface 2 4 a opposite to the inner surface of the first substrate 10 and a second surface 24 b opposite to the inner surface of the second substrate 12, parallel to these substrates.地 Configuration. A majority of electron beams are formed in the skeleton 24 by uranium etching or the like through holes 26 and a plurality of spacers 2 8 are opened. The electron beam passing holes 26 are arranged opposite to the electron emitting elements 18, respectively, and pass the electron beams emitted by the electron emitting elements. The spacer openings 2 8 are respectively located between the electron beam passing holes 2 6 and are arranged at specific intervals.

The skeleton 24 is formed, for example, from an iron-nickel metal plate to a thickness of 0.1 to 0.25 mm. On the surface of the skeleton 24, an oxide film made of elements constituting a metal plate, such as an oxide film made of Fe304 and NiFe204, is formed. A high-resistance film is formed on a surface of at least the second substrate side of the skeleton 24. A high-resistance film is formed by coating a surface of a skeleton with a high-resistance substance made of glass, ceramics, or the like and firing it. The resistance of the high-resistance film is set above Ε + 8 Ω / □. The electron beam passing hole 26 is, for example, formed in a rectangular shape of 0.15 to 0.25 mm × 0.15 to 0.25 mm, and the spacer opening 28 is formed in a circular shape with a diameter of about 0.2 mm to 0.5 mm, for example. The above-mentioned high-resistance film is also formed -10- (7) 200414795 on the wall surface defining the electron beam passage hole 26.

On the first surface 24a of the frame 24, the first spacer 30a is formed by being overlapped with each of the spacer openings 28 to form a single body. The extended end of the first spacer 30a is in contact with the inner surface of the first substrate 10 through the metal back layer 17 and the black light shielding layer 11 of the phosphor screen 16. On the second surface 24b of the frame 24, second spacers 30b are integrally formed by overlapping the respective spacer openings 28, and the extended ends thereof abut against the inner surface of the second substrate 12. The extended end of each second spacer 3 Ob is located on the wiring 21 provided on the inner surface of the second substrate 12. The first and second spacers 30a and 30b are formed of an insulating material. The front end portion of the first spacer 3 0a and the front end portion of the second spacer 3 Ob constitute the conductivity-imparting portions 3 1 a and 3 1 b impregnated with a conductive material, respectively. In each of the conductivity-imparting portions 3 1 a and 3 1 b, the content of the conductive material is gradually decreased from the front end of the spacer to the middle portion, that is, toward the skeleton 24 side.

As described later, the conductivity applying portions 3 1 a and 3 1 b form an electric field that repels the electron beams emitted from the electron emission elements 18 in a direction away from the first and second spacers 30a and 30b. As the conductive material contained in each of the conductive imparting portions 31 a and 3 lb, for example, Ni, In, Ag, Au, Pt, Ir, Ru, W, or the like can be used. The height of the conductivity-imparting portions 31a and 31b and the content concentration of the conductive material are arbitrarily set in consideration of the repulsive force given to the electron beam, that is, the amount of orbital correction of the electron beam. Each of the first and second spacers 30a and 30b is formed in a finely pushed shape from the bone frame 24 side to the extended end, that is, toward the front end and the diameter becomes smaller. For example, the straightness of the base end of each of the first spacers 30a located on the side of the skeleton 24 is -11-(2004) 79514 with a diameter of about 0.4mm, a diameter of the front end of about 0.3mm, and a height of about 0.6mm. The diameter of the base end of each of the second spacers 30b on the side of the skeleton 24 is approximately 0.4 mm, the front end is approximately 0.2 mm in length, and the height is approximately 0.8 mm. In this way, the height of the first spacer 30 a is lower than the height of the second spacer 30 b. The surface resistances of the first spacer 3 0 a and the second spacer 3 0 b were 5 X 1 0 13 Ω. Each spacer opening 28, the first and second spacers 3 0a,

30b is aligned with each other, and the first and second spacers are connected to each other through the spacer openings 28. Thereby, the first and second spacers 30a and 30b are integrated with the skeleton 24 in a state in which the skeleton 24 is sandwiched by both sides. The spacer assembly 22 configured as described above is disposed between the first substrate i 0 and the second substrate 12. The first and second spacers 3 0 a and 3 0 b can support the atmospheric pressure load acting on these substrates by abutting on the inner surfaces of the first substrate 10 and the second substrate 12 while maintaining the interval between the substrates. On a specific tweet.

As shown in Fig. 2, the SED system includes a voltage supply unit (not shown) that applies a voltage to the frame 24 and the metal back plate 17 of the first substrate 10. This voltage supply unit is connected to the frame 24 and the metal back plate 7 respectively. For example, a voltage of 12 kV is applied to the frame 24 and a voltage of 12 kV or less is applied to the metal back plate 17. The voltage applied to the frame 24 is set to be the same as or higher than the voltage applied to the first substrate 10. In this S ED, when an image is displayed, an anode voltage is applied to the phosphor screen 16 and the metal back plate 17, and the anode voltage is used to accelerate the electron beam B emitted by the electron emitting element 18 to impact the fluorescent light. Body screen} 6. -12- (9) 200414795 In this way, the phosphor layer of the phosphor screen 16 is excited to emit light, and an image can be displayed.

Next, a method for producing S E D having the above-mentioned structure will be described. When manufacturing the spacer combination 22, first, prepare a rectangular shaped frame having a frame 24 of a specific size and a frame having almost the same size as the frame! And second dies 36a, 36b. In this case, after degreasing, rinsing, and drying a thin plate having a thickness of 0.12 mm formed from Fe-45 to 55% Ni, electron beam passage holes 26 and spacer openings 28 are formed by etching to serve as a skeleton. twenty four. Thereafter, the entire skeleton 24 is oxidized to oxidize it, and an insulating film is formed on the surface of the skeleton including the inner surface of the electron beam passage hole 26 and the spacer opening 28. Further, a solution in which fine particles of tin oxide and antimony oxide are dispersed is sprayed on the insulating film to cover it, and the solution is dried and fired to form a high-resistance film.

As shown in FIG. 4, the first and second dies 36 a and 36 b functioning as a forming die have through-holes 38 a and 38 b for forming spacers, and these through-holes are arranged corresponding to the spacer openings 28 of the skeleton 24 . In the first mold 36a and the second mold 36b, at least the inner surfaces of the through holes 38a and 38b are coated with a resin that is thermally decomposable by heat treatment. In a state where each of the through holes 3 8 a is aligned with the spacer openings 2 8 of the skeleton 24, the first mold 36a and the i-th surface 24a of the skeleton are brought into close contact. Similarly, the second mold 36b and the second surface 24b of the skeleton are brought into close contact with each other with the through holes 3 8b positioned in alignment with the spacer openings 2 8 of the skeleton 24. The first mold 3 6 a, the skeleton 2 4, and the second mold 3 6 b are fixed with a jig or the like (not shown). Next, for example, -13- (10) 200414795 38a, the holes 3 8 b of the skeleton 24 are supplied in a paste form from the outer side of the first mold 3 6 a, and the gap is formed with an ultraviolet-hard insulating glass spacer. The material 40 is a through-hole spacer opening 28 in the i-th mold and a through-material forming material 40 in the second mold 36b. The spacer-forming material 40 is a binder (organic component) and a glass frit paste. Next, for the second mold 3 6 a and hereinafter referred to as UV), if necessary, thermosetting coating may be performed on the first and second molds 36 a and the resin is thermally decomposed, as shown in FIG. 5. The filled spacer-forming material 40 is irradiated with radiation-ultraviolet rays from the outer side of the tube (to harden the spacer-forming material by UV curing. Then, the respective through holes 38a of 36b, 38b in spacer forming material 40 and

A gap is formed between the through holes. At both ends of each spacer-forming material 40, that is, the end that becomes part 30a of the second spacer, and the front end that becomes part 3o of the second spacer, for example, the conductive material is attached by screen printing. Silver paste 42. After that, the first and second molds 3 ", 36b are separated by the skeleton 24,

Next, the skeleton 24 of the first and second spacers 30a and 30b formed by the spacer-forming material 40 is heat-treated in a heating furnace, and the binder in the spacer-forming material is scattered, and the distance is about 5 00. The spacer forming material and the silver paste 42 are actually fired under conditions of ~ 550 t and 30 minutes to 1 hour. Thereby, as shown in Fig. 6, a spacer combination 22 in which the first and second spacers 30a and 30b are formed on the skeleton 24 can be obtained. At the same time, the silver component in the silver paste 42 diffuses to the range of about 0.15 mm in the front end portions of the first and second spacers 30a and 30b. The result was -14- (11) 200414795, and it was possible to obtain the first and second spacers provided with the electroconductive imparting portions 3 1 a and 3 1 b each containing silver at the tip portion as a whole, that is, integrally. 3 0 a, 3 0 b. On the other hand, it is prepared in advance: a first substrate 1 0 provided with a phosphor screen 16 and a metal back plate 17; and an electron emitting element 18 and a wiring 2 1 provided, and a second 2 having a side wall 14 bonded thereto Substrate 1 2.

Next, the spacer combination 22 configured as described above is positioned and placed on the second substrate 12. At this time, the spacer combination 22 is positioned so that the extended ends of the second spacer 3 Ob are arranged on the wiring 21, respectively. In this state, the first substrate 10, the second substrate 12, and the spacer combination 22 are arranged in a vacuum chamber. After the vacuum chamber is evacuated, the first substrate is bonded to the first substrate via the sidewall 14. 2 Board. As a result, the SED including the spacer combination 22 is manufactured.

According to the SED structured as described above, as shown in FIG. 3, the electron beam B emitted from the electron emitting element 18 located near the second spacer 3 Ob is formed by the front end portion of the second spacer 3 Ob. The electrical field formed by the conductive property imparting portion 3 1 b repels, and while acquiring the orbit from the direction in which the second spacer deviates, it faces the electron beam passing hole 26. Thereafter, the electron beam B is attracted by the charged second spacer 30b and the first spacer 30a this time, and acquires an orbit in a direction close to these spacers. In addition, the electron beam B is repelled by the electric field formed by the conductivity imparting portion 31a constituting the front end portion of the first spacer 30a, and while orbiting from the direction in which the first spacer deviates, it faces the phosphor screen 16. Due to this repulsion and attraction, the orbital deviation of the electron beam B is canceled, and the electron beam B emitted by the electron emitting element 18 finally reaches -15- (12) 200414795 to the phosphor layer with the phosphor screen 16 as the target.

The smaller the distance between the electron emitting element 18 and the spacer, the greater the amount of movement of the electron beam to the spacer side. Conversely, when the distance between the electron emitting element and the spacer is relatively large, the amount of electron beam moving to the spacer side It can be ignored. The movement of the electron beam is caused by the secondary electrons generated on the fluorescent surface and the reflected electrons striking the spacer, and the spacer is charged. At the acceleration voltage used in SE D, the secondary electron emission coefficient of the surface of the spacer is above 1 and the side wall of the spacer is positively charged, and the electron beam is attracted to the side of the spacer. In this SED, the spacer is not de-energized, but the front end of the first substrate 10 side of the first spacer 3 0a and the front end of the second substrate 12 side of the second spacer 3 Ob Each of the portions is provided with the conductivity-imparting portions 3 1 a and 3 1 b to form an electric field that repels the electron beam in a direction separated by the spacer. By controlling the height of the conductivity-imparting portions 3 1 a and 3 1 b, the electric field strength can be changed, and the amount of repulsion can be controlled. Therefore, according to this SED, the first and second spacers 30a,

3 0b is charged, and even when the electron beam B is attracted by these spacers, the orbital deviation of the electron beam B can be prevented. Thereby, the erroneous landing of the electron beam B is prevented, the degradation of color purity is reduced, and a SED with improved image quality can be obtained. In the conductivity imparting portion provided in the spacer, the conductivity imparting portion 3 1 b on the second substrate 12 side is close to the emission side of the electron beam. Therefore, an electric field formed by the conductivity imparting portion 3 1 b is used for electrons. The orbit of the beam makes a big impact. That is, the electron beam has high sensitivity to an electric field formed by the conductivity imparting portion 3 1 b. Therefore, even if the height of the conductivity-imparting portion 3 1 b from the second substrate 12 is -16- (13) 200414795, the orbit of the electron beam is greatly changed even if the height is slightly changed. For this reason, when it is desired to control the trajectory of the electron beam only by the conductivity imparting portion 3 1 b on the second substrate side, if the height of the conductivity imparting portion 3 1 b varies during the manufacturing process, the There is a difference in the amount of movement between the electron beams emitted by most electron emitting elements, so that it is difficult to correctly control the electron beam trajectory

However, according to the SED according to this embodiment, the conductivity imparting portions 3 1 a and 3 1 b are provided at the tip portions of the two spacers of the first spacer 30 a and the second spacer 3 Ob, and the conductivity imparting portion 3 1 is provided. The effect of b on the orbit of the electron beam is suppressed, and the low-sensitivity conductivity imparting portion 3 1 a is used to ensure the lack of orbit correction. Thereby, the orbit of the electron beam can be easily and accurately controlled.

Thereby, the manufacturing accuracy of the conductivity imparting portions 3 1 a and 3 1 b can be reduced, and the conductivity imparting portions 3 1 a and 3 1 b can be easily manufactured. That is, by providing the conductivity imparting portion 'on both ends of the first and second spacers 30a and 30b, it is easy to obtain the same as the case where the conductivity imparting portion is provided only on the second substrate 12 side with high accuracy. Effect. When conductive treatment is applied to the entirety of the first and second spacers 30a and 30b, the reactive current flowing from the first substrate 10 to the second substrate 12 through the spacer increases, causing a rise in temperature or power consumption. Quickly, in the SED operation, this conductive processing unit becomes a gas generating source, and it also causes ion impact of the electron emitting element arranged near the spacer. On the other hand, according to this embodiment, the conductivity-imparting portions 3 1 a and 3 1 b are formed at the tip portions of the first and second spacers 3 0a and 3 Ob, and the spacer is 17- (14) 200414795. The whole has a three-stage structure of a conductive part-insulating part-conductive part. Thereby, the increase in the reactive current, the increase in temperature, the increase in power consumption, and the ion impact are not caused. By changing the electric field around the spacer by the conductivity imparting portions 3 1 a and 3 1 b, electrons can be easily and accurately controlled The orbit of the beam.

The S ED of this embodiment is prepared, and the SED provided with a spacer not having the above-mentioned conductivity imparting sections 3 1 a and 3 1 b is used to compare the amount of movement of the electron beam. As a result, in the SED without the conductivity imparting portions 31a and 31b, the electron beam is attracted to the spacer side by about 1 2 0 // m. In contrast, in the SED of this embodiment, the electron beam moves. The amount is ± 20 // m, and the color purity of the displayed image is also improved.

According to this SED, the skeleton 24 is arranged between the first substrate 10 and the second substrate 12, and the height of the first spacer 30a is lower than the height of the second spacer 3 Ob. Thereby, the skeleton 24 is positioned closer to the first substrate 10 side than the second substrate 12. Therefore, even when a discharge is generated from the first substrate 10 side, it is possible to suppress the discharge damage of the electron emitting element 18 provided on the second substrate 12 by the skeleton 24. Therefore, it is possible to obtain an SED which is excellent in the withstand voltage against discharge and has improved image quality. According to the SED structured above, by forming the height of the first spacer 30a lower than that of the second spacer 3 Ob, even when the voltage applied to the skeleton 24 is larger than the voltage applied to the first substrate 10, it is possible to The electrons generated by the electron emitting element 18 are allowed to reach the screen side of the phosphor. Next, a method for manufacturing a spacer according to a second embodiment of the present invention will be described. In the same manner as the first embodiment, a skeleton 24 having a specific size is formed, and first and second molds 36a, 36b -18- (15) 200414795 are prepared. Next, as in the case shown in FIG. 4, the first mold 36a and the first surface 24a of the skeleton are brought into close contact with each other through the holes 38a aligned with the spacer openings 28 of the skeleton 24. Similarly, the second mold 36b and the second surface 2 # of the skeleton are brought into close contact with each other with the through holes 38b aligned with the spacer openings 28 of the skeleton 24. The i-th mold 36a, the skeleton 24, and the second mold 36b are fixed by a jig or the like (not shown).

Next, for example, a paste-like spacer-forming material 40 is supplied from the outer side of the first mold 3 6 a, and the through-holes 38 a of the first mold, the spacers 28 of the frame 24 are opened, and the second mold 3 6 The through hole 3 8 b of b is filled with the spacer forming material 40. The spacer-forming material 40 is an insulating glass paste containing a UV-curable binder (organic component) and a glass frit.

Next, "the filled spacer-forming material 40 is irradiated with UV from the outer surfaces of the first and second molds 36a and 36b, and the spacer-forming material is hardened. After that, you may heat-harden as needed. Then, the resin applied to each of the through holes 3 8 a and 3 8 b of the second and second molds “a,” is thermally decomposed by heat treatment, as shown in FIG. 7, in the spacer forming material 40. A gap is formed between the through hole and the through hole. Thereafter, the i-th and second molds 3 ″ and the core are separated by the skeleton 24. Next, the first and second spacers 30a, 30b formed by the spacer-forming material 40 are formed into a framework 24 by heat treatment in a heating furnace. The spacer shape: The binding agent in the material is scattered for debonding: The processed dumplings are as shown in FIG. 8 'The spacer-forming material 4〇 Before sintering -19- (16) 200414795 In a porous state, only the front end of the first spacer 30a and the second spacer The 3 Ob front end is, for example, ink-jet-attached to a solution formed by silver ultrafine particles and a tetradecane solution. The adhered solution permeated into the front end portions of the first and second spacers 30 a and 30 b by a capillary phenomenon 'by about 0.2 mm.

Next, "the skeleton 24 having the first and second spacers 30a and 30b formed therein is arranged in a heating furnace, and the actual firing is performed under the conditions of about 500 to 5500 processes and 30 minutes to 1 hour." to make. By actually firing, the glass particles constituting the spacer forming material are integrated, and the spacer combination 22 of the first and second spacers 3 0 a and 3 0 b can be obtained on the skeleton 24. At the same time, it is possible to obtain first and second spacers 30a and 30b each including the conductive provision portions 3 1 a and 3 1b each including silver at the tip portion as an integral portion. Thereafter, by the same method as in the first embodiment, by mounting the first substrate 10, the spacer combination 22, and the second substrate, an SED having the spacer combination 22 can be obtained.

The S ED of this embodiment is prepared, and the S ED provided with the spacers without the above-mentioned conductivity imparting portions 3 1 a and 3 1 b is compared to compare the amount of movement of the electron beam. As a result, in the SED in which the conductivity imparting portions 31a and 31b are not provided, the electron beam is attracted to the spacer side by about 1 2 0 # m '. In contrast, in the SED of this embodiment, the amount of movement of the electron beam It is ± 20 // m, and the color purity of a displayed image is also improved. In addition, other structures are the same as those of the first embodiment described above, and the same reference numerals are assigned to the same portions' and detailed descriptions thereof are omitted. In the SED including a spacer manufactured by the manufacturing method of the second embodiment, -20- (17) 200414795 can be obtained in the same manner as in the following. At the same time, prepare as shown in the figure, and close contact in the state of 2 8 alignment. Similarly the openings 2 8 are aligned; faces 24b are in close contact. 2 mold 36b system 'Next, the spacer 24 of the example forming material is filled with the spacer forming hole 3 8b. The end 40a is made of glass paste, and then the through hole is injected as a spacer. 3 The combination of the hardened type is conductive. Next, the same effect is achieved on the first and second sintered S. Mingguan S order book: The system of the third embodiment of the spacer is made in the same way as the first embodiment, and the skeleton 2 4 first and second molds 36a and 36b are formed. Next, as the ninth through-holes 3 8a are positioned in the spacer openings with the skeleton 24; the next 'make the table If fixture 30a and the first surface 24a of the skeleton' is positioned in each through-hole 3 8 b with the skeleton 2 4 In the state of the spacer, the second mold 36b and the second table of the skeleton are fixed, and these first mold 36a, the skeleton 24, and the second mold are fixed by a jig or the like (not shown). For example, if the first paste 40a is supplied from the outer side of the first mold 36a, the through-hole 38a of the first mold, the bone-free opening 28, and the through-hole 3 8b of the second mold 3 6b. Material 40. At this time, space is left at the end of the through hole 38a and through the first paste 40a. The first paste contains a UV-curable binder and insulation of glass frit. It is a paste that does not contain conductive components. A second paste 40b for forming materials is provided on the outer surfaces of the first mold 36a and the second mold 36b, and overlaps the ends of the first pastes 8a and 38b. The second paste 40b is a glass paste in which Au particles are diffused by using a component containing both a UV agent (organic component) and a glass frit. The filled first and second pastes 40a and 40b are irradiated with UV from the outer sides of the molds 36a and 36b, so that the first and second pastes 40a and 40b are irradiated with UV.

-21-(18) 200414795 and the second paste are UV-cured. After that, if necessary, heat curing may be performed. Next, the resin applied to each of the through holes 38a and 38b of the first and second dies 36a and 36b is thermally decomposed by heat treatment, and the resin is applied between the first and second pastes 40a and 40b and the through holes. A gap is formed between them. Thereafter, the first and second molds 36a, 36b are separated by the skeleton 24.

After the separation, the first and second spacers 3 0 a and 3 0 b formed by the first and second pastes 40 a and 4 0 b are heat treated in a heating furnace to form the first 24 And the binding agent in the second paste is scattered to perform a debinding treatment. In addition, the first and second pastes 40a and 40b are actually fired at about 500 to 550 ° C and 30 minutes to 1 hour. Thereby, as shown in Fig. 11, a spacer combination 22 of the first and second spacers 30a and 30b can be obtained on the skeleton 24. At the same time, it is possible to obtain first and second spacers 30a and 30b each having a conductive property imparting portion 3 1 a and 3 1 b containing silver at the tip portion as an integral portion.

Thereafter, by the same method as in the first embodiment, by mounting the first substrate 10, the spacer combination 22, and the second substrate, an SED having the spacer combination 22 can be obtained. The SED of this embodiment is prepared, and the S E D provided with a spacer not having the above-mentioned conductivity-imparting portions 3 1 a and 3 1 b is prepared, and the amount of movement of the electron beam is compared. As a result, in the S ED in which the conductivity imparting portions 3 1 a and 3 1 b are not provided, the electron beam is attracted to the spacer side by about 1 2 0 # m. In contrast, in the SED of this embodiment, The amount of electron beam movement is ± 20 // m, and the color purity of the displayed image is also improved. In addition, other structures are the same as those of the first embodiment described above, and the same reference numerals are given to the same parts as -22- (19) 200414795, and detailed descriptions thereof are omitted. Further, in the S E D including the spacer produced by the manufacturing method of the third embodiment, the same effect as that of the first embodiment can be obtained.

The present invention is not limited to the above embodiments, and various modifications are possible within the scope of the present invention. For example, the present invention is not limited to an image display device having a skeleton, but can also be applied to an image display device having no skeleton. In this case, by using a columnar or plate-shaped spacer that is formed as a single body, a conductive portion is provided at the front end portion of the first substrate side and the front end portion of the second substrate side of each of the spacers to be integrated. Also, the same effect as the above can be obtained.

In addition, in the present invention, the diameter or height of the spacer, the dimensions and materials of other constituent elements can be appropriately selected according to need. In the above-mentioned embodiment, one end of the spacer on the second substrate side is configured to be provided on the wiring of the second substrate, but it is not limited to the wiring. 2 on the substrate. The spacer openings of the skeleton can also be omitted. When the potential of the skeleton 24 is set to the same potential as that of the first substrate, the entire first spacer may be impregnated with a conductive material, and the entire first spacer may be formed as a conductivity-imparting portion. Moreover, in the said embodiment, although the structure which provided the electroconductivity imparting part in the front-end | tip part of a 1st and 2nd spacer, it is good also as the manufacturing method mentioned above, only the front-end | tip part of a 2nd spacer That is, the front end portion of the spacer on the second substrate side forms a conductivity-imparting portion, and the spacer is used to form a SED. -23- (20) (20) 200414795 The electron source is not limited to a surface-conduction electron emission element. As long as it is an FED for an electron source that emits electrons in a vacuum, such as an electric field emission type, a nano carbon tube, etc. can use. According to the present invention, according to the present invention, it is possible to provide an image display device capable of easily controlling the trajectory of an electron beam without causing a temperature rise, an increase in power consumption, and an increase in manufacturing cost, an image display device with improved image quality, and a spacer used in the image display device. A manufacturing method and an image display device including the spacer manufactured by the manufacturing method. [Brief Description of the Drawings] Fig. 1 is a perspective view showing a surface-conduction electron emission device (hereinafter, referred to as SED) according to a first embodiment of the present invention. Fig. 2 is a sectional view of the above-mentioned SED taken along the line II-II of Fig. 1

FIG. 3 is a cross-sectional view showing the above-mentioned s ED in an enlarged manner. Fig. 4 is a cross-sectional view showing the state of the first and second molds of the skeleton device in the manufacturing process of the spacer used in the SED. Fig. 5 is a cross-sectional view showing a state in which the spacer forming material is filled with the mold, UV irradiation is performed, and a silver paste is adhered in the manufacturing process. Fig. 6 is a sectional view showing a state where the mold is separated from the mold during the manufacturing process. -24- (21) 200414795 Fig. 7 is a cross-sectional view showing a method for manufacturing a spacer of S ED according to a second embodiment of the present invention. FIG. 8 is a process cross-sectional view showing a solution containing a conductive component adhered to the front end of the spacer in the method for manufacturing a spacer according to the second embodiment. FIG. 9 is a view showing a third embodiment of the present invention; Of] SED spacer manufacturing method cross-sectional view. Fig. 10 is a cross-sectional view showing a state in which a first paste and a second paste are filled in a mold in the spacer manufacturing method according to the third embodiment described above. Fig. 11 is a diagram showing a state in which the first paste and the second paste are filled. 3 Sectional view of the state E fired from the mold in the spacer manufacturing method of the embodiment. ○ Main component comparison table 10 First substrate 12 Second substrate 14 Side wall 15 Vacuum peripheral 16 Phosphor screen 17 Metal back layer 18 Electronics Radiation element 20 Sealing material 2 1 Wiring 22 Spacer combination

-25- (22) 200414795 (22)

24 bone frame 26 electron beam passing through hole 28 spacer opening 30a first spacer 30b second spacer 3 1a conductivity imparting portion 3 1b conductivity imparting portion 36a first mold 36b second mold 40 spacer formed material

-26-

Claims (1)

200414795 ⑴ Patent application scope 1 · An image display device comprising: a first substrate having a fluorescent surface; and i: the first substrate is arranged opposite to the first substrate with a gap, and at the same time, radiated electrons are provided to stimulate the above The second substrate of the majority of the electron sources on the fluorescent surface; and They are each formed of an insulating material, and are disposed between the first substrate and the second substrate to support a plurality of spacers acting on the atmospheric pressure load on the first and second substrates. The distal end portion and the distal end portion on the second substrate side are impregnated with a conductive material and each form a conductivity imparting portion. 2. The image display device according to item 1 of the scope of patent application, wherein the concentration of the conductive material in each of the conductive imparting portions is reduced from the front end of the spacer to the middle portion. 3. The image display device according to any one of item 1 or item 2 of the patent application scope, wherein the spacer is formed of a glass-containing insulating material, and each of the conductivity-imparting units is dispersed to form the above. Metal particles having conductivity in the glass component of the spacer. 4. The image display device according to any one of the scope of claims 1 or 2, wherein the spacer is formed of a glass-containing insulating material, and each of the conductivity imparting units is formed by diffusion. Among the glass components of the spacer, a conductive metal component. 5. The image display device according to item 3 in the scope of the patent application, wherein the metal particles include at least one of Ni, In, Ag, Au, pt, Ir, Ru, W -27- (2) 200414795. 6. The image display device according to item 1 of the scope of patent application, which includes a plurality of potential supply wirings provided on the second substrate, and one end of the second substrate side of each of the spacers is disposed on the potential supply. Wiring. 7. The image display device according to item 6 of the scope of patent application, wherein the electron source is a surface conduction electron source. 8. The image display device described in item 7 of the scope of patent application, wherein 'the potential supply wiring is a wiring that supplies potential to the electron source. 9] As described in any one of the scope of the patent application, item 1 or 2. The image display device includes a plate-shaped skeleton provided between the first and second substrates, and having a plurality of electron beam passage holes corresponding to the plurality of electron sources, and the spacers are fixed to the skeleton. 1 〇 · A method for manufacturing a spacer is directed to a first substrate having a fluorescent surface; and a first substrate having a fluorescent surface; and a first substrate having a gap therebetween and arranged opposite to each other; In the image display device of the second substrate of the electron source, a method of manufacturing a spacer that is disposed between the first substrate and the second substrate and supports a plurality of spacers acting on the atmospheric pressure load of the first and second substrates. It is characterized in that a spacer is formed of an insulating material, and a paddle or a solution containing a conductive component is attached to a front end portion of the spacer formed above, and a capillary phenomenon is applied to the front end of the spacer -28- (3) 200414795 The above-mentioned paste or solution is impregnated in the interior, and a spacer impregnated with the above-mentioned paste or solution is fired to form a spacer having a conductivity-imparting portion impregnated with a conductive material at the tip. 1 1. The method for manufacturing a spacer according to item 10 of the scope of patent application, wherein the two pastes are adhered to both ends of the spacer formed as described above, and the two ends are formed to have conductivity impregnated with a conductive material. A spacer for the imparting portion. 1 2 · A method for manufacturing a spacer is aimed at manufacturing and using a first substrate having a fluorescent surface; and a relative arrangement with the first substrate with a gap therebetween, and radiating electrons are provided to excite the fluorescent surface The second substrate of the majority of the electron sources; and the interval of the spacers of the image display device arranged between the first substrate and the second substrate to support the majority of the spacers acting on the atmospheric pressure load of the first and second substrates A method for manufacturing an object is characterized in that: a spacer is formed by an insulating material, A paste containing a conductive component is adhered to the front end portion of the spacer formed as described above. The spacer containing the paste is heat-treated to thermally diffuse the conductive component into the front end portion of the spacer to form an impregnation at the front end portion. The spacer of the conductivity-imparting portion of the conductive material. 1 3 · The method for manufacturing a spacer according to item 12 of the scope of patent application, wherein the paste is adhered to both ends of the spacer formed as described above, and the conductive material impregnated with a conductive material is formed at both ends. A spacer for the imparting portion. -29- (4) 200414795 1 4 · A method for manufacturing a spacer is used for a first substrate having: a fluorescent substrate; and a first substrate having a gap therebetween and arranged opposite to each other, and at the same time, radiating electrons are provided to A second substrate that excites the majority of the electron sources on the fluorescent surface; and an image display device that is disposed between the first substrate and the second substrate to support a plurality of spacers acting on the atmospheric pressure load on the first and second substrates A method for manufacturing a spacer is characterized in that: a forming mold having a plurality of through holes for forming a spacer is prepared, A first paste containing no conductive component is injected into the through hole, a second paste dispersed with a conductive component is superposed on the first paste and injected into the through hole, and the first and first heat treatments are performed. 2 paste to form a spacer having a conductivity-imparting portion in which a component having conductivity is dispersed at a tip portion. 15. The method for manufacturing a spacer according to item 14 of the scope of patent application, wherein after the first paste is injected into the through holes, the two ends of each through hole and the two sides of the first paste are The second paste is poured on the end side so as to form a spacer having a conductivity-imparting portion in which a component having conductivity is dispersed at a tip portion. 16. An image display device comprising: a first substrate having a fluorescent surface; and a first substrate having a gap therebetween and disposed opposite to each other, and provided with a plurality of electron sources that emit electrons to excite the fluorescent surface The second substrate; and the second substrate is manufactured by the manufacturing method described in any one of the items 10 to 15 in the patent application scope, and is arranged between the first substrate and the second substrate to support the role of the second substrate. Most of the atmospheric pressure loads on the 1 and 2 substrates are -30- (5) (5) 200414795 spacers. 1 7 · The image display device described in item 16 of the scope of patent application, wherein the device includes a plate provided between the i-th and second substrates and having electron beam passage holes corresponding to most of the electron sources. In the shape of a skeleton, each of the spacers is fixed to the skeleton. 1 ·· An image display device, comprising: a first substrate having a fluorescent surface; and a first substrate having a gap therebetween and disposed opposite to each other, and provided with a plurality of electron sources that emit electrons to excite the fluorescent surface A second substrate; and a plate-like skeleton provided between the first substrate and the second substrate, and having a plurality of electron beam passage holes corresponding to the majority of the electron sources, respectively. It is manufactured by the manufacturing method according to any one of items 2 and 14. It is disposed between the first substrate and the second substrate, and has the above-mentioned conductivity imparting portion at an end portion before the second substrate side. In order to support most of the spacers that are loaded with atmospheric pressure on the first and second substrates. -31-