l246l〇2 (1) 九、發明說明 【發明所屬之技術領域】 本發明，係關於具備間隔物構體之平面顯示裝置等的 衋像顯示裝置，以及畫像顯示裝置所使用之間隔物構體的 製造方法。 【先前技術】 近年來’作爲取代陰極射線管（以下簡稱C R T )之次 春 世代的輕量、薄型之顯示裝置，係有多種平面型之畫像顯 示裝置受到画目。例如，作爲平面顯示裝置而有功能的場 致顯不器（以下簡稱F E D )的一種，係有表面傳導型電子 放射裝置（以下簡稱SED )之開發正被進行。 此S E D ’係具備以特定之間_而對向配置之前面基板 以及背面基板，此等基板係藉由矩形狀之側壁，和周邊部 相互接合，而構成真空外圍器。於前面基板之內面，形成 有3色之螢光體層；而背面基板之內面，係配列有作爲激 f 發螢光體之電子源’對應各像素之電子放射元件。各電子 放射元件，係由電子放射部、對此電子放射部施加電壓之 一對之電極等，所構成之。 上述SED之中，前面基板以及背面基板之間的空間 ’也就是真空外圍器之內，維持高真空度者係爲重要。真 空度低時，電子放射元件之壽命，伴隨著裝置的壽命就會 減短。又，因爲前面基板和背面基板間係爲真空，故大氣 壓力會對前面基板、上面基板發生作用。於此，爲了支撐 -5 - (2) 1246102 作用於此等基板的大氣壓負荷，並維持基板間空隙，於兩 基板之間’配置有多數板狀或是柱狀之間隔物。 於前面基板以及背面基板’要全面分布配置間隔物； 故不會接觸前面基板之螢光體，又不會接觸背面基板之電 子放射元件’而極爲薄型之板狀，或極爲細型之柱狀間隔 物，係爲必要。又，此等間隔物’不得不設置於極爲靠近 電子放射元件的位置，故作爲間隔物不得不使用絕緣材料 。同時’硏討前面基板以及背面基板之薄板化時，更需要 大量之間隔物，而使製造更加困難。 作爲如此之間隔物之製造方法，於美國專利說明書第 5，7 4 0，8 2 0號中，提出了對可溶於氧或鹽基材質的間隔物 成形模具’塡充玻璃膠而硬化之後，將成形模具溶解的方 法。 然而，上述製造方法中，間隔物成形模具係於間隔物 成形後被溶解，也就是所謂用完就丟的成形模具，故難以 避免間隔物的製造成本提高。又，間隔物係於真空環境所 使周之零件’故間隔物成形模具的溶解過程對間隔物之損 害或污染，係成爲大問題。 前面基板和背面基板之間的空間狹窄時，螢光面所發 生之2次電子以及反射電子，會衝突基板間所配射之間隔 物’而使間隔物帶電。此時，自電子放射元件所放射之電 子束將被吸附至間隔物，而自原本之軌道偏離。其結果， 對螢光層將造成電子束之錯誤著陸（m i s s 1 a n d i η 2 )，而 有顯示畫像之顏色純度劣化的問題。又，亦有間隔物表面 -6- (3) 1246102 會發生放電，而使顯示裝置整體之耐電壓性降低的問題。 【發明內容】 此發明係有鑒於以上各點者，其目的係提供可將不對 間隔物產生傷害或污染，耐電壓特性以及顯示品質提昇之 畫像顯示裝置，以及此畫像顯示裝置所用之間隔物構體， 加以低價製造之間隔物構體製造方法。 爲達成上述目的，有關此發明型態之畫像顯示裝置， 係具備形成有畫像顯示面之第1基板；和與上述第1基卞反 以特定之空隙對向配置的同時，設置有將上述畫像顯示s 加以激發的複數之電子放射源的第2基板；和設置於上述 第1以及第2基板間，支撐作用於上述第1以及第2基板 的大氣壓力之間隔物構體； 上述間隔物構體，係具有：具有對向於上述第1以& 第2基板，同時各自對向上述電子放射源之複數之電子束 通過孔，的板狀之光柵；和設立於上述光柵之最少〜方之 表面上的複數之間隔物；上述間隔物，係具有自上述光· 向著延伸端，交互層積之大直徑之第1段部；以及直徑較 第1段部爲小之第2段部。 有關此發明之其他型態的間隔物構體之製造方法，係 具備有：具有複數之光束通過孔的板狀之光柵；和設立於 上述光栅之最少一方之表面上的同時，具有自上述光柵向 著延伸端，交互層積之大直徑之第1段部，以及直徑較第 1段部爲小之第2段部，之間隔物，而用於畫像顯示裝置 (4) 1246102 的間隔物構體之製造方法，其特徵係 準備形成有複數之光束通過孔的板狀之光栅， 準備具備有複數之間隔物形成孔；和將定位於各間隔 物形成孔之周圍’具有對應上述間隔物之第1以及第2段 部之間隔物形成孔，加以規定的同時，以彈性可變形之紫 外線透過材料形成的複數之孔形成部；的成形模具， 於上述成形模具之各間隔物形成孔’塡充具有紫外線 硬化性之間隔物形成材料， 將塡充有上述間隔物形成材料之成形模具密和於上述 光柵之表面，而形成成形模具以及光柵所構成之組合體， 透過上述組合體之成形模具，於上述間隔物形成材料 照射紫外線’使上述間隔物形成材料硬化， 使上述孔形成部彈性變形，而一邊將上述成形模具自 上述光柵脫模’而將上述硬化後之間隔物形成材料設置於 光柵上。 【實施方式】 以下參考圖示，將此發明，作爲平面型之晝像顯示裝 置而適用於SED的第1實施方式，加以詳細說明。 如第1至第3圖所示，S ED係具備各自以矩形狀之玻 璃板所構成的第1基板1 〇第1基板1 〇 ’以第2基板1 2 ; 此等基板係以1 .〇〜2. 〇mm左右之空隙而對向配置。第1基 板1 0以及第2基板1 2，係藉由玻璃所構成之矩形框狀之 側壁1 4，而相互接合周邊部群，以構成內部維持真空之 (5) 1246102 扁平狀真空外圍器1 5。作爲接合構件而有機能之側壁14 ’例如係以低融點玻璃、低融點金屬等之密封材2 0，密 封住第1基板1 〇之周邊部以及第2基板1 2之周邊部，而 相互接合此等基板群。 第1基板1 0之內面，係形成有作爲畫像顯示面而有 機能之螢光體屏1 6。此螢光體屏1 6，係將發出紅、綠、 藍光之螢光體層R、G、B以及遮光層11，並列構成；此 等螢光體層係形成爲條狀，點狀，或是矩形狀。於螢光體 屏1 6上，依序形成有鋁等所構成之金屬襯背1 7以及吸氣 膜19。 於第2基板1 2之內面側，係設置有作爲激發螢光體 屏16之螢光體層R、G、B之電子源，各自放射電子束之 多數的表面傳導型之電子放射元件1 8。此等之電子放射 元件1 8，係對應像素而以複數列以及複數行配列者。各 電子放射元件1 8，係由未圖示之電子放射部，以及對此 電子放射部施加電壓之一對之元件電極所構成。於第2基 板1 2之內面上，係有多條對電子放射元件1 8供給準位之 配線2 1，被設置爲矩形狀’而該端部係被拉出至真空外 圍器1 5之外部。 第1基板1 0以及第2基板1 2之間，係配置有間隔物 構體2 2。間隔物構體2 2，係具備矩形狀金屬板所構成之 光柵2 4，和一體化設立於光柵之兩面的多數之柱狀之間 隔物。 若詳細敘述，則如第2圖至第5圖所示’光柵2 4係 (6) 1246102 具有對向於第1基板10之內面的第1表面24a，以及對 向於第2基板12之內面的第2表面24b，並平行於此等 之基板而配置。於光柵24，係藉由蝕刻等而形成有多數 之電子束通過孔26。電子束通過孔26，係各自對向電子 放射元件1 8而配列，並讓自電子放射元件放射之電子通l246l〇2 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to an image display device such as a flat display device having a spacer structure, and the spacer structure used in the image display device. Production method. [Prior Art] In recent years, as a light-weight and thin display device that replaced the cathode-ray tube (hereinafter referred to as CR T) in the spring, a variety of flat-type image display devices have received attention. For example, a type of field display device (hereinafter referred to as F E D) that functions as a flat display device is being developed with a surface conduction electron emission device (hereinafter referred to as SED). The S E D ′ includes a front substrate and a back substrate which are arranged to face each other at a specific interval. These substrates are connected to each other by a rectangular side wall to form a vacuum peripheral. On the inner surface of the front substrate, a three-color phosphor layer is formed; and on the inner surface of the back substrate, an electron emitting element corresponding to each pixel is arranged as an electron source of the laser light emitting phosphor. Each electron emitting element is composed of an electron emitting portion, a pair of electrodes to which a voltage is applied to the electron emitting portion, and the like. In the above-mentioned SED, the space between the front substrate and the back substrate is also inside the vacuum peripheral device, and it is important to maintain a high degree of vacuum. When the vacuum is low, the life of the electron emitting element is shortened along with the life of the device. In addition, since there is a vacuum between the front substrate and the back substrate, atmospheric pressure acts on the front substrate and the top substrate. Here, in order to support the -5-(2) 1246102 atmospheric pressure load acting on these substrates and to maintain the space between the substrates, most plate-shaped or columnar spacers are arranged between the two substrates. Spacers must be arranged on the front substrate and the back substrate, so that they do not contact the phosphors on the front substrate or the electron-emitting elements on the back substrate. They are extremely thin plates or extremely thin columnar spaces. Is necessary. In addition, these spacers' have to be placed in a position very close to the electron emitting element, so that an insulating material has to be used as the spacer. At the same time, when the thickness of the front substrate and the back substrate is reduced, a large number of spacers are required, which makes manufacturing more difficult. As a method for manufacturing such a spacer, in U.S. Patent Specification No. 5,740,820, it is proposed that a spacer molding mold which is soluble in oxygen or a salt-based material is filled with glass glue and hardened. , Dissolving the forming mold. However, in the above-mentioned manufacturing method, the spacer forming mold is dissolved after the spacer is formed, which is a so-called forming mold that is thrown away after use. Therefore, it is difficult to avoid an increase in the manufacturing cost of the spacer. In addition, the spacers are in a vacuum environment, so the damage or contamination of the spacers by the dissolution process of the spacer forming mold becomes a major problem. When the space between the front substrate and the back substrate is narrow, the secondary electrons and reflected electrons generated on the fluorescent surface may collide with the spacers ′ emitted between the substrates and cause the spacers to be charged. At this time, the electron beam emitted from the electron emitting element will be attracted to the spacer and deviate from the original orbit. As a result, an error landing (m i s s 1 a n d i η 2) of the electron beam is caused to the fluorescent layer, and there is a problem that the color purity of the displayed image is deteriorated. In addition, there is a problem in that the surface of the spacer -6- (3) 1246102 causes a discharge, which reduces the voltage resistance of the entire display device. [Summary of the Invention] The present invention has been made in view of the above points, and an object thereof is to provide an image display device capable of preventing damage or pollution to a spacer, withstanding voltage characteristics, and improving display quality, and a spacer structure used in the image display device And a spacer structure manufacturing method manufactured at a low price. In order to achieve the above object, an image display device according to this aspect of the invention includes a first substrate on which an image display surface is formed, and is arranged opposite to the first substrate at a specific gap, and is provided with the image A second substrate showing a plurality of electron emission sources excited by s; and a spacer structure provided between the first and second substrates and supporting atmospheric pressure acting on the first and second substrates; the spacer structure The body has a plate-shaped grating having a plurality of electron beam passing holes facing the first and second substrates, and at the same time, each of the plurality of electron beam passing holes facing the above-mentioned electron radiation source; A plurality of spacers on the surface of the surface; the spacers have a first section section having a large diameter which is laminated alternately from the light and toward the extended end; and a second section section having a smaller diameter than the first section section. A method for manufacturing another type of spacer structure according to the present invention includes: a plate-shaped grating having a plurality of light beam passing holes; and a grating formed on at least one of the surfaces of the grating while having a grating from the grating. Toward the extended end, the spacers of the first segment having a large diameter and the second segment having a smaller diameter than the first segment are spacers, and the spacer structure for the image display device (4) 1246102 The manufacturing method is characterized by preparing a plate-shaped grating having a plurality of beam passing holes, preparing a plurality of spacer-forming holes, and positioning them around each of the spacer-forming holes. The spacer forming holes in the first and second sections are provided with a plurality of hole forming sections formed of elastically deformable ultraviolet transmitting material while specifying the forming molds; forming dies are formed in the spacers of the forming dies. A spacer-forming material having ultraviolet curability, a molding die filled with the spacer-forming material is compacted on the surface of the grating, and a molding die is formed, and The assembly formed by the grating passes through the forming mold of the assembly, and the spacer-forming material is irradiated with ultraviolet rays to harden the spacer-forming material, elastically deform the hole-forming portion, and while releasing the forming mold from the grating, The mold is used to place the hardened spacer-forming material on the grating. [Embodiment] A first embodiment of the present invention, which is applicable to SED as a flat daylight image display device, will be described in detail below with reference to the drawings. As shown in FIGS. 1 to 3, the S ED system includes a first substrate 10, a first substrate 10 ′, and a second substrate 12, each of which is a rectangular glass plate; and these substrates are 1.. 〜2. 0mm gaps are opposed to each other. The first substrate 10 and the second substrate 12 are rectangular frame-shaped sidewalls 14 made of glass, and are joined to each other to form a peripheral vacuum (5) 1246102 flat vacuum peripheral 1 5. The side wall 14 ′ having energy as a bonding member is, for example, a sealing material 20 such as a low-melting-point glass or a low-melting-point metal to seal the peripheral portion of the first substrate 10 and the peripheral portion of the second substrate 12. These substrate groups are bonded to each other. An inner surface of the first substrate 10 is formed with a phosphor screen 16 which functions as an image display surface. The phosphor screen 16 is composed of phosphor layers R, G, B, and light-shielding layers 11 which emit red, green, and blue light. These phosphor layers are formed into strips, dots, or rectangles. shape. On the phosphor screen 16, a metal back 17 and an air absorbing film 19 made of aluminum and the like are sequentially formed. On the inner surface side of the second substrate 12, a surface-conduction type electron emission element 18 is provided as an electron source for exciting the phosphor layers R, G, and B of the phosphor screen 16, and each emits most of the electron beam. . These electron emission elements 18 are arranged in a plurality of columns and a plurality of rows corresponding to the pixels. Each of the electron emitting elements 18 is composed of an electron emitting portion (not shown) and an element electrode which is one of a pair of voltages applied to the electron emitting portion. On the inner surface of the second substrate 12, there are a plurality of wirings 21 for supplying a level to the electron emitting element 18, which are arranged in a rectangular shape, and the end portion is pulled out to the vacuum peripheral 15 external. A spacer structure 22 is arranged between the first substrate 10 and the second substrate 12. The spacer structure 22 is provided with a grating 24 composed of a rectangular metal plate and a plurality of columnar spacers integrally set on both sides of the grating. As described in detail, as shown in FIGS. 2 to 5, 'Grating 2 4 series (6) 1246102 has a first surface 24 a facing the inner surface of the first substrate 10 and a first surface 24 a facing the second substrate 12. The second surface 24b on the inner surface is arranged parallel to these substrates. The grating 24 has a plurality of electron beam passage holes 26 formed by etching or the like. The electron beams passing through the holes 26 are arranged opposite to the electron emitting elements 18, and let the electrons emitted from the electron emitting elements pass through.
^IEL 適。 光柵2 4，係由鐵鎳系之金屬板以厚度〇 . 1〜〇 . 3 m m而 形成。光柵24之表面，係覆蓋有由構成金屬板之元素所 構成之氧化膜，例如Fe304、NiFe2 04所構成之氧化膜。 光柵24之表面24a、24b，亦於各電子束通過孔26之壁 面’覆蓋有具有放電電流限制效果之高電阻膜。此高電阻 膜’係以由玻璃爲主成分之高電阻物質所形成。 光柵2 4之第1表面2 4 a上，係一體化設立有第1間 隔物3 0 a ’而定位於相鄰之電子束通過孔2 6之間。第1 間隔物3 0 a之前端’係經由吸氣膜丨9、金屬襯背1. 7，以 及螢光體屏1 6之遮光層1 1，而接觸第丨基板1 〇之內面 。光柵24之第2表面24b上，係一體化設立有第2間隔 物3 0 b，而定位於相鄰之電子束通過孔2 6之間。第2間 隔物3 0 b之前端係接觸於第2基板1 2之內面。於此，各 第2間隔物3 Ob之前端，係定位於設置在第2基板1 2上 之配；r泉2 1上。各弟1以及弟2間隔物3 0 a ' 3 0 b係相互整 列而定位，並以自兩面挾持光柵2 4之狀態，和光柵2 4 — 體形成。 各第1間隔物3 0 a ’係自光柵2 4而朝向延伸端直徑 -10- (7) 1246102 縮小地，形成爲尖端較細之錐狀。各第1間隔物3 0 a ’係 具有自上述光柵24向著延伸端，交互層積之大直徑之第 1段部50a，以及直徑較第i段部爲小之第2段部50b ’ 四形成爲表面凹凸之間隔物。各第1間隔物3 0 a，係具有 2個之第1段部50a和1個第2段部50b而形成3段；其 咼度’例如’係形成爲〇.75mm。成爲凸部之第1段部 5 0 a ’係具有槪略橢圓形狀之橫剖面形狀，而其直徑係形 成爲1.3 5mm x0.3mm。第丨以及第2段部5〇a、50b之各 局度皆形成爲〇 · 2 5 m m。於第i間隔物3 〇 a之直徑方向， 第1段部50a對第2段部50b之最大突出量dl，係形成 爲1 0 0 // m以下。 各第2間隔物3 0 b，係自光柵2 4而朝向延伸端直徑 縮小地’形成爲尖端較細之錐狀。各第2間隔物3 0 b，係 具有自上述光柵24向著延伸端，交互層積之大直徑之第 1段部5 1 a，以及直徑較第丨段部爲小之第2段部5丨b， 而形成爲表面凹凸之間隔物。於此，各第2間隔物3 0 b， 係具有2個之第1段部5 0 a和2個第2段部5 0 b而彤成4 段；其高度，例如，係形成爲1 . 〇 m m。成爲凸部之第1段 部5 1 a，保具有槪略橢圓形狀之橫剖面形狀，而其直徑係 形成爲1 · 4 m m x 0.3 5 m m。成爲凹部之第2段部5 1 b，係具 有槪略橢圓形狀之橫剖面形狀，而其直徑係形成爲 1 . 3 5 m m X 〇 · 3 m m。第1以及第2段部5 1 a、5 1 b之各高度 皆形成爲〇 . 2 5 m m。於第2間隔物3 0 b之直徑方向，第1 段部5 1 a對第2段部5 1 b之最大突出量d 2，係形成爲1 0 0 -11 - (8) 1246102 V m以下。 如上述而構成之間隔物構體2 2，係配置於第1基板 10以第2基板12之間。第1以及第2間隔物30a、30b， 係藉由接觸第1基板1 0以及第2基板1 2之內面，而支撐 作用於此等之基板的大氣壓力負荷，將基板間之間隔維持 在特定數値。 SED，係具備對光柵24以及第1基板之金屬襯背 1 7施加電壓的，未圖示之電壓供給部。此電壓供給部， φ 係各自連接光柵24以及金屬襯背1 7，例如，對光柵24 施加12kV之電壓，而對金屬襯背17施加l〇kV之電壓。 SED中，顯示畫像的情況，對螢光體屏1 6以及金屬襯背 1 7施加陽極電壓，將自電子放射元件1 8所放射之電子束 以陽極電壓加速，而向螢光體屏1 6衝撞。依此，螢光體 屏1 6之螢光體層被激發而發光，並顯示畫像。 其次，對如以上之構成之SED的製造方法加以說明 。一開始，說明間隔物構體22之製造方法。 着 如第6圖所示，製造間隔物構體2 2時，首先準備特 定尺寸之光栅2 4、和具有幾乎相同與此光栅之尺寸的， 矩形板狀上模具3 6 a以及下模具3 6 b。將F e - 5 0 °/〇 N i所構 成之板厚0.1 5 m m的金屬板加以脫脂、洗淨、乾燥後，以 蝕刻形成電子束通過孔2 6而作爲光柵2 4。之後，將光柵 24進行全面氧化處理後，於包含電子束通過孔26之內面 的光柵表面，形成絕緣膜。更且於絕緣膜上，塗佈以玻璃 做爲主成分之塗佈液，乾燥之後，以燒烤而形成高電阻膜 -12- (9) 1246102 上模具3 6 a ’係具有爲了將第1間隔物3 〇 a加以成形 之’多數的間隔物形成孔4 0 a。同樣的，下模具3 6 b，係 具有爲了將桌2間隔物3 0 b加以成形之，多數的間隔物形 成孔40b 。 於此’對上模具3 6 a以及下模具3 6 b之構成以及該製 is方法’以上模具3 6 a爲代表加以說明。 如第6圖所示，作爲成形模具之上模具3 6 a，係具備 由不鏽鋼、聚乙烯酯等所構成的矩形板狀模具本體5 2 a ; 此模具本體中，在對應於第1間隔物3 〇a之位置，形成有 多數之透孔5“。各透孔54a，係形成爲較間隔物形成孔 爲大之徑。各透孔5 4 a之中，係設有作爲彈性可變形之紫 外線透過材料，例如矽酮，所構成之孔形成部5 6a。於孔 形成部56a ’形成具有對應第！間隔物3〇a之形狀之有底 的間隔物形成孔4 0 a。依此，間隔物形成孔4 〇 a之周圍， 係被矽酮包圍。另外’做爲孔形成部5 6 a所使用之彈性可 變形之紫外線透過材料，並不限定於矽酮，而可使用聚碳 酸酯、丙烯酯等。 製造如此之上模具3 6 a時，如第7圖（a )所示，首 先’準備有多數之間隔物形成孔被高精密度形成之主要母 模具60。此主要母模具6〇，係由複數枚，例如4枚之金 屬板層積構成；此等之金屬板，係藉由雷射、蝕刻等，以 筒精密度形成對應第1間隔物3 0 a之形狀的間隔物形成孔 6 1 °接著，如第7圖（a )以及第7圖（b )所示，於主要 -13- (10) 1246102 母模具6 0之間隔物形成孔6 1，塡充矽酮等模具形成材料 ’而形成具有對應間隔物形成孔之多數之凸部的主要公模 具6 2。另外’主要公模具6 2亦可由切割形成。 其次，如第7圖（c )所示，準備形成有多數之透孔 54a之模具本體52a。於模具本體52a裝設主要公模具52a ’而主要公模具之各凸部6 3，係呈於模具本體之各透孔 5 4a內幾乎同軸配置地，配合位置者。 於此狀態，如第7 ( d )圖所示，於模具本體5 2 a之 各透孔5 4 a，塡充室溫硬化型之矽酮。矽酮硬化之後，將 主要公模具6 2脫模。依此，如第7 ( e )圖所示，可得到 將規定間隔物形成孔4 0 a之孔形成部5 6 a，加以一體化具 備之上模具3 6 a。 另一方面，於下模具3 6 b，亦和上模具3 6 a相同之形 成，具備多數之透孔54b所形成之模具本體52b、設置於 矽酮所構成之各透孔的孔形成部56b、以及對應於孔形成 部所形成之第2間隔物，有底之間隔物形成孔4 0 b。然後 ，下模具36b係和上模具36a以相同方法製造。 使用如上述構成之上模具36a以及下模具36b而做成 間隔物構體時，對上模具3 6a之間隔物形成孔40a以及下 模具36b之間隔物形成孔40b，各自塡充間隔物形成材料 46。做爲間隔物形成材料46，至少使用含有紫外線硬化 型之接著劑（有機成分）以及玻璃塡充物之玻璃膠。適當 選擇玻璃膠之比重、黏度。 接著，如第8圖所示，使塡充有間隔物形成材料4 6 -14- (11) 1246102^ IEL is appropriate. The grating 24 is formed of an iron-nickel metal plate with a thickness of 0.1 to 0.3 mm. The surface of the grating 24 is covered with an oxide film composed of elements constituting a metal plate, such as an oxide film composed of Fe304 and NiFe2 04. The surfaces 24a, 24b of the grating 24 are also covered with a high-resistance film having a discharge current limiting effect on the wall surface 'of each electron beam passing hole 26. This high-resistance film 'is formed of a high-resistance substance composed mainly of glass. On the first surface 24a of the grating 24, a first spacer 30a 'is integrally established and positioned between adjacent electron beam passing holes 26. The front end of the first spacer 30 a is in contact with the inner surface of the first substrate 10 through the getter film 9, the metal backing 1. 7, and the light shielding layer 11 of the phosphor screen 16. On the second surface 24b of the grating 24, a second spacer 30b is integrally set, and is positioned between the adjacent electron beam passing holes 26. The front end of the second spacer 3 0 b is in contact with the inner surface of the second substrate 12. Here, the front end of each of the second spacers 3 Ob is positioned on a pair disposed on the second substrate 12; The spacers 3 0 a ′ 3 0 b of each brother 1 and brother 2 are positioned in a row with each other, and are formed in a state of holding the grating 24 with the grating 2 4 on both sides. Each of the first spacers 3 0 a ′ is reduced in diameter from the grating 24 toward the extended end -10- (7) 1246102 and is formed into a tapered shape with a thinner tip. Each of the first spacers 30a 'has a first section 50a with a large diameter which is laminated from the above-mentioned grating 24 toward the extended end, and a second section 50b' with a smaller diameter than the i section. Spacer with uneven surface. Each of the first spacers 30a is formed into three segments by including two first segment portions 50a and one second segment portion 50b; the degree of the angle 'e.g.' is, for example, 0.75 mm. The first step portion 50 0 ', which is a convex portion, has a cross-sectional shape with a substantially elliptical shape, and its diameter is 1.3 5 mm x 0.3 mm. The localities of the 50th and 50th sections of the first and second stage sections are formed to be 0.25 mm. In the diameter direction of the i-th spacer 30a, the maximum protrusion amount dl of the first step portion 50a to the second step portion 50b is formed to be 1 0 0 // m or less. Each of the second spacers 3 0 b is formed in a tapered shape with a thinner tip toward the extended end from the grating 24. Each of the second spacers 3 0 b has a first section portion 5 1 a with a large diameter laminated alternately from the above-mentioned grating 24 toward the extended end, and a second section portion 5 having a smaller diameter than the first section portion 丨b, and formed as a spacer with uneven surface. Here, each of the second spacers 3 0 b has two first segment portions 50 a and two second segment portions 50 b and is formed into four segments; its height, for example, is formed as 1. 〇mm. The first step portion 5 1 a which becomes a convex portion has a cross-sectional shape of a substantially elliptical shape, and its diameter is formed to be 1.4 mm m by 0.3 5 m m. The second stage portion 5 1 b which becomes the recessed portion has a cross-sectional shape with a slightly elliptical shape, and its diameter is formed to be 1.3 m m × 0.3 m. The heights of the first and second step portions 5 1 a and 5 1 b are each 0.25 mm. In the diameter direction of the second spacer 3 0 b, the maximum protruding amount d 2 of the first segment portion 5 1 a to the second segment portion 5 1 b is formed to be 1 0 0 -11-(8) 1246102 V m or less . The spacer structure 22 constructed as described above is arranged between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b support the atmospheric pressure load acting on the substrates by contacting the inner surfaces of the first substrate 10 and the second substrate 12 to maintain the interval between the substrates at A specific number. The SED includes a voltage supply unit (not shown) that applies a voltage to the grating 24 and the metal back 17 of the first substrate. The voltage supply unit φ is connected to the grating 24 and the metal backing 17 respectively. For example, a voltage of 12 kV is applied to the grating 24 and a voltage of 10 kV is applied to the metal back 17. In the SED, when an image is displayed, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron emitting element 18 is accelerated by the anode voltage to the phosphor screen 16. Crash. Accordingly, the phosphor layer 16 of the phosphor screen 16 is excited to emit light, and displays an image. Next, the manufacturing method of the SED structured as described above will be described. First, a method for manufacturing the spacer structure 22 will be described. As shown in FIG. 6, when manufacturing the spacer structure 22, a grating 2 4 of a specific size and a rectangular plate-shaped upper mold 3 6 a and a lower mold 3 6 having almost the same dimensions as the grating are prepared first. b. A metal plate having a plate thickness of 0.1 5 mm formed by F e-50 ° / 〇 N i was degreased, washed, and dried, and then an electron beam passage hole 26 was formed by etching to form a grating 24. After that, the grating 24 is completely oxidized, and an insulating film is formed on the surface of the grating including the inner surface of the electron beam passing hole 26. Furthermore, a coating liquid containing glass as a main component is coated on the insulating film, and after drying, a high-resistance film is formed by grilling. 12- (9) 1246102 The upper mold 3 6 a ' The object 3 〇a is formed, and the majority of the spacers form the hole 4 0 a. Similarly, the lower mold 3 6 b has a plurality of holes 40 b for forming the spacer 2 0 b of the table 2. Here, the structure of the upper mold 3 6 a and the lower mold 3 6 b and the method for manufacturing the same will be described as a representative. As shown in FIG. 6, as the upper mold 3 6 a of the forming mold, a rectangular plate-shaped mold body 5 2 a made of stainless steel, polyvinyl ester, or the like is provided; At the position of 3 〇a, a large number of through holes 5 "are formed. Each through hole 54a is formed to have a larger diameter than the spacer-forming hole. Each of the through holes 5 4 a is provided as an elastically deformable hole. The hole forming portion 56a is formed of an ultraviolet transmitting material, such as silicone. A bottomed spacer forming hole 40a having a shape corresponding to that of the spacer 30a is formed in the hole forming portion 56a '. Accordingly, Around the spacer-forming hole 40a, it is surrounded by silicone. In addition, as the elastically deformable ultraviolet transmitting material used for the hole-forming portion 5a, it is not limited to silicone, but polycarbonate can be used. Acrylate, etc. When manufacturing such a mold 36a, as shown in Fig. 7 (a), first, a main master mold 60 having a large number of spacer-forming holes formed with high precision is prepared. This main master mold 60, which is composed of a plurality of laminated metal plates, such as four; A metal plate is formed by a laser, etching, or the like to form a spacer-forming hole 6 1 ° corresponding to the shape of the first spacer 3 0 a with a cylinder precision. Then, as shown in FIG. 7 (a) and FIG. 7 (b ) As shown in the figure below. The main hole of the main hole of the -13- (10) 1246102 master mold 60 forming the hole 61 is filled with a mold-forming material such as silicone to form a convex portion having a large number of corresponding spacer-forming holes. Mold 6 2. In addition, the main male mold 62 can also be formed by cutting. Next, as shown in FIG. 7 (c), a mold body 52a having a large number of through holes 54a is prepared. A main male mold is installed in the mold body 52a. 52a ', and each convex part 63 of the main male mold is arranged coaxially in each through hole 5 4a of the mold body, and is matched with the position. In this state, as shown in FIG. 7 (d), in the mold Each through hole 5 4 a of the body 5 2 a is filled with room temperature hardening type silicone. After the silicone is hardened, the main male mold 6 2 is demolded. Accordingly, as shown in FIG. 7 (e), A hole forming portion 5 6 a in which a predetermined spacer is formed into a hole 40 a is obtained and integrated with an upper mold 3 6 a. On the other hand, in The mold 3 6 b is also formed in the same manner as the upper mold 3 6 a, and includes a mold body 52 b formed by a large number of through holes 54 b, a hole forming portion 56 b provided in each through hole made of silicone, and corresponding hole formation. The second spacer formed by the bottom portion and the bottomed spacer form a hole 40b. Then, the lower mold 36b is manufactured in the same manner as the upper mold 36a. The upper mold 36a and the lower mold 36b are configured as described above. In the spacer structure, the spacer-forming hole 40a of the upper mold 36a and the spacer-forming hole 40b of the lower mold 36b are filled with the spacer-forming material 46, respectively. As the spacer-forming material 46, at least glass adhesive containing a UV-curable adhesive (organic component) and a glass filler is used. Properly choose the specific gravity and viscosity of the glass glue. Next, as shown in FIG. 8, the plutonium is filled with the spacer-forming material 4 6 -14- (11) 1246102
之間隔物形成孔4 0 a，呈定位於電子束通過孔2 6之間地 ，將上模具36a對光柵24定位，而密著於光柵24之第1 表面24a。同樣的，將下模具36b，呈各間隔物形成孔 4 〇b定位於電子束通過孔26之間地加以定位，而密著無 光柵24之第2表面24a。依此，可構成由光柵24，上模 具36a以及下模具36b所組成之組合體42。組合體42中 ’上模具3 6 a之間隔物形成孔4 〇 a和下模具3 6 b之間隔物 形成孔3 6 b，係挾持光柵2 4而對向配列者。 其次’如第8圖所示，對已塡充之間隔 }\y ΗΛ, 不The spacer forms a hole 40a, which is positioned between the electron beam passing holes 26, and positions the upper mold 36a to the grating 24 and is in close contact with the first surface 24a of the grating 24. Similarly, the lower mold 36b is positioned with the spacer-forming holes 40b positioned between the electron beam passing holes 26, and closely adheres to the second surface 24a without the grating 24. According to this, a combined body 42 composed of the grating 24, the upper mold 36a, and the lower mold 36b can be formed. In the assembly 42, the spacer forming hole 40a of the upper mold 3 6a and the spacer forming hole 3 6b of the lower mold 3 6 b are opposed to each other by supporting the grating 24. Secondly, as shown in Figure 8, the interval between the full charge} \ y ΗΛ, not
4 6 ’例如使用紫外線燈等，自上模具3 6 a以及下模具3 6 之外面側照射紫外線（UV )，而使間隔物形成材料被u 硬化。此時，塡充有間隔物形成材料46之間隔物形成3 4〇a、4 Ob之周圍，係被紫外線透過材料之矽酮所形成白 孔形成部56a、56b所包圍。故，紫外線係直接，以及支 過孔形成部5 5 6 a、56b，照射於間隔物形成材料46。從行 ’被充塡之間隔物46，以致其內部都能確實硬化。 之後’如帛9圖所示，使硬化之間隔物形成材料4 殘留於光栅24上地，將上模具36a以及下模具自^ 柵24脫模。硬化後之間隔物形成材料以， / 夕」、即弟1以】 第2間隔物30a、30b，係各自形成具有第丨段部以及第- I又口β之凹凸狀。然後’規範間_物形成$ w 扎 4 0 a、4 0 b 之 5 形成部56a、56b ’係以彈性可變形之砂酮所形成。故$ 第10圖所示’上模具36a之脫模時’孔形成㈤5“係》 著硬化後之第1間隔物30a的凹凸，而彈性變形。從而 -15- (12) 1246102 即使於弟1間隔物3 0a形成爲凹凸形狀時，仍可不損傷此 等第1間隔物’而輕易將上模具36a脫模。對下模具36b 亦相同，可不損傷第2間隔物3〇b，而輕易脫模。 其次’將設有間隔物形成材料之光柵24，於加熱爐 內進行熱處理’自間隔物形成材料內將接著劑蒸發之後， 以大約5 00 C〜5 5〇t的30分鐘〜丨小時，將間隔物形成材 料燒烤而玻璃化。依此，可得到於光柵24上置入有第！ 以及第2間隔物3 0 a、3 0 b的間隔物構體2 2。 φ 另一方面，SED之製造中，先準備設有螢光體屏16 以及金屬襯背1 7的第1基板1 〇 ;和設有電子放射元件1 8 以及配線2 1之同時’接合於側壁1 *之第2基板1 2。 接著’將如上述所得之間隔物構體2 2，於第2基板 1 2上定位配置。於此狀態，將第1基板1 〇、第2基板1 2 、以及間隔物構體2 2配置於真空室內，將真空室內真空 排氣後’經由側壁1 4而接著第1基板以及第2基板。依 此，可製造具備間隔物構體22之SED。 φ 若依以上構成之SED，構成間隔物構體之第1以及第 2間隔物30a、30b，係各自具有互相直徑不同之第1段部 以及第2段部，而形成爲表面凹凸狀。故，可抑制對間隔 物表面之反射電子，2次電子之衝突，進而可抑制間隔物 之帶電所造成之耐放電電壓低落以及電子束軌道偏移。比 起具備高度相同但不具段部之間隔物的SED和本實施方 式之SED，本實施方式之SED，約減低了 30%之電子束軌 道偏移。依此，可得到耐電壓特性以及顯示品質提高之畫 -16- (13) 1246102 像顯示裝置。 又’若依上述之製造方法，形成具有第1以及第2段 部而表面凹凸之間隔物時，亦可因孔形成部56a、5 6b之 彈性變形’而可輕易將上模具以及下模具脫模，故無將成 形模具溶解之必要。故，不會發生溶解成形模具所帶來的 對間隔物之傷害或污染；同時，可多次，重複使用成形模 具。依以上情事，可廉價製造畫像顯示裝置所使用之間隔 物構體。 Φ 上述之實施方式中’間隔物構體22，雖由第1以及 第2間隔物以及光柵，而一體構成者，但將第2間隔物形 成於第2基板1 2上之構成亦可。又，間隔物構體，僅具 備光柵以及桌2間隔物，而以光柵接觸第1基板之構成亦 可 。 如第11圖以及第12圖所示，若依本發明之第2之實 施方式的S E D，則間隔物構體2 2，係具有矩形狀金屬板 所構成之光栅2 4，和僅一體設立於光柵之一方之表面的 4 多數之柱狀之間隔物3 0。光栅24係具有對向於第1基板 1 0之內面的第1表面24a，和對向於第2基板1 2之內面 的第2表面2 4 b，而此等基板係平行於基板而配置。光柵 2 4，係由蝕刻等而形成有多數之電子束通過孔2 6。電子 束通過孔2 6，係各自對向於電子放射元件1 8而配列’讓 自電子放射元件所放射之電子束透過。 光柵24之第1以及第2表面24a、24b，和各電子束 通過孔2 6之內壁面，係覆蓋有做爲絕緣層’以玻璃、陶 -17- (14) 1246102 瓷等作爲主成分之絕緣性物質；例如，Li系之鹼性硼矽 酸玻璃所構成，厚度約1 0 m之高電阻膜4 3。然後，光 柵24，其第1表面24a係經由吸氣膜、金屬襯背17、螢 光體屏1 6，以接觸第1基板1 〇之內面而被設置者。設置 於光柵24之電子束通過孔26，係對向於螢光體屏16之 螢光體層R、G、B，以及第2基板1 2上的電子放射元件 1 8。依此，各電子放射元件1 8，係透過電子束通過孔2 6 ，而對向於相對應之螢光體層。 · 光柵24之第2表面24a上，係一體設立有複數之間 隔物3 0。各間隔物3 0之延伸端，係碰觸第2基板1 2之 內面，而於此係碰觸設置於第2基板1 2之內面上的配線 2 1上。各個間隔物3 0，係形成爲自光柵2 4側，朝向延伸 端而直徑縮小之尖端較細的錐狀。 各間隔物3 0 ’係具有自上述光柵2 4向著延伸端，交 互層積之大直徑之第1段部5 0 a，以及直徑較第1段部爲 小之第2段部5 0 b，而形成爲表面凹凸之間隔物。各間隔 4 物3 0 ’係具有2個之第1段部5 0 a和2個第2段部5 0 b 而形成4段；其高度，例如’係形成爲1 . 4 m m。成爲凸部 之第1段部5 0 a ’係具有槪略橢圓形狀之橫剖面形狀，而 其直徑係形成爲1 · 4 m m X 0 . 3 5 m m。第]以及第2段部5 0 a 、5 0 b之各高度皆形成爲〇 . 3 5 m m。於間隔物3 0之直徑方 向，第1段部5 0a對第2段部5 Ob之最大突出量係形成爲 1 0 0 // m 以下。 如上述所構成之間隔物構體2 2，係藉由使光柵2 4平 -18- (15) 1246102 面接觸第1基板1 0，且間隔物3 0之延伸端接觸第2基板 1 2之內面，而支撐作用於此等基板之大氣壓負荷，並將 基板間之間隔維持在特定數値。 第2之實施方式中，其他之構成係和上述第1之實施 方式相同，而相同部分係附加相同參考符號，並省略詳細 說明。有關第2之實施方式的SED以及間隔物構體22， 係可以相同於上述第1實施方式之製造方法的製造方法而 製造。然後，第2之實施方式中，亦可得到與上述第1實 施方式相同之效果。 上述之實施方式中，雖使用紫外線硬化材料做爲間隔 物形成材料，但亦可用熱硬化型之間隔物形成材料。也就 是說’做爲間隔物形成材料46，可使用例如含有熱硬化 型之接著劑以及玻璃塡充物之玻璃膠。 此時’和上述第1之實施方式相同，於上模具3 6 a以 及下模具36b的間隔物形成孔’塡充間隔物形成材料46 後’使周光柵2 4、上彳旲具6 a以及下模具3 6 b來構成組 合體4 2。接著，將組合體4 2加熱而將間隔物形成材料加 熱硬化後’自光栅2 4將上模具3 6 a以及下模具3 6 b分離 〇 其次，將設置有間隔物形成材料46之光柵24於加熱 壚內進行熱處理’自間隔物形成材料內將接著劑蒸發之後 ，以大約5 0 0 °C〜5 5 0 °C的30分鐘〜丨小時，將間隔物形成 材料燒烤而玻璃化。依此，可得到於光柵24上置入有第 1以及第2間隔物30a、30b的間隔物構體22。 ，19- (16) 1246102 此方式的情況下’將間隔物形成材料4 6加熱硬化時 ，因光柵24、上模具36a、下模具36b之溫度分布、熱膨 脹率的差別’於光柵表面和上模具以及下方表面的界面， 容易產生平面方向之位置偏移。然而，若依本實施方式， 上模具3 6 a以及下模具3 6 b中’間隔物形成孔4 〇 a、4 〇 b 之周圍所設置的孔形成部5 6 a、5 6 b，係以彈性材料之矽 酮所形成。故’即使光柵與成形模具間產生平面方向之位 置偏移，藉由孔形成部5 6 a、5 6 b之彈性變形，而可吸收 作用於被加熱硬化之間隔物形成材料4 6的負荷。從而， 進行間隔物形成材料之加熱硬化時，可急速加熱或急速冷 卻，並追求製造效率之提昇。 本發明係非如此限定於上述實施方式，在實施階段於 不脫離該主旨之範圍內，可變化構成要素並具體化。又， 將上述實施方式所揭示之複數之構成要素，加以適當組合 ’可形成多種發明。例如，自實施方式所揭示之所有構成 要素’刪除幾個構成要素亦可。更且，亦可適當組合不同 實施方式之構成要素。 間隔物之直徑、高度、階段數、其他構成要素之尺寸 、材質等，係不限定於上述實施方式，而可配合必要而適 富選擇。此發明，係不限於使用表面傳導型電子放射元件 做爲電子源，而亦可適用於使用電場放射型、奈米碳管等 其他電子源的畫像顯示裝置。 上述第1實施方式中，間隔物構體之第1以及第2間 隔物’雖任一個皆做爲具有第1段部以及第2段部的凹凸 -20- (17) 1246102 形狀，但僅使第1以及第2間隔物之任一方成爲凹凸形狀 亦可。間隔物中第1段部以及第2段部之剖面形狀，係並 不限於橢圓形而其他形狀亦可；更且，第1段部以及第2 段部，亦可形成爲相互不同之剖面形狀。 【產業之可利用性】 若依此發明，可抑制對間隔物表面之反射電子，2次 電子之衝突，進而可抑制間隔物之帶電所造成之耐放電電 壓低落以及電子束軌道偏移。依此，可得到耐電壓特性以 及顯示品質提高之畫像顯示裝置。又，形成具有第1以及 第2段部而表面凹凸之間隔物時，亦可因孔形成部之彈性 變形，而可輕易將上模具以及下模具脫模，故無將成形模 具溶解之必要。故，不會發生溶解成形模具所帶來的對間 隔物之傷害或污染，而可廉價製造畫像顯示裝置所使用之 間_物構體。 【圖式簡單說明】 【第1圖】第]圖係表示有關本發明之第1之實施方 式之SED的立體圖 【第2圖】第2圖係沿著第丨圖之II-II線切開之上 述SED的立體圖 【第3圖】第3圖係擴大表示上述S E D之剖面圖 【第4 _】第4圖係將上述間隔物的一部分，擴大表 示之立體圖 -21 - (18) 1246102 【第5圖】第5圖係沿著第4圖之V-V線的剖面圖 【第6圖】第6圖係表示上述間隔物構體之製程的剖 面圖 【第7圖】第7圖係用於上述間隔物構體之製造的成 形模具之製程，加以表示之剖面圖 【第8圖】第8圖係顯示將成形模具以及光柵密接形 成之組合體的剖面圖 【第9圖】第9圖係顯示將上述成形模具脫模之狀態 · 的剖面圖 【第1 〇圖】第1 〇圖係顯示上述成形模具脫模時，成 形模具以及間隔物的剖面圖 【第1 1圖】第1 1圖係將有關本發明之第2之實施方 式之SED，部分切斷而表示的立體圖 【第1 2圖】第1 2圖係關於上述第2之實施方式之 S E D的剖面圖 • 【主要元件符號說明】 I 〇 第1基板 II 遮光層 12 第2基板 14 側壁 15 真空外圍器 16 螢光體屏 ]7 金屬観背 -22- (19)1246102 18 電子放射源 19 吸氣膜 20 密封材 2 1 配線 22 間隔物構體 24 光柵 24a 第 1表面 24b 第2表面 26 電子束通過孔 30a 第1間隔物 3 0b 第2間隔物 3 6a 上模具 36b 下模具 40a 間隔物形成孔 40b 間隔物形成孔 43 高電阻膜 50a 第1段部 50b 第2段部 5 1 a 第1段部 5 1b 第2段部 52a 模具本體 52b 模具本體 54a 透孔 54b 透孔4 6 ′, for example, an ultraviolet lamp is used to irradiate ultraviolet rays (UV) from the outer surfaces of the upper mold 36 and the lower mold 36, so that the spacer forming material is hardened by u. At this time, the periphery of the spacer forming 340a and 4Ob filled with the spacer forming material 46 is surrounded by the white hole forming portions 56a and 56b formed by the silicone of the ultraviolet transmitting material. Therefore, the ultraviolet ray is directly irradiated onto the spacer forming material 46 and the via hole forming portions 5 5 6 a and 56 b are irradiated. From the row ′, the spacers 46 are filled so that the inside thereof is surely hardened. After that, as shown in FIG. 9, the hardened spacer-forming material 4 is left on the grating 24, and the upper mold 36 a and the lower mold are released from the grating 24. After hardening, the spacer-forming material is, "Xi", that is, the first spacer] The second spacers 30a and 30b are each formed into a concave-convex shape having a first section section and a first section and a first section β. Then, the "specification space" is formed into the formation portions 56a, 56b, 5a, 4b, and 5b, which are formed by elastic deformable ketones. Therefore, as shown in Fig. 10, when the upper mold 36a is demolded, the hole formation ㈤5 "system" is elastically deformed by the unevenness of the first spacer 30a after hardening. Thus -15- (12) 1246102 When the spacer 30a is formed into a concave-convex shape, the upper mold 36a can be easily demolded without damaging these first spacers. The same is true for the lower mold 36b, and the second spacer 30b can be easily demolded without damaging the second spacer 30a. Next, 'the grating 24 provided with the spacer-forming material is heat-treated in a heating furnace', and the adhesive is evaporated from the spacer-forming material for 30 minutes to 5 hours at about 500 C to 5 50 t. The spacer-forming material is grilled and vitrified. In this way, a spacer structure 2 2 in which the first and second spacers 3 0 a and 3 0 b are placed on the grating 24 can be obtained. Φ On the other hand, SED In manufacturing, a first substrate 10 provided with a phosphor screen 16 and a metal back 17 is prepared; and a second substrate provided with an electron emitting element 18 and a wiring 21 is bonded to the side wall 1 * 1 2. Next, the spacer structure 2 2 obtained as described above is positioned on the second substrate 12. In a state, the first substrate 10, the second substrate 1 2 and the spacer structure 22 are arranged in a vacuum chamber, and after the vacuum chamber is evacuated, the first substrate and the second substrate are connected to each other through the side wall 14. Therefore, the SED including the spacer structure 22 can be manufactured. Φ According to the SED structured above, the first and second spacers 30a and 30b constituting the spacer structure each have a first segment portion having a different diameter from each other and The second section is formed with a concave-convex surface. Therefore, it is possible to suppress the reflected electrons on the surface of the spacer and the collision of secondary electrons, and further reduce the drop in the withstand voltage caused by the charging of the spacer and the electron beam orbital deviation Compared with the SED with spacers of the same height but without segments and the SED of this embodiment, the SED of this embodiment reduces the electron beam orbital offset by about 30%. With this, the withstand voltage characteristics and display can be obtained. Picture of improved quality -16- (13) 1246102 image display device. Also, if a spacer having first and second stage portions with uneven surfaces is formed according to the above-mentioned manufacturing method, the hole forming portions 56a, 5 may also be used. 6b elastic deformation ' The upper mold and the lower mold can be easily demolded, so there is no need to dissolve the forming mold. Therefore, no damage or pollution to the spacer caused by dissolving the forming mold will occur; at the same time, the forming mold can be reused multiple times According to the above, the spacer structure used in the image display device can be manufactured at a low cost. Φ The 'spacer structure 22' in the above-mentioned embodiment is integrated with the first and second spacers and the grating, but A configuration in which the second spacer is formed on the second substrate 12 may be used. The spacer structure may include only a grating and a table 2 spacer, and a configuration in which the grating contacts the first substrate may be used. As shown in FIG. 11 and FIG. 12, according to the SED according to the second embodiment of the present invention, the spacer structure 2 2 is a grating 2 4 having a rectangular metal plate, and is integrally formed only with There are 4 majority of columnar spacers 30 on one side of the grating. The grating 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 2 4b facing the inner surface of the second substrate 12, and the substrates are parallel to the substrate. Configuration. The grating 24 is formed with a large number of electron beam passing holes 26 by etching or the like. The electron beams passing through the holes 26 are arranged opposite to the electron emitting elements 18, respectively, so that the electron beams emitted from the electron emitting elements are transmitted. The first and second surfaces 24a, 24b of the grating 24 and the inner wall surfaces of the electron beam passing holes 26 are covered as an insulating layer. The main components are glass, ceramic-17- (14) 1246102 porcelain, etc. Insulating material; for example, a high-resistance film 43 made of Li-based alkaline borosilicate glass with a thickness of about 10 m. Then, the first surface 24a of the light grid 24 is placed through a getter film, a metal back 17, and a phosphor screen 16 so as to contact the inner surface of the first substrate 10. The electron beam passing holes 26 provided in the grating 24 are opposed to the phosphor layers R, G, and B of the phosphor screen 16 and the electron emitting elements 18 on the second substrate 12. According to this, each of the electron emitting elements 18 passes through the electron beam passing hole 26 and faces the corresponding phosphor layer. A plurality of spacers 30 are integrally formed on the second surface 24a of the grating 24. The extended end of each spacer 30 touches the inner surface of the second substrate 12, and here, it touches the wiring 21 provided on the inner surface of the second substrate 12. Each of the spacers 30 is formed in a tapered shape with a thinner tip toward the extended end from the side of the grating 24. Each of the spacers 3 0 ′ has a first segment portion 5 0 a with a large diameter which is laminated from the above-mentioned grating 24 toward the end, and a second segment portion 50 b having a smaller diameter than the first segment portion, It is formed as a spacer with uneven surface. Each interval 4 object 3 'has two first segment portions 50 a and two second segment portions 50 b to form four segments; its height, for example, is' 1.4 mm. The first segment portion 50a 'which is a convex portion has a cross-sectional shape of a slightly oval shape, and its diameter is formed to be 1.4 mm m 0.35 mm. The heights of the first and second segment portions 50 a and 50 b are each 0.35 mm. In the diameter direction of the spacer 30, the maximum protruding amount of the first segment portion 50a to the second segment portion 5 Ob is formed to be 1 0 0 // m or less. The spacer structure 2 2 constructed as described above is made by making the grating 2 4 flat -18- (15) 1246102 surface contacting the first substrate 10 and the extended end of the spacer 30 contacting the second substrate 12 The inner surface supports the atmospheric pressure load on these substrates and maintains the interval between the substrates at a certain number. In the second embodiment, the other components are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and detailed descriptions are omitted. The SED and the spacer structure 22 according to the second embodiment can be manufactured by the same manufacturing method as the manufacturing method of the first embodiment. Then, in the second embodiment, the same effects as those in the first embodiment can be obtained. In the above-mentioned embodiment, although a UV-curing material is used as the spacer-forming material, a heat-curing type spacer-forming material may be used. That is, as the spacer-forming material 46, for example, a glass paste containing a thermosetting type adhesive and a glass filler can be used. At this time, as in the first embodiment described above, the spacers of the upper mold 3 6 a and the lower mold 36 b are formed with holes 'filled with the spacer forming material 46', and then the peripheral grating 2 4 and the upper mold 6 a are formed. The lower mold 3 6 b constitutes the composite body 4 2. Next, after heating the assembly 4 2 to heat and harden the spacer-forming material, the upper mold 3 6 a and the lower mold 3 6 b are separated from the grating 2 4. Next, the grating 24 provided with the spacer-forming material 46 is placed on the grating 24. Heat treatment is performed in a heating pan. After evaporating the adhesive from the spacer-forming material, the spacer-forming material is grilled and vitrified for about 30 minutes to 5 hours at about 500 ° C to 5 50 ° C. As a result, a spacer structure 22 in which the first and second spacers 30a and 30b are placed on the grating 24 can be obtained. 19- (16) 1246102 In the case of this method, when the spacer-forming material 4 6 is heated and hardened, the difference between the temperature distribution of the grating 24, the upper mold 36a, and the lower mold 36b, and the thermal expansion coefficient are 'on the grating surface and the upper mold And the interface on the lower surface is prone to positional displacement in the plane direction. However, according to this embodiment, the hole forming portions 5 6 a and 5 6 b provided around the 'spacer-forming holes 4 0a and 4 0b' in the upper mold 36 a and the lower mold 3 6 b are based on It is formed by silicone of elastic material. Therefore, even if the positional displacement in the planar direction occurs between the grating and the forming die, the elastic deformation of the hole forming portions 5 6 a and 5 6 b can absorb the load acting on the spacer-forming material 46 which is hardened by heating. Therefore, when the spacer-forming material is heat-hardened, it can be rapidly heated or rapidly cooled, and the improvement of manufacturing efficiency can be pursued. The present invention is not limited to the above-mentioned embodiments, and the constituent elements may be changed and embodied in the range of implementation without departing from the gist. Further, a plurality of inventions can be formed by appropriately combining the plural constituent elements disclosed in the above embodiments. For example, several constituent elements may be deleted from all the constituent elements' disclosed in the embodiment. Furthermore, constituent elements of different embodiments may be appropriately combined. The diameter, height, number of stages, dimensions, materials, etc. of the spacers are not limited to the above-mentioned embodiments, and can be selected in accordance with necessity. This invention is not limited to the use of surface-conduction electron emission elements as the electron source, but can also be applied to image display devices using other electron sources such as electric field emission type and nano carbon tubes. In the above-mentioned first embodiment, although the first and second spacers of the spacer structure are both formed as bumps having a first step portion and a second step portion -20- (17) 1246102, only Either the first or the second spacer may have an uneven shape. The cross-sectional shapes of the first and second segment sections in the spacer are not limited to oval shapes and other shapes may be used; moreover, the first and second segment sections may be formed with mutually different cross-sectional shapes. . [Industrial Applicability] According to this invention, the reflected electrons on the surface of the spacer and the secondary electrons can be suppressed, and the drop in discharge resistance voltage and the electron beam orbital deviation caused by the charging of the spacer can be suppressed. This makes it possible to obtain an image display device having withstand voltage characteristics and improved display quality. In addition, when a spacer having first and second step portions with uneven surfaces is formed, the upper mold and the lower mold can be easily demolded due to the elastic deformation of the hole forming portion, so it is not necessary to dissolve the mold. Therefore, the spacers are not damaged or contaminated by dissolving the forming mold, and the spacer structure used in the image display device can be manufactured at low cost. [Brief description of the drawings] [Figure 1] Figure 1 is a perspective view showing the SED according to the first embodiment of the present invention. [Figure 2] Figure 2 is a cut along the line II-II of Figure 丨Perspective view of the above SED [Fig. 3] Fig. 3 is an enlarged cross-sectional view of the above-mentioned SED [4th _] Fig. 4 is an enlarged perspective view of a part of the spacer -21-(18) 1246102 [No. 5 Figure] Figure 5 is a cross-sectional view taken along the line VV of Figure 4 [Figure 6] Figure 6 is a cross-sectional view showing the process of the spacer structure [Figure 7] Figure 7 is used for the above-mentioned space Cross-sectional view showing the manufacturing process of the forming mold for the physical structure [Fig. 8] Fig. 8 is a cross-sectional view showing a combination of the forming mold and the grating tightly formed. [Fig. 9] Fig. 9 shows A cross-sectional view of the state of the above-mentioned forming mold release [Fig. 10] Fig. 10 shows a cross-sectional view of the forming mold and the spacer when the above-mentioned forming mold is released [Fig. 11] Fig. 11 shows The SED according to the second embodiment of the present invention is a partially cutaway perspective view [No. 1 2 ] Figure 12 is a cross-sectional view of the SED in the second embodiment described above. [Description of main component symbols] I. The first substrate II light-shielding layer 12 Second substrate 14 Side wall 15 Vacuum peripheral 16 Phosphor screen] 7 Metal back -22- (19) 1246102 18 Electron radiation source 19 Air-absorbing film 20 Sealing material 2 1 Wiring 22 Spacer structure 24 Grating 24a First surface 24b Second surface 26 Electron beam passing hole 30a First spacer 3 0b 2nd spacer 3 6a upper mold 36b lower mold 40a spacer forming hole 40b spacer forming hole 43 high resistance film 50a first section 50b second section 5 1 a first section 5 1b second section 52a Mold body 52b mold body 54a through hole 54b through hole
-23- (20)1246102 5 6a 孔 形 成 部 5 6b 孔 形 成 部 60 主 要 母 模 具 6 1 間 隔 物 形 成孔 62 主 要 公 模 具 63 凸 部 d 1 最 大 突 出 量 d2 最 大 突 出 量 R 螢 光 體 層 G 螢 光 體 層 B 螢 光 體 層 U V 紫 外 線-23- (20) 1246102 5 6a Hole forming part 5 6b Hole forming part 60 Main female mold 6 1 Spacer forming hole 62 Main male mold 63 Protrusion d 1 Maximum protrusion d2 Maximum protrusion R Phosphor layer G Fluorescence Bulk layer B Phosphor layer UV