WO2005027610A3 - Blindage pour carte de circuits imprimes et procede de fabrication associe - Google Patents

Blindage pour carte de circuits imprimes et procede de fabrication associe Download PDF

Info

Publication number
WO2005027610A3
WO2005027610A3 PCT/EP2004/051923 EP2004051923W WO2005027610A3 WO 2005027610 A3 WO2005027610 A3 WO 2005027610A3 EP 2004051923 W EP2004051923 W EP 2004051923W WO 2005027610 A3 WO2005027610 A3 WO 2005027610A3
Authority
WO
WIPO (PCT)
Prior art keywords
shield
cover
circuit board
roof
shaped
Prior art date
Application number
PCT/EP2004/051923
Other languages
English (en)
Other versions
WO2005027610A2 (fr
Inventor
Mats Olsson
Original Assignee
Sony Ericsson Mobile Comm Ab
Mats Olsson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP20040445001 external-priority patent/EP1515598B1/fr
Application filed by Sony Ericsson Mobile Comm Ab, Mats Olsson filed Critical Sony Ericsson Mobile Comm Ab
Priority to JP2006525811A priority Critical patent/JP4499724B2/ja
Priority to BRPI0414233-0A priority patent/BRPI0414233A/pt
Publication of WO2005027610A2 publication Critical patent/WO2005027610A2/fr
Publication of WO2005027610A3 publication Critical patent/WO2005027610A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention se rapporte à un blindage pour des cartes de circuits imprimés, plus précisément à un blindage fabriqué convenablement à partir d'une protection métallique en un morceau (1), ainsi qu'au procédé de fabrication associé. Ce blindage comprend au moins une partie de blindage (3) façonnée à partir de la protection (1) conçue pour recouvrir au moins une partie de la carte de circuits imprimés. Dans un mode de réalisation préféré, la protection est dotée de parois externes (6) et d'un toit (5), la partie de blindage comprenant une paroi de blindage interne (3) conçue pour dépendre du toit (5). Cette paroi de blindage (3) peut être façonnée par découpage et inclinaison du matériau à partir du toit (5). Cette protection (1) peut être faite d'un plastique métallisé ou d'un métal.
PCT/EP2004/051923 2003-09-12 2004-08-26 Blindage pour carte de circuits imprimes et procede de fabrication associe WO2005027610A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006525811A JP4499724B2 (ja) 2003-09-12 2004-08-26 回路基板のシールド及びその製造方法
BRPI0414233-0A BRPI0414233A (pt) 2003-09-12 2004-08-26 blindagem para placa de circuito e método de formar a mesma

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
EP03077870 2003-09-12
EP03077870.8 2003-09-12
EP04445001.3 2004-01-02
EP20040445001 EP1515598B1 (fr) 2003-09-12 2004-01-02 Blindage pour une plaque de circuit et sa fabrication
US53576804P 2004-01-12 2004-01-12
US60/535,768 2004-01-12

Publications (2)

Publication Number Publication Date
WO2005027610A2 WO2005027610A2 (fr) 2005-03-24
WO2005027610A3 true WO2005027610A3 (fr) 2005-06-23

Family

ID=34317075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/051923 WO2005027610A2 (fr) 2003-09-12 2004-08-26 Blindage pour carte de circuits imprimes et procede de fabrication associe

Country Status (4)

Country Link
JP (1) JP4499724B2 (fr)
KR (1) KR20060119940A (fr)
BR (1) BRPI0414233A (fr)
WO (1) WO2005027610A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078321A (ja) * 2006-09-20 2008-04-03 Sony Ericsson Mobilecommunications Japan Inc 通信端末及び送信機のシールド構造
JP2018032656A (ja) * 2016-08-22 2018-03-01 沖電気工業株式会社 シールドケース

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11177270A (ja) * 1997-12-12 1999-07-02 Mitsumi Electric Co Ltd 高周波回路装置のアース構造
DE19945427C1 (de) * 1999-09-22 2000-11-02 Siemens Ag Abschirmvorrichtung und Verfahren zu deren Herstellung
WO2002024431A1 (fr) * 2000-09-18 2002-03-28 Shielding For Electronics, Inc. Structures multi-couches et procedes de fabrication de structures multi-couches
WO2003032703A1 (fr) * 2001-10-03 2003-04-17 Matsushita Electric Industrial Co., Ltd. Dispositif haute frequence

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322498A (ja) * 1991-04-23 1992-11-12 Murata Mfg Co Ltd 高周波機器
JPH098487A (ja) * 1995-06-23 1997-01-10 Oki Electric Ind Co Ltd シールド構造
JPH10117082A (ja) * 1996-10-08 1998-05-06 Kitagawa Ind Co Ltd 電磁波シールドカバー
JPH11330765A (ja) * 1998-05-19 1999-11-30 Matsushita Electric Ind Co Ltd 表面実装モジュール
JP2954188B1 (ja) * 1998-08-12 1999-09-27 埼玉日本電気株式会社 電子機器のシールド構造
JP3959214B2 (ja) * 1999-11-01 2007-08-15 株式会社東芝 無線機のシールド構造
JP3933852B2 (ja) * 2000-08-18 2007-06-20 三菱電機株式会社 シールド装置
JP2002261486A (ja) * 2001-03-01 2002-09-13 Alps Electric Co Ltd 電子回路ユニット
JP3960115B2 (ja) * 2001-05-24 2007-08-15 松下電器産業株式会社 携帯用電力増幅器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11177270A (ja) * 1997-12-12 1999-07-02 Mitsumi Electric Co Ltd 高周波回路装置のアース構造
DE19945427C1 (de) * 1999-09-22 2000-11-02 Siemens Ag Abschirmvorrichtung und Verfahren zu deren Herstellung
WO2002024431A1 (fr) * 2000-09-18 2002-03-28 Shielding For Electronics, Inc. Structures multi-couches et procedes de fabrication de structures multi-couches
WO2003032703A1 (fr) * 2001-10-03 2003-04-17 Matsushita Electric Industrial Co., Ltd. Dispositif haute frequence
EP1357779A1 (fr) * 2001-10-03 2003-10-29 Matsushita Electric Industrial Co., Ltd. Dispositif haute frequence

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *

Also Published As

Publication number Publication date
WO2005027610A2 (fr) 2005-03-24
KR20060119940A (ko) 2006-11-24
JP4499724B2 (ja) 2010-07-07
BRPI0414233A (pt) 2006-10-31
JP2007505489A (ja) 2007-03-08

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