WO2005013658A1 - パワー素子冷却装置 - Google Patents
パワー素子冷却装置 Download PDFInfo
- Publication number
- WO2005013658A1 WO2005013658A1 PCT/JP2004/010468 JP2004010468W WO2005013658A1 WO 2005013658 A1 WO2005013658 A1 WO 2005013658A1 JP 2004010468 W JP2004010468 W JP 2004010468W WO 2005013658 A1 WO2005013658 A1 WO 2005013658A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power element
- heat sink
- heat
- cooling device
- pressure adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
Definitions
- the present invention relates to a cooling device for a power element having a function of satisfactorily radiating heat generated from a power element such as a power transistor or a power MOS FET.
- Fig. 2 shows a conventional power element cooling device.
- 1 is a heat sink provided in the unit
- 2 is a board fixed to the heat sink
- 3 is a power element mounted on the board
- 5 is a pressure adjusting screw
- 6 is a fixing that fixes the board 2 to the heat sink 1.
- Screws 8 are cooling fins having screw holes. In these configurations, the cooling fin 8 is fixed to the back surface of the power element 3 with the pressure adjusting screw 5, and the cooling of the power element 3 is performed by the cooling fin 8 (for example, see Patent Document 1).
- the cooling fin 8 was fixed to the back of the power element 3 with the pressure adjusting screw 5, and then the substrate 2 was fixed to the heat sink 1 with the fixing screw 6. At this time, since the cooling fin 8 was fixed to the power element 3 with a single pressure adjusting screw 5, two-handed work or work by fixing a jig occurred to prevent the cooling fin 8 from rotating. As described above, it was difficult to align the power element 3 and the cooling fin 8, so that assembly was difficult.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2001-308236 (Page 6, FIG. 1)
- the conventional power element cooling device has a problem in that a large amount of space is required when a power element generating a large amount of heat is radiated only by cooling fins.
- the cooling fin was screwed to the back of the power element, and then mounted on the board. At this time, since the cooling fin was fixed to the power element with a single screw, two-handed work or work by fixing a jig occurred to prevent the rotation of the cooling fin. Since it was difficult to align the power element and the cooling fins, Was not easy.
- the present invention has been made in view of such problems, and has a large heat dissipation effect in a small space, enables components to be arranged near the power element, and has a power element cooling apparatus that is easy to assemble.
- the purpose is to provide.
- the present invention is configured as follows.
- the invention according to claim 1 is a power device including a heat sink provided in a unit, a substrate fixed to the heat sink, and a power device mounted on the substrate.
- a heat dissipating sheet provided in close contact between a surface and the heat sink, an L-shaped fitting having screw holes for fixing the power element and the heat dissipating sheet to the heat sink at a predetermined pressure, and a screw hole for the L-shaped fitting And a pressure adjusting screw for adjusting the caro pressure by using the pressure adjusting screw.
- the heat dissipation sheet is made of silicone rubber.
- a mounting hole for the pressure adjusting screw is provided on a back surface of the heat sink.
- the heat radiation sheet is in close contact with the heat radiation surface of the power element and the heat sink, the heat radiation sheet is transmitted to the heat card sink of the power element, and the entire heat sink becomes a heat radiation surface.
- a cooling effect can be obtained.
- the parts are tightened using the L-shaped bracket and the pressure adjusting screw, each part can be prevented from rotating, and the assembly of this device can be facilitated.
- the heat radiation sheet is made of rubber made of silicon
- the heat of the power element can be efficiently transmitted to the heat sink, and the mounting error between the substrate and the heat sink can be absorbed.
- stress on the power element due to the tightening of the pressure adjusting screw can be reduced.
- the mounting holes for the pressure adjusting screws are provided on the back surface of the heat sink and the pressure adjusting screws are tightened from the heat sink side, assembly is facilitated.
- components can be arranged near the power element, so that space can be saved.
- FIG. 1 is a side sectional view of a power element cooling device showing an embodiment of the present invention.
- FIG. 2 is a side sectional view showing a conventional power element cooling device.
- FIG. 1 is a side sectional view of a power element cooling device showing an embodiment of the present invention.
- a feature of the present invention resides in that an L-shaped fitting and a heat dissipation sheet are provided.
- 4 is an L-shaped bracket
- 5 is a pressure adjusting screw
- 6 is a fixing screw
- 7 is a heat dissipation sheet.
- the L-shaped bracket 4 fixes the power element 3 and the heat radiating sheet 7 to the heat sink 1 at a predetermined pressure and has a screw hole.
- the pressure adjusting screw 5 adjusts the pressing force using the screw hole of the L-shaped bracket 4.
- the heat radiating sheet 7 is adhered between the heat radiating surface of the power element 3 and the heat sink 1 to radiate the heat of the power element 3 to the heat sink 1.
- a heat dissipation sheet 7 is sandwiched between the power element 3 and the heat sink 1, the L-shaped bracket 4 is mounted on the power element 3, and the pressure adjusting screw 5 is fixed from the back of the heat sink 1 to fix each part. Therefore, it is no longer difficult to align the power element 3 and the cooling fin 8 as in the related art.
- heat sink 1 and power element Since the child 3 and the L-shaped bracket 4 are in surface contact with each other, the L-shaped bracket 4 is prevented from rotating, and assembling can be performed more easily than before. Further, since the pressure adjusting screw 5 is also fastened to the heat sink 1 side, components can be arranged near the power element 3.
- the generated heat is transmitted to the heat sink 1 via the heat radiation sheet 7 and radiated.
- the entire heat sink 1 serves as a heat dissipation surface, and a large cooling effect can be obtained.
- the heat radiation sheet 7 is made of rubber, it transmits the heat of the power element 3 to the heat sink 1 and absorbs a mounting error between the substrate 2 and the heat sink 1, so that the stress on the power element 3 due to the tightening of the pressure adjusting screw 5 is reduced. To reduce.
- the L-shaped bracket 4 is made shorter to give an allowance for the lateral dimension on the contact side with the heat sink 1, and the tightening of the pressure adjusting screw 5 on the back of the heat sink 1 is adjusted using the screw holes to connect the power element 3.
- the power element cooling device of the present invention is used for improving heat radiation of various electronic devices such as an inverter device using a power device and an electric control device.
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003286856A JP2005057081A (ja) | 2003-08-05 | 2003-08-05 | パワー素子冷却装置 |
| JP2003-286856 | 2003-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005013658A1 true WO2005013658A1 (ja) | 2005-02-10 |
Family
ID=34113981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/010468 Ceased WO2005013658A1 (ja) | 2003-08-05 | 2004-07-23 | パワー素子冷却装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005057081A (ja) |
| WO (1) | WO2005013658A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11063495B2 (en) | 2019-07-01 | 2021-07-13 | Nidec Motor Corporation | Heatsink clamp for multiple electronic components |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61129344U (ja) * | 1985-02-01 | 1986-08-13 | ||
| JPS6424850U (ja) * | 1987-08-06 | 1989-02-10 | ||
| JP2002033591A (ja) * | 2000-07-18 | 2002-01-31 | Fujitsu Denso Ltd | 電子部品の固定構造 |
-
2003
- 2003-08-05 JP JP2003286856A patent/JP2005057081A/ja active Pending
-
2004
- 2004-07-23 WO PCT/JP2004/010468 patent/WO2005013658A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61129344U (ja) * | 1985-02-01 | 1986-08-13 | ||
| JPS6424850U (ja) * | 1987-08-06 | 1989-02-10 | ||
| JP2002033591A (ja) * | 2000-07-18 | 2002-01-31 | Fujitsu Denso Ltd | 電子部品の固定構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005057081A (ja) | 2005-03-03 |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |