WO2005004044A1 - Circuit d'antenne et carte a circuit integre sans contact - Google Patents

Circuit d'antenne et carte a circuit integre sans contact Download PDF

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Publication number
WO2005004044A1
WO2005004044A1 PCT/JP2004/003217 JP2004003217W WO2005004044A1 WO 2005004044 A1 WO2005004044 A1 WO 2005004044A1 JP 2004003217 W JP2004003217 W JP 2004003217W WO 2005004044 A1 WO2005004044 A1 WO 2005004044A1
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WO
WIPO (PCT)
Prior art keywords
antenna
chip
protrusions
conductor
coil
Prior art date
Application number
PCT/JP2004/003217
Other languages
English (en)
Japanese (ja)
Inventor
Katsuhisa Orihara
Original Assignee
Sony Chemicals Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corporation filed Critical Sony Chemicals Corporation
Publication of WO2005004044A1 publication Critical patent/WO2005004044A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
    • H01Q9/27—Spiral antennas

Definitions

  • the present invention relates to an antenna circuit in which at least an antenna coil is formed on a surface of a predetermined base material made of a printed wiring board, and an antenna circuit provided with the antenna circuit.
  • the present invention relates to a non-contact type IC (Integrated Circuit) card having a communication function and a memory for reading and / or writing.
  • IC integrated Circuit
  • This RF ID system consists of a small non-contact integrated circuit (hereinafter, referred to as IC) device called a transbonder that stores various data in a readable and / or writable manner and has a communication function.
  • This RFID system can be used for various purposes such as, for example, production and logistics management by attaching a transbonder to a product as a tag, collection of tolls and identification cards for transportation agencies, and electronic money management. It is expected to be applied.
  • transponders used in RFID systems that have a built-in power supply
  • those that do not have a power supply that operates by supplying power from the reader Z writer have been developed in recent years.
  • this transbonder has been developed in a variety of portable shapes such as a label type, coin type, box type, stick type, cylindrical type, and card type. Can be.
  • the card-type transbonder has been applied to transportation commuter passes and identification cards, etc., because it has a shape conforming to the conventional usage and is easy to handle, and is becoming widespread.
  • transbonders often use loop antennas for transmitting and receiving power and signals used as power.
  • the transbonder is
  • the IC chip 103 is connected to a resonance circuit in which an antenna coil 101 ′ and a tuning capacitor 102 are arranged in parallel.
  • the tuning capacitor 102 may be configured inside the IC chip 103.
  • a metal wire rod wound in a ring shape can be used as the antenna coil.
  • the antenna coil made of a wire has a lower limit on the wire diameter from the viewpoint of characteristics and strength, and when the number of turns is large, the thickness must be reduced to prevent the assembled shape from flattening. This is particularly difficult to apply to card-type transbonders.
  • a card-type transbonder using a carrier frequency of 13.56 MHz, which is a short-wave band is provided with a predetermined conductor foil such as a copper foil in accordance with recent improvements in photo-etching technology.
  • a printed wiring board is used as a base material on the surface of the substrate, and a so-called printed antenna, in which an antenna conductor is formed using photo-etching technology, is used as an antenna coil (for example, Patent Document 1: Patent No. 2 Reference is made to JP-A-81-44477.).
  • a resonance circuit is used to efficiently convert the energy of the magnetic field into a voltage.
  • the carrier frequency is a resonance frequency f represented by the following equation (1).
  • the voltage V becomes maximum.
  • L is the inductance
  • C is the capacitance
  • the transbonder modulation is performed on a carrier having a fixed frequency, for example, 13.56 MHz, so that it is tuned at the resonance frequency f0 and the energy of the magnetic field is adjusted. It is important to convert to voltage efficiently.
  • the resonance frequency f can be set by selecting an appropriate capacitance. Is managing.
  • the capacitance of the transbonder is not only the capacitance of the capacitor 10.2 as the lumped constant element shown in FIG. 1 but also the capacitance of the entire circuit constituting the transponder.
  • parasitic capacitance also exists in the antenna coil itself.
  • transbonders often have a built-in resonance capacitor inside the IC chip.
  • the capacitance in the transbonder is the sum of the capacitance of the external element, the parasitic capacitance of the antenna, and the capacitance inside the IC chip.
  • the capacitance inside the IC chip usually varies from one manufacturing process to another, and for example, it often changes within a range of about 20% from the reference value to the soil. Therefore, in order to manufacture a trans-bonder that is surely tuned to the carrier frequency, for example, a plurality of adjustment capacitors are arranged in parallel on the board surface. The capacitance was adjusted by connecting the capacitors according to the characteristics by panning. .
  • a plurality of resonance circuits are prepared and a resonance circuit according to the characteristics of the IC chip is selected, or before or after mounting the IC chip.
  • the antenna pattern is modified according to the characteristics of the IC chip, such as by making additional modifications to the antenna pattern. Post-processing such as adjusting the pacitance was required.
  • the present invention has been made in view of such circumstances, and has been provided with an antenna circuit capable of inexpensively obtaining characteristics optimized according to the characteristics of an IC chip, and an antenna circuit provided with the antenna circuit.
  • the purpose is to provide a non-contact type IC force as a transbonder.
  • An antenna circuit according to the present invention that achieves the above object is an antenna circuit in which at least an antenna coil is formed on a predetermined base material.
  • An IC chip mounting portion for mounting an IC chip is formed, and the antenna coil is configured such that a coil length is variable according to the mounting position of the IC chip with respect to the IC chip mounting portion.
  • Such an antenna circuit according to the present invention can change the coil length of the antenna coil according to the mounting position of the IC chip, and thus absorbs variations in the tuning frequency for each manufacturing process by adjusting the inductance. can do.
  • a plurality of the IC chip mounting sections are formed to make the coil length of the antenna coil variable.
  • the antenna circuit according to the present invention can easily mount an IC chip according to desired characteristics.
  • a plurality of antenna conductors each having a predetermined conductor pattern are formed on the surface of the base material, and the electrical connection is achieved by mounting the IC chip on one of the IC chip mounting portions.
  • the antenna coil is formed by the plurality of antenna conductors that are conducted to the antenna coil.
  • a plurality of projections which serve as one terminal for connecting the IC chip, are formed at a predetermined interval on one of the plurality of antenna conductors.
  • the other antenna conductor is configured as a plurality of protrusions that face the respective protrusions of the one antenna conductor and serve as the other terminals for connecting the IC chip, and the IC chip mounting portion includes the one antenna
  • a plurality of projections are formed in parallel corresponding to a plurality of projections formed by the projections on the conductor and the projections serving as the other antenna conductors facing the projections.
  • the antenna circuit according to the present invention can extremely easily form a plurality of IC chip mounting portions.
  • the one antenna conductor is a spiral antenna conductor wound along each side of the base material having a main surface having a rectangular shape, and the IC chip mounting portion is formed of the spiral shape. It is formed by a plurality of protrusions formed at the innermost peripheral portion of the antenna antenna and a plurality of protrusions as the other antenna conductors facing these protrusions.
  • the antenna circuit according to the present invention can efficiently secure the area formed as the ⁇ C chip mounting portion by utilizing the shape of the antenna coil.
  • the antenna circuit according to the present invention may have the following configuration.
  • the plurality of antenna conductors are formed with a plurality of protrusions each serving as a terminal for connecting the IC chip at a predetermined interval
  • the IC chip mounting portion is A plurality of pairs of protrusions formed by each protrusion on one antenna conductor of the plurality of antenna conductors and each protrusion on another antenna conductor of the plurality of antenna conductors facing these protrusions According to the above, a plurality are formed in parallel.
  • the one antenna conductor is a spiral antenna conductor wound along each side of the base material whose main surface has a rectangular shape, and the other antenna conductor is a spiral antenna conductor of the one antenna conductor.
  • the antenna circuit according to the present invention can extremely easily form a plurality of IC chip mounting portions and efficiently secure an area to be formed as the IC chip mounting portion by utilizing the shape of the antenna coil. be able to.
  • the IC chip mounting portion may be formed on the same plane as the surface of the substrate on which the antenna coil is formed, and may be formed on the back surface of the surface of the substrate on which the antenna coil is formed. It can also be formed.
  • the IC chip mounting portion on the back surface of the surface of the substrate on which the antenna coil is formed, the IC chip is mounted on the surface of the substrate on which the antenna coil is formed. Even when it is difficult to secure a sufficient area for forming the mounting section, it is possible to secure a sufficient area for forming the IC chip mounting section.
  • a printed wiring board on which a predetermined conductive foil is applied on the surface can be used, and as the antenna coil, the conductive foil can be used.
  • the antenna circuit according to the present invention by forming the antenna coil as a printed antenna using an inexpensive printed wiring board as a base material, easy processing can be realized, and Manufacturing using the substrate manufacturing process becomes possible, and overall manufacturing costs can be significantly reduced.
  • a non-contact type IC card for achieving the above-mentioned object is a non-contact type IC card having a communication function as well as storing various data in a readable and Z- or writable manner.
  • An antenna circuit having at least an antenna coil formed on a surface of the material; and an IC chip mounted on an IC chip mounting portion formed on the antenna circuit, wherein the antenna coil is mounted on the IC chip mounting portion.
  • the coil length is variable in accordance with the mounting position of the IC chip.
  • Such a non-contact type IC card according to the present invention can change the coil length of the antenna coil according to the mounting position of the IC chip mounted on the antenna circuit, and can reduce the variation in the tuning frequency for each manufacturing process. It is possible to absorb by adjusting the inductance.
  • the antenna circuit and the non-contact type IC card according to the present invention include a plurality of IC chip mounting portions formed so that the coil length of the antenna coil is variable according to the mounting position of the IC chip.
  • tuning for each manufacturing process Frequency variations can be absorbed by adjusting the inductance, eliminating the need for post-processing such as adjusting the capacitance on the substrate side according to the characteristics of the IC chip.
  • optimized characteristics can be obtained at low cost.
  • FIG. 2 is a diagram illustrating a relationship between an output voltage and a carrier frequency in a transbonder.
  • FIG. 3 is a block diagram showing a schematic configuration example of an RFID system using the transbonder shown as an embodiment of the present invention.
  • FIG. 4 is a plan view of a basic circuit board used for a transbonder shown as an embodiment of the present invention.
  • FIG. 5 is a perspective view showing only a conductor portion of a circuit board having a configuration different from that of the circuit board shown in FIG.
  • FIG. 6 is a plan view of a basic circuit board having another antenna pattern configuration.
  • a transbonder 10 as a non-contact type IC (Integrated Circuit) card in which data is read and / or written in a non-contact manner by the reader / writer 1 by performing wireless communication with the transponder 1.
  • This transbonder 10 is a so-called printer in which an antenna conductor is patterned and formed on a predetermined resin substrate serving as a base material. It mounts an antenna coil consisting of an antenna, and absorbs variations in the tuning frequency for each manufacturing process by adjusting the inductance.
  • the transbonder 10 includes therein a circuit board on which at least an antenna coil and an IC chip are mounted. Although not specifically shown, the transbonder 10 is provided with a core material made of, for example, urethane resin on the surface of the circuit board on which the IC chip is mounted, and is provided with a scratch-resistant material such as a polyester film on both sides of the circuit board. The structure is sandwiched between resin films having excellent properties.
  • such a transbonder 10 can absorb variations in the tuning frequency for each manufacturing process by adjusting the inductance. It is said.
  • FIG. 4 is a plan view of a basic circuit board used for the transbonder 10.
  • the circuit board includes a predetermined insulating support having at least one surface on which a predetermined conductive foil such as a copper foil is coated with a predetermined base material 11 on a surface of a predetermined base material 11 to form an antenna coil as described later.
  • the antenna circuit 20 is formed, for example, in a card shape having a rectangular main surface.
  • the antenna circuit 20 can be configured using any type of antenna as long as it is generally used as a base material of a printed wiring board. More specifically, the antenna circuit 20 is a paper phenol board defined by the National Electrical Manufacturers Association (NEMA) as symbols XXP, XPC, etc., and a paper phenol board defined as the symbol FR-2.
  • NEMA National Electrical Manufacturers Association
  • Polyester substrate paper epoxy substrate specified as the same symbol FR-3, glass paper composite epoxy substrate specified as the same symbol CEM-1, glass non-woven paper composite specified as the same symbol CHE-3 Epoxy board, glass cloth specified as the same symbol G-10 Epoxy board, glass cloth specified as the same symbol FR-4 It is configured using a so-called rigid substrate on which one or both surfaces of a predetermined conductive foil such as a copper foil such as an epoxy substrate are applied.
  • a glass cloth epoxy substrate (FR-4) having little hygroscopicity and dimensional change and having self-extinguishing properties is most preferable.
  • the antenna circuit 20 is configured such that two antenna conductors 12 and 13 as radiation electrodes are formed on the surface by photoetching the base material 11. More specifically, in the antenna circuit 20, a spiral antenna conductor 12 wound along each side of the base 11 is formed on the surface of the base 11.
  • a plurality of protrusions 12 a, 12 b, 12 c, 12 d, 12 e, 12 f, ⁇ ⁇ ⁇ Are formed at predetermined intervals.
  • a plurality of protrusions 13a, 13b, 13c, 13d, 13e, 13f, 13f as other antenna conductors are A plurality of protrusions 12 a, 12 b, 12 c, 12 d, 12 e, 12 f,... Of the antenna conductor 12 are formed at predetermined intervals. I have. In FIG.
  • protrusions 12 a, 12, 12 c, 12 d, 12 e, and 12 f are formed on the antenna conductor 12, and the six This shows the case where the projections 13a, 13b, 13c, 13d, 13e, and 13f are formed. Further, in the antenna circuit 20, the outermost side of the antenna conductor 12 and the plurality of protrusions 13a, 13b, 13c, 13d, 13e, 13 ⁇ , One end of each is connected by a predetermined jumper wire 14a, 14b, 14c, 14d, 14e, 1f,.
  • connection terminals are connected, and one of the plurality of protrusions 13a, 13b, 13c, 13d, 13e, 13f,.
  • the other connection terminal is connected to one projection opposite to one projection of the antenna conductor 12 connected to the terminal.
  • Each projection 13 a, 13 b, 13 c, 13 A plurality of IC chip mounting portions are formed in parallel corresponding to a plurality of pairs of protrusions formed by d, 13 e, 13 f,.
  • FIG. 4 shows a case where six IC chip mounting portions are formed as indicated by broken lines, corresponding to the formation of six pairs of protrusions. Among these six IC chip mounting parts, the figure shows that the IC chips 25 are connected to the projections 12 d and 13 d.
  • the antenna circuit 20 by mounting the IC chip 25 on one of the IC chip mounting portions, the antenna conductor 12 and the plurality of protrusions 13a, 13b, 13c, and 13d , 13 e, 13 f, ⁇ --are electrically connected.
  • the antenna conductor 12 and the plurality of protrusions 13a, 13b, 13c, 13d, 13e, 13f, 13f This constitutes one antenna coil.
  • the antenna circuit 20 is equivalent to a circuit in which one conductor pattern forming an antenna coil is divided into a plurality of parts through a plurality of protrusions, and a circuit in which these are connected in parallel is formed. .
  • the coil length of the antenna coil differs depending on the IC chip mounting portion on which the IC chip 25 is mounted. Specifically, in this circuit board, when the IC chip 25 is connected to the protrusions 12a and 13a, the coil length becomes the shortest, and the IC chip 25 is connected to the protrusion 12a. f, 13 f, the coil length is the longest.
  • this circuit board mounts multiple antenna coils with different coil lengths It is configured to be equivalent to As a result, the resonance frequency of this circuit board varies according to the IC chip mounting portion on which the 1 ⁇ chip 25 is mounted, so that an appropriate IC chip mounting portion corresponding to the characteristics of the IC chip 25 is selected. This makes it possible to adjust the variation of the tuning frequency for each manufacturing process.
  • the selection of the IC chip mounting section is performed as follows.
  • the input capacitance is measured in an acceptance inspection of the manufactured IC chip.
  • the transbonder 10 it is not necessary to measure the capacitance of all the IC chips. This is due to the fact that the IC chips used for the transbonder are very small, and tens of thousands of IC chips can be manufactured on a single wafer, but the characteristics of the same wear are uniform. Therefore, in manufacturing the transbonder 10, it is only necessary to measure the capacitance of several IC chips from the same wafer, and the labor of the operator can be extremely reduced.
  • the position of the IC chip mounting portion for mounting the IC chip is determined according to the measured characteristics of the IC chip, and the program of the mounting machine is selected.
  • the transbonder 10 has an IC chip mounting portion on which the IC chip 25 is mounted, and a coil of an antenna coil according to the mounting position of the IC chip 25.
  • a variable length on the surface of the base material 11 variations in tuning frequency for each manufacturing process can be absorbed by adjusting the inductance.
  • Post-processing such as adjusting the capacitance on the substrate side according to the characteristics of the IC chip 25, such as making adjustments, is unnecessary, and the characteristics optimized according to the characteristics of the IC chip 25 are eliminated. To get cheap Kill.
  • the transbonder 10 by forming a plurality of IC chip mounting portions in order to make the coil length of the antenna coil variable, I The C chip 25 can be easily mounted.
  • the transbonder 10 forms an antenna coil as a printed antenna using an inexpensive printed wiring board on the base material 11, the processing of the antenna circuit 20 is easy, and the production of the printed wiring board is also easy.
  • the antenna circuit 20 can be manufactured using the process, and the overall manufacturing cost can be significantly reduced.
  • the present invention is not limited to the above-described embodiment.
  • the IC chip mounting portion has been described as being formed on the same plane as the surface of the substrate 11 on which the antenna coil has been formed.
  • the IC chip mounting part is formed on the back surface of the surface of the substrate on which the antenna coil is formed by using a printed wiring board with a predetermined conductive foil such as copper foil on both surfaces of the substrate. You can also.
  • FIG. shows only the conductor portion of the basic circuit board used for the transbonder.
  • the antenna circuit 40 is provided on the surface side of the base material (not shown) with the protrusions 12a, 12b, 12c, 12d, 12e, and 12f shown in FIG.
  • the antenna conductor 42 on which the projections 42a, 42b, 42c, 42d, 42e, 42f, and--corresponding to the projections 13a, 13b, and 13b are formed.
  • a plurality of through-holes 45a, 45, 45c, 45d, 45e, 45 ⁇ is formed so as to penetrate from the front surface to the back surface of the base material (not shown). Further, in this antenna circuit 40, a plurality of through holes 46a, 46b, 46c, 46d, 46e, 46mm,... Penetrate from the front surface to the back surface of the base material, respectively. Drilled so that
  • protrusions 47 a, 47 b, 47 c, 47 d, 47 e, 47 f,. are formed as end points, and through holes 46a, 46b, 46c, 46d, 46e, 46f,. 3 a, 43, 43 c, 43 d, 43 e, 43 f,...---And the projections formed on the back side 48 a, 48 b, 48 c, 48 d, 48 e , 48 f, ⁇ ⁇ ⁇ are each pierced.
  • the IC chip mounting portion may be formed on the back surface of the base material on which the antenna coil is formed. Accordingly, the present invention provides a method for forming an IC chip mounting portion even when it is difficult to secure a sufficient area as a region for forming an IC chip mounting portion on the surface of the base material on which the antenna coil is formed. It is possible to secure a sufficient area to perform.
  • the antenna is formed using the antenna conductor 12 and the plurality of protrusions 13 a, 13 b, 13 c, 13 d, 13 e, 13 f,.
  • the present invention has been described as constituting a coil, the present invention provides a method in which a plurality of antenna conductors each having a predetermined conductor pattern are formed on a base material surface, and if the inductance can be adjusted, the antenna conductor is formed. Regardless of the number, any can be applied.
  • the present invention can be applied to an antenna circuit 60 as shown in FIG.
  • This antenna circuit 60 is formed by exposing two antenna conductors 62 and 63 as radiation electrodes on the surface of a base material 61. Specifically, in the antenna circuit 60, the antenna circuit 60 is wound on the surface of the base material 61 along each side of the base material 61. A spiral antenna conductor 62 and a linear antenna conductor 63 parallel to the innermost peripheral portion of the antenna conductor 62 are formed. Further, in the antenna circuit 60, an end on the outer peripheral side of the antenna conductor 62 and one end of the antenna conductor 63 are connected by a predetermined jumper wire 6.
  • a plurality of protrusions 62a, 62, 62c, 62d, 62e, 62f are formed on the innermost peripheral side of the spiral antenna conductor 62 as a part of a series of conductors. It is formed at intervals.
  • the linear antenna conductor 63 also includes a plurality of protrusions 63a, 63b, 63c, 63d, 63e, 63f, 63-, as part of a series of conductors, respectively.
  • the antenna conductor 62 are formed at predetermined intervals so as to face the protrusions.
  • the region formed between the above and the above is where the above-mentioned r'C chip 25 is mounted. That is, in the antenna circuit 60, the protrusions 62 a, 62, 62 c, 62 d, 62 e, 62 ⁇ ,...
  • the antenna conductor 62 and the protrusions 63 a, 63 b, 63 c, 63 d, 63 e, 63 ⁇ ,... are terminals for connecting the IC chip 25, respectively.
  • One of the two connection terminals of the IC chip 25 is connected to one of the plurality of protrusions 62a, 62, 62c, 62d, 62e, 62f, 62f,.
  • the other connection terminal is connected to a plurality of projections 63 a, 63 b, 63 c, 63 d, 63 e, 63 f, 63 e, 63 f in the antenna conductor 63.
  • it is connected to one protruding portion facing one protruding portion of the antenna conductor 62 connected to one connection terminal.
  • each of the protrusions 62a, 62b, 62c, 62d, 62e, 62f, '.' In the antenna conductor 62, and these protrusions 6 2a, 62b , 62c, 62d, 62e, 62f, 63f, 63f, 63d, 63d, 63e
  • the IC chip mounting part corresponds to the plurality of protrusions formed by 3 f, Are formed in parallel.
  • the present invention provides any antenna circuit such as the antenna circuit 60 described above, in which a plurality of antenna conductors each having a predetermined conductor pattern are formed on a substrate surface and the inductance can be adjusted. Even those can be applied.
  • the antenna conductor 12 and the plurality of protrusions 13 a, 13 b, 13 c, 13 d, 13 e, 13 f, 13 f are formed.
  • the description has been made assuming that the tuning capacitor and the like are provided inside the IC chip 25, but the present invention does not require that these various elements be integrated into an integrated circuit as an IC chip. It can also be applied when mounting on an antenna circuit. ...
  • the antenna coil is described as being formed as a printed antenna.
  • the present invention is not limited to this, and may be any as long as it functions as an antenna coil. If applicable, it can be applied.
  • the card type transbonder 10 has been described.
  • the present invention is not limited to the card type, but can be applied to various other shapes according to the application. It is.

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
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Abstract

Selon l'invention, un transpondeur comprend un circuit d'antenne (20) présentant au moins une bobine d'antenne formée sur la surface d'un matériau de base (11) spécifique d'une carte imprimée, et une puce à circuit intégré (25) montée sur une partie de montage prévue à cet effet sur le circuit d'antenne (20). Une pluralité de parties de montage de puce à circuit intégré sont agencées de sorte que la longueur de la bobine d'antenne varie en fonction de la position de montage de la puce à circuit intégré (25). Etant donné que le transpondeur peut faire varier la longueur de la bobine d'antenne en fonction de la position de montage de la puce à circuit intégré (25), la variation de la fréquence d'accord au cours des processus de production peut être décalée par ajustement de l'inductance.
PCT/JP2004/003217 2003-07-07 2004-03-11 Circuit d'antenne et carte a circuit integre sans contact WO2005004044A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003271518A JP4102994B2 (ja) 2003-07-07 2003-07-07 アンテナ回路及び非接触型ｉｃカード、並びに非接触型ｉｃカードの製造方法
JP2003-271518 2003-07-07

Publications (1)

Publication Number Publication Date
WO2005004044A1 true WO2005004044A1 (fr) 2005-01-13

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PCT/JP2004/003217 WO2005004044A1 (fr) 2003-07-07 2004-03-11 Circuit d'antenne et carte a circuit integre sans contact

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WO2006087423A1 (fr) 2005-02-17 2006-08-24 Upm Raflatac Oy Procede de reglage de transpondeur et transpondeur
DE102006001005A1 (de) * 2006-01-05 2007-07-12 Smart Devices Gmbh & Co. Kg Produktionstechnisches Zentrum Hannover Verfahren zur Anpassung von RFID-Transpondern sowie eine derart hergestellte Antennenstruktur
US7880614B2 (en) 2007-09-26 2011-02-01 Avery Dennison Corporation RFID interposer with impedance matching
FR3021786A1 (fr) * 2014-06-02 2015-12-04 Oberthur Technologies Procede de fabrication d'une antenne a capacite configurable
CN105701535A (zh) * 2016-01-22 2016-06-22 刘军 电子标签腕带

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KR100841646B1 (ko) * 2006-11-17 2008-06-27 엘에스산전 주식회사 무선 주파수 식별 태그 안테나
JP5034736B2 (ja) * 2007-07-17 2012-09-26 株式会社村田製作所 無線ｉｃデバイス
US20160284461A1 (en) * 2015-03-28 2016-09-29 Intel IP Corporation Tuning inductance ratio of a passive device
JP7376463B2 (ja) * 2020-02-04 2023-11-08 富士フイルム株式会社 非接触式通信媒体、磁気テープカートリッジ、及び非接触式通信媒体の製造方法
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JP2000285214A (ja) * 1999-03-31 2000-10-13 Tokin Corp 非接触データキャリア
JP2001251114A (ja) * 2000-03-02 2001-09-14 Dainippon Printing Co Ltd アンテナシートおよび非接触式データキャリア

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006087423A1 (fr) 2005-02-17 2006-08-24 Upm Raflatac Oy Procede de reglage de transpondeur et transpondeur
US7994995B2 (en) 2005-02-17 2011-08-09 Upm Raflatac Oy Transponder tuning method and a transponder
KR101197746B1 (ko) 2005-02-17 2012-11-06 유피엠 라플라탁 오이 트랜스폰더 튜닝 방법 및 트랜스폰더
DE102006001005A1 (de) * 2006-01-05 2007-07-12 Smart Devices Gmbh & Co. Kg Produktionstechnisches Zentrum Hannover Verfahren zur Anpassung von RFID-Transpondern sowie eine derart hergestellte Antennenstruktur
US7880614B2 (en) 2007-09-26 2011-02-01 Avery Dennison Corporation RFID interposer with impedance matching
FR3021786A1 (fr) * 2014-06-02 2015-12-04 Oberthur Technologies Procede de fabrication d'une antenne a capacite configurable
CN105701535A (zh) * 2016-01-22 2016-06-22 刘军 电子标签腕带
CN105701535B (zh) * 2016-01-22 2018-12-18 刘军 电子标签腕带

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TW200506747A (en) 2005-02-16
JP4102994B2 (ja) 2008-06-18
TWI358669B (fr) 2012-02-21
JP2005033587A (ja) 2005-02-03

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