WO2004076114A1 - 噴流式半田付け装置 - Google Patents
噴流式半田付け装置 Download PDFInfo
- Publication number
- WO2004076114A1 WO2004076114A1 PCT/JP2003/013834 JP0313834W WO2004076114A1 WO 2004076114 A1 WO2004076114 A1 WO 2004076114A1 JP 0313834 W JP0313834 W JP 0313834W WO 2004076114 A1 WO2004076114 A1 WO 2004076114A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- flow guide
- jet nozzle
- jet
- molten
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Definitions
- the present invention relates to a soldering device, and more particularly, to a solder flow soldering device suitable for downsizing a soldering device.
- a jet-type soldering device that corrects soldering defects such as bridge pillars generated by soldering with the primary jet nozzle with a secondary jet nozzle and performs soldering (For example, see Patent Document 1).
- the surface of the solder is oxidized to generate impurities called dross.
- an inert gas for example, see Patent Document 2
- an antioxidant oil such as vegetable oil.
- the molten dross jetted from the primary jet nozzle of the solder tank and dropped, and the molten solder jetted and dropped from the secondary jet nozzle were separated from the primary jet nozzle and the secondary jet nozzle from both sides.
- Dross easily accumulate at the junction point D, where the dross merges between the jet nozzles. When this dross occurs, it grows and spreads along the solder surface, and eventually rises and spreads on the jet surface created by the primary jet nozzle and the secondary jet nozzle.
- a gap of at least 5 cm is conventionally provided between the primary jet nozzle and the solder jetted from the secondary jet nozzle and falling. I have.
- Patent Document 1 Japanese Patent Application Laid-Open No. 9-184050
- Patent Document 3 Patent Document 3
- the jet type soldering apparatus has the following problems.
- the dross adheres to the soldering surface of the substrate and causes defects such as solder bridges and valleys.
- the bridge cannot be completely eliminated for fine pitch electronic components.
- printed circuit boards with fine-pitch electronic components soldered in a conventional jet soldering bath require a visual inspection of the soldering part after soldering, and correct the generated bridge with a trowel. It must be done, hindering productivity.
- a gap of about 5 cm is provided between the solder jetted from the primary jet nozzle and the secondary jet nozzle, and the board moves between the primary jet nozzle and the secondary jet nozzle. During this time, the solder attached to the board cools down, and the soldering performance at the secondary jet nozzle deteriorates. Further, as a result that the gap between the nozzles cannot be woven, the miniaturization of the jet type soldering apparatus is hindered.
- lead-free solder has been used for environmental protection.
- this lead-free solder has a higher melting point (around 230 ° C) than the melting point of conventional solder (around 183 ° C). ). Therefore, the effect of lowering the solder temperature on the board surface is greater than that of conventional solder. Therefore, in order to use the lead-free solder, it is necessary to further narrow the space between the primary jet nozzle and the 27 jet nozzle in order to prevent the solder from being reduced.
- the present invention solves this problem and reduces the occurrence of dross to improve product reliability.
- it is intended to provide a small-sized soldering apparatus that can use lead-free solder. Disclosure of the invention
- the present invention provides a jet type soldering apparatus according to claim 1, wherein the molten solder jetted from the primary jet nozzle of the solder bath and the molten solder jetted from the secondary jet nozzle are formed.
- the number of glues indicates that the guide plate is provided.
- solder flow guide plate is made of a material to which solder does not adhere.
- the jet type soldering apparatus according to claim 3 is the jet type soldering apparatus according to claim 1 or 2, wherein the solder flow guide plates are alternately arranged in a ridge line direction of one V-shaped plate. And a strip-shaped solder guide portion formed by being divided into two.
- the jet-type soldering device according to claim 4 is the jet-type soldering device according to claim 3, wherein a solder distribution portion is provided between strip-shaped solder guide portions formed on the solder flow guide plate. It is assumed that it is glued.
- the jet-type soldering apparatus is the jet-type soldering apparatus according to claim 1 or 2, wherein the solder flow guide plate includes two plates arranged in a V-shape. The ridge line portion of the solder flow guide plate arranged in the shape of a letter has a gap.
- solder-flow guide plate is an intersection of a V-shaped solder flow guide plate, or the jet-flow soldering device according to claim 1 or 6.
- FIG. 1 is a view showing an embodiment of a vertical soldering apparatus according to the present invention.
- FIG. 2 is a perspective view of the solder flow guide plate of the present invention.
- FIG. 3 is a top view (a), a front view (b), and a side view (c) of the solder flow guide plate of the present invention.
- FIG. 4 is a development view of the solder flow guide plate of the present invention.
- FIG. 5 is a diagram for explaining a falling state of molten solder in the jet-type soldering apparatus of the present invention.
- FIG. 6 is a view showing another embodiment of the jet type soldering apparatus of the present invention.
- FIG. 7 is a perspective view showing another embodiment of the solder flow guide plate of the present invention.
- FIG. 8 is a top view (a), a front view (b), and a side view (c) of FIG.
- FIG. 9 is a diagram for explaining a state of molten solder falling in a conventional jet type soldering apparatus.
- a solder tank 6 for storing the molten solder S is provided with a pump (not shown) for forming a primary jet nozzle 1, a secondary jet nozzle, a nozzle 2, and jet waves 24, 25.
- Solder flow guide plates 4 and 5 are provided above the solder surface F of the molten solder S between the jet nozzles 1 and 2.
- the solder flow guide plates 4 and 5 are provided at points where the molten solder jetted from the primary jet nozzle 1 of the solder tank 6 and the molten solder jetted from the secondary jet nozzle 2 fall.
- the solder flow guide plates 4 and 5 are provided with solder guide portions 4a and 5a (see FIGS. 2 and 3) to be described later for dropping the molten solder S to different positions on the solder surface F of the solder bath 6. It has a V-shaped shape.
- the spouts 1a and 2a in the two areas where the rooster ⁇ substrate ⁇ which is transported in the direction of arrow A by the transport conveyor are curved, It is on the top of molten solder S. Further, the jet port 2b is bent upward and is directed upward, so that the molten solder jetted from the jet port 2b is difficult to flow on the molten solder S.
- the molten solder S stored in the solder bath 6 is ejected by a pump (not shown) to form jet waves 24 and 25. Solder is performed by making the jet waves 24 and 25 come into contact with the Tori SI spring board P while transporting it.
- the guide plates 4 and 5 are formed by punching a single flat plate 10 such as stainless steel, which is a material to which solder is not adhered, and bending it into a V-shape at a substantially central portion R thereof.
- Guide plates 4 and 5 are formed.
- the guide plates 4 and 5 are formed with strip-shaped solder guides 4 a and 5 a, respectively, for dropping the molten solder S to different positions on the solder surface F of the solder bath 6.
- the solder guides 4a and 5a cross each other by being bent at a substantially central portion R in a V-shape.
- a space W is formed at a portion where the solder guides 4a and 5a intersect.
- the molten solder that has slid down along the solder guides 4a and 5a passes through the space W and falls on the solder surface F opposite to the guide plate on which the molten solder has fallen. In other words, the molten solder falls on a nozzle side different from the jet nozzle.
- the solder guides 4 a and 5 a are shown above the molten solder surface F, but other than that, the central portion R may be any shape as long as it is above the molten solder surface F.
- the solder guides 4a, 5a are above the molten solder surface F.
- the angle of the V-shape and the size of the position of the solder guides 4a and 5a are as follows: molten solder jetting from the primary jet nozzle of the solder bath and falling; jetting from the secondary jet nozzle to drop. It is determined appropriately in consideration of the viscosity of the molten solder and the degree of fiber transport of the board P, so that the molten metal does not merge and the nozzle is unlikely to accumulate between the primary jet nozzle and the secondary jet nozzle. .
- solder diverting portion G for diverting the molten solder jetted from the jet port is provided between the self-solder and the guide portions 4a and 5a.
- the solder diverging portion G is bent at the cutting portion 50 in the falling direction of the molten solder and stands upright.
- the solder flow guide plates 4 and 5 may be disposed on either side of the jet nozzles 1 and 2, but for easy understanding, as shown in FIG. Flow guide plate 5 is located on the jet nozzle 2 side Description will be made assuming that the solder flow guide plates 4 are provided respectively.
- solder flow guide plates 4 and 5 The operation of the solder flow guide plates 4 and 5 will be described with reference to FIG.
- Upper part of solder flow guide plate 4, 5 provided at the point where molten solder K jetted from nozzle 1 and molten solder K jetted from secondary jet nozzle 2 fall from nozzle 1 4 1, 5 1
- the molten solder K falls down.
- the molten solder K flowing down from the jet nozzle 1 falls to the solder flow guide plate 5.
- a gap W is formed at the intersection of the solder guides 4 a and 5 a, and the molten solder dropped to the position where the solder guide 5 a is formed, of the molten molten solder K dropped on the guide plate 5.
- the solder guide portion 5a falls along the solder guide portion 5a as it passes through the gap W, and falls onto the solder surface F of the solder tank 6 on the side where the jet nozzle 2 is provided. Further, of the molten solder that has fallen into the solder flow guide plate 5, the molten solder K that has fallen to the upper portion where the solder diverting portion G is formed is diverted by the solder diverting portion G, and the inside of the solder solution on both sides is separated. 5 Drops along a, and falls on the solder surface F near the position where the jet nozzle 2 of the solder tank 6 is arranged.
- the molten solder K flowing down from the jet nozzle 2 falls to the solder flow guide plate 4.
- the molten solder K that has fallen on the solder flow guide plate 4 falls along the solder guide portion 4 a as it is, passes through the gap W, and remains in the solder bath 6.
- the molten solder K that has fallen on the solder flow guide plate 4 the molten solder K that has fallen on the upper portion where the solder shunt portion G is formed is shunted by the solder shunt portion G, and the solder guide portions 4 on both sides are separated.
- A falls along a, and falls on the solder surface F near the position where the jet nozzle 1 of the solder tank 6 is arranged.
- solder flow guide plates 4 and 5 drop to the nozzle side different from the nozzle from which the molten solder K jetted from the primary jet nozzle 1 and the molten solder K jetted from the secondary jet nozzle 2 are jetted. Act to do.
- the solder flow guide plates 4 and 5 have the same nozzle because the solder guide portions 4 a and 5 a are alternately formed in the direction of the ridge line R of the V-shaped plate.
- the molten solder K flowing down from the solder tank 6 also falls to a different position on the solder surface F of the solder bath 6, that is, a position separated by the width of the solder guide 4a or the solder guide 5a. Therefore, as shown in Fig.
- the flow guide plates 4 and 5 of the solder are shown in black and are not shown in detail.
- the printed circuit board P is moved in the direction of arrow A by the transfer device, not shown above the primary jet nozzle 1.
- the printed circuit board P first comes into contact with the jet wave 24 formed by the jet nozzle 1, and then withdraws into the jet wave 25 formed by the jet nozzle 2. break away.
- the molten solder jetted from the primary jet nozzles 1 and the secondary jet nozzles 2 is such that excess jets of molten solder are injected into the printed circuit board glue after the jet waves 24 and 25 are injected into the printed circuit board. Fall to the top.
- the molten solder K that has fallen on the upper portions of the solder flow guide plates 4 and 5 is, as described above, the molten solder K jetted from the primary jet nozzle 1 and the secondary jet nozzle 2, as shown in FIG. It falls to the nozzle side different from the jet nozzle. Furthermore, the solder flow guide plates 4 and 5 have the same nozzle because the solder guide portions 4 a and 5 a are formed alternately in the ridge direction of the V-shaped plate. The molten solder K flowing down from the solder tank 6 also falls to a different position on the solder surface F of the solder bath 6, that is, to positions dl and d2 separated by the width of the solder guide 4a or the solder guide 5a.
- the angle of the V-shape When the angle of the V-shape is narrowed, the distance between the molten solder K which jets from the primary jet nozzle and the secondary jet nozzle and falls, respectively, becomes small, and when the angle of the V-shape is increased, the primary angle becomes large. The distance between the molten solder K which jets from the jet nozzle and the secondary jet nozzle and falls, respectively, increases. Therefore, by reducing the distance between the primary jet nozzle and the secondary jet nozzle, the cooling of the solder applied to the substrate is reduced. In order to achieve this, it is preferable that the angle of the V-shape is large, so that dross does not easily accumulate between the primary jet nozzle and the secondary jet nozzle without the molten solder K joining.
- the angle is increased, the falling speed of the dropped molten solder decreases, and the solder flow guide plates 4 and 5 do not slide down smoothly. It is not preferable because it lowers the temperature of the molten solder. Also, when the angle is reduced, the distance between the molten solders that have fallen into the solder bath 6 becomes smaller, and the molten solders K that have fallen merge and dross easily accumulates between the primary jet nozzle and the secondary jet nozzle. .
- the angle of the V-shape is appropriately determined in consideration of the position and size of the solder guides 4a and 5a, the viscosity of the molten solder, the transfer speed of the spring 3
- FIG. 6 shows an embodiment in which solder flow guide plates 4 and 5 having a structure in which two plates are arranged in a V-shape as shown in FIGS. 7 and 8 are provided.
- the solder tank 6 for storing the molten solder S is provided with a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) for forming jet waves 24, 25. ing.
- solder flow guide plates 4 and 5 are provided above the solder surface F of the molten solder S.
- the solder flow guide plates 4 and 5 are provided at points where the molten solder jetted from the primary jet nozzle 1 of the solder tank 6 and the molten solder K jetted from the secondary jet nozzle 2 fall.
- the solder flow guide plates 4 and 5 are formed by arranging two plates in a V-shape, and the ridge portions of the solder flow guide plates 4 and 5 provided in the V-shape are provided with a gap SP. I have. In FIG. 6, solder guide portions 4a and 5a to be described later are not shown.
- the lower end of the solder flow guide plates 4 and 5 is an interval SP at which the molten solder K that has fallen on the upper part falls on a nozzle side different from the nozzle on which the molten solder K has been jetted.
- the solder flow guide plates 4 and 5 are provided with solder guide portions 4 a and 5 a, each of which is composed of a plurality of independent columns, in the ridge direction.
- the solder guides 4a and 5a drop the molten solder K to different positions on the solder surface F of the solder bath 5. Each is erected at the position to be lowered.
- solder guides 4a are spaced only 2 apart, and the solder guides 5a are spaced 2 L apart and stand upright on the V-shaped guide plates 4 and 5, the direction of which is vertical. It is. Also, the distance between the solder guides 4a and 5a is L apart, and the solder guides 4a and 5a are erected alternately. Further, the solder guides 4a and 5a may have a shape other than a column, for example, a polygonal column such as a triangular column or a quadrangular column, or an elliptical column.
- the angle of the V-shape, the position, size and spacing SP of the solder guides 4a and 5a are determined by the molten solder K jetted from the primary jet nozzle and the secondary jet nozzle of the solder tank and falling. It is appropriately determined in consideration of the viscosity of the molten solder K, the transport speed of the wiring board P, and the like so that dross does not easily accumulate between the primary jet nozzle and the secondary jet nozzle without flowing.
- the number is preferably about 10 to 20.
- the distance SP between the solder flow guide plates 4 and 5 drops on the nozzle side different from the nozzle from which the molten solder jetted from the primary jet nozzle force and the nozzle from which the molten solder jetted from the secondary jet nozzle is jetted.
- the length of the solder flow guide plates 4 and 5 is determined appropriately according to the length p and the inclination of the solder flow guide plates.
- solder flow guide plates 4 and 5 operate as follows. Although the solder flow guide plates 4 and 5 may be arranged on either of the jet nozzles 1 and 2, for easy understanding, as shown in FIG. The description will be made assuming that the flow guide plate 5 is provided on the jet nozzle 2 side and the solder flow guide plate 4 is provided on the jet nozzle 2 side. That is, the molten solder jetted from the primary jet nozzle 1 of the solder tank and the molten solder K jetted from the secondary jet nozzle 2 fall on the solder flow guide plates 4 and 5 provided at the points where they fall. K falls. The molten solder K that has flowed down from the jet nozzle 1 falls onto the solder flow guide plate 5.
- the solder guide 5a has not been erected, and the molten solder K that has fallen to the position falls directly between the solder plans 5a, Solder surface F of solder tank 6 on the side where jet nozzle 2 is arranged Fall on. Also, of the molten solder that has fallen on the solder flow guide plate 5, the molten solder K that has fallen on the upper portion where the solder guide portion 5a is erected is shunted by the solder guide portion 5a and falls. It falls on the solder surface F on the side where the jet nozzle 2 of the tank 6 is arranged.
- the molten solder K flowing down from the jet nozzle 2 falls to the solder flow guide plate 5.
- the molten solder K that has fallen into the solder flow guide plate 5 the molten solder K that has fallen to the position where the solder guide portion 5a has not been set up, falls directly between the solder guide portions 5a, It falls onto the solder surface F on the side where the jet nozzle 2 of the solder tank 6 is arranged.
- the molten solder K that has fallen on the upper portion where the solder guide portion 5a is erected and shunted by the solder guide portion 5a and drops It falls on the soldering surface F on the side where the jet nozzle 1 of the tank 6 is disposed.
- the solder flow guide plates 4 and 5 fall on the side of the molten solder jetted from the primary jet nozzle 1 and the molten solder force jetted from the secondary jet nozzle 2 and on the side of the nodule that is different from the jetted nodule I do.
- the solder flow guide plates 4 and 5 are formed by alternately standing the solder guide portions 4a and 5a in the ridge line direction of the two V-shaped plates. Accordingly, the molten solder K flowing down from the same nozzle also drops at a different position on the solder surface F of the solder bath 6, that is, at a position separated by the width L of the solder guide 4a or the solder guide 5a. Therefore, as shown in Fig. 5, the molten solder K jetted and dropped from the primary jet nozzle and the secondary jet nozzle of the solder tank does not merge, and the molten solder K flows between the primary jet nozzle and the secondary jet nozzle. Dross is hard to accumulate.
- the printed circuit board P is moved in the direction of arrow A by a laser transfer device as shown above the primary jet nozzle 1.
- the printed circuit board P first strokes the jet wave 24 formed by the jet nozzle 1 and then inverts into the jet wave 25 formed by the jet nozzle 2, and further proceeds to the jet type soldering device. Leave from.
- the molten solder jetted from the primary jet nozzles 1 and the secondary jet nozzles 2 contacts the printed circuit board P after the jet waves 24 and 25 come into contact with the excess molten solder K and the solder flow guide plates 4 and 5 Fall to the top.
- the molten solder K jetted from the jet nozzle 1 and the molten solder K jetted from the secondary nozzle 2 fall to a nozzle side different from the jetted nozzle.
- the solder flow guide plates 4 and 5 are formed by alternately standing the solder guide portions 4 a and 5 a in the ridge line direction of the two V-shaped plates.
- the molten solder flowing down from the same nozzle also drops to a different position F on the solder surface of the solder bath 6, that is, a position d1 or d2 separated by the width of the solder guide 4a or the solder guide 5a.
- the molten solder that jets and drops from the primary jet nozzle of the solder tank and the molten solder that jets and drops from the secondary jet nozzle do not merge, and
- the molten solder dropped to the position d1 or d2 separated by the width of 4a or the solder guide portion 5a interferes with each other, and dross does not easily accumulate between the primary jet nozzle and the secondary jet nozzle.
- the drop point of the molten solder jetted from the primary jet nozzle of the solder tank and the molten solder jetted from the secondary jet nozzle are set to fall from the primary jet nozzle.
- the molten solder that is jetted and the molten solder that is jetted from the secondary jet nozzle fall on a different nozzle side from the jetted nozzle, respectively.
- the space between the primary jet nozzle and 27 fire jet nozzle can be narrowed, and cooling of the solder does not occur while the board moves between the primary jet nozzle and the secondary jet nozzle, resulting in poor soldering.
- soldering performance will not be degraded. Furthermore, as a result of the gap between the nozzles being ⁇ , the size of the jet-type soldering apparatus can be reduced. In addition, it is possible to use lead-free solder, which does not cause cooling of the solder, which greatly contributes to environmental protection.
- the solder flow guide plate is made of a material to which solder does not adhere, so that the solder flow guide plate is cleaned. In addition, maintenance work such as replacement is not required, and the molten solder falls quickly, so that the molten solder in the solder bath is not cooled and energy consumption can be suppressed.
- the solder flow guide plate is bent in a single V-shape. The solder flow guide plate can be formed with a simple structure.
- solder is provided between strip-shaped solder guide portions formed on the solder flow guide plate.
- the provision of the diverter prevents the molten solder that has fallen between the solder guides from dropping onto the same nozzle side as the nozzle that has been jetted through the space between the solder guides. Is done. Therefore, dross does not easily accumulate between the primary jet nozzle and the secondary jet nozzle without the molten solder jetting from the primary jet nozzle and the secondary jet nozzle of the solder tank merging.
- the jet type soldering apparatus according to claim 5, the jet type soldering apparatus according to claim 1 or 2, wherein the solder flow guide plate includes two plates arranged in a V-shape. Since the ridge of the solder flow guide plate disposed at V has a gap, the position and speed at which the molten solder slides down can be determined independently. As a result, the degree of freedom in determining the position of the primary jet nozzle and the secondary jet nozzle in the solder tank is increased.
- the solder flow guide plate has a plurality of independent solder guide portions alternately erected in a ridge direction.
- the solder flow guide plate has an intersection of a V-shaped solder flow guide plate or a V-shaped solder flow guide plate. Since the intersection on the extension line of the shaped solder flow guide plate is above the molten solder, the molten solder that has dropped upward between the solder guides passes through the space between the solder guides and is jetted. It is prevented that each falls to the same nozzle side. As a result, the molten solder flowing from the primary jet nozzle and the secondary jet nozzle of the solder tank does not merge, and dross does not collect between the primary jet nozzle and the secondary jet nozzle. .
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03769946A EP1600237A1 (en) | 2003-02-26 | 2003-10-29 | Jet soldering apparatus |
US10/542,626 US7416103B2 (en) | 2003-02-26 | 2003-10-29 | Flow soldering apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-49353 | 2003-02-26 | ||
JP2003049353A JP2004259963A (ja) | 2003-02-26 | 2003-02-26 | 噴流式半田付け装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004076114A1 true WO2004076114A1 (ja) | 2004-09-10 |
Family
ID=32923306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013834 WO2004076114A1 (ja) | 2003-02-26 | 2003-10-29 | 噴流式半田付け装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7416103B2 (ja) |
EP (1) | EP1600237A1 (ja) |
JP (1) | JP2004259963A (ja) |
KR (1) | KR20050100662A (ja) |
CN (1) | CN100421855C (ja) |
WO (1) | WO2004076114A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0610679D0 (en) * | 2006-05-30 | 2006-07-12 | Pillarhouse Int Ltd | Soldering apparatus |
US20080302861A1 (en) * | 2007-06-11 | 2008-12-11 | Szymanowski Richard A | Method and apparatus for wave soldering an electronic substrate |
CN101417374B (zh) * | 2008-11-28 | 2011-05-18 | 广州瀚源电子科技有限公司 | 一种无铅焊料减渣方法 |
JP2010155269A (ja) * | 2008-12-27 | 2010-07-15 | Senju Metal Ind Co Ltd | はんだ槽及びはんだ槽に収容されたはんだの加熱方法 |
CN104249208B (zh) * | 2013-06-26 | 2018-03-06 | 联想企业解决方案(新加坡)私人有限公司 | 波峰焊装置及其喷嘴 |
DE102014110720A1 (de) * | 2014-07-29 | 2016-02-04 | Illinois Tool Works Inc. | Lötmodul |
JP6184451B2 (ja) * | 2015-09-03 | 2017-08-23 | 美弘 高塚 | 噴流式ハンダ付け装置及び噴流式ハンダ付け装置におけるハンダ離脱制御方法 |
JP6593400B2 (ja) * | 2017-08-04 | 2019-10-23 | 千住金属工業株式会社 | 噴流はんだ槽及び噴流はんだ付け装置 |
JP6566021B2 (ja) * | 2017-12-25 | 2019-08-28 | 千住金属工業株式会社 | 噴流はんだ槽及び噴流はんだ付け装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5156324A (en) * | 1992-03-17 | 1992-10-20 | Electrovert Lgd | Solder apparatus with dual hollow wave nozzles |
JPH05305432A (ja) * | 1992-04-24 | 1993-11-19 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
US5769305A (en) * | 1995-08-02 | 1998-06-23 | Nihon Den-Netsu Keiki Co., Ltd. | Apparatus for wave soldering printed wiring boards |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9200060A (nl) * | 1992-01-14 | 1993-08-02 | Soltec Bv | Soldeermachine met verbeterde configuratie van soldeerstromen. |
CN2178581Y (zh) * | 1993-12-10 | 1994-10-05 | 中国三江航天工业集团公司 | 液态金属软钎接的感应式双波峰电磁泵 |
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2003
- 2003-02-26 JP JP2003049353A patent/JP2004259963A/ja not_active Withdrawn
- 2003-10-29 US US10/542,626 patent/US7416103B2/en not_active Expired - Fee Related
- 2003-10-29 KR KR1020057014632A patent/KR20050100662A/ko not_active Application Discontinuation
- 2003-10-29 EP EP03769946A patent/EP1600237A1/en not_active Withdrawn
- 2003-10-29 CN CNB2003801099669A patent/CN100421855C/zh not_active Expired - Fee Related
- 2003-10-29 WO PCT/JP2003/013834 patent/WO2004076114A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5156324A (en) * | 1992-03-17 | 1992-10-20 | Electrovert Lgd | Solder apparatus with dual hollow wave nozzles |
JPH05305432A (ja) * | 1992-04-24 | 1993-11-19 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
US5769305A (en) * | 1995-08-02 | 1998-06-23 | Nihon Den-Netsu Keiki Co., Ltd. | Apparatus for wave soldering printed wiring boards |
Also Published As
Publication number | Publication date |
---|---|
KR20050100662A (ko) | 2005-10-19 |
EP1600237A1 (en) | 2005-11-30 |
US7416103B2 (en) | 2008-08-26 |
CN1753752A (zh) | 2006-03-29 |
JP2004259963A (ja) | 2004-09-16 |
US20060191976A1 (en) | 2006-08-31 |
CN100421855C (zh) | 2008-10-01 |
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