WO2004073905A1 - Procede de production de moules pour moulage de precision a cire perdue - Google Patents

Procede de production de moules pour moulage de precision a cire perdue Download PDF

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Publication number
WO2004073905A1
WO2004073905A1 PCT/JP2004/001734 JP2004001734W WO2004073905A1 WO 2004073905 A1 WO2004073905 A1 WO 2004073905A1 JP 2004001734 W JP2004001734 W JP 2004001734W WO 2004073905 A1 WO2004073905 A1 WO 2004073905A1
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WIPO (PCT)
Prior art keywords
resin
component
mold
wax
model
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PCT/JP2004/001734
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English (en)
Japanese (ja)
Inventor
Hidekazu Suzuki
Taro Kita
Akio Saito
Kazuki Kamata
Masato Kikuchihara
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Shonan Design Co., Ltd.
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Application filed by Shonan Design Co., Ltd. filed Critical Shonan Design Co., Ltd.
Priority to US10/546,388 priority Critical patent/US20060144555A1/en
Priority to EP04711720A priority patent/EP1600229A1/fr
Publication of WO2004073905A1 publication Critical patent/WO2004073905A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
    • B22C1/02—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by additives for special purposes, e.g. indicators, breakdown additives
    • B22C1/10—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by additives for special purposes, e.g. indicators, breakdown additives for influencing the hardening tendency of the mould material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C9/00—Moulds or cores; Moulding processes
    • B22C9/02—Sand moulds or like moulds for shaped castings
    • B22C9/04—Use of lost patterns
    • B22C9/043—Removing the consumable pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C9/00—Moulds or cores; Moulding processes
    • B22C9/12—Treating moulds or cores, e.g. drying, hardening

Definitions

  • the present invention provides a method for removing the resin model in a mouth-strap precision manufacturing method using a resin model instead of a mouth model.
  • the present invention relates to a method for manufacturing a mold for a lost-stroke precision manufacturing, which has sufficient strength and eliminates cracks in the mold.
  • the lost wax method is a method of manufacturing a mouth model having the same shape as a manufactured product by spray-molding a molten wax component into a mold for mass production of a mouth model, cooling, and demolding.
  • the surface was coated with a refractory material, heated to melt and flow the wax model, completely burned out by high-temperature firing, manufactured a hollow mold, poured the molten alloy into the mirror mold, and cooled. After solidification, it goes through a manufacturing process that involves breaking the mold and removing the structure.
  • this wax component is injection-molded into a mold to produce a wax model.
  • the injection temperature, injection pressure, injection pressure holding time, and cooling / demolding temperature are controlled to produce a uniform quality wax model. Is done.
  • the wax model manufactured in this way is stored in a constant temperature room at a constant temperature, and care is taken to maintain the dimensional accuracy as much as possible.
  • To assemble this wax model a wax model is brazed to a separately prepared gate model, and it is assembled in a tree-like shape. The entire assembled model is called Perry. Since the shape of the tree is the same as the gate system, the design takes into account many factors, such as the properties of the molten metal, the size and shape of the material, the manufacturing conditions, and the ease of cutting from the tree. Is designed.
  • the pellets produced in this way are repeatedly immersed in coating slurry and dried, and coated in layers.
  • the binder used for the coating tree is colloidal silica, ethyl silicate, or the like. These binders are mixed with refractory fine powder as a filler to form a slurry. After the wax model is immersed in the slurry thus produced, the stucco particles are sprinkled and dried. Stucco grains include zircoside and morocite grains. By repeating these operations several times, the coating work is completed.
  • a wax model is eluted from the ⁇ type at a temperature of 120-150 ° C. This is called dewaxing.
  • the shell ⁇ is heated at 700 ° C to 100 ° C to improve the strength of the mold. Fired in a furnace.
  • the molten alloy is injected into the mold thus manufactured, and after cooling, the mold is collapsed by a knock machine or the like. Is removed. Parts that can be repaired are repaired by welding, and the surface is finished with NC processing or grinders and heat treated to produce a ferrous alloy product.
  • Japanese Unexamined Patent Publication No. 5-23791 discloses a model in which a synthetic resin film is formed on a wax surface.
  • Japanese Patent Publication No. Hei 5-3 2 9 1 7 4 discloses a tooth binding model manufactured from a heated molten resin to form a model.
  • Japanese Patent Application Laid-Open No. 7-90484 is a model in which a photo-curable resin sheet is laminated with a loss-storage table.
  • Japanese Patent Application Laid-Open No. 7-295954 is a model in which an embroidery model made of cotton yarn or a synthetic material is coated with a plastic or plastic material.
  • Japanese Patent Application Laid-Open No. Hei 7-474733 discloses a model in which a photocurable resin model or a heat-melting resin laminate model is inserted into a mold, and a molded article is formed by injection molding of a Lost Toxic resin.
  • Japanese Patent Application Laid-Open No. 2000-26631186 is a model in which a lost wax table is laminated on an ultraviolet curable resin model.
  • synthetic resin has been used for a part or the whole of a model, but this is mainly aimed at improving the shape retention of a wax model and producing a simple model.
  • a model using a synthetic resin is used as a substitute for a wax model in a precision structural loss method.
  • a resin model is used as a substitute for a wax model, it is difficult for the resin of the resin model to easily flow away during the dewaxing process, and in the vicinity of the temperature range where the resin of the resin model undergoes thermal decomposition, expansion and large amounts of combustion gas generate ⁇ -type internal stress. It grows rapidly, causing hair-crack cracks in the ⁇ type, and in some cases, type ⁇ ⁇ collapses.
  • the resin model is not used in the dewatering process and the initial baking process, because it is difficult for the resin model to desorb and decompose and pyrolyze.
  • the problems with these wax models are that the edges are hard to come out, the thin ribs are hard to stand, the thin ribs are easy to break, and thin parts must be removed with great care when removing the mold.
  • a wax model that has a part that is too thin, such as less than one restaurant.
  • the produced wax model has problems that it is easily damaged due to its low surface hardness, has poor dimensional accuracy, and is damaged by drop impact when it is carried.
  • the created wax model has a change in shape under summer conditions. There is a problem that it must be stored in a constant temperature room because it is easily caused. Furthermore, there is a problem that in the summer, when moving the wax model, great care must be taken.
  • the wax component is a relatively low-molecular-weight organic substance and softens at about 80 ° C.
  • the problem of the mouth model concentrates on the problem caused by the wax component.
  • improvement research has been conducted by changing the composition of the oral component, but the oral component is a low-melting organic substance that melts at a temperature slightly higher than room temperature. At present, the fundamental problem has not been solved because it is crystallized and solidified.
  • the present inventors have developed a resin model that promises to improve the defects of the wax model.
  • the composition has been studied diligently. It is an object of the present invention to provide a resin composition for a model excellent in shape retention and opening property in a system in which a plasticizer and a mouth / box component are skillfully blended with a urethane resin that is easily decomposed. It is necessary to set a method of opening that is suitable for the resin model, and to reinforce the mirror mold in the low-temperature region to be dewaxed. Disclosure of the invention
  • the present invention comprises a polyfunctional polyol component (A), a polyfunctional polyisocyanate component (B), a plasticizer (C), a wax-wax component (D), and a hollow resin balloon (E).
  • A polyfunctional polyol component
  • B polyfunctional polyisocyanate component
  • C plasticizer
  • D wax-wax component
  • E hollow resin balloon
  • a primary layer consisting of a plurality of coating layers laminated on the surface of the resin model (H)
  • the process of applying, drying and curing the oxysilicon (N) to form a thick coating layer is repeated a plurality of times, starting with the thick coating layer laminated on the surface of the resin model (H).
  • Step of manufacturing a backup layer made of: A resin model (H) coated with a thick refractory coating multilayer consisting of the primary layer and the backup layer described above is placed in a furnace with a gate facing down.
  • the average number of functional groups of the polyfunctional polyol component (A) is 2.8 or more
  • the average number of functional groups of the polyfunctional polyisocyanate component (B) is 2.0 or more
  • NCO / OH is 0.8 to 1 0 is desirable.
  • the plasticizer (C) is phase-separated and micro-dispersed during the reaction curing of the two-component reaction-curable urethane resin liquid (F).
  • the two-component reaction-curable urethane resin liquid (F) preferably contains 2 to 20% by weight of a polyether chain represented by the following chemical structural formula.
  • the mouthwash component (D) is in the form of a powder having a melting point of 60 to 130 ° C and a maximum of 5 mm, and is contained in the two-component reaction-curable urethane resin solution (F) in an amount of 3 to 30%. Desirably, it is contained by weight.
  • the epoxy silicon (N) comprises a bisphenol-type epoxy (J), an aminosilane (K), and an organic solvent (L).
  • the hollow resin balloon (E) has a particle diameter of 10 to LOO m and a true specific gravity of 0.01 to 0.03, and the two-part reaction-curable urethane resin liquid (F) It is desirable that the content is 0.001 to 0.5% by weight.
  • a method for manufacturing a mold for loss-to-truss precision manufacturing using the resin model of the present invention It will be explained in the process.
  • a two-component reaction-curable urethane resin solution (F) composed of a wax component (D) and a hollow resin balloon (E) is blended, and the two-component reaction-curable urethane resin solution (F) is molded ( Cast it into G), cure it, remove it, and make a resin model (H).
  • the binder component of the two-component reaction-curable urethane resin liquid (F) is composed of a polyfunctional polyol component (A) and a polyfunctional polyisocyanate component (B).
  • the plasticizer (C), wax component (D) and hollow resin balloon (E) are additive components.
  • the plasticizer (C) may be added to the polyfunctional polyol component (A), or may be added as one component when producing the polyfunctional polyol component (A). Further, the plasticizer (C) may be added to the polyfunctional polyisocyanate component (B), or may be added as one component when producing the polyfunctional polyisocyanate component (B). .
  • wax component (D) may be added to the polyfunctional polyol component (A), or after the polyfunctional polyol component (A) and the polyfunctional polyisocyanate component (B) are blended. It may be added. Furthermore, the wax component (D) may be added to the polyfunctional polyisocyanate component (B), or the polyfunctional polyol component (A) and the polyfunctional polyisocyanate component (B) are blended. It may be added after the addition.
  • the hollow resin balloon (E) may be added to the polyfunctional polyol component (A), or may be added after the polyfunctional polyol component (A) and the polyfunctional polyisocyanate component (B) are blended. good. In addition, the The hollow resin balloon (E) may be added to the polyfunctional polyisocyanate component (B).
  • a mold, a simple mold, a resin mold and a silicone rubber mold are applicable.
  • the mold is suitable for mass production
  • the simple mold and resin mold are suitable for medium-volume production
  • the silicone rubber mold is suitable for small-lot trial production.
  • Die ⁇ Simple mold-The resin mold is designed with a draft angle, but in the case of a silicone rubber mold, the mold design with a draft angle is not an absolute requirement. In other words, due to the rubber elasticity, the silicon rubber mold is slightly bent, the model is taken out, and if the bending stress is released, the original shape can be restored. However, if used many times, rubber elasticity will be lost, so the limit is about 20 moldings. Therefore, it is suitable for small-scale trial production.
  • the resin model (H) is immersed in the refractory coating liquid (I), pulled up and dried, coated with epoxy silicon (N), dried and cured, and then cured.
  • the operation of forming a refractory coating layer on the surface of (1) is repeated a plurality of times, for example, 2 to 5 times, to form a primary layer in which a plurality of refractory coating layers are laminated. That is, in the second step, when the resin model (H) is immersed in the refractory coating liquid (I) and pulled up, the refractory coating liquid (I) adheres to the surface of the resin model (H). Come up.
  • the layer made of epoxy silicon (N) is completely formed at room temperature and has a heat-resistant three-dimensional network structure, so it consists of a primary layer and a backup layer in a low temperature range of 80 to 200 ° C. It gives strength to the refractory coating layer. It is supposed that it burns in the high temperature range of 500 to 1000 ° C and loses its intensity. Therefore, by providing a layer made of epoxy silicon (N) between the layers and superimposing it, the D-type strength in the low temperature region is remarkably improved.
  • the exuded plasticizer (C) and wax / wax component (D) accumulate in the gap between the resin mold (H) and the mold, and penetrate into the porous mold inner surface, and the increase in mold pressure is reduced. Is done.
  • the accumulation of the wax component (D) further increases, it slowly descends and begins to dewax by dripping from the gate. Once the dewaxing phenomenon occurs, a dewaxing passage is created, after which dewaxing proceeds sequentially. If the temperature is raised so that it passes through this process in a short period of time, the combustion temperature will rapidly rise and the decomposition gas will accompany, so the internal pressure of the mold will rise sharply and the layer made of epoxy silicon (N) Even though it is a significantly reinforced type II, it will crack.
  • the furnace temperature is gradually increased, and heating is performed at 150 to 500 ° C. for 2 to 8 hours to complete the dewaxing and burning of the resin model.
  • the internal pressure of the mold ⁇ due to the decomposed gas becomes a force to push out the molten and liquefied substances, so that the dewaxing proceeds smoothly and the decomposed gas is also discharged smoothly. Hair cracking is avoided.
  • the terminal hydroxyl group becomes primary or secondary by various addition methods such as addition of ethylene oxide alone, addition of propylene oxide alone, mixed addition, and sequential addition. Due to this, the reactivity of terminal hydroxyl groups is different, and polyether polyols having various hydrophilicity depending on whether the added chain is ethylene oxide or propylene oxide are commercially available.
  • the amine polyol is obtained by adding ethylene oxide to propylene oxide to a low molecular weight amine such as ammonia ethyl diamine. Therefore, it contains tertiary nitrogen in the molecule, and is a polyol possessing the effect of promoting the reactivity of isocyanate. It is an essential component of the present invention that performs rapid curing.
  • Polyester polyol is obtained by esterifying a dibasic acid and a low molecular weight diol to form a hydroxyl group at the molecular end.
  • a wide variety of polyester polyols can be obtained.
  • Acryl polyol is a polymer obtained by polymerizing methyl acrylate / methyl methacrylate with an acryl monomer having a terminal hydroxyl group, and is an acryl polyol having a plurality of hydroxyl groups in an acryl chain.
  • Various acryl polyols formed by selecting the type of acrylic monomer and adjusting the molecular weight are commercially available.
  • Film formation The resin solution, which has increased the degree of polymerization to a high level, polymerized, and dissolved in an organic solvent, becomes a paint with excellent weather resistance by performing a slight cross-linking with aliphatic polyisocyanate.
  • Butadiene polyol is a copolymer of butadiene having a hydroxyl group at a terminal and a compound having a double bond. A relatively hydrophobic polyol.
  • the polyfunctional polyisocyanate component (B) is a compound containing two or more isocyanate groups in one molecule, and the polyol component is a compound containing two or more hydroxyl groups in one molecule.
  • the isocyanate group is a very reactive functional group and reacts with a hydroxyl group having active hydrogen, an amino group or a thiol group. Amino groups and thiol groups react instantaneously, so they are limitedly applied to poorly reactive isocyanate components and poorly reactive aromatic amines, etc., but still react more quickly. The combination is not heavily used.
  • the diphenyl methanediisocyanate is also obtained as a mixture of various isomers due to the chemical reaction at the time of production, and there are industrially pure MDI and polymeric MDI. Pure MDI is binuclear, polymeric MDI is polynuclear, pure MDI is isolated by distillation, and polymeric MDI remains in the bottom. Polymeric MDI is commercially available from various manufacturers, because the number of polynuclei varies depending on the production conditions. Also, naphthalene nuclei include naphthalene dicysinate 1 and naphthylene dicysinate which have a group 1 in the naphthalene nucleus.
  • This polyether chain is a soft component, and when heated to a high temperature in the dewaxing / firing process, it is thermally decomposed. .
  • the blending amount of the polyisocyanate component and the polyol component is designed so that the number of NCO groups and OH groups is calculated, and the ratio of the number of NCO groups to OH groups (NCOZ OH) is usually around 1.0.
  • (NCOZ ⁇ H) 1.0 is a design in which the number of isocyanate groups and hydroxyl groups are the same, and the reaction ends exactly. That is, it is a region where the highest strength is exhibited.
  • the average number of functional groups of the polyisocyanate component to be at least 2.1 and the average number of functional groups of the polyol component to be at least 3.0, it is possible to obtain an NCOZOtHl. It is set to 7 to 1.0.
  • the isocyanate group is in a severely shortage state, failing to obtain a three-dimensional network structure after reaction hardening, causing an extreme decrease in hardness, and eventually becoming soft enough to make the shape retention difficult.
  • the NCOZOH is 1-0 or more, the isocyanate group becomes excessive, and the unreacted isocyanate group remains even after the demolding time. Phenomena such as uneven coloration or foaming of the cured product surface occur.
  • catalysts that promote the chemical reaction between the polyfunctional polyol component (A) and the polyfunctional polyisocyanate component (B) include a metal catalyst and an amine catalyst.
  • the metal catalyst examples include zinc octoate / lead octoate, dibutyltin dilaurate, dibutyltin diacetate, and the like.
  • the amine catalyst examples include triethylenediamine, NN-dimethylbiperazine, and N-methylmorpholine. These catalysts are usually added to the polyol component. Usually 1 to 1000 ppm is added to the polyfunctional polyol component (A) to adjust the pot life. In the present invention, a catalyst is added to the polyfunctional polyol component (A) so that the pot life, that is, the pot life is within 5 minutes. If the pot life exceeds 5 minutes, the curing demold time will be 2 hours or more, which will hinder resin model production. Therefore, the pot life is preferably 1 to 2 minutes.
  • the plasticizer (C) used in the present invention is a compound having no functional group that causes a chemical reaction and having negligible inert volatility, and preferably a liquid at room temperature.
  • the plasticizer (C) include an ester plasticizer, an ether plasticizer, and an ester ether plasticizer.
  • ester plasticizer include octyl adipate (DOA), octyl phthalate (D0P), and dibutyl phthalate (DBP).
  • Ethylene plasticizer is ethylene Glycol butyl ether, ethylene glycol diphenyl ether, diethylene glycol dimethyl ether, methylene glycol methyl ethyl ether, diethylene glycol methyl dimethyl ether, dimethylene glycol ethyl butyl ether, dimethylene glycol dibutyl ether, triethylene glycol Dimethyl ether, triethylene glycol dimethyl ether, triethylene glycol dibutyl ether, troethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol monomethyl ether, and the like.
  • ether ester examples include ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and diethene glycol monomonophenyl ether acetate.
  • the amount of the plasticizer (C) used is 2 to 20% by weight based on the two-component reaction-curable urethane resin liquid (F). If the amount of the plasticizer (C) used is higher than 20% by weight, the plasticizer (C) bleeds to the surface of the resin model, causing stickiness and sunset. When the amount of the plasticizer (C) is less than 2% by weight, the resin is thermally decomposed, melted, lost, and burned out in the dewaxing / firing process, so that the resin is hardly discharged. This is because the plasticizer (C) is a liquid at room temperature and has a low viscosity that easily flows out at high temperatures. In order to exert such effects strongly, it is desirable to contain the plasticizer (C) as high as possible.
  • the separated microdispersion structure can be described as the presence of a plasticizer (C) that becomes a larva in a honeycomb-shaped cured resin.
  • the honeycomb-shaped cured resin has a structure with excellent strength and physical properties, and has a structure in which the plasticizer (C) is carefully preserved in the honeycomb and is not released to the outside.
  • the plasticizer (C) does not ooze out on the surface of the cured product, and does not cause the generation of the evening sun.
  • the plasticizer dissolves in the cured resin, and when it becomes saturated or more, the plasticizer oozes out on the surface of the cured product and tacks out. If there is much oozing, stickiness is likely to occur.
  • Such a phase-separated microdispersion structure has been confirmed by electron microscopy. To promote the phase-separated microdispersion structure, it is necessary to rapidly cure within 5 minutes of the pot life. It is preferably within 3 minutes. If the pot life exceeds 5 minutes, phase separation microdispersion becomes difficult to complete, and it takes one day or more to remove the mold when making the model, and the speed of model production is lost.
  • the plasticizer (C) When present as a two-part reaction-curable urethane resin liquid (F), the plasticizer (C) needs to be in a homogeneously dissolved state. At the stage of reaction curing, phase separation micro-dispersion from the cured resin is promoted, At the end of curing, it contains a plasticizer dispersed in the mouth and prevents bleeding to the surface.
  • the composition is based on such a delicate balance. In other words, it is designed in a region where the balance between the hydrophilicity and hydrophobicity of the plasticizer (C) and the reaction curable resin is well adjusted.
  • An alkylene oxide chain is effective as a hydrophilic segment, and a hydrocarbon chain is effective as a hydrophobic segment.
  • the hydrophilicity and hydrophobicity of the plasticizer (C) itself can be adjusted within a certain range.
  • the hydrophobicity increases as it changes to methyl ether, ethyl ether, butyl ether, and phenyl ether.
  • the chemical structure and amount of the plasticizer (C) and the chemical structure and amount of the two-component reaction-curable urethane resin solution (F) are changed to set the range of the phase separation microdispersion.
  • Typical waxes include candelilla wax, carnauba wax, rice wax, beeswax, whale mouth ⁇ , and monsoon wax. These waxes may be mixed singly, or may be a wax to which a third component is added.
  • the main components are ester compounds of higher fatty acids and higher alcohols, which have the chemical composition of wax.
  • oils There are two types of oils: petroleum oils and synthetic oils. It is easy to understand that the mouth is a natural box.
  • Polyethylene wax is produced by the polymerization of ethylene, but also by pyrolysis of general-purpose polyethylene. Natural wax has a molecular weight of 100 or less, whereas polyethylene wax has a molecular weight of 1
  • the mouth / box component (D) of the present invention may be composed of a single mouth / single box, but rather is used by being blended.
  • the wax component (D) is a compound having a strong paraffinic property, having a very strong hydrophobicity, and being solid at room temperature. Therefore, it has a property that it is hardly dissolved in the polyfunctional polyol component (A), the polyfunctional polyisocyanate component (B) and the plasticizer (C). Therefore, even when it is mixed with the two-component reaction-curable urethane resin liquid (F), it is hardly dissolved, and is in a state of swelling and floating in a liquid system. In such a state, when the two-component reaction-curable urethane resin liquid (F) is rapidly cured, it is embedded and contained as a solid in the cured resin.
  • the particle diameter of the hollow resin balloon (E) is 10 ⁇ m or less, the fluidity of the two-component reaction-curable urethane resin liquid (F) compounding system becomes poor, and the casting operation becomes difficult.
  • the particle size is 100 zm or more, the floating of the hollow resin balloon (E) particles in the two-component reaction-curable polyurethane resin liquid (F) compounding system is accelerated, and separation in the liquid is not preferred.
  • the preferred particle size is between 20 and 80 microns.
  • the hollow resin balloon (E) is relatively uniformly dispersed in the cured resin model (H) mixed with the two-component reaction-curable urethane resin liquid (F).
  • gas was dispersed in the resin model (H) in a sealed state, and dewaxing and interspersed with unnecessary combustion components contributed greatly to dewaxing properties. It produces a contributing effect.
  • the compounding amount of the hollow resin balloon (E) is 0.001 to 1.0% by weight based on the two-component reaction-curable urethane resin liquid (F).
  • the amount is less than 0.001% by weight, the effect of greatly reducing the degassing property and flammability is reduced. If the content is more than 1.0% by weight, the resin mixture becomes rough and the fluidity becomes poor, so that smooth casting becomes difficult.
  • the compounding amount of the hollow resin balloon (E) is 0.03 to 0.10% by weight based on the two-component reaction-curable urethane resin liquid (F).
  • an inert organic compound having no active hydrogen may be added to the two-component reaction-curable urethane resin solution (F) composed of For example, organic solvents, antioxidants, coloring agents, curing accelerators, dispersants, modifiers, and the like.
  • organic solvent methyl acetate / ethyl acetate / butyl acetate / methyl ethyl ketone / methyl isobutyl ketone'toluene / xylene may be blended for the purpose of reducing the viscosity.
  • a hindered phenol or a hindered amine may be blended for the purpose of preventing thermal deterioration and ultraviolet light deterioration.
  • a coloring agent an organic dye may be blended for the purpose of aesthetic sense.
  • Tertiary amine / a trace amount of zinc octylate-peptyltin laurate may be added as a curing accelerator.
  • a dispersant an amide compound or a surfactant may be added. However, it is not preferable to mix inorganic substances that become ash after combustion.
  • the refractory coating liquid (I) is a slurry-like liquid in which fine zirconium alumina is usually blended with colloidal silica ethyl silicate.
  • the binder used for the refractory coating liquid (I) ie, co-idal silica and ethyl silicate, has a usable life, it is particularly necessary to carefully control the pH of the liquid. is there.
  • Colloidal silica and ethyl silicate are hardened by a dehydration reaction. When this is fired at a high temperature, it is further dehydrated and becomes ceramic by the Si—0—Si bond, resulting in a high hardness ⁇ . Since ethyl silicate is used in an alcohol solvent system, alcohol is scattered during drying. Colloidal silica is water-based, and water is scattered when dried. ⁇ In the construction industry, due to the problem of environmental pollution, colloidal silicity, which does not splash alcohol, tends to be heavily used.
  • Epoxysilicone (N) is a low-viscosity, sprayable liquid obtained by mixing bisphenol A type epoxy (J) with aminosilane (K) and diluting it with an organic solvent (L).
  • Bisphenol-type epoxy (J) is an epoxy having a molecular glycidyl group represented by the chemical structural formula shown in the following chemical formula 4, and includes bisphenol A-type epoxy and bisphenol F-type epoxy.
  • Bisphenol A-type epoxy is commercially available under the trademark Epikoto 828 Epicoat 1001.
  • Bisphenol type epoxy (J) is represented by the following chemical structural formula.
  • R H or CH a
  • Aminosilane (K) is commercially available as a silane coupling agent, and is a compound having an alkoxysilyl group and an amino group at the molecular terminal represented by the following chemical structural formula.
  • the organic solvent (L) is preferably a diluting solvent for epoxy resins that does not impair the reaction between epoxy and amine.
  • a diluting solvent for epoxy resins that does not impair the reaction between epoxy and amine.
  • ketone-based organic solvents as true solvents for dissolving epoxy resins
  • ester-based organic solvents ester-based organic solvents
  • ether-based organic solvents as diluent solvents for dissolving and diluting epoxy resins with true solvents
  • aromatic organic solvents aromatic organic solvents
  • alcohol-based solvents Organic solvents and the like are examples of organic solvents and the like.
  • the glycidyl group of the bisphenol-type epoxy (J) and the amino group of the aminosilane (K) undergo an addition reaction at room temperature to bond.
  • the alkoxysilyl group of aminosilane causes a dealcoholization reaction with the moisture in the air and the OH group on the surface of the underlying refractory coating layer to form a film.
  • the addition reaction between the glycidyl group and the amino group and the dealcohol condensation reaction between the alkoxysilyl group proceed smoothly at room temperature.
  • the blending ratio of bisphenol-type epoxy (J) and aminosilane (K) is determined by determining the blending weight such that aminosilane (K) is 1.5 to 2 moles per mole of bisphenol-type epoxy (J). Good.
  • the epoxy silicon (N) layer adheres firmly to the underlying primary and backup layers.
  • the adhesion mechanism is that the alkoxysilyl group of aminosilane (K) undergoes a de-alcohol reaction with the Si—OH group on the surface of the underlying refractory coating layer, and the formation of a Si—0—Si bond occurs. Strong bonding with covalent bonds. Also, it is considered that the OH group generated by the addition reaction between the epoxy group and the amino group generates a hydrogen bond with Si—OH of the base refractory coating layer, and is strongly bonded.
  • the dewaxing temperature of the wax model is raised to 120 ° C, and dewaxed at 120 to 150 ° C for 1 to 2 hours. The temperature is raised to ⁇ 500 ° C. If this condition is applied as it is, the thermal expansion of the resin model and the generation of combustion gas due to thermal decomposition will cause the ⁇ internal pressure to rapidly increase, causing the ⁇ to crack, and in some cases the ⁇ ⁇ to collapse. Become. It is considered that the reason for the cracks occurring when the mold dewaxes is that the internal stress increases when the mold ⁇ strength is at a low level, and the mold ⁇ strength does not withstand the internal stress.
  • preheating was performed for 2 to 8 hours in a low temperature range of 60 to 120 ° C, and 5 to 50% of the weight of the resin model was initially set.
  • a step of dewaxing is provided, and the furnace temperature is gradually increased and heating is performed for 2 to 5 hours in a medium temperature range of 150 to 500 ° C, and a step of degassing and burning of the resin model is completed. It comprises a step of firing in a high temperature range of from 100 to 100 ° C.
  • low-temperature dewaxing conditions that avoid rapid temperature rise are introduced because resin components that are difficult to dewax are mainly used.
  • the plasticizer (C) By preheating at 60 to 120 ° C for 2 to 8 hours, the plasticizer (C), microphase separated in the resin component, oozes through the resin membrane to the interface between the resin and the mold. Seems to come. This is accumulated, and the plasticizer (C) starts flowing out of the gate through the inner surface of the mold. Furthermore, since the wax component (D) is at a temperature near or above its melting point, it has begun to soften and liquefy, exuding together with the plasticizer (C), or the plasticizer (C). Begins to flow out of the gate along the path that has flowed out. In the low temperature range of 60 to 120 ° C, the resin component is in a softened and degraded state, and pyrolysis that has generated gas has not yet occurred.
  • the inside of the mold is an internal pressure due to the thermal expansion of the resin component, and serves as a force for pushing out the plasticizer (C) and the wax component (D) to the gate. Therefore, the pressure inside the mold ⁇ is reduced by the extrusion and outflow, so that the mold ⁇ ⁇ can withstand the internal pressure and the generation of cracks can be avoided.
  • the resin component undergoes thermal decomposition, generating decomposition gas, while decomposing the main chain and side chains to lower the molecular weight, and the resin itself partially liquefies.
  • Decomposed gas is generated inside the type III and is contained.
  • the internal pressure of the mold increases, but if the passage through which the plasticizer (C) or wax component (D) escapes at 60 to 120 ° C is opened, the decomposition gas can be easily removed. Get out.
  • composition of the resin model and the strength of the refractory coating material and the application of dewaxing conditions suitable for the resin model have been studied diligently from three directions, and a method of forming a mold without cracks in the dewaxing and firing processes. Heading, the present invention has been reached.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mold Materials And Core Materials (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention se rapporte à la production d'une composition de résine de modélisation présentant d'excellentes caractéristiques de stabilité dimensionnelle et de déparaffinage et prenant la forme d'un système judicieux qui comprend une résine uréthanne pouvant facilement subir une décomposition thermique, un plastifiant et une cire ou un composant cireux. L'invention se rapporte à un procédé de déparaffinage adapté à des modèles fabriqués à partir de ladite composition, qui permet d'accroître la résistance d'un moule dans la région de basses températures dans laquelle le déparaffinage est effectué. Conformément à l'invention, un moule est produit par application d'une couche primaire constituée de plusieurs couches de revêtement réfractaire parmi lesquelles des couches époxy-silicone sont déposées et d'une couche de renforcement constituée de plusieurs couches de revêtement épaisses disposées à la surface d'un modèle en résine fabriqué par réticulation d'un fluide à base d'une résine uréthanne réticulable en deux parties (F) qui comporte un composant polyol polyfonctionnel (A), un composant polyisocyanate polyfonctionnel (B), un plastifiant (C), une cire ou un composant cireux (D), des ballons en résine creux (E), ladite application étant suivie par un préchauffage du composite obtenu à une température basse dans la plage comprise entre 60 et 120 °C pendant 2 à 8 heures de manière à effectuer un déparaffinage initial visant à supprimer 5 à 50 % en poids du modèle en résine, par élévation graduelle de la température du four, par un chauffage du composite résultant à une température moyenne dans une plage comprise entre 150 et 500 °C pendant 2 à 5 heures, puis par cuisson dudit composite à une température élevée dans une plage comprise entre 500 et 1 000 °C pendant 2 à 5 heures.
PCT/JP2004/001734 2003-02-21 2004-02-17 Procede de production de moules pour moulage de precision a cire perdue WO2004073905A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/546,388 US20060144555A1 (en) 2003-02-21 2004-02-17 Method for producing molds for lost wax precision casting
EP04711720A EP1600229A1 (fr) 2003-02-21 2004-02-17 Procede de production de moules pour moulage de precision a cire perdue

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003043576A JP4006696B2 (ja) 2003-02-21 2003-02-21 ロストワックス精密鋳造用鋳型の製作方法
JP2003-043576 2003-02-21

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WO2004073905A1 true WO2004073905A1 (fr) 2004-09-02

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EP (1) EP1600229A1 (fr)
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US7824870B2 (en) * 2006-01-03 2010-11-02 Alcon, Inc. System for dissociation and removal of proteinaceous tissue
JP5036362B2 (ja) * 2007-03-24 2012-09-26 旭有機材工業株式会社 鋳型用ウレタン硬化型有機粘結剤並びにこれを用いて得られる鋳物砂組成物及び鋳型
RU2470734C1 (ru) * 2011-07-21 2012-12-27 Государственное образовательное учреждение высшего профессионального образования "Комсомольский-на-Амуре государственный технический университет" (ГОУВПО "КнАГТУ") Суспензия для изготовления керамической формы методом электрофореза
KR101328099B1 (ko) 2011-12-28 2013-11-12 재단법인 포항산업과학연구원 주조품 제조 방법
KR20140027014A (ko) * 2012-08-23 2014-03-06 주식회사 엘지화학 가소제 조성물
JP6055963B2 (ja) * 2012-08-31 2017-01-11 株式会社Ｐｃｓジャパン 鋳型製造方法
CN105537510A (zh) * 2015-12-15 2016-05-04 铜陵铜官府文化创意股份公司 以地蜡为主体的铸造蜡及其制备方法
US10814377B2 (en) * 2017-06-28 2020-10-27 Raytheon Technologies Corporation Method for casting shell dewaxing
EP3489271B1 (fr) * 2017-11-22 2020-05-27 3M Innovative Properties Company Cyclage thermique d'une composition résistante de faible densité
WO2021025889A1 (fr) * 2019-08-02 2021-02-11 Canon Virginia, Inc. Soudage au laser de segments plastiques
GB202107433D0 (en) * 2021-05-25 2021-07-07 Hatton Designs Of London Ltd Improving green strength of ceramic shell

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US4008185A (en) * 1974-03-29 1977-02-15 The Dow Chemical Company Process for preparing rapid-setting polyurethanes
US5391460A (en) * 1993-07-12 1995-02-21 Hughes Aircraft Company Resin composition and process for investment casting using stereolithography
JPH09174563A (ja) * 1995-12-26 1997-07-08 Teijin Seiki Co Ltd 光造形型およびその製造方法

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EP1600229A1 (fr) 2005-11-30
JP2004261817A (ja) 2004-09-24
US20060144555A1 (en) 2006-07-06

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