WO2004073063A1 - Dispositif electronique et dispositif a semiconducteur - Google Patents
Dispositif electronique et dispositif a semiconducteur Download PDFInfo
- Publication number
- WO2004073063A1 WO2004073063A1 PCT/JP2003/001526 JP0301526W WO2004073063A1 WO 2004073063 A1 WO2004073063 A1 WO 2004073063A1 JP 0301526 W JP0301526 W JP 0301526W WO 2004073063 A1 WO2004073063 A1 WO 2004073063A1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Definitions
- An object of the present invention is to provide an electronic device in which a high-frequency power module for use in a wireless communication device or the like is mounted and which has improved high-frequency characteristics.
- the tab 4 is supported by a tab suspension lead 6 having four narrow corners. These tab suspension leads 6 are located on a diagonal line of the rectangular sealing body 2, and the outer ends face each corner of the rectangular sealing body 2.
- the sealing body 2 is a flat quadrilateral, and the corners (corners) are chamfered to form a slope 2a (see FIG. 1).
- the outer end of the tab suspension lead 6 slightly protrudes from this chamfered portion to 0.1 mm or less.
- the protruding length is determined by the cutting type of the press machine when cutting the tab suspension lead in the lead frame state, and for example, 0.1 mm or less is selected.
- a sealing body 2 is formed between each lead 7 and the lead 7 and between the lead 7 and the tab suspension lead 6. There are resin burrs that occur when performing.
- the resin paris part is generated when the sealing body 2 is formed by performing single-side molding on one surface of the lead frame 13 shown in FIG.
- runners are located during transfer molding. There, the runner-cured resin is ejected by one pin ejector lead frame 1
- crosstalk between input signal wirings may cause output fluctuations and signal waveform distortion in the respective circuit sections.
- an external signal input lead from an antenna with a small input signal In addition, it is necessary to minimize the influence of crosstalk between adjacent leads.
- the lead 7 and the tab 4 of the high-frequency power module 1 are mounted.
- a land 81 connected to the wiring and a tab fixing portion 82 as a tab connection terminal are provided. Therefore, the high-frequency power module 1 is positioned and mounted so that the lead 7 and the tab 4 of the high-frequency power module 1 coincide with and overlap the land 81 and the tap fixing portion 82.
- the signal output mode of the RFVC044 is 3780 to 3840MHz in 03] ⁇ , 3610 to 3760MHz in DCS, and 3860 to 3980MHz in # 3 in the Rx mode.
- the Tx mode is 3840 to 398 ⁇ for GSM, 3580 to 3730MHz for DCS, and 3860 to 398 ⁇ for PCS.
- the outputs of the two TXVCOs 67 are sensed by coupler 70. This detection signal is input to the mixer 72 via the amplifier 71.
- the mixer 72 inputs the RF local signal output from the RFVCO 44 via the switch 49.
- the output signal of the mixer 72 is input to the mixer 64 and the DPD 65 together with the output signal of the adder 63.
- An offset PLL Phase-Locked Loop
- the frequency of the output signal from the mixer 72 is 8 OMHz in each communication system.
- a land 81 for lead connection for supplying a fixed ground potential to the LNA (first circuit unit) 24 of the high-frequency power module 1 is also connected to the inner layer GND 89 via the through hole 84. Therefore, as shown in FIG. 16, when the high-frequency power module 1 is mounted on the mounting board 80, the LNA 24 is supplied from the tab fixing portion 82 through the tab 4. The same durand potential common to the ground potential is supplied as a fixed potential via the lead 7 and the wire 10.
Abstract
L'invention concerne une structure de boîtier d'un module de puissance haute fréquence (1) dans lequel des circuits intégrés de traitement de signaux analogiques haute fréquence comprenant un amplificateur à faible bruit sont formés. Cette structure comprend le module de puissance haute fréquence (1) et un substrat de boîtier (80). Le module de puissance haute fréquence (1) comprend un tube (4), plusieurs charges (7), une puce à semiconducteur (3) comportant plusieurs terminaux d'électrode et une partie circuit, plusieurs câbles (10) destinés à connecter les terminaux d'électrode aux charges (7), et plusieurs câbles (10) destinées à connecter les terminaux d'électrode au tube (4). Le substrat de boîtier (80) peut alimenter un potentiel à la terre à faible inductance obtenue par le biais de plusieurs trous traversants (84) vers le tube (4). Les câbles à potentiel fixe sont disposés le long des deux cotés du câble de signaux à travers lequel un signal d'entrée est transmis à la partie circuit, et le potentiel à la terre à faible inductance est alimenté à partir du substrat de boîtier (80) vers le tube (4), empêchant ainsi la création d'un écho magnétique entre un système de communication couramment utilisé et un autre. Ainsi, une condition recherchée d'un appel téléphonique peut être réalisée dans un dispositif électronique, notamment un téléphone mobile.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004568182A JP4137059B2 (ja) | 2003-02-14 | 2003-02-14 | 電子装置および半導体装置 |
PCT/JP2003/001526 WO2004073063A1 (fr) | 2003-02-14 | 2003-02-14 | Dispositif electronique et dispositif a semiconducteur |
TW092115874A TW200428614A (en) | 2003-02-14 | 2003-06-11 | Electronic device and semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/001526 WO2004073063A1 (fr) | 2003-02-14 | 2003-02-14 | Dispositif electronique et dispositif a semiconducteur |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004073063A1 true WO2004073063A1 (fr) | 2004-08-26 |
Family
ID=32866112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001526 WO2004073063A1 (fr) | 2003-02-14 | 2003-02-14 | Dispositif electronique et dispositif a semiconducteur |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4137059B2 (fr) |
TW (1) | TW200428614A (fr) |
WO (1) | WO2004073063A1 (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059885A (ja) * | 2005-07-22 | 2007-03-08 | Marvell World Trade Ltd | 高速集積回路用のパッケージング |
EP1827062A3 (fr) * | 2006-02-27 | 2008-08-20 | Denso Corporation | Dispositif électronique |
US7884451B2 (en) | 2005-07-22 | 2011-02-08 | Marvell World Trade Ltd. | Packaging for high speed integrated circuits |
EP2450951A1 (fr) * | 2010-11-08 | 2012-05-09 | Samsung Electronics Co., Ltd. | Boîtier plat quadruple doté d'une pale exposée |
KR101495823B1 (ko) | 2007-11-26 | 2015-02-25 | 각고호우징 게이오기주크 | 전자회로 |
JP2016174094A (ja) * | 2015-03-17 | 2016-09-29 | 住友電工デバイス・イノベーション株式会社 | 半導体組立体 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8571229B2 (en) * | 2009-06-03 | 2013-10-29 | Mediatek Inc. | Semiconductor device |
EP3088931A1 (fr) * | 2015-04-30 | 2016-11-02 | LG Innotek Co., Ltd. | Appareil de déplacement de lentille, module de caméra et dispositif optique comprenant celui-ci |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738011A (ja) * | 1993-06-29 | 1995-02-07 | Hitachi Ltd | 半導体集積回路装置 |
JP2000091489A (ja) * | 1998-09-15 | 2000-03-31 | Anam Semiconductor Inc | 半導体パッケ―ジ用リ―ドフレ―ム及び、これを用いた半導体パッケ―ジ |
EP1187208A2 (fr) * | 2000-08-30 | 2002-03-13 | Hitachi, Ltd. | Dispositif semi-conducteur |
US20020050380A1 (en) * | 2000-06-30 | 2002-05-02 | International Business Machines Corporation | Electronic package with plurality of solder-applied areas providing heat transfer |
-
2003
- 2003-02-14 WO PCT/JP2003/001526 patent/WO2004073063A1/fr active Application Filing
- 2003-02-14 JP JP2004568182A patent/JP4137059B2/ja not_active Expired - Fee Related
- 2003-06-11 TW TW092115874A patent/TW200428614A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738011A (ja) * | 1993-06-29 | 1995-02-07 | Hitachi Ltd | 半導体集積回路装置 |
JP2000091489A (ja) * | 1998-09-15 | 2000-03-31 | Anam Semiconductor Inc | 半導体パッケ―ジ用リ―ドフレ―ム及び、これを用いた半導体パッケ―ジ |
US20020050380A1 (en) * | 2000-06-30 | 2002-05-02 | International Business Machines Corporation | Electronic package with plurality of solder-applied areas providing heat transfer |
EP1187208A2 (fr) * | 2000-08-30 | 2002-03-13 | Hitachi, Ltd. | Dispositif semi-conducteur |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059885A (ja) * | 2005-07-22 | 2007-03-08 | Marvell World Trade Ltd | 高速集積回路用のパッケージング |
US7884451B2 (en) | 2005-07-22 | 2011-02-08 | Marvell World Trade Ltd. | Packaging for high speed integrated circuits |
EP1827062A3 (fr) * | 2006-02-27 | 2008-08-20 | Denso Corporation | Dispositif électronique |
KR101495823B1 (ko) | 2007-11-26 | 2015-02-25 | 각고호우징 게이오기주크 | 전자회로 |
EP2450951A1 (fr) * | 2010-11-08 | 2012-05-09 | Samsung Electronics Co., Ltd. | Boîtier plat quadruple doté d'une pale exposée |
JP2016174094A (ja) * | 2015-03-17 | 2016-09-29 | 住友電工デバイス・イノベーション株式会社 | 半導体組立体 |
Also Published As
Publication number | Publication date |
---|---|
TWI292208B (fr) | 2008-01-01 |
JPWO2004073063A1 (ja) | 2006-06-01 |
TW200428614A (en) | 2004-12-16 |
JP4137059B2 (ja) | 2008-08-20 |
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