WO2004059358A1 - Dispositif optique et procede de fabrication correspondant - Google Patents

Dispositif optique et procede de fabrication correspondant Download PDF

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Publication number
WO2004059358A1
WO2004059358A1 PCT/KR2002/002484 KR0202484W WO2004059358A1 WO 2004059358 A1 WO2004059358 A1 WO 2004059358A1 KR 0202484 W KR0202484 W KR 0202484W WO 2004059358 A1 WO2004059358 A1 WO 2004059358A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
optical
silicon layer
optical fiber
grooves
Prior art date
Application number
PCT/KR2002/002484
Other languages
English (en)
Inventor
Younil Ko
Sangmo Shin
Sangheum Park
Original Assignee
Microsolutions, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsolutions, Inc. filed Critical Microsolutions, Inc.
Priority to AU2002360220A priority Critical patent/AU2002360220A1/en
Priority to PCT/KR2002/002484 priority patent/WO2004059358A1/fr
Publication of WO2004059358A1 publication Critical patent/WO2004059358A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps

Definitions

  • the present invention relates to an optical device used in an optical communication system and a method for fabricating the same.
  • an optical device connected to optical fibers including optical components such as optical active/passive devices including LD (laser diode) , PD (photodiode) , a filter, a lens, etc. or components using an optical waveguide for fabricating an integrated device are used in an optical communication system.
  • optical components such as optical active/passive devices including LD (laser diode) , PD (photodiode) , a filter, a lens, etc. or components using an optical waveguide for fabricating an integrated device are used in an optical communication system.
  • the optical signals can be smoothly transmitted only when the center of the optical fibers and that of the optical devices are accurately identical to each other.
  • FIG. 1 illustrates a method for connecting an optical waveguide device and an input/output optical fiber block in the related art.
  • the optical waveguide device and the input/output optical fiber block are first fabricated, respectively.
  • the optical fiber block usually has grooves of a V shape, a U shape or a shape for fixing the optical fibers.
  • the optical fibers are then mounted in the grooves .
  • an input optical fiber block to which one optical fiber is fixed is brought into contact with an input face of the optical waveguide device.
  • the alignment device finely moves the input optical fiber block and matches the core center of the input optical waveguide with that of the input optical fiber when the intensity of light outputted from the input optical fiber through the input optical waveguide of the optical waveguide device is maximized.
  • an output optical fiber block to which at least one output optical fiber is fixed is brought into contact with an output face of the optical waveguide device.
  • the alignment device finely moves the output optical fiber block and matches the core center of the output optical waveguide in the optical waveguide device with that of the output optical fiber when the intensity of light outputted from the input optical fiber through at least one output optical fibers is maximized.
  • the input optical fiber and the input optical waveguide, and the output optical waveguide and the output optical fiber are connected to one another using epoxy, a laser, an adhesive, etc.
  • an optical waveguide device and an input/output optical fiber block that are currently being produced are each fabricated and diced in a batch process on different silicon wafers.
  • lots of devices and blocks are fabricated at a time.
  • the optical waveguide and the optical fiber core can be simply connected to each other within a short time without an expensive precise alignment device.
  • An optical device having an optical fiber block integrated therein requires lots of mask processes and etch processes in its fabrication process.
  • an optical device connected to optical fibers including optical components such as optical active/passive devices including a LD (laser diode) , a PD (photodiode) , a filter, a lens, etc.
  • optical active/passive devices including a LD (laser diode) , a PD (photodiode) , a filter, a lens, etc.
  • an input/output optical fiber block are fabricated on a single SOI (silicon on insulator) substrate, in such a manner that a portion of an upper silicon layer is etched using the properties of the SOI substrate to thereby simply and accurately form optical mounting grooves, and if an optical waveguide device is formed, a portion of the upper silicon layer is etched and a low clad layer is then formed to connect the optical fibers and the optical waveguide, to thereby simply and accurately each other without an expensive alignment device due to reduced error- causing factors.
  • SOI silicon on insulator
  • an optical device includes: a first optical fiber block, wherein the first optical fiber block includes a first sub substrate fabricated using a substrate having a lower silicon layer, an intermediate insulating film and an upper silicon layer, and at least one first optical fiber mounted on the first sub substrate; a second optical fiber block, wherein the second optical fiber block includes a second sub substrate fabricated using the same substrate as the first optical fiber block and at least one second optical fiber mounted on the second sub substrate; and an optical device block including a third sub substrate fabricated using the same substrate as the first and second optical fiber blocks, wherein the optical device block is connected to the first and second optical fiber blocks, wherein the first and second sub substrates of the first and second optical fiber blocks have first and second grooves for mounting the first optical fibers and the second optical fibers thereon, respectively, and the first and second grooves are each formed by removing the upper silicon layer of the first and second sub substrates.
  • the first and second grooves may be each formed by removing the intermediate insulating film of the first and second sub substrates together with the upper silicon layer of the first and second sub substrates and may have a U shape. It is preferred that the first and second optical fibers are fixed so that both edges and bottom of its cross section are brought into contact with the inner sides of the first and second grooves having the U shape.
  • the optical device block may be an optical waveguide block having at least one optical waveguide.
  • the first and second optical fiber blocks are connected to both sides of the optical waveguide block, respectively, so that an optical axis of the optical waveguide block and that of the optical fiber blocks are identical to each other.
  • the optical waveguide block comprises a lower clad layer formed on the third sub substrate, wherein the sum of a thickness of the lower silicon layer, the intermediate insulating film and the upper silicon layer in the third sub substrate is substantially the same as that of a thickness of the lower silicon layer, the intermediate insulating film and the upper silicon layer in the first and second sub substrates.
  • the lower clad layer is formed at a portion where a portion of the upper silicon layer of the third sub substrate is removed and the upper silicon layer is removed substantially in the same thickness as the removed upper silicon layer.
  • the optical device block comprises one of passive devices having a 3D structure shape including a flat type optical device formed using a Si0 2 or polymer material, a LD, a PD, and a filter, a lens and a mirror which are fabricated by micromachining.
  • An optical device includes: a first optical fiber block, wherein the first optical fiber block includes a first sub substrate fabricated using a substrate having a lower silicon layer, an intermediate insulating film and an upper silicon layer, and at least one first optical fiber mounted on the first sub substrate; a second optical fiber block, wherein the second optical fiber block includes a second sub substrate fabricated using the same substrate as the first optical fiber block and at least one second optical fiber mounted on the second sub substrate; and an optical waveguide block, wherein the optical waveguide block has a third sub substrate fabricated using the same substrate as the first and second optical fiber blocks, a lower clad layer formed on the third sub substrate, and optical waveguides formed on the lower clad layer, wherein the sum of a thickness of the lower silicon layer, the intermediate insulating film, the upper silicon layer and the lower clad layer in the third sub substrate is substantially the same as that of a thickness of the lower silicon layer, the intermediate insulating film and the upper silicon layer in the first and second sub substrates.
  • the lower clad layer may be formed at a portion remained after removing a portion of the upper silicon layer of the third sub substrate substantially in the same thickness as the removed upper silicon layer portion.
  • the first and second optical fiber blocks are each connected to both sides of the optical waveguide block so that an optical axis of the optical waveguide block and that of the optical fiber blocks are identical to each other. It is preferred that the first and second sub substrates of the first and second optical fiber blocks have first and second grooves for mounting the first and second optical fibers thereon, respectively, and the first and second grooves are each formed by removing the upper silicon layer or the upper silicon layer and the intermediate insulating film of the first and second sub substrates .
  • a method for fabricating an optical device includes the steps of: preparing a s ⁇ bstrate having a lower silicon layer, an intermediate insulating film and an upper silicon layer, wherein the substrate includes first, second and third regions; removing the upper silicon layer in a predetermined region of the first and second regions in the substrate to form at least one first and second grooves; forming the at least one first device in a third region of the substrate; and arranging optical fibers in the first and second groove, respectively.
  • the first device comprises one of passive devices having a 3D structure shape including a flat type optical device using a Si0 2 or polymer material, LD, PD, and a filter, a lens and a mirror which are fabricated by micromachining.
  • the intermediate insulating film in a predetermined region of the substrate can be removed together with the upper silicon layer in the predetermined region of the first and second regions in the substrate.
  • a method for fabricating an optical device includes the steps of: preparing a substrate having a lower silicon layer, an intermediate insulating film and an upper silicon layer, wherein the substrate includes first, second and third regions; removing a portion of the upper silicon layer in the third region of the substrate; forming a lower clad layer on the entire surface of the substrate; removing a portion of the lower clad layer so that the upper silicon layer in the first and second regions of the substrate is exposed; forming at least one optical waveguide on the lower clad layer; forming at least one first and second grooves in the first and second regions of the substrate, respectively; and arranging optical fibers in the first and second grooves, respectively.
  • the first and second grooves may be formed by removing the upper silicon layer in a predetermined region of the first and second regions of the substrate or by removing the intermediate insulating film together with the upper silicon layer.
  • a method for fabricating an optical device includes the steps of: preparing a substrate having a lower silicon layer, an intermediate insulating film and an upper silicon layer, wherein the substrate includes first, second and third regions; removing a portion of the upper silicon layer in the third region of the substrate; forming a lower clad layer on the entire surface of the substrate; removing a portion of the lower clad layer so that the upper silicon layer in the first and second regions of the substrate is exposed; forming a core layer on the entire surface of the substrate; patterning the core layer to form at least one optical waveguide in the third region and form first and second grooves in the first and second regions, respectively; and etching the upper silicon layer in the first and second regions using the first and second groove formation patterns, thus forming the first and second grooves .
  • the step of forming the first and second grooves further comprising the steps of: forming an upper clad layer on the entire surface of the substrate; and removing the upper clay layer and the first and second groove formation patterns in the first and second regions.
  • the intermediate insulating film of the first and second regions may be also removed together.
  • the step of removing the upper clad layer and the first and second groove formation patterns may further include the steps of: dicing the substrate so that the first, second and third regions of the substrate are each separated, thus forming a first sub substrate having the first region, a second sub substrate having the second region and a third sub substrate having the third region; arranging the optical fibers in the first and second grooves, respectively; lapping and polishing both sides of the third sub substrate and one side of the first and second sub substrates; and aligning and connecting the first and second sub substrates to both sides of the third sub substrate so that the lapped and polished sides face one another.
  • FIG. 1 illustrates a method for connecting an optical waveguide device and an input/output optical fiber block in the related art
  • FIG 2 to FIG. 10 are process perspective views for explaining a method for fabricating an optical device according to an embodiment of the present invention
  • FIG. 11 is a cross-sectional view illustrating a state where optical- fibers and an optical waveguide are connected in an optical device.
  • an optical device connected to optical fibers such as a passive device of a 3D structure shape including a flat type optical device using a Si0 2 or polymer material, a LD
  • optical waveguide device (laser diode) , a PD (photodiode) , a filter, a lens and a mirror which are fabricated by micromachining, and an input/output optical fiber block are fabricated on a single SOI (silicon on insulator) substrate. It is thus possible to form grooves for mounting optical fibers simply and accurately and to connect the optical waveguide and the optical fibers easily and accurately without an alignment device.
  • SOI silicon on insulator
  • FIG. 10 is a process perspective view of the optical device.
  • FIG. 11 is a cross-sectional view illustrating a state where the optical fibers and the optical waveguide are connected in the optical device.
  • a portion in the left side of the center line indicates a cross section cut laterally to the optical fiber and a portion in the right side of the center line indicates a cross section at a portion where the optical fiber and the optical waveguide are connected.
  • the optical fiber of the present invention is classified into first, second and third regions.
  • the first and second regions are optical fiber blocks in which optical fibers 510, 520 and 530 are mounted and the third region is an optical waveguide block in which an optical waveguide 310 (see FIG. 11) is formed.
  • Each of the first, second and third regions is composed of a SOI substrate 100.
  • the SOI substrate 100 includes a lower silicon layer 110, an intermediate insulating film 120 and an upper silicon layer 130.
  • the optical fiber block in which the optical fibers 510, 520 and 530 are mounted has grooves for mounting the optical fibers 510, 520 and 530.
  • the grooves for mounting the optical fibers have a U shape and have a shape from which the intermediate insulating film 120 and the upper silicon layer 130 of the SOI substrate 100 are removed.
  • the optical waveguide block having optical waveguides formed therein includes a lower clad layer 200 and an upper clad layer 400 with an optical waveguide 310 intervened between them.
  • the lower clad layer 200 and the upper clad layer 400 surround the optical waveguide 310.
  • the clad layers 200 and 400 serve to allow light to be transferred well through the optical waveguide 310 so that light is totally reflected on a boundary between the optical waveguide 310 and the lower and upper clad layers 200 and 400. Therefore, the lower clad layer 200 and the upper clad layer 400 are formed using a material having a refractive index lower than the optical waveguide 310.
  • the top of the substrate 100 in the optical fiber block i.e., the height of the upper silicon layer 130 and the height of the lower clad layer 200 in the optical waveguide block are formed to be substantially the same. That is, the optical waveguide 310 is formed at the same height as the height of the substrate in the optical fiber block in which the optical fibers 510, 520 and 530 are mounted. Furthermore, the optical fibers 510, 520 and 530 are aligned so that their optical axes are identical to each other.
  • a SOI substrate is used as a substrate becoming the basis for fabricating the optical device. After a silicon layer is etched by a predetermined thickness, a lower clad layer is formed. If grooves for mounting optical fibers are formed, an intermediate oxide film of the SOI substrate is used as an etch stopper.
  • the SOI substrate 100 having a third region where an optical waveguide will be formed and first and second regions where optical fibers will be arranged is prepared.
  • the SOI substrate 100 includes a lower silicon layer 110, an intermediate insulating film 120 formed using an oxide film such as Si0 2 , and an upper silicon layer 130.
  • the upper silicon layer 130 in the third region of the substrate 100 is experienced by wet or dry etch by a predetermined depth.
  • the etch depth of the upper silicon layer 130 is determined depending on a thickness of a lower clad layer to be formed at the etched portion, usually about several to tens of ⁇ m.
  • An oxide film (Si0 2 ) that will form the lower clad layer is formed on the entire surface of the substrate 100, as shown in FIG. 3.
  • a chemical mechanical polishing (CMP) process is then implemented so that the silicon layer 130 on the first and second regions is exposed.
  • CMP chemical mechanical polishing
  • the lower clad layer 200 having the same height as the silicon layer 130 in the first and second regions is formed in the third region of the substrate 100, as shown in FIG. 4.
  • the lower clad layer 200 is formed so that it has a refractive index lower than a core layer to be formed later, as described above.
  • light totally reflects from a boundary between the lower clad layer 200 and the core layer, so that light well passes through the optical waveguide.
  • the core layer for forming a core pattern is formed on the entire surface of the substrate 100, as shown in FIG. 4.
  • the core layer may be formed using an oxide film such as Si0 2 and may be about several to tens of ⁇ m in thickness.
  • a metal layer (not shown) for patterning the core layer is formed.
  • the metal layer is patterned by means of a photolithography process.
  • the core layer is patterned using the patterned metal layer as a mask.
  • the formed pattern includes patterns 320 and 330 for forming first and second grooves for mounting the optical fibers thereon, which will be formed in the first and second regions of the substrate 100 in addition to the core pattern 310, as shown in FIG.5.
  • FIG. 5 shows a state where the metal layer is removed after the core layer is patterned using the metal layer as a mask.
  • the core pattern 310 formed in the third region of the substrate 100 becomes an optical waveguide for transferring light incident from the input optical fiber to the output optical fiber.
  • the optical waveguide may be formed in a variety of patterns.
  • the method of the present invention wherein the optical fibers can be stably mounted is very advantageous.
  • the upper silicon layer 130 of the substrate 100 is experienced by a dry etch using the optical fiber mounting groove formation patterns 320 and 330 formed together with the core pattern 310 as a mask, thus forming first and second grooves for mounting the optical fibers thereon.
  • the reason why the dry etch is possible is that the selective ratio between silicon oxide (Si0 2 ) forming the core layer and the upper silicon layer is good.
  • the intermediate insulating film 120 of the SOI substrate 100 can be used as the etch stopper when the upper silicon layer 130 is etched. Thus, etch can be performed uniformly.
  • FIG. 6 shows a state after the upper silicon layer 130 is etched. From FIG. 6, it can be seen that a ⁇ shaped groove is formed as the upper silicon layer 130 is dry-etched.
  • a silicon oxide film 400 used as the upper clad layer is formed on the entire surface of the substrate as shown in FIG. 6.
  • the upper clad layer 400 in the first and second regions of the substrate 100 is removed by means of a photolithography process.
  • the core layer formed on the upper silicon layer 130 in the first and second regions of the substrate 100, which is formed together with the core pattern 310 used as the optical waveguide, is also removed.
  • the intermediate insulating film 120 below the portion where the first and second grooves for mounting the optical fibers in the first and second regions of the substrate 100 are formed may be also removed.
  • a thickness of the upper silicon layer 130 is determined based on a depth of the grooves, it is preferred that the thickness of the upper silicon layer 130 is determined considering the removal of the intermediate insulating film 120, which is performed in the step shown in FIG. 8.
  • the portion where the optical waveguide 310 and the optical fiber block are connected is half-cut by means of a dry and wet etch, a dicing saw, a laser and/or a combination thereof, micromachining, etc., so that third and fourth grooves are formed.
  • the reason why the third and fourth grooves are formed is that the center of the optical waveguide and the center of the optical fibers can be smoothly aligned.
  • FIG. 10 shows a cross section of the optical device illustrating that the optical fibers 510 and the optical waveguide 310 are aligned in the optical device as shown in FIG. 10.
  • the optical fibers 510 are mounted and connected so that the center of the optical fibers 510 and that of the optical waveguide 310 are identical to each other.
  • the lower clad layer 200 that is CMP-processed is formed on the substrate 100 so that the height of the optical waveguide 310 is the same as that of the substrate 100.
  • a cause that may cause error in the height of the optical fibers 510 is only error in the optical fibers themselves and error in a thickness of the core layer 310 forming the optical waveguide. That is, since error of the lower clad layer 200 is reduced, the optical fibers 510 can be aligned easily and accurately.
  • optical fibers can be fixed to the grooves very stably since the three portions of the optical fibers
  • an optical waveguide has been described as an example in the embodiment of the present invention
  • the spirit of the present invention can also be equally applied to a passive device of a 3D structure shape such as a flat type optical device using a Si0 2 or polymer material, a LD, a PD, and a filter, a lens and a mirror which are fabricated by micromachining, as described above.
  • an optical waveguide and optical fibers can be accurately connected through a simple process without an expensive alignment device. Therefore, a manufacturing process time and a process cost can be significantly reduced. It is also possible to increase reliability of the process due to reduced error-causing factors.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne un dispositif à guide d'onde et des modules à fibres optiques d'entrée/sortie formés au moyen d'un même substrat SOI (silicium sur isolant) afin de permettre leur alignement aisé et précis sans dispositif d'alignement coûteux. La couche isolante du substrat SOI peut consister en un dispositif d'arrêt de gravure afin de réaliser des rainures en forme de U permettant d'installer des fibres optiques, la couche principale pour le guide d'onde étant formée à partir d'une partie du substrat permettant de mettre tous les éléments à la même hauteur.
PCT/KR2002/002484 2002-12-30 2002-12-30 Dispositif optique et procede de fabrication correspondant WO2004059358A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002360220A AU2002360220A1 (en) 2002-12-30 2002-12-30 Optical device and method for fabricating the same
PCT/KR2002/002484 WO2004059358A1 (fr) 2002-12-30 2002-12-30 Dispositif optique et procede de fabrication correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2002/002484 WO2004059358A1 (fr) 2002-12-30 2002-12-30 Dispositif optique et procede de fabrication correspondant

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WO2004059358A1 true WO2004059358A1 (fr) 2004-07-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1635203A1 (fr) * 2004-09-10 2006-03-15 Kloe S.A. Procédé de couplage entre une fibre optique et un guide d'onde

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202505A (en) * 1981-06-06 1982-12-11 Nippon Sheet Glass Co Ltd Production of optical circuit
JPH0293406A (ja) * 1988-09-29 1990-04-04 Nec Corp アレイ光ファイバ端末
JPH02149805A (ja) * 1988-11-30 1990-06-08 Furukawa Electric Co Ltd:The 光ファイバと光導波路の結合方法
JPH02254404A (ja) * 1989-03-28 1990-10-15 Konica Corp ハイブリット集積回路の基板
US5197109A (en) * 1991-04-15 1993-03-23 Ngk Insulators, Ltd. Method of manufacturing assembly of optical waveguide substrate and optical fiber aligning substrate
US5305412A (en) * 1992-12-14 1994-04-19 Xerox Corporation Semiconductor diode optical switching arrays utilizing low-loss, passive waveguides
JPH0850218A (ja) * 1994-08-05 1996-02-20 Hitachi Cable Ltd 導波路型光モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202505A (en) * 1981-06-06 1982-12-11 Nippon Sheet Glass Co Ltd Production of optical circuit
JPH0293406A (ja) * 1988-09-29 1990-04-04 Nec Corp アレイ光ファイバ端末
JPH02149805A (ja) * 1988-11-30 1990-06-08 Furukawa Electric Co Ltd:The 光ファイバと光導波路の結合方法
JPH02254404A (ja) * 1989-03-28 1990-10-15 Konica Corp ハイブリット集積回路の基板
US5197109A (en) * 1991-04-15 1993-03-23 Ngk Insulators, Ltd. Method of manufacturing assembly of optical waveguide substrate and optical fiber aligning substrate
US5305412A (en) * 1992-12-14 1994-04-19 Xerox Corporation Semiconductor diode optical switching arrays utilizing low-loss, passive waveguides
JPH0850218A (ja) * 1994-08-05 1996-02-20 Hitachi Cable Ltd 導波路型光モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1635203A1 (fr) * 2004-09-10 2006-03-15 Kloe S.A. Procédé de couplage entre une fibre optique et un guide d'onde
FR2875306A1 (fr) * 2004-09-10 2006-03-17 Kloe S A Sa Procede de couplage entre une fibre optique et un guide d'onde

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