WO2004047017A1

WO2004047017A1 - Ic tag

Info

Publication number: WO2004047017A1
Application number: PCT/JP2003/014827
Authority: WO
Inventors: Taiga Matsushita; Masateru Yamakage; Yasukazu Nakata
Original assignee: Lintec Corporation
Priority date: 2002-11-21
Filing date: 2003-11-20
Publication date: 2004-06-03
Also published as: US20060139174A1; DE60332551D1; EP1564678A1; KR100973877B1; EP1564678B1; KR20050086663A; TW200416614A; US7294917B2; TWI338863B; EP1564678A4

Abstract

A first adhesive layer is formed on a base sheet. On the first adhesive layer, an electronic circuit having a circuit line and a bypath line, and/or an electronic circuit having a planar projection extended, and an IC chip connected to the electronic circuit are fabricated. The angle formed by the tangent of the bypath line at the connection between the bypath line and the circuit line and the tangent of the circuit line at the connection is 10 degrees or greater. A second adhesive layer covers the electronic circuit and IC chip. A releasing agent layer is partly formed at the interface between the base sheet and the first adhesive layer which the interface is the circuit surface where the electronic circuit and the IC chip are provided. Thus, an IC tag is produced.

Description

Specification

Technical field of IC tag

The present invention breaks the built-in electronic circuit when peeled off after attaching to an article

Regarding IC tag. Background art

In recent years, goods have been managed by attaching IC tags to goods such as goods, stored goods, and luggage. For example, an IC tag that records information such as manufacturing conditions, purchasing status, price information, and usage status is attached to products, and interrogators are used as necessary.

(Interrogator) is used to check and manage recorded information. However, when the adhesive used for the IC tag attached to an article has insufficient adhesive strength, it may be replaced with another article for some reason such as error or carelessness. In addition, there are cases where it is intentionally replaced with another article.

In such a situation, it is no longer possible to accurately manage goods. As a conventional IC tag, a technology has been described in which, when a base material bonded to the tag surface is tampered with, the surface base material is destructed in the layer to enhance the effect of preventing forgery (Japanese Patent Laid-Open No. 10-1). No. 7,196,2).

However, when a cut is made with a cutter or the like at the interface between the adhesive layer of the IC tag attached to the article and the article, a finger or the like is inserted into the cut, the end of the IC tag is picked, and the IC tag is peeled off. There is a problem that the electronic circuit surface and the surface substrate can be easily peeled off without breaking. Disclosure of the invention

As a method of solving the above problems, it is required that the function of the IC tag be impaired if it is put on another article, and that the article be managed accurately. The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, The circuit line has a detour on the surface of the first adhesive layer, and the angle between the tangent of the detour and the tangent of the circuit line at the connection point of the detour and the circuit line is changed. An electronic circuit having an angle of 10 degrees or more and an IC chip connected to the electronic circuit are provided, a second adhesive layer covering them is laminated, and an interface between the base material sheet and the first adhesive layer is further provided. By providing a release agent layer partially at a position corresponding to a circuit surface formed by the electronic circuit and the IC chip, a first adhesive layer is laminated on the surface of the base sheet, and the first adhesive layer is laminated. A structure in which an electronic circuit having planar protrusions extending on the surface of an adhesive layer and a chip connecting to the electronic circuit are provided, and a second adhesive layer covering the electronic circuit and the IC chip is laminated. And an interface between the substrate sheet and the first adhesive layer, which is formed by an electronic circuit and an IC chip. It has been found that the above problems can be solved by partially providing a release agent layer at a position corresponding to the circuit surface, and the present invention has been completed. That is, according to the present invention, a first adhesive layer is laminated on a surface of a base sheet, and a circuit line has a detour on a surface of the first adhesive layer, and the connection between the detour and the circuit line is performed. An electronic circuit having an angle between the tangent of the detour at the point and the tangent of the circuit line of 10 degrees or more and an IC chip connected to the electronic circuit, and a second contact covering the electronic circuit and the IC chip. It has a structure in which an adhesive layer is laminated, and is partially located at the interface between the base sheet and the first adhesive layer, which corresponds to the circuit surface formed by the electronic circuit and the IC chip. And a release agent layer is provided on the IC chip. Further, the present invention provides the above-described IC tag, wherein at least one detour is provided in the circuit surface at a position where a release agent layer is provided.

Further, the present invention provides the above-mentioned IC tag, wherein the planar protrusion is extended and connected to the detour.

Further, the present invention provides an electronic circuit in which a first adhesive layer is laminated on a surface of a base sheet, and a planar projection is extended on a surface of the first adhesive layer, and a connection to the electronic circuit. Do

An IC chip is provided, and a second adhesive layer covering the electronic circuit and the IC chip is laminated; and an interface between the base material sheet and the first adhesive layer, wherein the electronic circuit And an IC tag characterized in that a release agent layer is partially provided at a position corresponding to a circuit surface formed by an IC chip. Further, the present invention provides an electronic circuit in which a first adhesive layer is laminated on a surface of a base sheet, and a planar projection is extended on a surface of the first adhesive layer, and a connection to the electronic circuit. The chip has a structure in which a C chip is provided, and a second adhesive layer covering the electronic circuit and the IC chip is laminated, and furthermore, an interface between the base material sheet and the first adhesive layer, It is an object of the present invention to provide an IC tag characterized in that release agent layers are provided at positions corresponding to both ends of a circuit surface formed by a slave circuit and an IC chip.

Further, the present invention provides the IC tag according to the above IC tag, wherein at least one planar protrusion is provided in the circuit surface at a position where the release agent layer is provided. .

Further, the present invention provides the above-described IC tag, wherein the planar protrusion has an area determined by the following equation.

(Where S is the area of the planar protrusion, and W is the line width of the circuit line adjacent to the planar protrusion.)

Further, the present invention provides the above IC tag, wherein the release agent layer is provided so as to cover 20 to 90% of the area surrounded by the outer periphery of the circuit surface via the first adhesive layer. It offers IC evenings.

Further, the present invention provides an IC tag in which the release sheet is laminated on the surface of the second adhesive layer in the above-described IC tag.

When the IC tag of the present invention is peeled off after being attached to an article, the built-in electronic circuit can be surely damaged. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic sectional view of an example of the IC tag of the present invention.

FIG. 2 is a perspective plan view showing an electronic circuit as an example of the IC tag of the present invention. FIG. 3 is a perspective plan view showing another example of an electronic circuit of the IC tag of the present invention. FIG. 4 is a schematic sectional view of an example after the IC tag of the present invention has been peeled off. FIG. 5 is a plan view showing an example of the shapes of circuit lines and detours in the IC tag of the present invention.

FIG. 6 is a perspective plan view showing another example of an electronic circuit of the IC tag of the present invention. FIG. 7 is a schematic perspective sectional view of an example of the IC tag of the present invention.

FIG. 8 is a perspective plan view showing an electronic circuit as an example of the IC tag of the present invention. FIG. 9 is a perspective plan view showing another example of an electronic circuit of the IC tag of the present invention. FIG. 10 is a schematic perspective sectional view of an example after the IC tag of the present invention is peeled off.

FIG. 11 is a plan view showing an example of the shape of a planar projection extending to a circuit line in the IC tag of the present invention.

In the figure, 1 indicates a substrate sheet, 2 indicates a first adhesive layer, 3 indicates an electronic circuit, 4 indicates a circuit line, 5 indicates a second adhesive layer, and 6 indicates a second adhesive layer. 7 indicates an IC chip, 7 indicates a release agent layer, 8 indicates a detour, 9 indicates a planar protrusion, 10 indicates a bonding line, 11 indicates a release sheet, and 1 2 indicates an article. , 13 indicates a circuit surface, 14 indicates a connection point between the circuit line and the detour, 15 indicates a tangent of the detour at the connection point between the circuit line and the detour, and 16 indicates a circuit line. The tangent of the circuit line at the connection point with the detour is shown, and 17 indicates a cut. BEST MODE FOR CARRYING OUT THE INVENTION

The IC tag of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 7 are schematic cross-sectional views of an example of the IC tag of the present invention.

The base sheet 1 is preferably a sheet made of a thermoplastic resin. Examples of thermoplastic resin sheets include polyethylene resins such as high-density polyethylene, medium-density polyethylene, and low-density polyethylene; polypropylene resins such as polypropylene; polymethyl_1-pentene / ethylene / cyclic-olefin copolymer; Polyolefin resins such as ethylene-vinyl acetate copolymer, polyethylene terephthalate, polyethylene naphtholate, polyester resins such as polybutylene terephthalate, polyvinyl chloride resin, polyvinyl alcohol resin, polycarbonate Sheets made of various synthetic resins such as copolymer resins, polyamide resins, polyimide resins, fluororesins, or copolymers containing any of these resins, polymer blends, and polymer alloys can be used. A sheet comprising is preferably used.

The base sheet 1 may be uniaxially stretched or biaxially stretched. The base sheet 1 may be a single layer or a multilayer of two or more layers of the same type or different types. Further, the base sheet 1 is preferably one having water resistance. If it is water-resistant, it will not break even if it gets wet.

The thickness of the substrate sheet 1 is not particularly limited, but may be usually from 10 to 25 Oim, and preferably from 20 to L0zm.

The surface of the base sheet 1 may be surface-treated to increase the adhesive strength between the base sheet 1 and the first adhesive layer 2. Examples of the surface treatment method include corona discharge treatment, chemical treatment, and resin coating.

Examples of the adhesive used for the first adhesive layer 2 include various adhesives such as a hot-melt adhesive, a pressure-sensitive adhesive, and a thermosetting adhesive. Examples of adhesives include natural rubber adhesives, synthetic rubber adhesives, acrylic resin adhesives, polyester resin adhesives, polyvinyl ether resin adhesives, urethane resin adhesives, and silicone resins. And the like.

Specific examples of the synthetic rubber-based adhesive include styrene-butadiene rubber, polyisobutylene rubber, isobutylene-isoprene rubber, isoprene rubber, styrene-isoprene block copolymer, styrene-butadiene block copolymer, styrene-ethylene-butylene block copolymer. Polymers, ethylene vinyl acetate thermoplastic elastomers, and the like.

Specific examples of the acrylic resin-based adhesive include acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, monoethyl hexyl acrylate, methyl methacrylate, ethyl methacrylate, and methacrylic. Homopolymers or copolymers such as acid butyl and acrylonitrile are exemplified. The polyester resin-based adhesive is a copolymer of a polyhydric alcohol and a polybasic acid. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, and vinyldiol. The polybasic acids include terephthalic acid, adipic acid, and maleic acid. Specific examples of the polyvinyl ether resin adhesive include polyvinyl ether, polyvinyl isobutyl ether, and the like. Specific examples of the silicone resin-based adhesive include dimethylpolysiloxane. These adhesives can be used alone or in combination of two or more.

Of these adhesives, polyester resin-based adhesives are preferred.

The first adhesive layer 2 may contain a tackifier, a softener, an anti-aging agent, a filler, and a coloring agent such as a dye or a pigment, if necessary. Examples of the tackifier include a rosin resin, a terpene-6-enol resin, a terpene resin, an aromatic hydrocarbon-modified terpene resin, a petroleum resin, a coumarone'indene resin, a styrene resin, a phenolic resin, and a xylene resin. . Softeners include process oils, liquid rubbers, plasticizers, and the like. Fillers include silica, talc, clay, calcium carbonate, and the like.

The thickness of the first adhesive layer 2 is not particularly limited, but may be usually 1 to 100 μm, and preferably 3 to 50 zm.

In the IC chip of the present invention, the interface between the base sheet 1 and the first adhesive layer 2 is partially located at a position corresponding to the circuit surface 13 formed by the electronic circuit 3 and the IC chip 6. An exfoliating agent layer 7 is provided. Two or more release agent layers 7 are provided at intervals. The shape and size of the release agent layer 7 and the interval between the release agent layers 7 are not particularly limited, and may be various shapes, sizes, and intervals.

For example, as shown in FIGS. 2, 8, and 9, the release agent layer 7 may be provided so as to cover the entire surface at positions corresponding to both ends of the circuit surface 13; As shown in FIG. 3, a release agent layer 7 may be further provided at a position corresponding to an intermediate portion of the circuit surface 13, but a portion not covered by the release agent layer 7 is left. In addition, as shown in FIG. 6, the entire surface at positions corresponding to both ends of the circuit surface 13 may not be covered, and some portions may not be covered. Further, the release agent layer よい may be provided at a position corresponding to an intermediate portion of the circuit surface 13 without being provided at positions corresponding to both ends of the circuit surface 13.

By adopting such a structure, the first adhesive layer 2 is directly laminated on the surface of the base material sheet 1 at the position where the release agent layer 7 is not provided, and at the position where the release agent layer Ί is located. , The first adhesive layer 2 is directly laminated on the release agent layer 7. When the IC tag is peeled off after being attached to the article 12, for example, at the position where the release agent layer 7 is present, the first adhesive layer 2 is peeled off at the interface with the release agent layer 7, and the release agent layer 7 is removed. In the position where it is not, the electronic circuit 3 is cut off at the interface between the article 1 2 and the second adhesive layer 5 or inside the second adhesive layer 5, and the electronic circuit 3 remains adhered to the first adhesive layer 2, The electronic circuit 3 is cut off together with the base sheet 1.

The release agent layer 7 is preferably provided so as to cover 20 to 90% of an area surrounded by the outer periphery of the circuit surface 13 via the first adhesive layer 2, and 40 to 80% is provided. It is particularly preferable to be provided so as to cover.

The release agent layer 7 is preferably provided so as to protrude beyond the outer periphery of the circuit surface 13, and the protruding width is not particularly limited, but is preferably 1 mm or more. The shape of the release agent layer 7 is preferably a triangle, a quadrangle, a pentagon or more polygon, an ellipse, a circle, or the like (see FIGS. 2, 3, and 6). The shapes of the two release agent layers 7 may be the same or different. Preferably, the two release agent layers 7 are completely separated and independent, but may be partially connected.

Examples of the release agent used in the release agent layer 7 include release agents such as a silicone resin, a long-chain alkyl resin, and a fluorine resin.

The thickness of the release agent layer 7 is not particularly limited, but is preferably from 0.01 to 5 μm, and particularly preferably from 0.03 to 1 μm.

In the IC tag of the present invention, the electronic circuit 3 is provided on the surface of the first adhesive layer 2.

The electronic circuit 3 includes a circuit line 4 formed of a conductive material. Examples of the conductive material include a metal simple substance such as a metal foil, a vapor-deposited film, and a thin film formed by sputtering. Gold, silver, nickel, copper, aluminum, etc. can be used as the metal simple substance. Further, as the conductive substance, a conductive paste in which metal particles such as gold, silver, nickel, and copper are dispersed in a binder can be used.

The average particle size of the metal particles is preferably from 1 to 15 μm, and particularly preferably from 2 to 10 μm. Examples of the binder include polyester resin, polyurethane resin, epoxy resin, and phenol resin. The thickness of the circuit line 4 constituting the sub-circuit is not particularly limited, but is 5 to 50 m in the case of metal foil, and 0.01 to 1 in the case of metal film by vapor deposition and sputtering. In the case of a conductive paste, the thickness is preferably 5 to 30 μm.

The width of the circuit line 4 is not particularly limited, but is preferably from 0.1 to 10 mm, particularly preferably from 0.1 to 3 mm.

To form the electronic circuit 3 on the first adhesive layer 2, for example, a metal foil is bonded to the base sheet 1 with an adhesive, and the metal foil is etched to remove portions other than the circuit. And a method of forming the electronic circuit 3. The etching process can be performed by a process similar to a normal etching process. The formation of the electronic circuit 3 on the surface of the first adhesive layer 2 can also be performed by attaching a conductive paste to the shape of the electronic circuit 3 by means of printing, coating, or the like.

Examples of the shape of the electronic circuit 3 include those shown in FIGS. 2 and 3. FIGS. 2 and 3 show that a circuit line 4 composed of a single conductive material line is spaced from the outer periphery of the rectangular base sheet 1 in a doubly annular manner at a predetermined interval. To form an electronic circuit 3 as an antenna. The electronic circuit 3 may be arranged in a doubly annular shape as shown in FIGS. 2 and 3, but may be a single to ninefold annular shape, or may be a ^-or more annular shape. Good.

The circuit line 4 of the electronic circuit 3 has a bypass 8. The circuit line 4 having the detour 8 may be the innermost circuit line 4, the outermost circuit line 4, or any intermediate circuit line 4. . The angle between the tangent 15 of the detour 8 and the tangent 16 of the circuit 4 at the connection point 14 between the detour 8 and the circuit line 4 is described as an angle において in FIG. The angle Θ is 10 degrees or more, preferably 45 degrees or more, and particularly preferably 80 degrees or more. Further, the upper limit of the angle 0 may be less than 180 degrees. With such a structure, as shown in FIG. 4, the portion of the detour 8 where the release agent layer 7 is located remains bonded to the first adhesive layer 2 and the second adhesive layer 5. In this state, the first adhesive layer 2 is peeled off at the interface with the release agent layer 7, and where the release agent layer 7 is not provided, the first adhesive layer 2 is cut off inside the second adhesive layer 5, and the electronic circuit is cut off. 3 is peeled off together with the base sheet 1 while being adhered to the first adhesive layer 2, and the electronic circuit 3 is cut. The shape of the detour 8 is not particularly limited, and a part of the outer line such as a circle and an ellipse is missing. Shape, shape missing one side of triangle outer shape, shape missing one side of square outer shape such as square, rectangle, diamond, trapezoid, etc., shape missing one side of polygonal outer shape of pentagon or more, etc. There are various shapes.

When the detour 8 is provided on the innermost circuit line 4, the size of the detour 8 may be smaller than the empty space surrounded by the electronic circuit. If it is provided on the circuit line 4, it may be smaller than the size of the IC chip. The distance from the furthest part of the detour 8 farthest from the circuit line 4 to the circuit line 4 is preferably 2 mm or more.

The thickness of the detour 8 is not particularly limited, but is the same as the thickness of the electronic circuit, and the preferred range is also the same.

The line width of the detour 8 is not particularly limited, but is preferably from 0.11 to 10 mm, particularly preferably from 0.10 to 3 mm.

The number of the detours 8 is preferably 1 to 10, more preferably 1 to 5. When a plurality of detours 8 are provided, the plurality of detours 8 may be the same or different in shape and / or size.

It is preferable that the circuit wire 4 has a planar protrusion 9 extending therefrom.

The shape of the planar protrusion 9 is preferably a target shape such as a square, a regular hexagon, a regular octagon, a regular decagon, a polygonal shape, a circular shape, or a shape similar thereto.

The area of the planar projection 9 is determined by the following equation: S≥ (2W) ² (where S is the area of the planar projection and W is the line width of the circuit line adjacent to the planar projection). The one having an area determined by the following formula S (4W) ² (where S and W are the same as described above) is particularly preferable.

The upper limit of the area of the planar projection 9 is preferably 10% or less, more preferably 5% or less, and particularly preferably 3% or less, with respect to the area of the empty portion surrounded by the electronic circuit. The thickness of the planar projection 9 is the same as the thickness of the electronic circuit, and the preferred range is also the same.

As shown in FIGS. 3 and 6, the planar projection 9 may be directly extended to the bypass 8 of the circuit line 4 of the electronic circuit 3, or may be planar with the bypass 8 of the circuit line 4. The connecting line 10 may be connected and extended between the protrusions 9. As a result, as shown in FIG. Insert a notch 17 into the interface between the second adhesive layer 5 of the IC tag attached to the article 12 and the article 1 and the article 12 with a force, and insert a finger or the like into the notch 17 to insert the IC tag. When the IC tag is peeled off, the detour 8 or the flat protrusion 9 adheres the first adhesive layer 2 and the second adhesive layer 5 where the release agent layer 7 is located. In the state as it is, the first adhesive layer 2 is peeled off at the interface with the release agent layer 7, and when there is no release agent layer 7, the interface between the article 12 and the second adhesive layer 5 Alternatively, the electronic circuit 3 is cut off inside the second adhesive layer 5, the electronic circuit 3 is peeled off together with the base sheet 1 while being adhered to the first adhesive layer 2, and the electronic circuit 3 is cut.

As shown in FIGS. 8 and 9, the planar projection 9 may be directly extended to the circuit line of the electronic circuit, or a coupling line 10 may be provided between the circuit line and the planar projection 9. May be connected and extended. By doing so, even if the antenna is not cut off at the interface of the release agent layer, some of the planar protrusions are peeled off while being adhered to the base sheet side as shown in FIG. Therefore, the antenna function is destroyed.

The flat protrusion 9 may extend to the circuit wire 4 of the innermost ring of the electronic circuit or may extend to the circuit wire 4 of the outermost ring. Any of the circuit lines 4 on the route 4 may be extended. When the planar protrusion 9 extends to the intermediate circuit line 4, the outer circuit line 4 is formed avoiding the planar protrusion 9.

The number of the planar projections 9 is preferably 1 to 10, and particularly preferably 1 to 5. The material of the detour 8 is the same as the material of the circuit line 4 of the electronic circuit, and is preferably integrated.

The material of the planar projection 9 is such that the planar projection 9 does not peel off from the circuit line 4, the detour 8 or the coupling line 10 of the electronic circuit when the IC ring of the present invention is peeled off. Any material may be used, for example, a conductive material that is a material of the electronic circuit, various resins such as acrylic resin and polyester resin, etc., and the same material as the circuit wire 4 or the coupling wire 10 of the electronic circuit. It is preferable from the viewpoint of production, and an integrated one is particularly preferable.

The material of the bonding wire 10 is such that the bonding wire 10 does not peel off from the detour 8 of the circuit wire 4 and the planar projection 9 of the electronic circuit when the IC tag of the present invention is peeled off. For example, a conductive material that is a material of the electronic circuit may be used, and the same material as the circuit line 4 or the coupling line 10 of the electronic circuit is particularly preferable. There are various methods for extending the detour 8, the planar protrusion 9 and / or the connecting line 10 to the circuit line 4 of the electronic circuit 3, and there are various methods, for example, a detour 8, the planar protrusion 9 from a metal foil. And / or a method of forming an electronic circuit together with the coupling line 10 by etching, a method of forming a detour 8 on the circuit line 4 of the electronic circuit 3 by printing or coating, etc. It is particularly preferable to form the electronic circuit with a resin, together with the planar protrusions 9 and / or the connection lines 10. .

: When the planar projection 9 or the detour 8 is provided, it may be provided in a place where the release agent layer 7 is not provided, but at least one of the planar projection 9 or the detour 8 is peeled off in the circuit plane. It is particularly preferable to provide it at the place where the agent layer 7 is located. In addition, when the planar protrusion 9 is extended in the detour 8, at least one of the detours 8 in which the planar protrusion 9 is extended, at least 人, the surface of the release agent layer 7 in the circuit surface. Preferably, it is provided at a certain place.

: As another embodiment of the IC circuit of the present invention, as shown in FIGS. 9 and 10, an electronic circuit: a planar projection without providing a detour 8 or a coupling line 10 in the circuit line 4 of FIG. 9 can be extended directly to the electronics, circuit 3 © circuit line 4. Also in this case, the planar projection 9 may be provided at a location where the release agent layer 7 is not provided, but at least one of the planar projections 9 is provided at a location where the release agent layer 7 exists in the circuit plane. Is preferred. The number of the planar projections 9 is preferably 1 to: L 0, and particularly preferably 1 to 5. When a plurality of planar projections 9 are provided, the plurality of planar projections 9 may have the same shape and / or size, and may be different from each other, or may be different.

An IC chip 6 is connected to both ends of the electronic circuit 3. The JC chip 6 may be provided inside the electronic circuit 3, may be provided outside the electronic circuit 3, or may be provided above the electronic circuit 3.

In order to connect the terminals of the outermost and innermost electronic circuits 3 to the IC chip 6, the terminals of the outermost or innermost electronic circuits 3 do not short-circuit with the ring heater circuit 3 without jumping over. It is preferable that the drawer (jumper circuit) extend inside or outside the electronic circuit 3 and be connected to the IC chip 6.

The method of forming the jumper circuit is as follows. From the end of the electronic circuit 3, traverse the portion of the ring-shaped electronic circuit 3, mark the insulating ink linearly by screen printing or the like, and conduct the conductive ink on the printed insulating ink. The conductive paste is printed in a line by screen printing or the like, A method of forming the conductive circuit line 4 is exemplified. Examples of the conductive paste include those described above. Examples of the insulating ink include a photo-curable ink such as an ultraviolet curing type ink.

As a method of connecting the IC chip 6 to the end of the electronic circuit 3, there is a method of connecting the IC chip 6 to the surface of the end of the electronic circuit 3 via an anisotropic conductive film by a flip chip bonding method. In the flip chip bonding method, a wire pump is provided on the electrode portion of the IC chip 6, and the surface of the IC chip 6 where the wire bumps are located is pressed on the anisotropic conductive film coated on the terminal surface of the heater circuit 3. This is a method in which wire bumps penetrate into the anisotropic conductive film to make the end of the electronic circuit 3 conductive with the IC chip.

In the IC tag of the present invention, the second adhesive layer .5 is laminated so as to cover the surface of the first adhesive layer 2 where the electronic circuit 3 is not provided, the electronic circuit 3 and the IC chip 6. . '':,.: 'Examples of the adhesive used for the second adhesive layer 5 include various adhesives such as a hot-melt adhesive, a pressure-sensitive adhesive, and a thermosetting adhesive. Examples of the type of the adhesive include: the same as the adhesive used for the first adhesive layer 2 described above. These adhesives can be used alone or in combination of two or more. Among these adhesives, a pressure-sensitive adhesive is preferable, and an acrylic pressure-sensitive adhesive is particularly preferable.

The surface of the second adhesive layer 5 is preferably flat.

Although the thickness of the second adhesive layer 5 is not particularly limited, the thickness is different between a place where the electronic circuit 3 and the T Ci chip 6 are covered and a place where the first adhesive layer 2 is covered. It is usually 10 to 100 / m, preferably 15 to 50 m.

The surface of the second adhesive layer 5 may be covered with a release sheet 11.

Any release sheet may be used as the release sheet 11. For example, films made of various resins such as polyethylene terephthalate, polyethylene terephthalate, polyethylene, polypropylene, ren, and polyarylate, and polyethylene laminate — Paper, polypropylene-laminated paper, clay-coated paper, resin-coated paper, glass paper, and other various paper materials. The surface of this base material that is to be bonded to the second adhesive layer 5 is subjected to a peeling treatment according to necessity: What was done can be used.

Was dried overnight at gravure and applied to a thickness of 5 m to laminate the first adhesive layer 2.

Further, a 3.5-meter-thick copper foil was heat-pressed on the surface of the first adhesive layer 2 with a 100 ° C. heat roll. Next, as shown in Fig. 2, on the surface of the electrolytic copper foil, as shown in Fig. 2, a ten-fold rectangular circuit wire 4 (antenna) having a long side of 45 mm and a short side of 15 mm and the innermost ring The resist ink was printed (line width: 0.15 mm) on the circuit line 4 in the form of a detour 8 by screen printing. This was treated with a ferric chloride solution to remove the portions other than the loop circuit line 4 and the bypass 8. Thereafter, the etching resist ink was removed with an alkaline aqueous solution to form an electronic circuit 3 provided with the same detour 3 as in FIG. Note that the detour 8 and the tangent angle 0 are 5 mm long, 7 'mm wide, and 90 ° at 0 ° for a detour 8 that lacks one long side of the rectangular outer peripheral line. There is a shape that lacks one side of the outer line of the equilateral triangle.Circuit 8 is 7 mm on the negative side, angle 6> is 60 degrees, and a semicircular circular detour.8 is 3 mm in diameter, Angle 6> is 85 degrees, trapezoidal detours without upper base 8 are 10 mm lower base, 3 mm upper base, 5 mm height, 0 angle is 1 4 5 ₆ ^{; In} order to make the end of the electronic circuit (antenna) 3 of the innermost ring and the end of the electronic circuit 3 of the outermost ring conductive, an ultraviolet-curing ink was applied between them by screen printing, After printing in a shape, the resin is cured by irradiating ultraviolet rays, and a silver paste (average particle size of silver particles: 5〃m, binder: polyester resin) is applied to the surface of the curing line of the ultraviolet curable ink. Printed on the linear (length 1 0 mm) by screen printing method and dried to form a jumper circuit. ,

Next, a wire bump is provided on the electrode part of the IC chip (manufactured by Philips, product name "I / CODE") 6 using a gold wire, and this IC chip 6 is attached to an anisotropic conductive film (manufactured by Sony Chemical Co., Ltd.). The circuit was connected to both ends of the circuit using the flip-chip bonding method under the name “FP2322D”).

On the other hand, a 70 m thick glassine paper was peeled off with silicone resin on the entire surface on one side. Using a roll knife coater, the acryl-based low-adhesion pressure-sensitive adhesive (LINTEC Co., Ltd., product name "PA-T 1"). Apply and dry to form a 20〃m-thick second adhesive layer 5 and peel off with second adhesive layer 5 .Sheet 1 1 was prepared. .

Next, the release sheet with the second adhesive layer 5 and the second adhesive layer 5 of 11 were attached to the entire surface of the sheet 1 on which the electronic circuit 3 and the IC chip 6 were provided. The adhesive layer 2, the electronic circuit 3 and the IC chip 6 were covered with the second adhesive layer 5 to prepare an IC chip. ,

A non-contact transmission / reception test was performed on the obtained ισ tag, and transmission / reception was performed normally.

The peeling seed 11 of this IC tag was peeled off, and the IC tag was affixed to a polypropylene plate. Twenty-four hours later, from the end of this IC tag, make a cut in the second adhesive shoulder with a 5 mm ヅ knife from the one end of the IC tag, and cut 17 with this finger and peel off the polypropylene resin plate. Layer 7 Covered electronic circuit S & 3 part is polypropylene Remaining on the resin plate, other non-stripping agent If part is polyethylenetere tere of base sheet 1;., ^: Phthalate layer, polypropylene Peeled from the resin plate. The electronic circuit 3 was cut off due to the separation, and a non-contact transmission / reception test was performed.

When this peeling / cutting test was performed on 30 IC tags, 30 pieces were cut.

: (Example 2) ·, '

The planar projection 9 and the release agent layer 7, except that were formed as FIG. 3, the first _embodiment; in the like to prepare a IC Yugu. The shape of the release agent layer 7 is located at both ends of the circuit surface. The angle of the hypotenuse of the right triangle is 45 degrees, the width of the uncoated portion is 3 mm, the right angle at both ends of the circuit surface is the square and the center of the circuit surface The area enclosed by the outer periphery of the electronic circuit 3 and the IC chip 6 covered by the parallelogram is approximately 70% of the area enclosed by the outer periphery of the electronic circuit. Was 1 mm in outer edge and length. The shape and size of the detour 8 are the same as those in the first embodiment. The size of the planar protrusion 9 is a circle having a diameter of 2 mm, a thickness of 35 μm, and a length of the coupling line 10. Was 0.5 mm, the width was 0.1 mm, and the thickness was 35 m. When a non-contact transmission / reception test was performed on the obtained IC tag, transmission / reception was performed normally. Further, a peeling / cutting test was performed on 30 of the obtained IC tags in the same manner as in Example 1. All were cut.

(Example 3)

In the same manner as in Example 1 except that the planar projection 9 was directly extended to the circuit line 4 without providing the detour 8, and the planar projection 9 and the release agent layer 7 were formed as shown in FIG. I created an IC-tag. The shape of the release agent layer 7 is as follows: the angle of the hypotenuse is 45 degrees, the width of the coated part is 3 mm, and the outer periphery of the electronic circuit 3 is covered by two pentagons. About 60% of the enclosed area, the length between the edge of the pentagon and the outer edge of the base sheet 1 was 1 mm. The size of the planar projection 9 is a circle having a diameter of 2 mm and a square having a side of 2 mm, the thickness is 35 m, the length of the coupling wire 10 is 0, 5 mm, the width is 0.1 mm, and the thickness is 0.1 mm. It was 35 m. A non-contact transmission / reception test was performed on the obtained IC tag, and transmission / reception was performed normally. In addition, a peeling / cutting test was performed on 3.0 rogue IC tags in the same manner as in Example 1. Taro. IC evening 30 pieces were cut.

(Example 4):

On one surface of polyethylene terephthalate 7 film (width 100mm, length 50mm, thickness 50〃m) as the base sheet 1, a shape as shown in Fig. 8 (angle of the trapezoidal oblique line: 45 degrees) The width of the uncoated part: 3 mm, the area enclosed by the outer periphery of the electronic circuit covered by two trapezoids: about 75% of the area enclosed by the outer periphery of the electronic circuit, the end of the trapezoid and the base sheet 1 Dry with a gravure coater to a thickness of 0.05 / m and apply a silicone resin-based release agent to the outer edge (length: lmm) to a thickness of 0.05 / m. Layer 7 was formed. Next, a polyester-based hot-melt adhesive (Toyobo Co., Ltd., product name “Pai-Kin 30S S”) is dried on the surface of the release agent layer 7 and the base material seed 1 all over the gravure cup. To a thickness of 3 m.

Further, an electro-deposited copper foil having a thickness of 35 μm was heat-pressed on the surface of the first adhesive layer 2 with a 100 ° C. heat-sealing roll. Next, on the surface of the electrolytic copper foil, as shown in FIG. 8, a ten-fold annular circuit wire (antenna) having a long side of 45 mm and a short side of 15 mm and a planar projection 9 and The etching resist ink was printed (line width: 0.15 mm) on the bonding lines 10 by screen printing. Chloride this

At this time, the portion of the electronic circuit 3 covered with the release agent layer 7 remains on the polypropylene resin plate, and the other non-release agent layer portion is a polyethylene terephthalate sheet of #sheet 1; It was peeled off from the resin plate or peeled off at the planar projection. : The electronic circuit 3 was cut off due to the separation, and a non-contact transmission / reception test could not be performed (peel-off test).

.... This 0 peeling test was performed on 10 IC tags, and all 10 were cut. ■ '',

(Problem 5)

^: Peripheral protrusion 9 and release agent layer Ί (periphery of electronic circuit covered with two 0-gons ::: area enclosed by: electronic circuit and]: about 75% of area enclosed by outer periphery of C chip ) Was formed as in Example 9 in the same manner as in Example 1 to produce an IC tag. The size of the planar projection 9 was a square with a diameter of 2 mm and a thickness of 35 m. : 'A contactless transmission / reception test was performed on the obtained IC tag, and transmission / reception was successful. When the obtained 10 IC tags were subjected to the peeling / cutting test in the same manner as in Example 1, all of the 10 IC tags were cut.

(Example 6)

An I: C tag was prepared in the same manner as in Example 2, except that the shape of the planar projection 9 was changed as shown in FIG. The size of the planar projection 9 was 2 mm in diameter, and the thickness was 35 mm. When a non-contact transmission / reception test was performed on the obtained IC tag, transmission / reception was normally performed. In addition, a peeling / cutting test was performed on 10 of the obtained IC dougs as in Example 1; however, a peeling / cutting test was performed in the same manner as in Example 1. disconnected.

(Comparative Example 1)

..IC tag was created in the same manner as in Example 1 except that the detour & was not provided. When a non-contact transmission / reception test was performed on the obtained IC tag, transmission / reception was performed normally.

A peeling / cutting test was performed on the 10 IC tags in the same manner as in Example 1.

Of the 1.0 IC tags, 6 could be peeled off without breaking the electronic circuit. Non-contact transmission / reception of IC tags peeled without destroying electronic circuits After conducting the test, transmission / reception was successful.

The IC tag of the present invention can be used as a tag for managing articles such as merchandise, stored goods, and luggage.

Claims

The scope of the claims :

1. A first adhesive layer is laminated on a surface of the sheet, and a circuit line has a detour on a surface of the first adhesive layer, and a detour at a connection point between the detour and the circuit line. An electronic circuit having an angle of a tangent between the tangent line and the circuit line of at least 1.0 degree and an IC chip connected to the electronic circuit are provided, and a second adhesive layer covering the electronic circuit and the IC chip is laminated. In addition, the release agent layer is partially located at the interface between the シ ^ sheet and the first adhesive layer, which corresponds to the circuit surface formed by the electronic circuit and the IC chip. An IC tag characterized by being provided with a tag. :

: 2.: The IC block according to claim 1, wherein the bypass is at least one in the circuit plane at a position where the release layer is provided.

3, Planar protrusion is extended to the detour! ) The IC evening bag according to claim 1 or 2.

An electronic circuit in which a first adhesive layer is laminated on the surface of the base material sheet, and a planar protrusion extends on the surface of the first adhesive layer, and an IC chip connected to the electronic circuit are provided. Having a structure in which a second adhesive layer covering the electron tU path and the IC chip is laminated; and an interface between the substrate seed and the first adhesive layer, An i-σ tag featuring a release agent layer partially at the position corresponding to the circuit surface formed by the circuit and IC chip. ,

5. An electronic circuit in which a first adhesive layer is laminated on the surface of a base material sheet, and a planar projection extends on the surface of the first adhesive layer, and an IC connected to the electronic circuit. A chip is provided, and a second adhesive layer covering the electronic circuit and the IC chip is laminated. Further, at the interface between the base material and the first adhesive layer, An IC tag, wherein release agent layers are provided at positions corresponding to both ends of a circuit surface formed by an electronic circuit and an IC chip.

6. The IC tag according to claim 4, wherein at least one planar protrusion is provided in the circuit surface at a position where the release agent layer is provided.

7. The IC tag according to claim 4, wherein the planar projection has an area determined by the following equation.