KR20110111998A - Rfid inlay, card containing thesame and method for manufacturing thereof - Google Patents

Abstract

The present invention provides an RFID including an antenna layer including a substrate and an antenna, and an IC chip layer connected to the antenna layer and including an IC chip protruding to an upper portion of the antenna layer and a photocurable resin layer covering the protrusion of the IC chip. It's about inlays. The RFID inlay of the present invention can prevent the IC chip or the connection portion of the IC chip and the antenna from being damaged during the manufacturing process or the use process, and has excellent heat resistance but excellent adhesion between the layers and does not exhibit curl phenomenon. The card including the RFID inlay of the present invention is excellent in pressure resistance and heat resistance.

Description

RDF inlays, cards comprising the same, and methods for manufacturing the same {RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF}

The present invention relates to an RFID inlay, a card including the same, and a method of manufacturing the same, which can prevent the IC chip or the connection portion between the IC chip and the antenna from being damaged during the manufacturing process or the use process, and has excellent heat resistance and The present invention relates to an RFID inlay having excellent adhesion and no CURL phenomenon, a card including the same, and a method of manufacturing the same.

Technologies using radio frequency (RF) have been widely applied and used in the field of mobile communication technology, distribution, diagnostics, and security.

In particular, in the case of an RFID (Radio Frequency Identification) device, it is possible to specify and utilize a radio frequency of a specific band that can be individually recognized, and can be used without directly contacting a reader that directly transmits and receives information with an RFID device. In addition, it can be used in various ways in addition to the currently used traffic card in that it is compact enough to be mounted in the card.

In general, RFID amplifies a tag's transmit / receive signal by using a built-in battery, and thus has high signal sensitivity and transmit / receive distance. Passive and built-in batteries that drive functions and integrated circuit chips are used only for driving integrated circuit chips. Transmit and receive functions are classified as semi-active and driven by power generated by the antenna.

Passive RFID is composed of an antenna patterned to transmit and receive a constant frequency in the film-like thin film and IC chip driven by the power generated through the antenna.

The active RFID is amplified by a battery in which the signal received at the antenna is embedded and transferred to the IC chip, and is supplied with sufficient power for signal processing in the IC chip in which the controller, memory and the like are embedded. In addition, the signal processed in the IC chip is amplified, modulated by a specific RF, and delivered to the reader. Therefore, the transmission / reception distance is relatively longer than the passive RFID, and the transmission / reception sensitivity is also good.

Semi-active RFID has the function of maximizing the life of the built-in battery by optimizing the transmission and reception signal processing between the antenna and the reader through the power management module embedded in the IC chip.

Regardless of whether it is passive, active or semi-active, the RFID necessarily includes an antenna and an IC chip, and the antenna and the IC chip are connected by a connection portion. IC chips, which are chip-shaped integrated circuits, are smaller in thickness than thin-film antennas, but are relatively thicker, and the connection between the antenna and the IC chip is weaker in pressure than the antenna or the IC chip itself.

However, in the mobile communication technology field, distribution field, diagnostic field, security field, etc., the RFID is manufactured in the form of a thin card or a small chip. The IC chip itself, or the antenna and the IC chip has a problem that the connection portion is easily broken during the manufacturing process.

An object of the present invention is to prevent damage to the IC chip or the connection portion of the IC chip and the antenna during the manufacturing process or use process, and excellent heat resistance, excellent adhesion between the layers and RFID inlay that does not appear curl (CURL) phenomenon It is to provide a card and a manufacturing method thereof.

In order to achieve the above object, an RFID inlay according to an embodiment of the present invention is an antenna layer including a substrate and an antenna, and the IC chip and the protrusion of the IC chip which is connected to the antenna layer and protrudes above the antenna layer. It includes an IC chip layer comprising a photocurable resin layer covering.

One surface of the photocurable resin layer may cover and protect the protruding portion of the IC chip to cover the entire surface of the antenna layer, and the other surface of the photocurable resin layer may have a flat surface.

The photocurable resin layer may be prepared by coating and photocuring a photocurable resin composition comprising 18 to 80% by weight of a urethane oligomer, 18 to 80% by weight of a monomer and 0.1 to 15% by weight of a photoinitiator.

The monomer may be any one selected from the group consisting of phosphate, amide, hydroxy, aliphatic and combinations thereof.

The RFID inlay may further include a support layer on the photocurable resin layer.

A card according to another embodiment of the present invention includes the RFID inlay.

According to another aspect of the present invention, a method of manufacturing an RFID inlay includes a photocurable resin applying step of applying a photocurable resin composition to an antenna layer provided with an IC chip, and an IC chip coated with the photocurable resin. And a photocuring step of manufacturing the RFID inlay by curing the photocurable resin by irradiating the IC chip layer with light.

The method may further include laminating a support layer between the photocurable resin applying step and the photocuring step, laminating a support layer on top of the photocurable resin of the IC chip to which the photocurable resin prepared in the photocurable resin coating step is applied. .

The photocurable resin coating step and the photocuring step may be made of a roll-to-roll method.

According to another aspect of the present invention, there is provided a method of manufacturing a card including an RFID inlay, wherein the RFID inlay manufactured by the method of manufacturing the RFID inlay is selected from the group consisting of an upper cover, a lower cover, and a combination thereof. It may include a cover layer stacking step of stacking the cover layer.

In the cover layer stacking step, the cover layer may be attached by a sticker method by an adhesive layer formed on a surface where the cover layer and the RFID inlay meet.

Hereinafter, the present invention will be described in more detail with reference to the drawings. Like parts are designated by like reference numerals throughout the specification.

1 and 2 are cross-sectional views of an RFID inlay according to an embodiment of the present invention.

An RFID inlay 10 according to an embodiment of the present invention is essentially included in a product including an RFID. Referring to FIGS. 1 and 2, the RFID inlay 10 according to the present invention will be described. 10 includes an antenna layer 100 and an IC chip layer 200.

The antenna layer 100 includes a substrate 110 and an antenna 130.

The substrate 110 may be any one selected from the group consisting of a film, a fiber, paper, and a combination thereof in the form of a thin film, and when the film is used as the substrate 100, polyethylene terephthalate (PET) ), Polyethylene Naphtalate (PEN), Polyvinyl Chloride (PVC), Polyethylene (Polyethylene, PE), Polyimide (PI), Polypropylene (PP), Polycarbonate (Polycarbonate, PC), polyester, polysulfone, acrylonitrile butadiene styrene (ABS), polystyrene (PS), nylon (Nylon), and combinations thereof However, the present invention is not limited thereto.

Preferably, the substrate 110 is advantageous in that PET, PEN, PI, PC, and PP films have a favorable effect in terms of heat resistance and insulation, and in that it can prevent denaturation due to heat or pressure of the RFID. .

The substrate 110 may be used by subjecting it to a primer.

The antenna 130 may be made of a conductive material and may use any one metal selected from the group consisting of Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Co, Ti, and combinations thereof. . It is advantageous in terms of ease of processing and cost to use any one metal selected from the group consisting of Al, Cu, and combinations thereof as the conductive material of the antenna 130.

The antenna 130 is formed on the substrate 110 using the conductive material. Referring to FIG. 1, the antenna 130 may be formed on one surface of the substrate 110, and referring to FIG. 2, the antenna 130 may be formed on both surfaces of the substrate 110.

The method of forming the antenna 130 may be used without limitation as long as it is a method of forming an antenna of RFID, and specifically, may be formed by sputtering or printing a metal layer formed on the substrate with a specific antenna pattern. The metal layer may be formed by etching.

An adhesive layer (not shown) may be further formed between the substrate 110 and the antenna 130, and the adhesive of the adhesive layer may adhere the substrate 110 to the antenna 130. Can be used without limitation.

The IC chip layer 200 includes an IC chip 210 and a photocurable resin layer 230.

The IC chip 210 may be used without limitation as long as it is an IC chip used in RFID. The IC chip 210 is positioned to be in contact with one surface of the substrate 110 or one surface of the antenna 130 of the antenna layer 100, and thus some or all of the IC chip protrudes above the antenna layer 100.

The IC chip 210 is connected to the antenna 130 by a connection unit (not shown), and the connection unit may be used without limitation as long as it is a method of connecting the IC chip and the antenna in the conventional RFID. The IC chip operates by receiving a signal received from the antenna.

The photocurable resin layer 230 covers the protruding portion and the connecting portion of the IC chip 210, which part or all protrudes from the upper portion of the antenna layer 100, so that the IC chip 210 or the substrate may be damaged by heat or pressure. This prevents the connection from breaking.

Specifically, one surface of the photocurable resin layer 230 covers and protects the protrusion of the IC chip 210 and covers the entire surface of the antenna layer 100. The other side may have a flat surface.

Since the RFID inlay 10 includes the photocurable resin layer 230, it is not necessary to form a protective layer in a thermosetting manner as in the prior art, and thus the IC chip 210 and the high temperature and high pressure may be formed during thermal curing. It is possible to prevent the connection part from being broken, and to prevent this, it is not necessary to provide a separate space for accommodating the IC chip 210 in the resin layer, thereby simplifying the manufacturing process.

3 and 4 are cross-sectional views of an RFID inlay 10 according to an embodiment of the present invention. Referring to FIGS. 3 and 4, the RFID inlay 10 is disposed on the photocurable resin layer 230. The support layer 300 may further include.

The support layer 300 may use any one selected from the group consisting of a film, a fiber, paper, and a combination thereof in a thin film form, and in the case of using the film as the support layer 300, polyethylene terephthalate (PET) ), Polyethylene Naphtalate (PEN), Polyvinyl Chloride (PVC), Polyethylene (Polyethylene, PE), Polyimide (PI), Polypropylene (PP), Polycarbonate (Polycarbonate, PC), polyester, polysulfone, acrylonitrile butadiene styrene (ABS), polystyrene (PS), nylon (Nylon), and combinations thereof It may be, but is not limited thereto.

Preferably, the support layer 300 is advantageous in that the use of PET, PEN, PI, PC, and PP film has an advantageous effect in terms of heat resistance and insulation, and can prevent modification due to heat or pressure of the RFID. .

The support layer 300 may prevent a curl phenomenon (CURL phenomenon) that may occur when the photocurable resin layer 230 is formed on the antenna layer 100. In addition, the support layer 300 may be made of the same material as the base material 110, or may be used of a different material, when using the same material as the base material 110 to more effectively prevent the curl phenomenon Can be.

The photocurable resin layer 230 may be prepared by coating and photocuring the photocurable resin composition.

The photocurable resin composition may be used as long as it can be cured through light irradiation after coating, and is not particularly limited in the present invention.

Preferably, the photocurable resin composition may include a urethane-based oligomer, a monomer and a photoinitiator. The urethane oligomer may be preferably an aliphatic urethane oligomer, and more preferably an aliphatic urethane oligomer having two or more functional groups. When the aliphatic urethane-based oligomer is used, it is possible to reduce the occurrence of curl on the RFID inlay, increase adhesion to the base layer or the support layer, and provide proper flexibility and protection to protect the IC chip having the inside of the RFID inlay. It may have resiliency.

The monomer may be any one selected from the group consisting of phosphate-based, amide-based, hydroxy-based, aliphatic-based and combinations thereof, and the aliphatic-based monomers. May be an aliphatic monomer in which ethyl oxide or propyl oxide is introduced as a functional group or an aliphatic monomer in which aromatic carbon is partially introduced.

The phosphate monomer is phosphate (meth) acrylate (Phosphate (Meth) acrylate), the amide monomer is N, N-dimethyl acrylamide (N, N-Dimethyl acrylamide), As the hydroxy (Hydroxy) monomer, 2-hydroxy ethyl (meth) acrylate (2-Hydroxy ethyl (meth) acrylate, 2-HEMA), as the aliphatic monomer, phenoxy (meth) acrylate ( Phenoxy (Meth) acrylate, Phenoxy Ethyl (Meth) acrylate, Lauryl (Meth) acrylate, Ethylene glycol nonylphenyl ether (meth) acrylate ( Ethyleneglycol Nonylphenyl Ether (Meth) acrylate) and combinations thereof may be any one selected from the group consisting of.

When the phosphate-based monomer and the amide-based monomer are used, the adhesion of the photocurable resin layer may be excellent, and when the aliphatic monomer is used, flexibility and resilience may be reduced while reducing curl. Can be given to a photocurable resin layer.

The photoinitiator can be used a conventional photoinitiator used in the photocurable resin composition, and can be appropriately selected according to the configuration of the light source, monomer and oligomer used at the time of light irradiation.

As the photoinitiator, any one used as the photoinitiator in the photocurable resin may be used. However, in consideration of the light transmittance of the material used as the support layer, it is preferable to select and use an appropriate one.

The photoinitiator is 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (2,4,6-Trimethylbenzoyl-diphenyl-phosphineoxide, TPO), 2-methyl-1 [4- (methylthio) phenyl]- 2-morpholinopropane-1-one (2-Methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one) and any combination thereof may be used, and TPO In the case of using, it is excellent as a photoinitiator in the long wavelength of 350nm or more, it is possible to pass to the deep part even in the thickness of 200nm to 1000nm, it is possible to improve the adhesive force and curing characteristics of the photocurable resin layer.

The photocurable resin composition may further include other additives such as an antioxidant, and the antioxidant may be triethylene glycol-bis-3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propio. Nate (Triethylene glycol-bis-3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate) can be used, in this case there is an effect that can prevent oxidation. The other additives may be included in 0.01 to 3% by weight based on the entire photocurable resin composition.

The photocurable resin composition may include a photocurable resin composition comprising 18 to 80% by weight of a urethane oligomer, 18 to 80% by weight of a monomer, and 0.1 to 15% by weight of a photoinitiator, and preferably 38 to 70% by weight of a urethane oligomer. It may include 18 to 60% by weight of monomer, 0.1 to 6% by weight of photoinitiator, and more preferably 48 to 60% by weight of urethane oligomer, 38 to 50% by weight of monomer and 0.1 to 4% by weight of photoinitiator. . When constituting the photocurable resin composition in the above ratio, it is possible to form a photocurable resin layer having a low curling phenomenon and excellent adhesion and curing properties. In addition, when the photocurable resin composition is formed at the above ratio, photocuring is possible even at a depth of 200 μm or more, and it may impart appropriate flexibility and restoration characteristics to protect the RFID inlay.

The photocurable resin composition may further include a solvent, and any solvent may be used as long as it is a common solvent included in the photocurable resin composition. For example, acrylates, alcohols, methacrylamides, ethers, and the like can be used, but are not limited thereto.

5 and 6 show cross-sectional views of a card 20 according to another embodiment of the invention. Referring to FIG. 5, a card 20 according to another embodiment of the present invention includes the RFID inlay 10.

The card 20 including the RFID inlay 10 includes one cover layer 400 selected from the group consisting of an upper cover 410, a lower cover 430, and a combination thereof. It may be to include more.

The upper cover 410 and the lower cover 430 may be used as long as it can be used as a surface agent of the card, it may be any one selected from the group consisting of synthetic resin film, fiber, paper and combinations thereof.

The upper cover 410 and the lower cover 430 may be an adhesive layer (not shown) is formed on the surface that meets the RFID inlay 10. The adhesive layer may use a known adhesive, and since the adhesive layer is further formed, the card 20 including the RFID inlay 10 may be manufactured by a sticker method instead of a thermocompression method that is a conventional card manufacturing method.

Referring to FIG. 6, the card 20 including the RFID inlay 10 may further include an upper coating layer 510 positioned on the upper cover 410 of the RFID inlay 10. A lower coating layer 530 may be further included below the lower cover 430 of the RFID inlay 10.

The method of manufacturing an RFID inlay according to another embodiment of the present invention includes a photocurable resin coating step and a photocuring step.

The photocurable resin composition may be further prepared before the photocurable resin coating step.

The photocurable resin composition manufacturing step includes a first preheating process, a first mixing process, a second preheating process, a stirring process, a second mixing process.

Details regarding the specific structure and content of the photocurable resin composition are the same as described in the RFID inlay, and thus descriptions thereof are omitted.

The first preheating process is a process of preheating the oligomer at 20 to 80 ℃ for 10 to 200 minutes, preferably the oligomer may be preheated at 40 to 60 ℃ for 20 to 60 minutes. In the case of the first preheating process, the oligomer may become low in the preheating process at a relatively high temperature, thereby sufficiently mixing.

The first mixing process is a process of preparing a mixture by mixing a monomer with the oligomer.

The second preheating process is a process of preheating the mixture at 20 to 80 ℃ for 10 to 80 minutes, preferably a process of preheating the mixture at 40 to 60 ℃ for 20 to 60 minutes. In the case of the second preheating process, the oligomer and the monomo may be better mixed according to the low viscosity due to the preheating.

The stirring process is a process of stirring the second preheated mixture. The stirring process may be performed in a step of high speed stirring after low speed stirring.

The secondary mixing process is a process of adding a photoinitiator to the mixture.

After the second mixing process, the filtration process may be further performed.

The photocurable resin coating step is a step of applying the photocurable resin composition to the antenna layer 100 provided with the IC chip (210).

Since the details of the IC chip 210 and the antenna layer 100 are the same as described in the RFID inlay 10, description thereof is omitted.

The photocuring step is a step of curing the photocurable resin by light irradiation to the IC chip layer 200 provided with the IC chip 210 coated with the photocurable resin.

Between the photocurable resin coating step and the photocuring step, the support layer lamination step of laminating the support layer 300 on top of the photocurable resin of the IC chip 210 coated with the photocurable resin prepared in the photocurable resin coating step It may further include.

Since the contents of the support layer 300 are the same as described in the RFID inlay 10, description thereof is omitted.

The photocurable resin coating step and the support layer stacking step may be sequentially performed, and an appropriate amount of the photocurable resin is applied to the antenna layer 100, and the support layer 300 is laminated on the coated photocurable resin. The surface of the resin layer may be flattened at a height suitable for the photocurable resin and the IC chip 210 protruding part or all of the antenna layer 100 and the upper portion of the antenna layer.

Any one step selected from the group consisting of the photocurable resin coating step, the photocuring step, the supporting layer stacking step, and a combination thereof may be made in a rule-to-roll manner. The roll-to-roll method is a method of manufacturing an RFID inlay by cutting a plurality of RFID inlays continuously while cutting the substrate onto a rotary roll without cutting the substrate for each RFID inlay. The RFID inlay manufacturing method may apply a roll-to-roll method to manufacture the RFID inlay through a simple and automated method.

The photocuring step may be made only in the first photocuring step in consideration of the degree of curing of the photocurable composition or the light transmission performance of the support layer, and after the first photocuring step, the RFID inlay manufactured in the first photocuring step It may further comprise a secondary photocuring step of curing the photocurable resin composition by light irradiation again.

According to another embodiment of the present invention, a method of manufacturing a card including an RFID inlay includes an upper cover 410, a lower cover 430, and a cover of an RFID inlay 10 manufactured by the method of manufacturing an RFID inlay. Cover layer stacking step of stacking the cover layer 400 made of a combination.

The cover layer stacking step may be by a thermocompression bonding method, and the cover layer 400 may be by a sticker method by an adhesive layer formed on a surface where the cover layer 400 meets the RFID inlay 10. .

When the cover layer stacking step is performed by a sticker method, it is possible to prevent breakage of the IC chip or the connection portion of the IC chip and the antenna, which may occur in the case of the thermocompression bonding method.

In the method of manufacturing a card including the RFID inlay, the upper coating layer 510 is stacked on the RFID inlay on which the cover layer is stacked, and the lower coating layer 530 is laminated on the RFID inlay on which the cover layer is stacked. The coating layer 500 may further include a lamination process.

Since the description of the cover layer 400 and the coating layer 500 is the same as described in the RFID inlay 10, the description is omitted.

In the photocurable resin composition and the photocurable resin layer, photocuring means all the cases where the resin composition is cured by irradiation with light to form a resin layer, not by a thermocompression bonding method, and preferably the photocuring is UV. May be curing.

The RFID inlay of the present invention can prevent the IC chip or the connection portion of the IC chip and the antenna from being damaged during the manufacturing process or the use process, and has excellent heat resistance but excellent adhesion between the layers and does not exhibit curl phenomenon. The card including the RFID inlay of the present invention is excellent in pressure resistance and heat resistance,

In addition, the present invention is a manufacturing method of the card including the RFID inlay and the RFID inlay is simple, but can be applied to mass production, it is possible to prevent the damage of the connection between the IC chip or IC chip and the antenna by not applying high temperature and high pressure A method of manufacturing a card including an RFID inlay and an RFID inlay is provided.

1 is a cross-sectional view of one aspect of an RFID inlay in accordance with an embodiment of the present invention.
2 is a cross-sectional view of another aspect of an RFID inlay in accordance with an embodiment of the present invention.
3 is a cross-sectional view of one aspect of an RFID inlay including a support layer in accordance with one embodiment of the present invention.
4 is a cross-sectional view of another aspect of an RFID inlay including a support layer in accordance with an embodiment of the present invention.
5 is a sectional view of a card including an RFID inlay according to another embodiment of the present invention.
Figure 6 is a cross-sectional view of another aspect of a card including an RFID inlay in accordance with another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Photocurable  Preparation of Resin Composition

To prepare a photocurable resin composition having the content and composition of Table 1.

( Example 1 )

Table 1 The oligomers of Example 1 were preheated at 50 ° C. for 30 minutes and then placed in a blending bath. The monomer of Example 1 of Table 1 was put into the mixing tank which put the said oligomer by the corresponding quantity, respectively. After the mixing tank was left at 50 ° C. for about 30 minutes, stirring was started. Stirring was followed by high speed stirring followed by low speed stirring and repeated until the contents completely dissolved. A photoinitiator was added to the mixing tank under stirring. After stirring was completed, a photocurable resin composition was prepared while filtering.

( Example 2  To Example  7)

A photocurable resin composition was prepared in the same manner as in Example 1, except that oligomers, monomers, and photoinitiators were used in the corresponding amounts and configurations of Table 1 below.

Example
One Example
2 Example
3 Example
4 Example
5 Example
6 Example
7 Oligomer 1 - 55 - - - - - Oligomer 2 55 - - 55 55 55 55 Oligomer 3 - - 55 - - - - Monomer 1 - - - 10 10 10 10 Monomer 2 - - - - 8 8 8 Monomer 3 7 7 7 7 7 7 7 Monomer 4 7 7 7 7 7 7 7 Monomer 5 7 7 7 7 7 7 7 Monomer 6 7 7 7 7 7 7 7 additive 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Photoinitiator 1 2.9 2.9 2.9 2.9 2.9 - 4 Photoinitiator 2 - - - - - 2.9 - Sum 86 86 86 96 104 104 105.1

(Unit: parts by weight)

The composition of each oligomer in Table 1 is shown in Table 2 below.

Kinds Viscosity cPs (Temp. ℃) Diluent Oligomer1 Bisphenol-A Epoxy
(Bisphenol-A Epoxy) 800,000 (25)
2,300 (65) - Oligomer 2 Aliphatic Urethane
(Aliphatic Urethane) 12,000 (25) N- (2-hydroxypropyl) methacrylamide N- (2-hydroxypropyl) methacrylamide (HPMA) 35% by weight Oligomer 3 Epoxy 40,000 (25) -

In Table 1, the configuration of each monomer, photoinitiator and other additives is shown in Table 3 below.

Kinds Structure Monomer 1 Phosphate Phosphate Methacrylate Monomer 2 Amide N, N-Dimethylacrylamide Monomer 3 Hydroxy system 2-Hydroxy ethyl methacrylate (2-HEMA) Monomer 4 Aliphatic system Phenoxy Ethyl Acrylate (CAS No: 48145-04-6) Monomer 5 Aliphatic system Lauryl acrylate Monomer 6 Aliphatic system Ethyleneglycol Nonylphenyl Ether Acrylate (CAS No: 50974-47-5) additive Antioxidant Triethylene glycol-bis-3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate (Triethylene glycol-bis-3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate) Photoinitiator 1 - 2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide (2,4,6-Trimethylbenzoyl-diphenyl-phosphineoxide, TPO) Photoinitiator 2 - 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropane-1-one (2-Methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one), trade name Irgacure 907, manufactured by Ciba

RFID Inlay  Produce

( Example 1  To Example 7  Occation)

The antenna layer and the IC chip having a specific pattern were laminated through a process of etching a heat-resistant PET film and attaching aluminum to the substrate. The photocurable composition of Examples 1 to 7 prepared above was applied to the surface of the antenna layer having the IC chip, and a PET film was laminated on the surface of the photocurable composition in a roll-to-roll manner. The PET film was laminated to the antenna layer coated with the laminated photocurable composition by passing through a roller, and using a UV light irradiator (using a metal halide lamp, the amount of UVA 260 mJ / cm ² when passing 3 mpm). To harden the photocurable resin.

( Comparative Example  Occation- Photocurable  Does not contain a resin layer Thermocompression  system)

The IC chip was bonded to the antenna layer having a specific pattern through a process of etching a heat-resistant PET film and bonding aluminum to the substrate. An RFID inlay as a comparative example was manufactured by thermally laminating a PET film on both sides of the substrate including the antenna layer to which the IC chip was bonded, and thermally laminating it.

RFID Inlay  Property evaluation

The degree of curling and adhesion of the RFID inlay manufactured by the above method were evaluated and shown in Table 4 below.

The curling phenomenon was evaluated by comparing the before and after photocuring of the RFID inlay manufactured by the above method, and the case of maintaining the shape before and after the photocuring and without edge lift was evaluated as good, and was indicated as ○. Although the shape was maintained before and after photocuring, the lifting phenomenon appeared in the corner part as a normal evaluation, and was represented by (triangle | delta). The cases of severe shrinkage after photocuring were evaluated as poor and ×.

The degree of adhesive strength was evaluated by spreading the heat-resistant PET and the support layer PET of the RFID inlay manufactured in the above manner, and when the separation was excellent enough to tear the PET when the separation was evaluated as very good and marked with ◎, separation When it takes force, but PET is evaluated as the degree of excellent tearing and represented by ○. The case where some force was taken at the time of separation was evaluated as normal, and it was shown as (triangle | delta), and the case where it was easy to separate was evaluated as bad and marked with x.

Example 1 Example 2 Example 3 Curl phenomenon ○ × △ Adhesion △ △ ×

Referring to Table 4, Example 1 using the oligomer 2 showed relatively good results in terms of adhesion and curling.

The physical properties of Examples 4 to 7 were evaluated while changing the type and content of the monomer and photoinitiator to the oligomer 2 used in Example 1, and the results are summarized in Table 5 below.

In the following Table 5, the curing properties were cured by irradiation with UV depending on the thickness. The state of cure after cure was checked, and if oily residue remained, it was evaluated as uncured. In case of satisfying the deep sclerosis at 1000um thickness, it was evaluated as very good and marked with ◎. In case of satisfactory deep sclerosis of 200um thickness, it was evaluated as excellent and indicated as ○. And evaluated as Δ.

Example 1 Example 4 Example 5 Example 6 Example 7 Curl phenomenon Good Good Good Good Good Adhesion △ ○ ◎ △ ◎ Curing property ○ ○ ○ ○ ◎

Referring to Table 5, the adhesion was excellent in the case of Examples 4 to 7 using the monomer phosphate-based monomer 1 and the amide-based monomer 2, the photoinitiator 2 is used when It showed better results than Example 6 used. Curling phenomenon was good in the overall Example, the curing properties were all excellent, but in the case of Example 7 to increase the content of the photoinitiator was found to be more excellent curing properties.

RFID Inlay  Manufacture of cards to include

The cards of Example 1 and Examples 4 to 7 were manufactured by laminating a sticker method on the upper cover and the lower cover on the RFID inlays of Examples 1 and 4 to 7, and overlaminating the coating layer. In the RFID inlay of the comparative example, the upper, lower cover and the upper and lower coating layers were laminated and laminated by thermocompression bonding to prepare a card of the comparative example.

Checking whether the IC chip or the connection portion of the IC chip and the antenna is damaged in the cards of the prepared examples and comparative examples are shown in Table 6 below. If 120 cards are manufactured and at least one card has a damaged part of IC chip or IC chip and antenna, it is indicated as bad and indicated by ×. Indicated.

Comparative example Example 1 Example 4 Example 5 Example 6 Example 7 Damage × ○ ○ ○ ○ ○

Referring to Table 6, in the case of the comparative example that does not include a photocurable resin layer, it was found that the connection portion of the IC chip or the IC chip and the antenna is damaged during the manufacturing process by the thermocompression bonding method. In Examples 4 to 7, there was no damage to the IC chip or the connection portion between the IC chip and the antenna, which is considered to be because the connection portion between the IC chip or the IC chip and the antenna was protected by the photocurable resin layer.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

10: RFID inlay 20: Card containing RFID inlay
100: antenna layer 110: substrate
130: antenna 200: IC chip layer
210: IC chip 230: photocurable resin layer
300: support layer 400: cover layer
410: upper cover layer 430: lower cover layer
500: coating layer 510: top coating layer
530: bottom coating layer

Claims (11)

An antenna layer comprising a substrate and an antenna, and
An IC chip layer connected to the antenna layer and including an IC chip protruding above the antenna layer and a photocurable resin layer covering the protrusion of the IC chip.
RFID inlay comprising. The method of claim 1,
One surface of the photocurable resin layer covers and protects the protrusion of the IC chip, and covers the entire surface of the antenna layer.
The other surface of the photocurable resin layer is RFID inlay flat surface. The method of claim 1,
The photocurable resin layer is an RFID inlay manufactured by applying a photocurable resin composition comprising a urethane-based oligomer 18 to 80% by weight, a monomer 18 to 80% by weight and a photoinitiator 0.1 to 15% by weight. The method of claim 3,
The monomer is any one selected from the group consisting of phosphate, amide, hydroxy, aliphatic and combinations thereof. The method of claim 1,
The RFID inlay further comprises a support layer on top of the photocurable resin layer. A card comprising an RFID inlay according to any one of claims 1 to 5. A photocurable resin coating step of applying the photocurable resin composition to an antenna layer provided with an IC chip, and
Photocuring step of manufacturing an RFID inlay by curing the photocurable resin by light irradiation to the IC chip layer provided with the IC chip coated with the photocurable resin
Method of manufacturing an RFID inlay comprising a. The method of claim 7, wherein
A support layer lamination step of laminating a support layer on top of the photocurable resin of the IC chip coated with the photocurable resin prepared in the photocurable resin coating step between the photocurable resin coating step and the photocurable step
Method of manufacturing an RFID inlay further comprising. The method of claim 7, wherein
The photocurable resin coating step and the photocuring step is a roll-to-roll method of manufacturing an RFID inlay. A cover layer for laminating any one cover layer selected from the group consisting of an upper cover, a lower cover, and a combination thereof to an RFID inlay manufactured by the method for manufacturing an RFID inlay according to any one of claims 7 to 9. Stacking Step
Method of manufacturing a card comprising an RFID inlay comprising a. The method of claim 10,
The cover layer in the stacking step of the cover layer is a manufacturing method of a card comprising an RFID inlay that is attached by a sticker method by an adhesive layer formed on a surface where the cover layer and the RFID inlay meet.

Images