KR20210120510A - A wireless communication card and a method for producing the card - Google Patents

Abstract

According to an embodiment of the present invention, a card with a wireless communication function comprises: an antenna inlay layer including an antenna; a core layer covering an upper part of the antenna inlay layer; and an epoxy layer covering a lower part of the antenna inlay sheet. The core layer and the epoxy layer are formed in a stacked layer structure for preventing protrusion to prevent external exposure caused by a protruding structure of the antenna inlay sheet.

Description

Wireless communication card and manufacturing method thereof

The present invention relates to a method of manufacturing a wireless communication card. More specifically, the present invention relates to a card capable of wireless communication and a method for manufacturing the same.

In general, credit cards can be used in place of cash, and in recent years, smart cards with IC chips capable of storing large amounts of information have been developed and are being actively used not only for payment but also for various membership cards. In this smart card market, special cards using various materials are being developed. In particular, for VIP customers, differentiated metal credit cards and wooden cards containing solid wood are being developed.

Furthermore, such a credit card is also manufactured as a hybrid card with a built-in RF antenna and a contactless IC chip to enable a wireless interface, although a contact IC chip containing credit information is externally provided, and the hybrid card has contact with the reader. A contact chip for supporting communication is provided outside, and an RF antenna capable of supporting non-contact communication is built inside.

In particular, with the development of card materials and manufacturing methods, hybrid cards are also becoming very thin while maintaining characteristic materials to realize high-quality credit cards, and various sheet stacking structures and manufacturing technologies for this purpose have been proposed. .

However, it is still difficult to reduce the thickness of the antenna layer layer for wireless communication, such as RF, due to limitations in technical communication standards.

In addition, the antenna layer layer is typically composed of a metal coil antenna formed by an etching method on a resin layer, which protrudes at a certain height in the upper or lower direction. As compression and lamination are repeated and the card thickness becomes thinner Due to the antenna protrusion, the protrusion or dent marks appear large on the exterior.

In particular, in the case of a coil-type antenna, the thickness is considerable, and it is formed repeatedly along the edge of the card, and even when holding the card, the repeated points of protrusions and dents can be felt by touch. It has become a major obstacle to manufacturing.

Furthermore, since the thickness due to the overall chip packaging structure and shape exists in the wireless chip module itself connected to the antenna coil for wireless communication, the shape may also protrude, resulting in visual and tactile discomfort. have.

In addition, in the case of a card of a high-quality material such as a metal card that has been recently applied, the protrusion of the antenna coil and the wireless chip form is more problematic due to an increase in thickness due to a special material.

The present invention has been devised to solve the above problems, and in a card capable of wireless communication such as RF, while minimizing the protrusion of an antenna and a wireless chip provided in an antenna inlay for wireless communication, the card thickness is kept thin An object of the present invention is to provide a wireless communication card that forms a laminated layer structure for preventing protrusion and a method for manufacturing the same.

In addition, the present invention is to provide an effective manufacturing method for forming an anti-protrusion structure capable of minimizing the protrusion of the antenna and the radio chip while keeping the card thickness thin as described above, and a wireless communication card manufactured by the manufacturing method. It has its purpose.

A wireless communication card according to an embodiment of the present invention for solving the above problems, the antenna inlay layer comprising an antenna; a core layer covering an upper portion of the antenna inlay layer; and an epoxy layer covering a lower portion of the antenna inlay sheet, wherein the core layer and the epoxy layer are formed in a protrusion prevention laminated layer structure to prevent external exposure due to the protruding structure of the antenna inlay sheet.

A method of manufacturing a card having a wireless communication function according to an embodiment of the present invention for solving the above problems, the step of laminating an antenna inlay layer on the epoxy layer; and laminating a core layer covering the antenna of the antenna inlay layer on the antenna inlay layer, wherein the core layer and the epoxy layer protrude to prevent external exposure due to the projecting structure of the antenna inlay sheet It is characterized in that it is formed in a laminated layer structure for prevention.

According to an embodiment of the present invention, by laminating a core layer covering the upper part of the antenna inlay including the protruding antenna formed by the etching method as the center, and laminating with an epoxy layer covering the lower part, the upper surface of the card And it is possible to minimize the antenna protrusion of the lower surface.

In addition, according to an embodiment of the present invention, the wafer level integrated circuit part (wafer chip) of the wireless communication chip module provided in the antenna inlay is configured to protrude downward, and the wafer chip protection area for accommodating the wafer level integrated circuit part in the epoxy layer By inserting and stacking in the protection area, effectively preventing protrusion to the outside due to the wireless communication chip module, while maintaining the thinness and wireless communication function, manufacturing a thin high-quality card with a more flexible and smooth shape can do.

1 is a diagram illustrating a perspective view of a hybrid card according to an embodiment of the present invention.
2 is a cross-sectional view of a hybrid card according to an embodiment of the present invention.
3 to 7 are a flowchart for explaining a method of manufacturing a hybrid card according to the first embodiment of the present invention, and cross-sectional views for each main process.
8 to 12 are a flowchart for explaining a method of manufacturing a hybrid card according to a second embodiment of the present invention, and cross-sectional views for each main process.

The following is merely illustrative of the principles of the invention. Therefore, those skilled in the art will be able to devise various devices which, although not explicitly described or shown herein, embody the principles of the present invention and are included within the spirit and scope of the present invention. Moreover, it is to be understood that all conditional terms and examples listed herein are, in principle, expressly intended solely for the purpose of enabling the concept of the present invention to be understood, and not limited to the specifically enumerated embodiments and states as such. should be

For example, throughout the specification, when it is said that a part is "connected" with another part, it is not only "directly connected" but also "indirectly connected" with another member interposed therebetween. cases are included. In addition, when a part "includes" a certain component, this means that other components may be further provided without excluding other components unless otherwise stated.

Moreover, it is to be understood that all detailed description reciting specific embodiments, as well as principles, aspects, and embodiments of the present invention, are intended to include structural and functional equivalents of such matters. It is also to be understood that such equivalents include not only currently known equivalents, but also equivalents developed in the future, i.e., all devices invented to perform the same function, regardless of structure.

The above-described objects, features, and advantages will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains can easily implement the technical idea of the present invention. There will be. In addition, in describing the present invention, if it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

1 is a perspective view of a hybrid card 100 according to an embodiment of the present invention. Hybrid card 100 may include one or more sheets or layers (layers).

As an embodiment, the hybrid card 100 includes a contact IC chip module and a wireless communication chip module capable of wireless communication, and according to the card issuance and operation system of the card company, credit payment and check based on the contact IC chip. It may be a card capable of processing card payment or wireless communication chip-based credit payment, check card payment, post-payment payment, and the like, respectively.

In addition, in the embodiment of the present invention to be described below, the hybrid card 100 exemplifies a case in which a metal or a metal card is used, but the material of the special material sheet may be different, and even if the hybrid card 100 is not a metal, the implementation of the present invention The stacked layer structure for preventing protrusion of the center of the antenna inlay according to the example may be applied.

Referring to FIG. 1 , a hybrid card 100 according to an embodiment of the present invention includes a metal layer 110 , an adhesive layer 120 , an upper printed layer 160 , a top coating layer 150 , an insulating layer 130 , It may include a core layer 125, an antenna inlay layer 140, an epoxy layer 145, a lower printed layer 165, and a magnetic strip overlay layer (MS O/L (Magnetic stripe Overlay) 170), A contact IC chip 155 in the form of a COB (Chip on Board) that provides contact communication and transaction functions may be attached thereto, and the antenna inlay layer 140 is connected to an antenna to provide wireless communication and transaction functions. A wireless communication chip module 115 may be provided.

In this drawing, only the above-described components have been described, but the present invention is not limited thereto, and other components for implementing the hybrid card may be further added, and a display unit, a biometric sensor unit, etc. may be additionally included for additional functions. can

In addition, the hybrid card 100 of the present invention can be manufactured to meet the standard size and thickness according to a predefined standard, and the size and thickness of each sheet is determined to be an optimal thickness suitable for the operation of the hybrid card and wireless communication sensitivity, etc. It can be implemented to be combined.

First, the antenna inlay layer 140 according to an embodiment of the present invention may include an inlay sheet and an etching antenna formed by etching a metal layer by an etching method and attached to the inlay sheet, and the etching antenna will protrude upward.

More specifically, the antenna inlay layer 140 may be formed by depositing or plating a metal layer such as aluminum or copper on the upper surface of a resin layer such as PET. It can be etched so that only the antenna part remains by etching it by an etching method. Here, the acid-resistant anticorrosive agent may use "etching ground" in which beeswax, bitumen, rosin, and the like are mixed.

Accordingly, the antenna inlay layer 140 is a sheet that provides a wireless communication function including a radio frequency (RF) antenna protruding according to etching, and the antenna coil has a sensitivity optimized through an RF communication (eg, NFC) sensitivity test. The number of turns of the coil is determined to indicate. In general, in the case of an antenna inlay equipped with a conventional coil type antenna, there is a problem that it is thick as a thickness of 0.33T (0.33mm). The thickness can be configured as thin as 0.05T (0.05mm).

In addition, the wireless communication chip module 115 according to an embodiment of the present invention may be attached to the antenna inlay layer 140 . Here, in order to maximize the thickness improvement and protrusion prevention of the wireless communication chip module 115 according to an embodiment of the present invention, a wafer level integrated circuit unit rather than a full chip package including a cover, a mold, etc. provided in a conventional chip module. It is preferable to be composed of a wafer chip from which only the bay is extracted.

Accordingly, the wireless communication chip module 115 connected to the antenna of the antenna inlay layer 140 according to an embodiment of the present invention removes a cover, a mold, etc. on a typical wireless communication semiconductor chip package and performs only a practical function. It may be called a wafer chip module 115 configured by extracting only a wafer level integrated circuit part, and the wafer chip module 115 may be configured to be connected and attached to an etched antenna so as to protrude under the antenna inlay layer 140 .

However, the wafer chip module 115 may be vulnerable to external impact because the cover and the mold structure are omitted. Accordingly, an epoxy layer 145 may be provided under the antenna inlay layer 140 according to an embodiment of the present invention, and the epoxy layer 145 has a wafer chip protection region ( 117) can be formed.

The wafer chip protection region 117 may be perforated to a predetermined size and shape for accommodating the wafer chip module 115 , and the wafer chip module 115 is inserted into the protection region 117 , and the protection region ( Epoxy filling process is performed in the remaining space of 117 to fix the wafer chip module 115, and external impact can be minimized.

In addition, since the wafer chip module 115 is accommodated in the protection region 117 and covered with epoxy filling, the lower protrusion of the wafer chip module 115 itself can be prevented.

In addition, since the epoxy layer 145 may also serve as an preventing material for preventing the etched antenna from protruding downward of the antenna inlay layer 140 , the existing stacked structure in which the antenna and wireless communication chip modules may protrude downward. can improve

And, the core layer 125 according to an embodiment of the present invention may be laminated on the antenna inlay layer 140, and is formed of a PVC material to form the body of the hybrid card 100 according to the embodiment of the present invention. can do.

In particular, the core layer 125 according to an embodiment of the present invention may cover the etched antenna portion of the antenna inlay layer 140 , and is laminated according to a heat press method, so that the etched antenna protrudes upward or a dent is formed. can be prevented from happening.

Therefore, the antenna inlay layer 140 according to the embodiment of the present invention is the antenna and the stacking method of the upper core layer 125 and the lower epoxy layer 145 designed according to the embodiment of the present invention. Since the wireless communication chip module is prevented from protruding, it is possible to manufacture the card 100 in a thinner and smoother form, and this effect can be more usefully used in a card of a special material such as metal.

An insulating layer 130 , a metal layer 110 , an adhesive layer 120 , an upper printed layer 160 , and a top coating layer 150 may be laminated on the core layer 125 , and attached according to a conventional laminating method. can be

Among them, the metal layer 110 is a core sheet expressing a card-specific material and weight, and may be formed of a SUS (steel use stainless, stainless steel) material. The metal material constituting the metal layer 110 may be selected in consideration of the material and weight for expressing the characteristics of the metal, as well as durability, wear, and degree of denaturation to withstand the processing process. As an embodiment, the metal layer 110 made of SUS may be a material that is resistant to corrosion and can be heat treated. Heat treatment refers to an operation process in which a metal is heated to a certain temperature and improved into a desired property or metal structure according to a cooling rate. The metal layer 110 may have irregularities on a part or all of its surface for adhesion. In addition, the metal layer 110 may be processed through a heat treatment process to improve strength and restoring force when manufacturing the hybrid card 100 .

The insulating layer 130 serves to block interference with the metal layer 110 so that the etched antennas of the antenna inlay layer 140 are operable. In order for the NFC antenna to work, communication with the opposite antenna reader must be made. In this case, a magnetic field is generated in the antenna coil, and since the antenna is attached to the upper and lower parts of the hybrid card, it is often close to a metal material. In this case, the metal material of the metal sheet changes the SRF (selfresonant frequency) of the antenna coil to worsen the loss, lower the inductance of the antenna coil, and eventually cause communication failure. The cause of this phenomenon is the eddy current (eddy current) generated in the metal due to the magnetic field. The insulating layer 130 is used for this purpose, and is also called a ferrite sheet. Ferrite can be used by turning iron into powder, oxidizing the outer surface to make it insulated, and applying pressure to shape it.

The insulating layer 130 and the metal layer 110 may be attached and formed by an adhesive such as a hot melt sheet. A hot melt is melted by heating, and a material such as a thermoplastic resin has a characteristic of being solidified when it is cooled after being melted by heating, so this material can be used as a film-type hot melt adhesive. As an embodiment, the hot melt is an adhesive sheet in consideration of the adhesive force between the metal layer 110 and the insulating layer 130 made of a metal material, and unlike an adhesive used for a plastic sheet, it may be implemented with a material suitable for a metal material.

Also, as an embodiment, at least one of the insulating layers 130 of the hybrid card 100 may be used in the form of being cut into one or more pieces. For example, by breaking the insulating layer 130, it may be implemented to be made of non-uniform pieces, or it may be made into several uniform pieces. As such, when at least one of the insulating layers 130 is cut into pieces, the hot melt melts and flows into the gaps between the pieces when attached to the hot melt, so that the adhesive strength with the adhesive sheet is improved.

Also, as an embodiment, at least one of the insulating layers 130 of the hybrid card 100 may further include ferrite in the form of powder. Ferrite is a ferromagnetic insulator, and when implemented in a powder form, not only increases adhesion but also forms an additional insulating layer by lamination, so that the insulating function between the metal layer 110 and other sheets can be further improved.

As an embodiment, although an embodiment in which ferrite is implemented in a powder form has been described, the present invention is not limited thereto, and may be manufactured in a net form or an amorphous powder form. Since ferrite is a ferromagnetic insulating material, metal sheet insulating properties are strengthened by adding it, thereby ensuring normal antenna operation in the hybrid card.

The upper print layer 160 and the lower print layer 165 are sheets that print and display card information, or print and display images such as card information, patterns, and patterns, respectively, as sheets, the front and back of the card. can be attached to each.

In addition, a hologram layer may be further provided on the upper printed layer 160 , hot stamping a hologram foil by transfer, laminating a plurality of moldings having a hologram pattern, or depositing a molding in which a hologram pattern is formed Alternatively, the hologram pattern formed on the hybrid card may be printed, including the coating layer in which the hologram pattern is micro-processed by UV resin coating.

Meanwhile, the magnetic strip overlay layer 170 may be a sheet including a magnetic strip.

The above-described components are a primary assembly including a core layer 125 , an antenna inlay layer 140 and an epoxy layer 145 through the primary processing of a laminated layer structure for preventing protrusion including the antenna inlay layer 140 . After forming, after laminating so that the remaining entire sheets are laminated, it may be processed to form one card body through a secondary laminate.

2 is a cross-sectional view of a hybrid card according to an embodiment of the present invention.

Referring to FIG. 2 , the hybrid card 100 according to an embodiment of the present invention has an overlay layer 170 , a lower printed layer 165 , an epoxy layer 145 , an antenna inlay layer 140 , in order from the bottom. The core layer 125 , the insulating layer 130 , the metal layer 110 , the adhesive layer 120 , the upper printed layer 160 , and the top coating layer 150 may be stacked.

And, as shown in FIG. 2 , the wafer chip module 115 according to an embodiment of the present invention may be attached to and connected to the antenna inlay layer 140 in the form of protruding downward, and the wafer chip module 115 protrudes. A wafer chip protection region 117 accommodating the wafer chip module 115 may be formed in the epoxy layer 145 corresponding to the position and region to be used.

Here, the wafer chip module 115 may be located inside the wafer chip protection region 117 , and for this purpose, the wafer chip protection region 117 may have a thickness d1 and a width d3 of the wafer chip module 115 . The hole may be formed in a wider size than that.

Accordingly, the epoxy layer 145 has a first width d2 that is wider than the width d1 of the wafer chip module 115 and a first depth d4 that is deeper than the thickness d3 of the wafer chip module 115 . A wafer chip protection region 117 may be formed. Here, the wafer chip module 115 may be generally circular, the width of the wafer chip module 115 may correspond to its diameter, and the wafer chip protection region 117 may be perforated in a circular column shape.

For example, sequentially, the top coating layer 150 and the upper printed layer 160 are 0.01 mm, the adhesive layer 120 is 0.01 mm, the metal layer 110 is 0.30 mm, the insulating layer 130 is 0.06 mm, the core layer 125 is 0.10 mm, the antenna inlay layer 140 is 0.05 mm, the epoxy layer 145 is 0.05 mm, the lower printed layer 165 is 0.01 mm, and the overlay layer 170 is 0.04 mm. The thickness of the lower protrusion of the wafer chip module 115 may be less than 0.05 mm, and the depth of the wafer chip protection region 117 of the epoxy layer 145 may be 0.05 mm.

In addition, in order to fix and protect the wafer chip module 115 accommodated in the wafer chip protection region 117 , the remaining space of the protection region 117 may be filled with a separate filler. For the filling treatment, an epoxy filling method may be exemplified, and the filling treatment process may be exemplified in various ways, which will be described later.

3 to 7 are a flowchart for explaining a method of manufacturing a hybrid card according to the first embodiment of the present invention, and cross-sectional views for each main process.

First, referring to FIGS. 3 and 4 , the MS overlay layer 170 and the lower printed layer 165 are laminated, and the epoxy layer 145 having the wafer chip protection region 117 perforated thereon is laminated.

Thereafter, referring to FIGS. 3 and 5 , an epoxy filling process may be performed on the wafer chip protection region 117 ( S105 ), and referring to FIGS. 3 and 6 , the filled wafer chip protection region 117 . The antenna inlay layer 140 is stacked so that the wafer chip module 115 protruding from the lower portion of the antenna inlay layer 140 is inserted.

And, referring to FIGS. 3 and 7 , a heat press process is performed to cover the etched antenna protruding from the upper portion of the antenna inlay using the PVC core layer 125 ( S109 ).

Then, as shown in FIG. 3, the insulating layer 130, the metal layer 110, the adhesive layer 120, the upper printed layer 160 and the top coating layer 150 are sequentially laminated, and the card ( 100) The hybrid card 100 can be manufactured in which a body is formed, and a contact-type IC chip is attached to the upper portion of the body, thereby preventing the antenna and the internal wireless communication module from protruding.

8 to 12 are a flowchart for explaining a method of manufacturing a hybrid card according to a second embodiment of the present invention, and cross-sectional views for each main process.

First, referring to FIGS. 8 and 9 , the upper portion of the etched antenna of the antenna inlay layer 140 is heat-pressed with the PVC core layer 125 , and the insulating layer 130 , the metal layer 110 , and the adhesive layer 120 . , the entire sheet on which the upper printed layer 160 and the top coating layer 150 are formed is rotated up and down to process the wafer chip module 115 to protrude upward (S201).

And, referring to FIGS. 8 and 10 , the epoxy layer 145 in which the wafer chip protection region 117 is perforated is formed so that the wafer chip module 115 is positioned inside the protection region 117 , the antenna inlay layer 140 . ) can be attached to the top (S203). At this time, an epoxy filling process as shown in FIG. 11 is performed on the remaining space of the wafer chip protection region 117 (S205). Therefore, in this case, the epoxy filling process can be easily performed compared to the first embodiment.

Thereafter, as shown in FIGS. 8 and 12 , the lower printed layer 165 and the MS overlay layer 170 are laminated ( S207 ), and the contact IC chip 155 is attached to prepare the hybrid card 100 . can

In the above, preferred embodiments of the present invention have been illustrated and described, but the present invention is not limited to the specific embodiments described above, and it is common in the technical field to which the present invention pertains without departing from the gist of the present invention as claimed in the claims. Various modifications may be made by those having the knowledge of, of course, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

100: hybrid card 110: metal layer
120: adhesive layer 130: insulating layer
140: antenna inlay layer 150: top coating layer
160: upper printed layer 165: lower printed layer
170: magnetic strip overlay layer
145: epoxy layer 155: contact IC chip
115: wireless communication chip module (wafer chip module)
117: wafer chip protection area

Claims (15)

A card having a wireless communication function, comprising:
An antenna inlay layer comprising an antenna;
a core layer covering an upper portion of the antenna inlay layer; and
Including; an epoxy layer covering the lower portion of the antenna inlay sheet;
The core layer and the epoxy layer are formed in a laminated layer structure for preventing protrusion to prevent external exposure due to the protrusion structure of the antenna inlay sheet.
wireless communication card. According to claim 1,
The antenna inlay layer includes an etched antenna protruding by an etching process
wireless communication card. 3. The method of claim 2,
The core layer is laminated according to a hot press method so that the etched antenna portion of the antenna inlay layer is covered, and includes a PVC material core sheet that prevents the etched antenna from protruding or dents are formed
wireless communication card. 3. The method of claim 2,
A wireless communication chip module is attached to the lower portion of the antenna inlay layer and is connected to the etching antenna,
The wireless communication chip module is a wafer chip module obtained by extracting a wafer level integrated circuit from the entire chip package.
wireless communication card. 5. The method of claim 4,
The epoxy layer
and a wafer chip protection region formed in a predetermined size and shape for accommodating the wafer chip module at a position corresponding to the wafer chip module.
wireless communication card. 6. The method of claim 5,
The width and thickness of the wafer chip module, characterized in that smaller than the width and depth of the wafer chip protection region
wireless communication card. 7. The method of claim 6,
Filling process using a filler is performed on the remaining space of the wafer chip protection area
wireless communication card. 8. The method of claim 7,
The filler includes an epoxy filler
wireless communication card. According to claim 1,
a lower printed layer laminated under the epoxy layer;
an MS overlay layer laminated under the lower printed layer;
an insulating layer laminated on the core layer;
a metal layer of SUS material laminated on the insulating layer and heat-treated to improve strength and resilience; and
Further comprising an upper printed layer laminated on the metal layer,
The lower printed layer, the MS overlay layer, the epoxy layer, the antenna inlay layer, the core layer, the insulating layer, the metal layer and the upper printed layer are attached according to a laminating method to form a metal card.
wireless communication card. According to claim 1,
A contact type IC chip module attached from the outside is further provided, characterized in that it provides a hybrid card function
wireless communication card. A method for manufacturing a card having a wireless communication function, the method comprising:
depositing an antenna inlay layer on top of the epoxy layer; and
Laminating a core layer covering the antenna of the antenna inlay layer on the antenna inlay layer;
The core layer and the epoxy layer are formed in a laminated layer structure for preventing protrusion to prevent external exposure due to the protrusion structure of the antenna inlay sheet.
A method of manufacturing a card. 12. The method of claim 11,
The antenna inlay layer includes an etched antenna protruding by an etching process,
Laminating the core layer comprises:
Laminating a PVC core sheet according to a hot press method so that the etched antenna portion of the antenna inlay layer is covered, and preventing the etched antenna from protruding or dents are formed
A method of manufacturing a card. 13. The method of claim 12,
A wireless communication chip module is attached to the lower portion of the antenna inlay layer and is connected to the etching antenna,
The wireless communication chip module is a wafer chip module obtained by extracting a wafer level integrated circuit from the entire chip package,
The epoxy layer
and a wafer chip protection region formed in a predetermined size and shape for accommodating the wafer chip module at a position corresponding to the wafer chip module.
A method of manufacturing a card. 14. The method of claim 13,
Further comprising the step of forming a hole in the wafer chip protection region in the epoxy layer,
The stacking of the antenna inlay layer may include: stacking the antenna inlay layer on the epoxy layer so that the wafer chip is inserted into the wafer chip protection region; and
Comprising the step of performing a filling process using a filler in the remaining space of the wafer chip protection area
A method of manufacturing a card. 12. The method of claim 11,
laminating the lower printed layer and the MS overlay layer laminated to the lower portion of the lower printed layer;
laminating the epoxy layer on the inner chain layer;
filling the wafer chip protection region formed on the epoxy layer with a filler; and
inserting a wafer chip module to be protruded under the antenna inlay into the wafer chip protection area;
stacking an insulating layer on the core layer;
laminating a heat-treated SUS metal layer on the insulating layer to improve strength and resilience;
laminating an upper printed layer on the metal layer;
forming a metal card by attaching the lower printed layer, the MS overlay layer, the epoxy layer, the antenna inlay layer, the core layer, the insulating layer, the metal layer, and the upper printed layer according to a laminating method; and
attaching a contact-type IC chip to the metal card;
A method of manufacturing a card.

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