CN100367308C - IC tag - Google Patents
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- CN100367308C CN100367308C CNB200380103786XA CN200380103786A CN100367308C CN 100367308 C CN100367308 C CN 100367308C CN B200380103786X A CNB200380103786X A CN B200380103786XA CN 200380103786 A CN200380103786 A CN 200380103786A CN 100367308 C CN100367308 C CN 100367308C
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- bonding coat
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Abstract
The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
Description
Technical field
The present invention relates to a kind of IC tag, when being attached to an IC tag on the article when coming off, it can destroy the built-in electronic circuit.
Background technology
By an IC tag is attached on the article, goods for example, Item Management has been implemented in stores and loading recently.For example, by on goods, sticking the information of recording, working condition for example, inventory status, the IC tag of the information of cost information and use has been implemented Item Management, and as required, by a further confirmation of interrogator.
Yet, when being attached on the article on the IC tag, be used for the adhesive bond strength of IC tag when not enough, the mistake that this IC tag may for example be slipped up and neglect owing to any reason, and stick on again on another part article.And this IC tag may intentionally be sticked on another part article again.In this case, can not correctly implement Item Management for a long time.
As traditional IC tag, when being described as the substrate change on being pressed in label surface, the surperficial substrate in layer is destroyed, thereby has increased the effect (JP 10-171962A) that prevents counterfeit.
Yet there is a problem, promptly when using a cutter etc., by cutting article and being attached to interface between the IC tag adhered layer on the article, the strip off IC tag, with insertion cut-away portions such as fingers and clutch IC tag, the surface substrate can be at an easy rate strip off from the electronic circuit, but can not destroy electronic circuit.
Summary of the invention
As solution to the problems described above, when IC tag sticked on another part article again, needs destroyed the function of IC tag and correctly implement Item Management.
As the present inventor for addressing the above problem the result who makes great efforts, find obtaining of the problems referred to above be by, with first adhesive lamination on a backing sheet, form an electronic circuit, it contains a circuitry lines that contains by-pass line, wherein by the tangent line of the junction by-pass line between by-pass line and circuitry lines and the angle that forms at the tangent line of this junction circuitry lines more than or equal to 45 degree, and less than 180 degree, an and IC chip that on the first bonding coat surface, is connected to electronic circuit, press second bonding coat and be used for overlay electronic circuit and IC chip, and forming a release agent layer corresponding to ground, the top, position of a circuit region, this circuit region comprises electronic circuit and IC chip and on the interface between the backing sheet and first bonding coat.In addition, find obtaining of the problems referred to above be by, with first adhesive lamination on a backing sheet surface, form an electronic circuit, it contains an IC chip that is connected to electronic circuit on the outstanding and first bonding coat surface, the plane of an extension, press second bonding coat and be used for overlay electronic circuit and IC chip, and in release agent layer of ground, top, position formation corresponding to a circuit region, this circuit region comprises electronic circuit and IC chip, and release agent layer is on the interface between the backing sheet and first bonding coat.So just finished the present invention.
Promptly, the invention provides an IC tag, it contains a structure, comprise and be pressed in lip-deep first bonding coat of backing sheet, an electronic circuit, comprise a circuitry lines that contains by-pass line, wherein by the tangent line of the junction by-pass line between by-pass line and circuitry lines, with the angle that forms at the tangent line of this junction circuitry lines more than or equal to 45 degree, and less than 180 degree, an and IC chip that on the first bonding coat surface, is connected to electronic circuit, second bonding coat that presses, be used for overlay electronic circuit and IC chip, and a release agent layer that forms on the ground, top, position corresponding to a circuit region, this circuit region comprises electronic circuit and IC chip, release agent layer is on the interface between the backing sheet and first bonding coat.
The present invention also provides IC tag as described above, and wherein at least one by-pass line is formed on the position that is formed with release agent layer in the circuit region.
The present invention also provides IC tag as described above, the outstanding by-pass line that extends in one of them plane.
The present invention also provides an IC tag, it contains a structure, comprise and be pressed in lip-deep first bonding coat of backing sheet, an electronic circuit, it contains outstanding and IC chip in plane of an extension, this chip is connected to and is formed on electronic circuit on the first bonding coat surface, second bonding coat that presses, be used for overlay electronic circuit and IC chip, an and release agent layer that forms on ground, top, position corresponding to a circuit region, this circuit region comprises electronic circuit and IC chip, and release agent layer is on the interface between the backing sheet and first bonding coat.
The present invention also provides an IC tag, it contains a structure, comprise and be pressed in lip-deep first bonding coat of backing sheet, an electronic circuit, it contains outstanding and IC chip in plane of an extension, this chip is connected to and is formed on electronic circuit on the first bonding coat surface, second bonding coat that presses, be used for overlay electronic circuit and IC chip, an and release agent layer that forms on ground, two terminal position top corresponding to a circuit region, this circuit region comprises electronic circuit and IC chip, and release agent layer is on the interface between the backing sheet and first bonding coat.
The present invention also provides IC tag as described above, and wherein at least one by-pass line is formed on the position that is formed with release agent layer in the circuit region.
The present invention also provides IC tag as described above, the outstanding area that has according to following formula calculating in one of them plane:
S≥(2W)
2
Here S is the outstanding area in plane, and W adjoins the outstanding circuitry lines live width in plane.
The present invention also provides IC tag as described above, wherein is formed with release agent layer, to cover a 20-90% areal extent that is surrounded by an exterior periphery of circuit region by first bonding coat.
The present invention also provides IC tag as described above, and one of them barrier liner is formed on the surface of second adhesive phase.
When sticking on an IC tag on the article when coming off, IC tag of the present invention must be destroyed a built-in electronic circuit.
Description of drawings
Fig. 1 shows an IC tag cross section profile of one embodiment of the invention;
Fig. 2 shows in the IC tag of the present invention, the electronic circuit perspective view of an embodiment;
Fig. 3 shows an IC tag perspective view of another embodiment of the present invention;
When the IC tag that Fig. 4 shows another embodiment of the present invention comes off, a state cross section profile;
Fig. 5 shows in the IC tag of the present invention, a circuitry lines and the nemaline planimetric map of bypass of an embodiment;
Fig. 6 shows in the IC tag of the present invention, the electronic circuit perspective view of another embodiment;
Fig. 7 shows an IC tag perspective cross-sectional view of another embodiment of the present invention;
Fig. 8 shows in the IC tag of the present invention, the electronic circuit perspective view of another embodiment;
Fig. 9 shows in the IC tag of the present invention, the electronic circuit perspective view of another embodiment;
When the IC tag that Figure 10 shows one embodiment of the invention comes off, the perspective cross section profile of a state;
Figure 11 shows in the IC tag of the present invention, the outstanding shape planimetric map that extends to circuitry lines in the plane of an embodiment;
In the accompanying drawings, 1 refers to a backing sheet, and 2 refer to first bonding coat, 3 refer to electronic circuit, and 4 refer to circuitry lines, and 5 refer to second bonding coat, 6 refer to the IC chip, and 7 refer to release agent layer, and 8 refer to by-pass line, 9 refer to that the plane is outstanding, 10 digital zygonemas, and 11 refer to barrier liner, 12 refer to article, and 13 refer to circuit region, and 14 refer to the connection between by-pass line and the circuitry lines, 15 refer to the tangent line of the junction by-pass line between by-pass line and the circuitry lines, and 16 refer to the tangent line of the junction circuitry lines between by-pass line and the circuitry lines, and 17 refer to cut.
Embodiment
Explain IC tag of the present invention with reference to the accompanying drawings.Fig. 1 and Fig. 7 show an IC tag cross section profile of one embodiment of the invention.
As the thin slice that comprises thermoplastic resin, operable thin slice for example comprises the various synthetic resin of one or more, polyolefin resin for example, the image height density polyethylene, medium density polyethylene, the polyvinyl resin of low density polyethylene etc., polypropylene, the acrylic resin of poly-Methyl-1-pentene/ethylene/cyclic olefine copolymer and vinyl-vinyl acetate copolymer; As polyethylene terephthalate, tygon naphtha ester, the alkyd resin of polybutyleneterephthalate; Corvic; Polyvinyl alcohol resin; Polycarbonate resin; Polyamide; Polyimide resin; Fluororesin; The multipolymer that contains their two or more polymerized units; The polymer blend that contains their two or more resins; The polymer alloy that contains their one or more resins.Especially, preferably use the thin slice that comprises alkyd resin.Backing sheet 1 can single shaft or biaxially oriented.Backing sheet 1 can comprise individual layer or two-layer or how different layer or identical layers.In addition, substrate thin layer 1 preferably has water proofing property.If the substrate thin layer has water proofing property, when the substrate thin layer was soaked in water, backing sheet destroyed such damage just for example can not cause.
The thickness of backing sheet 1 is without any restriction.Yet thickness is generally in the scope of 10-250 μ m, and preferably in the scope of 20-100 μ m.
In order to increase the bond strength between the backing sheet 1 and first bonding coat 2, surface treatment can be carried out in the surface of backing sheet 1.Surface treatment comprises for example Corona discharge Treatment, chemical treatment, resin coating etc.
The bonding agent that uses in first bonding coat 2 comprises various bonding agents, for example hot-melt adhesive, contact adhesive and resinoid.The kind of bonding agent comprises, for example caoutchouc adhesive, synthetic rubber binder, acrylic resin adhesive, alkyd resin bonding agent, polyvinylether resin binder, urethane resin bonding agent and organic siliconresin bonding agent.
The example of synthetic rubber binder comprises oil-extended styrene-butadiene rubber, Oppanol, polyisobutylene-isoprene rubber, isoprene rubber, the styrene-isoprene block copolymer, the styrene-butadiene block copolymer, styrene-ethylene-butylene block copolymer, ethylene-vinyl-acetic acid esters thermoplasticity synthetic rubber etc.The homopolymer that the example of acrylic adhesive comprises monomer is acrylic acid for example, methacrylate, ethylacrylic acid fat, propyl group acrylate, butylacrylic acid fat, 2-ethylhexyl acrylate, the methyl methacrylate, ethyl methacrylate, butyl methacrylate ester, and vinyl cyanide, the perhaps two or more multipolymers of their monomers.The alkyd resin bonding agent is the multipolymer of polyvalent alcohol and polyprotonic acid.Polyvalent alcohol comprises ethylene glycol, propylene glycol, and butylene glycol.Polyprotonic acid comprises terephthalic acids, hexanedioic acid, and maleic acid.The example of polyvinylether resin binder comprises polyvinylether and PVI polyvinyl isobutyl ether.The example of organic siliconresin bonding agent comprises dimethyl polysiloxane.Bonding agent can use or make up two or more compositions separately and use.
In these bonding agents, preferred alkyd resin bonding agent.
As required, a kind of tackifier, softening agent, antioxidant, filling agent, colorant for example dyestuff and pigment etc. can be mixed into first adhesive phase 2.
Tackifier comprise abietic resin, terpene phenol resin, terpene resin, aromatic hydrocarbons improved terpene resin, petroleum resin, coumarone indene resin, styrene resin, phenolic resin and xylene resin.Softening agent comprises processing oil, liquid rubber and plastifier.Filling agent comprises silica, talcum, clay, lime carbonate etc.
The thickness of first bonding coat 2 without limits, yet thickness is generally in the scope of 1-100 μ m, and preferably in the scope of 3-50 μ m.
In IC tag of the present invention, release agent layer 7 partly is formed on the position corresponding to circuit region 13, and this circuit region comprises electronic circuit 3 and IC chip 6, and release agent layer is on the interface between the backing sheet 1 and first bonding coat 2.
For example, as Fig. 2, Fig. 8 and shown in Figure 9, release agent layer 7 can form all surface of covering corresponding to two terminal positions of circuit region 13, perhaps as shown in Figure 3, release agent layer 7 can be formed on the position corresponding to circuit region 13 mesozones, but need reserve the zone that release agent layer 7 does not have covering.And as shown in Figure 6, release agent layer 7 can form all surface that does not cover corresponding to two terminal positions of circuit region 13, and reserves the partly covering of a zone.Further, release agent layer 7 can be formed on the position corresponding to circuit region 13 mesozones, and release agent layer is not formed on two terminal positions corresponding to circuit region 13.
As the result of this structure, first bonding coat 2 directly is pressed on the surface of substrate thin layer 1 and does not form on the position of release agent layer 7.And first bonding coat 2 directly be pressed on the position that is formed with release agent layer 7 on the release agent layer 7.Therefore, when IC tag for example pastes that the back IC tag comes off on the article 12, first bonding coat 2 comes off on the position that forms release agent layer 7 on the interface between first bonding coat 2 and the release agent layer 7, and IC tag is torn on the interface between the article 12 and second bonding coat 5, does not perhaps form on the position of release agent layer 7 to be torn in second bonding coat 5.Thereby electronic circuit 3 comes off on the position of electronic circuit 3 stickups first bonding coat 2 with backing sheet 1, and electronic circuit is cut open then.
The shape of release agent layer 7 preferably includes triangle, and quadrilateral, polygon be pentagon and greater than the polygon at five angles for example, oval and circle (with reference to figure 2, Fig. 3 and Fig. 6).Two shapes of release agent layer 7 can be identical or different.Two release agent layer 7 are preferably fully also separated individually, but can couple together on the part of release agent layer 7.
The separant that is used for release agent layer 7 comprises for example organic siliconresin, and long-chain contains alkyl group resin and fluororesin.
The thickness of release agent layer 7 is without any restriction.Yet thickness is preferably in the scope of 0.01-5 μ m, and more excellent scope at 0.03-1 μ m.
In IC tag of the present invention, electronic circuit 3 is formed on the surface of first bonding coat 2.
The average particulate diameter of metallic particles is preferably in the scope of 1-15 μ m, and more excellent scope at 2-10 μ m.Bonding agent comprises for example alkyd resin, Polyurethane resins, epoxy resin and phenolics.
The layer thickness of the circuitry lines 4 of formation electronic circuit is without any restriction.Yet the thickness of metal forming is preferably in the scope of 5-50 μ m, and the thickness of vapor deposition film or the metallic film that produced by sputter is preferably in the scope of 0.01-1 μ m, and the thickness of conducting resinl is preferably in the scope of 5-30 μ m.
The width of circuitry lines 4 is not particularly limited, but preferred scope at 0.01-10mm, more excellent scope at 0.1-3mm.
The method that is used for formation electronic circuit 3 on first bonding coat, 2 surfaces comprises, method that forms electronic circuit 3 for example, by the use bonding agent metal forming is adhered on the backing sheet 1, the etching processing metal forming, removing then is not the zone of electronic circuit.Etching processing can use the processing identical with general etching processing to carry out.Electronic circuit 3 is formed on the surface of first bonding coat 2, can also be by carrying out on the surface that conducting resinl is adhered to first bonding coat 2 with the shape of electronic circuit 3, by for example printing and exerting pressure.
The shape of electronic circuit 3 comprises, for example by Fig. 2 and shape shown in Figure 3.In Fig. 2 and Fig. 3, electronic circuit 3 is as an antenna, and by a kind of circuitry lines 4 of conductive material line is arranged with ten circles, this circle contains specific interval between every line, arranges with the exterior periphery direction inwards from rectangular substrate thin slice 1.Electronic circuit 3 can be arranged with ten circles as shown in Figures 2 and 3, perhaps can arrange by individual pen to nine circle, perhaps 11 or multiple circle arrange.
Result as this structure, as shown in Figure 4, first bonding coat 2 comes off on the position on the interface between first bonding coat 2 and the release agent layer 7, partly is being formed with on the position of release agent layer 7 at by-pass line 8 on this position, sticks on first bonding coat 2 and second bonding coat 5.On the position that does not form release agent layer 7, IC tag is torn in second bonding coat 5.Thereby electronic circuit 3 comes off on the position of electronic circuit 3 stickups first bonding coat 2 with backing sheet 1, and electronic circuit is cut open then.
The shape of by-pass line 8 does not have any restriction, comprise different shape, for example lack the ellipse of some circumference and round-shaped, perimeter line lacks on one side triangular shaped, and perimeter line lacks quadrangle form on one side, for example square, rectangle, rhombus and trapezoidal, perimeter line lack polygon on one side, for example pentagon and the polygon that contains more than five angles.
When by-pass line 8 was formed on the interior circuitry lines 4, the size of by-pass line 8 was usually less than the vacant zone that is surrounded by electronic circuit.And when by-pass line 8 was formed on the outermost circuitry lines 4, the size of by-pass line 8 was usually less than the size of IC tag.8 parts from circuitry lines 4 longest path lines from circuitry lines 4 to by-pass line preferably are not less than 2mm.
The thickness of by-pass line 8 is without any restriction, and is identical with the thickness of electronic circuit.Preferred thickness range is identical with the thickness range of electronic circuit.
The width of by-pass line 8 does not have any restriction, is preferably 0.01-10mm, and more excellent is 0.1-3mm.
The number of by-pass line 8 is preferably 1-10, more excellent 1-5.When forming the by-pass line 8 of a plurality of numbers, the shape of the by-pass line 8 of a plurality of numbers and/or size can identical or mutual differences.
The shape on plane outstanding 9 preferably includes for example square of symmetrical polygon, regular hexagon, and octagon and regualr decagon, and symmetric shape is for example circular, and their approximate shapes.
Plane outstanding 9 preferably contains the area that with good grounds following formula calculates:
S≥(2W)
2
Here S is the outstanding area in plane, and W adjoins the outstanding circuitry lines live width in plane.
Further, the plane outstanding 9 more excellent areas that contain with good grounds following formula calculating:
S≥(4W)
2
Here S and W are with above-mentioned identical.
The area upper limit on plane outstanding 9 preferably is not more than 10% of the vacant zone that surrounded by electronic circuit, more excellent be not more than 5% and optimum be not more than 3%.
The thickness on plane outstanding 9 is without any restriction, and is identical with the thickness of electronic circuit.Preferred thickness range is identical with the preferred thickness range of electronic circuit.
As shown in Fig. 3 and Fig. 6, plane outstanding 9 can directly extend to the by-pass line 8 of the circuitry lines 4 in the electronic circuit 3, perhaps can extend by the bonding line between the by-pass line 8 that connects plane outstanding 9 and circuitry lines 4 10.
Result as this structure, as shown in Figure 4, when passing through to use a cutter etc., when providing in the interface of a cutting 17 between IC tag second bonding coat 5 of article 12 and stickup article 12, IC tag just comes off, a finger shape element of insertion etc. enters cutting 17 and clamps an end of IC tag, be formed with on the position of release agent layer 7 in the interface between first bonding coat 2 and release agent layer 7, position at outstanding 9 stickup first bonding coats 2 of by-pass line 8 or plane and second bonding coat 5, first bonding coat 2 comes off, and in the interface between the article 12 and second bonding coat 5, perhaps do not form the position of release agent layer 7 at second bonding coat 5, IC tag is torn.Thereby electronic circuit 3 comes off on the position of electronic circuit 3 stickups first bonding coat 2 with backing sheet 1, and electronic circuit is cut open then.
As Fig. 8 and shown in Figure 9,9 circuitry lines that can directly extend in the electronic circuit 3 are given prominence on the plane, perhaps can extend by the bonding line 10 that connects between plane outstanding 9 and the circuitry lines 4.
As the result of this structure, when antenna cut on the release agent layer interface, as shown in figure 10, IC tag came off on the position of the outstanding stickup in a part of plane backing sheet.Therefore, antenna function is destroyed.
Plane outstanding 9 can extend to the interior circuitry lines 4 or the outermost circuitry lines 4 of electronic circuit.In addition, plane outstanding 9 can extend to any one circuitry lines of intermediate circuit line 4.When plane outstanding 9 extended to intermediate circuit line 4, linear the becoming of adjacent external circuit avoided plane outstanding 9.
The preferred 1-10 of number on plane outstanding 9 is individual, more excellent 1-5.
The material of by-pass line 8 is identical with the material of circuitry lines 4 in the electronic circuit.Preferred and the circuitry lines 4 of by-pass line 8 is an integral body.
Consider manufacture craft, preferably the material with circuitry lines 4 or bonding line 10 is identical for the material on plane outstanding 9, and plane outstanding 9 more excellent with circuitry lines 4 and bonding line 10 be an integral body.
The more excellent material with circuitry lines 4 or plane outstanding 9 of the material of bonding line 10 is identical.
Be used for by-pass line 8, the method that plane outstanding 9 and/or bonding line 10 extend to the circuitry lines 4 in the electronic circuit 3 comprises the whole bag of tricks.For example, the whole bag of tricks comprises one by a kind of metal forming formation electronic circuit of etching and by-pass line 8, the method for plane outstanding 9 and/or bonding line 10, a method that forms by-pass lines 8 by the circuitry lines in the printing or the electronic circuit 3 of exerting pressure 4.More excellent in a kind of metal forming formation electronic circuit of etching and by-pass line 8, the method for plane outstanding 9 and/or bonding line 10.
Outstanding 9 the time when forming by-pass line 8 and plane, they can form on the position that does not form release agent layer 7.But, form a by-pass line 8 or plane outstanding 9 at least on the more excellent position that in circuit region, forms release agent layer 7.When plane outstanding 9 extends to by-pass line 8, be preferably formed at least one by-pass line 8, it contains plane outstanding 9 and extends on the position that forms release agent layer 7 in the circuit region.
As another embodiment of IC tag of the present invention, as Fig. 9 and shown in Figure 10,9 circuitry lines 4 that can directly extend in the electronic circuit 3 are given prominence on the plane, and by-pass line 8 or bonding line 10 are not formed into circuitry lines 4 in the electronic circuit 3.In this case, plane outstanding 9 can form on the position that does not form release agent layer 7.But, on the more excellent position that in circuit region, forms release agent layer 7, form at least one plane outstanding 9.The number on plane outstanding 9 is preferably 1-10, more excellent 1-5.When the plane that forms a plurality of numbers gave prominence to 9, the shape and/or the size on the plane of a plurality of numbers outstanding 9 can be identical or different respectively.
The IC chip connects the two ends of electronic circuit.IC chip 6 can be formed on the inside of electronic circuit 3, the outside of electronic circuit 3, or on the top of electronic circuit 3.
For outmost turns and inner ring end with electronic circuit 3 are connected to IC chip 6, the outmost turns of electronic circuit 3 or inner ring end preferably are connected to IC chip 6, by from circulating electron circuit 3, forming line (wire jumper circuit) with the inside or outside directions of electronic circuit 3, and receive circulating electron circuit 3 without short circuit from an end.
The method that forms the wire jumper circuit comprises the method that is used to form a conductive circuit lines 4, part printing dielectric ink by the annular electronic circuit 3 of online intersection, from an end of electronic circuit 3 by serigraphy etc., printing conductive glue in the line on the printing dielectric ink that obtains by serigraphy etc. then.Conducting resinl comprises aforesaid conducting resinl.Dielectric ink comprises for example uv curing ink of light-curable ink.
The method that is used for IC chip 6 is connected to electronic circuit 3 ends comprises a method of attachment, by form an anisotropic conducting film on electronic circuit 3 end surface, connects anisotropic conducting film by flip chip method then.Flip chip method is the method for a simple conducting between electronic circuit 3 ends and IC chip 6, divide formation a line projection by an electrode part that is formed on IC chip 6, the line projection that will be formed on then on the IC chip 6 is pressed onto on the anisotropic conducting film that covers on electronic circuit 3 end surface, makes the line salient point embed in the anisotropic conducting film.
In IC tag of the present invention, suppress second bonding coat 5 with overlay electronic circuit 3, IC chip 6 and do not form first bonding coat 2 of electronic circuit 3 thereon.
The bonding agent that uses in second bonding coat 5 comprises various bonding agents, for example hot-melt adhesive, contact adhesive and resinoid.The kind of bonding agent comprises, and is for example identical with the aforementioned bonding agent that uses in first bonding coat 2.
Bonding agent can use or make up two or more compositions separately.In these bonding agents, preferred contact adhesive and more excellent acrylic pressure-sensitive adhesive.
The surface of second bonding coat 5 is preferably flat.
The thickness of second bonding coat 5 is without any restriction.Yet the thickness of overlay electronic circuit 3 and IC chip 6 parts is different with the part that covers first bonding coat 2.Maximum ga(u)ge is generally in the scope of 10-100 μ m, preferably in the scope of 15-50 μ m.
The surface of second bonding coat 5 can be coated with barrier liner 11.
As barrier liner 11, can use any barrier liner.For example, can use the barrier liner of contact second bonding coat 5 as required, in this liner, substrate surface be carried out isolation processing.As substrate, show the film that comprises various resins, polyethylene terephthalate for example, polybutyleneterephthalate, tygon, polypropylene and polyarylate, and various paper material for example are pressed with poly paper, be pressed with polyacrylic paper, clay tectorial paper, resin coating paper and viscose paper.
In this case, representative instance comprises a kind of release agent layer structure, and the separant that it comprises is organic siliconresin for example, and long-chain contains alkyl group resin and fluororesin.
The thickness of barrier liner 11 is without any restriction.Yet thickness can suitably be determined.
The formation of second bonding coat 5 can be by directly to electronic circuit 3, exerts pressure in IC chip 6 and first bonding coat, 2 surfaces that wherein do not form electronic circuit 3.Further, when by after applying bonding agent and forming second bonding coat 5 to the release agent layer surface of barrier liner 11, second bonding coat 5 can paste electronic circuit 3, IC chip 6 and wherein do not form first bonding coat, 2 surfaces of electronic circuit 3.
The method that forms first bonding coat, 2, the second bonding coats 5 and release agent layer 7 can make in all sorts of ways without any restriction.These methods comprise for example Kohler coater, knife type coater, fence coating machine, intaglio plate coating machine, glue spreader, curtain formula coating machine, metal mold coating machine, knife coater, web coater, mayer fence coating machine and kiss-coating machine.
As shown in figure 10, when the IC tag of another embodiment of the present invention came off after IC tag pastes article 12, IC tag and same position as shown in Figure 4 came off, except by-pass line 8 does not exist.As a result, electronic circuit 3 is cut open.
Example
To more specifically explain the present invention by example hereinafter.In addition, the present invention is not limited to these examples.
(example 1)
The formation of release agent layer 7 is, by with as shown in Figure 2 shape (angle 45 degree that in trapezoidal, contain oblique line, the width of the part of not exerting pressure is 3mm, be coated with two areas trapezoidal and that surround by exterior periphery of electronic circuit, be the area 75% that surrounds by an exterior periphery of electronic circuit approximately, gap length between trapezoidal end and backing sheet 1 outside is 1mm), apply organic siliconresin and to surface of pet film, (contain width 100mm, length 50mm and thickness 50 μ m),, dry down and solidified one minute at 130 ℃ then with certain amount to form the thickness 0.05 μ m after doing.Then, by the intaglio plate coating machine with the polyester-type hot-melt adhesive (by TOYO BOSEKI CO., LTD., produce, trade mark " BAYRON 30SS ") be applied on release agent layer 7 and backing sheet 1 surface, with certain amount to form the thickness 5 μ m after doing, to be pressed onto on first bonding coat.Further, on first bonding coat, 2 surfaces, heating contains one deck electrolytic copper foil of 35 μ m thickness and by 100 ℃ melting welding roll-in system.On the surface of electrolytic copper foil, use method for printing screen then, anti-etching ink printing is become ten circle circuitry lines 4 (antenna), contain long limit 45mm, minor face 15mm, live width 0.15mm also is connected to the interior circuitry lines 4 that contains live width 0.15mm in by-pass line 8.
Using a kind of ferric chloride solution that the electrolytic copper foil of printing is carried out etching processing, is not the part of annular electro route 4 and by-pass line 8 to remove.Then, anti-etching printing ink uses aqueous alkali to remove, and contains the electronic circuit 3 of by-pass line 8 with formation, as shown in Figure 2.
About the size of by-pass line 8 and the angle θ of tangent line, have the by-pass line 8 that rectangular perimeter lacks a long limit shape, contain the length of 5mm, the angle θ of the width of 7mm and 90 degree.Have the by-pass line 8 that the equilateral triangle girth lacks a limit shape, contain the length of side of 7mm and the angle θ of 60 degree.Semicircle by-pass line 8 with circular perimeter shape contains the radius of 3mm and the angle θ of 85 degree.Have the by-pass line 8 that trapezoidal girth lacks last Bottom Shape, contain the length of side of going to the bottom of 10mm, the last bottom side length of 3mm, the angle θ of high and 145 degree of 5mm.
For the end of the inner ring of conducting electronic circuit 3 (antenna) and the end of electronic circuit 3 outmost turns, by method for printing screen with a kind of uv curing ink with the linear gap that is printed onto between them.Ultra violet lamp is to solidify uv curing ink then.Then, silver paste (average particulate diameter of silver paste is 5 μ m, and bonding agent is an alkyd resin) is printed as linear (length that contains 10mm) on the curing line surface of uv curing ink, and is dry to form the wire jumper circuit.
Then, use gold thread to divide and form a line salient point in an IC chip 6 (producing trade mark " I/CODE " by PHILIPS CO.) electrode part.Use flip chip method IC chip 6 to be connected to the two ends of circuit by a kind of anisotropic conducting film (by SONY CHEMICALCO., LTD produces, trade mark " FP23322D ").
On the other hand, contain the preparation of a barrier liner 11 of second bonding coat 5, be (to produce by LINTEC CORPORATION by applying an acrylic pressure-sensitive adhesive, trade mark " PA-T1 ") to the isolation processing surface of barrier liner, its acquisition is by using roller cutter coating machine, use all surface of a kind of viscose paper one side of organic siliconresin isolation processing, this paper contains the thickness of 70 μ m, and dry second bonding coat 5 that contains 20 μ m thickness with formation.
Then, by pasting second bonding coat 5 forms electronic circuit 3 and IC chip 6 to backing sheet 1 all surface, this bonding coat 5 is in the barrier liner 11 that contains second bonding coat 5, and second bonding coat 5 covers first bonding coat 2, on electronic circuit 3 and the IC chip 6 with the preparation IC tag.
The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
The barrier liner that all surfaces in the IC tag is handled all peels off, and IC tag pastes on the acrylic resin plate.After 24 hours, by using cutter, provide cutting 17 in second bonding coat, length is the inside from the IC tag end to 5mm, and IC tag comes off from the acrylic resin plate.The part that is coated with the electronic circuit 3 of release agent layer 7 is stayed on the acrylic resin plate.The part polyethylene terephthalate thin slice with backing sheet 1 from the acrylic resin plate that is not release agent layer 7 comes off.Along with coming off, electronic circuit is cut open.The IC tag that comes off transmits and receives check (come off and cut check) by noncontact and checks.As a result, transmit and receive and to carry out.
30 IC tag are come off and cut check.As a result, 30 IC tag all are cut open.
(example 2)
The identical method preparation of describing in IC tag and the example 1 is except plane outstanding 9 and release agent layer 7 form as shown in Figure 3.The shape of release agent layer 7 contains the angle of 45 degree, be arranged in two ends of circuit region with equilateral triangle, the width 3mm of the part of not exerting pressure, the area that is coated with triangle and is coated with rhombus in the electronic circuit district at two ends of circuit region, and the area that surrounds by electronic circuit 3 and IC chip 6 exterior periphery, be to surround 70% of area by the electronic circuit exterior periphery approximately, the gap length between triangle shaped tip and backing sheet 1 outside is 1mm.The shape and size of by-pass line 8 are identical with shape and size in the example 1.The shape on plane outstanding 9 is the circles that contain diameter 2mm and thickness 35mm.Bonding line 10 contains the length of 0.5mm, the thickness of the width of 0.1mm and 35 μ m.The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
30 IC tag are come off and cut check.As a result, 30 IC tag all are cut open.
(example 3)
The identical method preparation of describing in IC tag and the example 1, except not forming by-pass line 8, plane outstanding 9 directly extends to circuitry lines 4, and plane outstanding 9 and release agent layer 7 form as shown in Figure 6.The shape of release agent layer 7 is oblique line angles of containing 45 degree in pentagon, the partial width 3mm that does not exert pressure, the area that is coated with two pentagons and surrounds by electronic circuit 3 exterior periphery, be to surround 60% of area by the electronic circuit exterior periphery approximately, the gap length between pentagon end and backing sheet 1 outside is 1mm.The shape on plane outstanding 9 is each square that contain the circle of diameter 2mm and contain length of side 2mm, and thickness 35mm.Bonding line 10 contains the length of 0.5mm, the thickness of the width of 0.1mm and 35 μ m.The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
30 IC tag are come off and cut check.As a result, 30 IC tag all are cut open.
(example 4)
The formation of release agent layer 7 is, by with as shown in Figure 8 shape (angle 45 degree that in trapezoidal, contain oblique line, the width 3mm of the part of not exerting pressure, be coated with two areas trapezoidal and that surround by exterior periphery of electronic circuit, be the area 75% that surrounds by an exterior periphery of electronic circuit approximately, gap length between trapezoidal end and backing sheet 1 outside is 1mm), apply organic siliconresin and to surface of pet film, (contain width 100mm, length 50mm and thickness 50 μ m),, dry down and solidified one minute at 130 ℃ then with certain amount to form the thickness 0.05 μ m after doing.Then, by the intaglio plate coating machine with the polyester-type hot-melt adhesive (by TOYO BOSEKI CO., LTD., produce, trade mark " BAYRON 30SS ") be applied on release agent layer 7 and backing sheet 1 surface, with certain amount to form the thickness 5 μ m after doing, to be pressed onto on first bonding coat.Further, on first bonding coat, 2 surfaces, heating contains one deck electrolytic copper foil of 35 μ m thickness and by 100 ℃ melting welding roll-in system.On the surface of electrolytic copper foil, use method for printing screen then, anti-etching ink printing is become ten circle circuitry lines 4 (antenna), contain long limit 45mm, minor face 15mm, live width 0.15mm, in plane outstanding 9 and bonding line 10, also be connected to interior circuitry lines, as shown in Figure 8.
Using a kind of ferric chloride solution that the electrolytic copper foil of printing is carried out etching processing, is not the annular electro route to remove, the part of plane outstanding 9 and bonding line 10.Then, anti-etching printing ink uses aqueous alkali to remove, and contains the electronic circuit 3 that plane outstanding 9 and bonding line 10 extend with formation, as shown in Figure 8.Each is a circle that contains diameter 1mm and thickness 35mm for the size on plane outstanding 9.Bonding line 10 contains the length of 0.5mm, the thickness of the width of 0.1mm and 35 μ m.
For the end of the inner ring of conducting electronic circuit 3 (antenna) and the end of electronic circuit 3 outmost turns, by method for printing screen with a kind of uv curing ink with the linear gap that is printed onto between them.Ultra violet lamp is to solidify uv curing ink then.Then, silver paste (average particulate diameter of silver paste is 5 μ m, and bonding agent is an alkyd resin) is printed as linear (length that contains 10mm) on the curing line surface of uv curing ink, and is dry to form the wire jumper circuit.
Then, use gold thread to divide and form a line salient point in an IC chip 6 (producing trade mark " I/CODE " by PHILIPS CO.) electrode part.Use flip chip method IC chip 6 to be connected to the two ends of circuit by a kind of anisotropic conducting film (by SONY CHEMICAL CO., LTD. produces, trade mark " FP23322D ").
On the other hand, contain the preparation of a barrier liner 11 of second bonding coat 5, be (to produce by LINTEC CORPORATION by applying an acrylic pressure-sensitive adhesive, trade mark " PA-T1 ") to the isolation processing surface of barrier liner, its acquisition is by using roller cutter coating machine, use all surface of a kind of viscose paper one side of organic siliconresin isolation processing, this paper contains the thickness of 70 μ m, and dry second bonding coat 5 that contains 20 μ m thickness with formation.
Then, by pasting second bonding coat 5 forms electronic circuit 3 and IC chip 6 to backing sheet 1 all surface, this bonding coat 5 is at the bottom of the isolation liner that contains second bonding coat 5 in 11, and second bonding coat 5 covers first bonding coat 2, on electronic circuit 3 and the IC chip 6 with the preparation IC tag.
The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
The barrier liner that all surface in the IC tag is handled all peels off, and IC tag pastes on the acrylic resin plate.After 24 hours, by using cutter, provide cutting 17 in second bonding coat, length is the inside from the IC tag end to 5mm, and IC tag comes off from the acrylic resin plate.The part that is coated with the electronic circuit 3 of release agent layer 7 is stayed on the acrylic resin plate.The part polyethylene terephthalate thin slice with backing sheet 1 from the acrylic resin plate that is not release agent layer 7 comes off.Along with coming off, electronic circuit is cut open.The IC tag that comes off transmits and receives check (come off and cut check) by noncontact and checks.As a result, transmit and receive and to carry out.
10 IC tag are come off and cut check.As a result, 10 IC tag all are cut open.
(example 5)
The identical method preparation of describing in IC tag and the example 1, except plane outstanding 9 and release agent layer 7 (contain the area that is coated with two quadrilaterals and surrounds by an exterior periphery of electronic circuit, be approximately by an exterior periphery encirclement area of electronic circuit 75%) form as shown in Figure 9.The size on plane outstanding 9 is squares that contain length of side 2mm and thickness 35mm.The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
10 IC tag are come off and cut check, identical with the method for describing in the example 1.As a result, 10 IC tag all are cut open.
(example 6)
The identical method preparation of describing in IC tag and the example 2 is except plane outstanding 9 forms with as shown in Figure 11 shape.The size on plane outstanding 9 is the circles that contain diameter 2mm and thickness 35mm.The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
10 IC tag are come off and cut check, identical with the method for describing in the example 1.As a result, 10 IC tag all are cut open.
(comparative example 1)
The identical method preparation of describing in IC tag and the example 1 is not except forming by-pass line 8.The IC tag that obtains transmits and receives by noncontact and checks.As a result, transmit and receive and correctly to carry out.
10 IC tag are come off and cut check, identical with the method for describing in the example 1.As a result, in 10 IC tag 6 can come off and not destroy electronic circuit.The IC tag of not destroying electronic circuit and coming off transmits and receives by noncontact to be checked.As a result, transmit and receive and correctly to carry out.
IC tag of the present invention can be used for for example goods of article, the Management label of stores and loading.
Claims (15)
1. IC tag, contain a kind of structure, comprise and be laminated to lip-deep first bonding coat of backing sheet, an electronic circuit that comprises the circuitry lines that contains by-pass line, and be connected to IC chip at lip-deep this electronic circuit of first bonding coat, second bonding coat that is used for overlay electronic circuit and IC chip on the lamination, and partly be formed on locational release agent layer corresponding to a circuit region, wherein by the tangent line of the junction by-pass line between by-pass line and circuitry lines, with the angle that forms at the tangent line of this junction circuitry lines more than or equal to 45 degree, and less than 180 degree, this circuit region comprises this electronic circuit and this IC chip, and release agent layer is on the interface between the backing sheet and first bonding coat.
2. IC tag as claimed in claim 1, wherein at least one by-pass line is formed on the position that is formed with release agent layer in the circuit region.
3. as the IC tag of claim 1 or 2, one of them plane is given prominence to and is extended to by-pass line.
4. as the IC tag of claim 1 or 2, wherein form the scope of release agent layer with the 20-90% that covers the area that is surrounded by the exterior periphery of circuit region by first bonding coat.
5. as the IC tag of claim 1 or 2, one of them barrier liner is formed on the surface that does not paste first bonding coat of second bonding coat.
6. IC tag, it contains a kind of structure, comprise and be laminated to lip-deep first bonding coat of backing sheet, the outstanding electronic circuit in plane that contains an extension, and be connected to the IC chip that is formed on lip-deep this electronic circuit of first bonding coat, second bonding coat that is used for overlay electronic circuit and IC chip that presses, and partly be formed on locational release agent layer corresponding to a circuit region, this circuit region comprises this electronic circuit and this IC chip, and this release agent layer is on the interface between the backing sheet and first bonding coat.
7. IC tag as claimed in claim 6, wherein at least one by-pass line is formed on the position that is formed with release agent layer in the circuit region.
8. IC tag as claimed in claim 6, the wherein outstanding area that has according to following formula calculating in this plane:
S≥(2W)
2
Here S is the outstanding area in this plane, and W adjoins the outstanding circuitry lines live width in plane.
9. IC tag as claimed in claim 6 wherein forms the scope of release agent layer with the 20-90% that covers the area that is surrounded by the exterior periphery of circuit region by first bonding coat.
10. IC tag as claimed in claim 6, one of them barrier liner are formed on the surface that does not paste first bonding coat of second bonding coat.
11. IC tag, it contains a kind of structure, comprise and be laminated to lip-deep first bonding coat of backing sheet, the outstanding electronic circuit in plane that contains an extension, and be connected to the IC chip that is formed on lip-deep this electronic circuit of first bonding coat, second bonding coat that is used for overlay electronic circuit and IC chip on the lamination, and partly be formed on locational release agent layer corresponding to two end parts of a circuit region, this circuit region comprises this electronic circuit and this IC chip, and this release agent layer is on the interface between the backing sheet and first bonding coat.
12. as the IC tag of claim 11, wherein at least one by-pass line is formed on the position that is formed with release agent layer in the circuit region.
13. as the IC tag of claim 11, wherein this plane is given prominence to and is had the area that calculates according to following formula:
S≥(2W)
2
Here S is the outstanding area in this plane, and W adjoins the outstanding circuitry lines live width in plane.
14., wherein form the scope of release agent layer with the 20-90% that covers the area that is surrounded by the exterior periphery of circuit region by first bonding coat as the IC tag of claim 11.
15. as the IC tag of claim 11, one of them barrier liner is formed on the surface that does not paste first bonding coat of second bonding coat.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002338640 | 2002-11-21 | ||
| JP338640/2002 | 2002-11-21 | ||
| JP364031/2002 | 2002-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1714369A CN1714369A (en) | 2005-12-28 |
| CN100367308C true CN100367308C (en) | 2008-02-06 |
Family
ID=35719268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200380103786XA Expired - Fee Related CN100367308C (en) | 2002-11-21 | 2003-11-20 | IC tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100367308C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7564354B2 (en) * | 2005-12-29 | 2009-07-21 | International Business Machines Corporation | Monitoring device for detecting opening of packaging |
| JP4866710B2 (en) * | 2006-11-16 | 2012-02-01 | リンテック株式会社 | Recording medium built-in structure, recording medium built-in structure laminate, and non-contact recording method using them |
| US8878675B2 (en) * | 2011-11-08 | 2014-11-04 | Avery Dennison Corporation | Merchandise tags with removal detection for theft prevention |
| DE112013007134T5 (en) * | 2013-06-03 | 2016-06-02 | Walki Group | A sealing badge having conductive features for preventing counterfeiting of a product and method of making the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000105807A (en) * | 1998-09-29 | 2000-04-11 | Toshiba Chem Corp | Label type noncontact data carrier |
| JP2001013874A (en) * | 1999-06-25 | 2001-01-19 | Matsushita Electric Works Ltd | Id label |
| JP2001109866A (en) * | 1999-10-13 | 2001-04-20 | Hitachi Maxell Ltd | Noncontact communication type semiconductor device |
-
2003
- 2003-11-20 CN CNB200380103786XA patent/CN100367308C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000105807A (en) * | 1998-09-29 | 2000-04-11 | Toshiba Chem Corp | Label type noncontact data carrier |
| JP2001013874A (en) * | 1999-06-25 | 2001-01-19 | Matsushita Electric Works Ltd | Id label |
| JP2001109866A (en) * | 1999-10-13 | 2001-04-20 | Hitachi Maxell Ltd | Noncontact communication type semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1714369A (en) | 2005-12-28 |
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