WO2004028956A3 - Verfahren und mikromechanisches bauelement - Google Patents

Verfahren und mikromechanisches bauelement Download PDF

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Publication number
WO2004028956A3
WO2004028956A3 PCT/DE2003/000630 DE0300630W WO2004028956A3 WO 2004028956 A3 WO2004028956 A3 WO 2004028956A3 DE 0300630 W DE0300630 W DE 0300630W WO 2004028956 A3 WO2004028956 A3 WO 2004028956A3
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical component
sacrificial layer
exposed
disclosed
layer
Prior art date
Application number
PCT/DE2003/000630
Other languages
English (en)
French (fr)
Other versions
WO2004028956A2 (de
Inventor
Gerhard Lammel
Frank Schaefer
Heribert Weber
Stefan Finkbeiner
Original Assignee
Bosch Gmbh Robert
Gerhard Lammel
Frank Schaefer
Heribert Weber
Stefan Finkbeiner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Gerhard Lammel, Frank Schaefer, Heribert Weber, Stefan Finkbeiner filed Critical Bosch Gmbh Robert
Priority to EP03717116A priority Critical patent/EP1546027A2/de
Priority to US10/529,425 priority patent/US20060037932A1/en
Priority to JP2004538667A priority patent/JP2006500232A/ja
Publication of WO2004028956A2 publication Critical patent/WO2004028956A2/de
Publication of WO2004028956A3 publication Critical patent/WO2004028956A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/12—STM or AFM microtips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0115—Porous silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)

Abstract

Es wird ein Herstellungsverfahren und ein mikromechanisches Bauelement vorgeschlagen, bei dein poröses Silizium (106) als Opferschicht dient und durch Wegätzen der Opferschicht eine Funktionsschicht (130) freigelegt wird.
PCT/DE2003/000630 2002-09-26 2003-02-27 Verfahren und mikromechanisches bauelement WO2004028956A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03717116A EP1546027A2 (de) 2002-09-26 2003-02-27 Verfahren und mikromechanisches bauelement
US10/529,425 US20060037932A1 (en) 2002-09-26 2003-02-27 Method and micromechanical component
JP2004538667A JP2006500232A (ja) 2002-09-26 2003-02-27 形成方法及びマイクロメカニックスの構成要素

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10244785A DE10244785A1 (de) 2002-09-26 2002-09-26 Verfahren und mikromechanisches Bauelement
DE10244785.3 2002-09-26

Publications (2)

Publication Number Publication Date
WO2004028956A2 WO2004028956A2 (de) 2004-04-08
WO2004028956A3 true WO2004028956A3 (de) 2004-12-23

Family

ID=31984076

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000630 WO2004028956A2 (de) 2002-09-26 2003-02-27 Verfahren und mikromechanisches bauelement

Country Status (5)

Country Link
US (1) US20060037932A1 (de)
EP (1) EP1546027A2 (de)
JP (1) JP2006500232A (de)
DE (1) DE10244785A1 (de)
WO (1) WO2004028956A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244786A1 (de) * 2002-09-26 2004-04-08 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren
DE60320391D1 (de) * 2003-07-04 2008-05-29 St Microelectronics Srl Herstellungsverfahren für eine Halbleitervorrichtung mit einem hängenden Mikrosystem und entsprechende Vorrichtung
DE102006023768A1 (de) * 2006-05-20 2007-11-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrogreifer
US20080277332A1 (en) * 2007-05-11 2008-11-13 Becton, Dickinson And Company Micromachined membrane filter device for a glaucoma implant and method for making the same
CN104766794A (zh) * 2014-01-02 2015-07-08 中国科学院上海硅酸盐研究所 一种碲化铋基材料的干法刻蚀方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542558A (en) * 1993-09-18 1996-08-06 Robert Bosch Gmbh Method for manufacturing micro-mechanical components using selective anodization of silicon
US5594171A (en) * 1994-10-31 1997-01-14 Kabushiki Kaisha Tokai Rika Denki Seisakusho Capacitance type acceleration sensor
EP0895276A1 (de) * 1997-07-31 1999-02-03 STMicroelectronics S.r.l. Verfahren zum Herstellen integrierter Mikrostrukturen von Einkristall-Halbleitermaterialien
EP1088785A1 (de) * 1999-09-10 2001-04-04 Ecole Polytechnique Federale De Lausanne Verfahren zur Herstellung einer dreiimensional hängenden Mikrostruktur, eine integrierte Mikrostruktur hergestellt durch dieses Verfahren und ein regelbares interiertes mikro-optisches Bauelement
WO2002051741A2 (de) * 2000-12-22 2002-07-04 Robert Bosch Gmbh Verfahren zur herstellung eines halbleiterbauelements sowie ein nach dem verfahren hergestelltes halbleiterbauelement, wobei das halbleiterbauelement insbesondere eine bewegliche masse aufweist

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69817518D1 (de) * 1997-07-10 2003-10-02 St Microelectronics Srl Verfahren zur Herstellung einer integrieten Schaltungsstruktur durch Entfernung einer Opferschicht

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542558A (en) * 1993-09-18 1996-08-06 Robert Bosch Gmbh Method for manufacturing micro-mechanical components using selective anodization of silicon
US5594171A (en) * 1994-10-31 1997-01-14 Kabushiki Kaisha Tokai Rika Denki Seisakusho Capacitance type acceleration sensor
EP0895276A1 (de) * 1997-07-31 1999-02-03 STMicroelectronics S.r.l. Verfahren zum Herstellen integrierter Mikrostrukturen von Einkristall-Halbleitermaterialien
EP1088785A1 (de) * 1999-09-10 2001-04-04 Ecole Polytechnique Federale De Lausanne Verfahren zur Herstellung einer dreiimensional hängenden Mikrostruktur, eine integrierte Mikrostruktur hergestellt durch dieses Verfahren und ein regelbares interiertes mikro-optisches Bauelement
WO2002051741A2 (de) * 2000-12-22 2002-07-04 Robert Bosch Gmbh Verfahren zur herstellung eines halbleiterbauelements sowie ein nach dem verfahren hergestelltes halbleiterbauelement, wobei das halbleiterbauelement insbesondere eine bewegliche masse aufweist

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
LEE C-S ET AL: "A new wide-dimensional freestanding microstructure fabrication technology using laterally formed porous silicon as a sacrificial layer", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 84, no. 1-2, 1 August 2000 (2000-08-01), pages 181 - 185, XP004222511, ISSN: 0924-4247 *
SPLINTER A ET AL: "Thick porous silicon formation using implanted mask technology", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 76, no. 1-3, 1 June 2001 (2001-06-01), pages 354 - 360, XP004241143, ISSN: 0925-4005 *

Also Published As

Publication number Publication date
JP2006500232A (ja) 2006-01-05
WO2004028956A2 (de) 2004-04-08
US20060037932A1 (en) 2006-02-23
DE10244785A1 (de) 2004-04-08
EP1546027A2 (de) 2005-06-29

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