WO2004021758A1 - Vorrichtung zum bestücken von substraten mit elektrischen bauelementen - Google Patents
Vorrichtung zum bestücken von substraten mit elektrischen bauelementen Download PDFInfo
- Publication number
- WO2004021758A1 WO2004021758A1 PCT/DE2003/002564 DE0302564W WO2004021758A1 WO 2004021758 A1 WO2004021758 A1 WO 2004021758A1 DE 0302564 W DE0302564 W DE 0302564W WO 2004021758 A1 WO2004021758 A1 WO 2004021758A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tables
- substrates
- gripper
- components
- feed devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Definitions
- the invention relates to a device for equipping substrates with electrical components by means of at least one movable placement head with at least one gripper for the components, the substrates being fixable on two adjacent tables, with feed devices with pick-up locations for the components on the side of the tables are provided and at least one stationary optical sensor device is provided for determining the component position on the placement head.
- Such a device is e.g. through Figures 58 to 60 and the associated page 15 of EP 1117287 A.
- the devices then have a plurality of tables which are closely adjacent to one another and on the sides of which the feed devices for the components are arranged.
- the optical sensor devices are located in a space between the feed devices and the tables.
- the invention has for its object to reduce the effort for the sensor devices and to increase the placement accuracy.
- the sensor device so that the number is halved. Since the number of spaces is also halved, the overall length of the placement device is reduced. Likewise, the wiring and control effort is reduced by half. A particular advantage is that all components are measured from both sides using one and the same sensor device. B. temperature-related deviations between two cameras are eliminated. The central arrangement of the sensor device minimizes temperature-related positional shifts in the camera position.
- An advantageous development of the invention according to claim 2 ensures that the placement head can move in a simple linear guide path, the pick-up locations for the components and the sensor device being located below the gripper track.
- the placement performance is significantly increased.
- the arrangement of the guideways on a carrier makes it possible to form them exactly parallel to one another and also to match the two positioning systems exactly to one another.
- FIG. 1 shows a schematic top view of a device for loading substrates 1 that can be fed in and out in a linear transport path 2.
- a stationary beam-like carrier 3 extends parallel to the transport path 2 and has on its two longitudinal sides stationary longitudinal guides 4, along which placement heads 5 with grippers 6 can be displaced.
- stationary transverse guides 7 are arranged in the central region of the device, on which slide-like tables 8 with the fixed xed substrates 1 are displaceable.
- optical sensor devices 9 designed as cameras are arranged in a stationary manner between the adjacent tables 8 under the gripper tracks.
- the placement position of the component 8 on the substrate 1 is defined by exact positioning of the placement head in the longitudinal direction and of the table 8 in the transverse direction, onto which the component can be placed by lowering the respective gripper 6.
- the sensor device 9 measures the relative position of the component on the placement head 5. A deviation of the component is taken into account when it is placed on the substrate 1 by appropriate correction of the coordinates of the table 8 or the placement head 5.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03790661A EP1527663A1 (de) | 2002-08-06 | 2003-07-30 | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10236004.9 | 2002-08-06 | ||
DE10236004A DE10236004B4 (de) | 2002-08-06 | 2002-08-06 | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004021758A1 true WO2004021758A1 (de) | 2004-03-11 |
Family
ID=30775045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/002564 WO2004021758A1 (de) | 2002-08-06 | 2003-07-30 | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1527663A1 (de) |
CN (1) | CN100409735C (de) |
DE (1) | DE10236004B4 (de) |
WO (1) | WO2004021758A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049336A (ja) * | 2004-07-30 | 2006-02-16 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
CN103722312A (zh) * | 2013-11-14 | 2014-04-16 | 苏州昌飞自动化设备厂 | 一种电子元件的双侧边脚焊接机的进料搬运机构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1009211A2 (de) * | 1994-01-10 | 2000-06-14 | Mydata Automation AB | Maschinenkonzept für Oberflächenmontage |
EP1117287A1 (de) * | 1998-09-25 | 2001-07-18 | Matsushita Electric Industrial Co., Ltd. | Verfahren und einrichtung zur montage von bauteilen |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5743001A (en) * | 1996-08-16 | 1998-04-28 | Amistar Corporation | Surface mount placement system with single step, multiple place carriage |
JP2001237596A (ja) * | 2000-02-24 | 2001-08-31 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2001267798A (ja) * | 2000-03-17 | 2001-09-28 | Murata Mfg Co Ltd | 部品装着装置 |
-
2002
- 2002-08-06 DE DE10236004A patent/DE10236004B4/de not_active Expired - Fee Related
-
2003
- 2003-07-30 EP EP03790661A patent/EP1527663A1/de not_active Withdrawn
- 2003-07-30 CN CNB038190044A patent/CN100409735C/zh not_active Expired - Fee Related
- 2003-07-30 WO PCT/DE2003/002564 patent/WO2004021758A1/de not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1009211A2 (de) * | 1994-01-10 | 2000-06-14 | Mydata Automation AB | Maschinenkonzept für Oberflächenmontage |
EP1117287A1 (de) * | 1998-09-25 | 2001-07-18 | Matsushita Electric Industrial Co., Ltd. | Verfahren und einrichtung zur montage von bauteilen |
Also Published As
Publication number | Publication date |
---|---|
EP1527663A1 (de) | 2005-05-04 |
DE10236004A1 (de) | 2004-02-26 |
DE10236004B4 (de) | 2007-08-23 |
CN1675975A (zh) | 2005-09-28 |
CN100409735C (zh) | 2008-08-06 |
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