WO2004019663A2 - Structures laminees et procede d'essai electrique desdites structures - Google Patents

Structures laminees et procede d'essai electrique desdites structures Download PDF

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Publication number
WO2004019663A2
WO2004019663A2 PCT/US2003/026874 US0326874W WO2004019663A2 WO 2004019663 A2 WO2004019663 A2 WO 2004019663A2 US 0326874 W US0326874 W US 0326874W WO 2004019663 A2 WO2004019663 A2 WO 2004019663A2
Authority
WO
WIPO (PCT)
Prior art keywords
thin
laminate sheet
laminate
conductive layers
dielectric layer
Prior art date
Application number
PCT/US2003/026874
Other languages
English (en)
Other versions
WO2004019663A3 (fr
Inventor
Mark Dhaenens
Scott Mckee
William Zidar
Todd Bingham
Original Assignee
Park Electrochemical Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Park Electrochemical Corp. filed Critical Park Electrochemical Corp.
Priority to AU2003262924A priority Critical patent/AU2003262924A1/en
Publication of WO2004019663A2 publication Critical patent/WO2004019663A2/fr
Publication of WO2004019663A3 publication Critical patent/WO2004019663A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Definitions

  • This invention concerns thin-laminate sheets, and more particularly,
  • PCBs are typically made of one or more layers of an insulating or
  • dielectric material with a continuous thin-layer of a conductive material such as
  • connection areas of printed circuits is then made by applying a traditional mask or
  • one or more devices are formed on the printed circuit
  • the PCB is made from a thin-laminate panel
  • Each panel of the PCB includes a
  • dielectric material such as a resin-impregnated fiberglass cloth layer
  • the panel further includes one and preferably two thin-conductive layers
  • PCBs can be constructed in several different arrangements depending on the face of the "capacitive" PCB.
  • PCBs can be constructed in several different arrangements depending on the face of the "capacitive" PCB.
  • the thick panels have a thickness of about
  • the distance between the conductive layers is generally
  • Panels that are constructed with a thin dielectric layer are often
  • the thickness of the dielectric layer is determined according to a number of factors
  • a conventional thin-laminate panel 10 is illustrated in Figure 1.
  • panel 10 includes a dielectric layer 20 (e.g., a prepreg layer comprising a fiber-glass
  • the first and second conductive layers 30, 40 is a thin copper layer.
  • dielectric layer can contain impurities that can lead to failure of the panel, e.g., a
  • an end user may form specific electrical circuit
  • testing is designed to ensure that the
  • the thin-laminate panels are usually
  • the sheet in selected sections to form smaller, individual panels from which the
  • PCBs are made.
  • one exemplary sheet size is 36"x 48", which is actually molded as a sheet with slightly larger dimensions (e.g., 37"x 49") and then
  • test result indicates the laminate as defective, when it is not, the sole problem being
  • a method for testing for defects in a thin-laminate structure suitable
  • the invention includes a thin-laminate sheet that is constructed so that
  • the two conductive layers are electrically isolated from one another along the
  • test is carried out on the thin-laminate sheet prior to shearing or cutting the sheet
  • Fig. 1 is perspective view of a conventional thin-laminate panel
  • Fig. 2 is a partial cross-sectional view of a thin-laminate sheet
  • Fig. 3 is a partial cross-sectional view of a thin-laminate sheet
  • Fig. 4 is a partial cross-sectional view of a thin-laminate sheet
  • thin-laminate sheet or panel refers to a laminate
  • laminate structure that has a thickness from about A mil (0.0005 inches) to about 6
  • Hipot testing of the thin-laminate structure is used to verify process defects, such as
  • probes that are connected to the testing device are positioned at select points of the
  • one probe is connected to one of the
  • conductive layers i.e., a power plane
  • a high voltage is applied.
  • the voltage is rapidly ramped up to 500 N and applied for a
  • predetermined time period The precise voltage value and the time during which it is applied can vary depending upon the laminate material and certain design
  • Hipot tester is commercially available under the trade
  • the tester includes a
  • Hipot table that can be a stainless steel plate or a sheet of 1/0 core on which the
  • a ground connector (neg. probe) is
  • a touch test probe (pos. probe) is placed on
  • tester detects any leakage current through the thin-laminate sheet.
  • the tester is a
  • Figure 2 is a partial cross-sectional view of a thin-laminate sheet 100
  • the thin-laminate sheet 100 is formed of three components,
  • the dielectric layer 130 is disposed between the first conductive layer
  • the thin-film sheet 100 has a
  • one of the first and second conductive layers 120, 140 has smaller dimensions than the dielectric layer 130 and the other of the first and
  • second conductive layers 120, 140 has larger dimensions than the dielectric layer
  • the first conductive layer 120 has smaller
  • the resulting structure has a
  • first conductive layer 120 can
  • the second conductive layer 140 can have the greater dimensions and the second conductive layer 140 can have the
  • a first shoulder 122 is formed between the edge of
  • the three layers 120, 130, 140 are not aligned at the peripheral edge 110 but
  • the dielectric layer 130 extends beyond the conductive layer 120 a
  • first distance and the second conductive layer 140 extends beyond the dielectric layer 130 a second distance with the first and second distances being a sufficient
  • distances can be the same distances or be different distances.
  • the sum of the distances can be the same distances or be different distances. For example, the sum of
  • one layer extends beyond
  • the adjacent layer by greater than about 1/16 inch; however, the sheet can be
  • one layer extends greater than 1 inch (e.g., 2 inches) relative to the
  • the layers can be arranged to extend other distances from one another so long as
  • the two conductive layers 120, 140 remain electrically isolated from each other.
  • Figure 3 is a partial cross-sectional view of a thin-laminate sheet 200
  • the thin-laminate sheet 200 is formed of the
  • the first conductive layer 120 the dielectric layer 130, and the second conductive
  • 200 has a configuration in which the first and second conductive layers 120, 140
  • peripheral edge 110 is thus defined by the
  • the dielectric layer 130 extends beyond the edges of the first and second conductive
  • the dielectric layer 130 extends beyond the
  • the distance which the dielectric layer 130 is isolated from one another is isolated from one another. For example, the distance which the dielectric layer 130 is isolated from one another.
  • the dielectric layer 130 extends beyond the two conductive
  • the dielectric layer 130 extends a greater distance, such as 1 inch or
  • the layers can be arranged to extend other distances from one another so long as the two conductive layers 120, 140 remain electrically isolated
  • Figure 4 is a partial cross-sectional view of a thin-laminate sheet 300
  • the thin-laminate sheet 300 is formed of the
  • the thin-laminate sheet 300 has
  • edge of the dielectric layer 130 does not extend to the peripheral edges of the first
  • the insulating member 150 is disposed within this open space and is
  • dielectric layer 130 at one end thereof and extends beyond the peripheral edges of
  • the insulating member 150 is generally in the form of a "picture frame" with the
  • dielectric layer 130 extending between a central opening defined by the insulating
  • the insulating member is disposed in the region where the open space existed, the insulating member
  • the insulating member 150 extends beyond the peripheral edges of
  • first and second conductive layers 120, 140 a sufficient distance to ensure that
  • first and second conductive layers 120, 140 are electrically isolated from one
  • the insulating member 150 is another. According to one exemplary embodiment, the insulating member 150
  • the insulating member 150 extends beyond the
  • the 300 can be arranged so that the insulating member 150 extends a greater distance
  • the layers can be arranged to extend other distances from one another so long as the two conductive layers 120, 140 remain
  • the purpose of the insulating member 150 is to electrically
  • insulating member 150 can be in the form of a film formed of a material with
  • Exemplary materials for forming the insulating film 150 include but are not limited
  • TEDLARTM which is a polyvinyl fluoride (PNF) film and TEFLON®
  • fluoropolymer resins commercially available from DuPont. It will also be appreciated that
  • the aforementioned insulating mediums are merely exemplary and other
  • the thin-laminate sheet 300 During the manufacturing of the thin-laminate sheet 300, the
  • thin-laminate sheet 300 The thin-laminate sheets of the various embodiments disclosed
  • the thicknesses of the individual layers are chosen so that the resulting product is
  • the dielectric material can be any suitable dielectric material that is
  • Suitable dielectric materials include but are not limited to a plastic film, such as
  • acrylics or polyimides e.g., KAPTON® available from DuPont.
  • the dielectric material can be a reinforcement
  • the dielectric material reinforcement is preferably
  • quartz quartz, cellulose, paper, and non-woven organic reinforcements, such as aramid,
  • polyester, orlon, nylon, etc., and thermoplastic or thermoset film reinforcements are examples of thermoplastic or thermoset film reinforcements
  • polyimide e.g., aromatic polyamide fibers (such as KEVLAR® or THERMOUNT®, both of which are available from DuPont)
  • polyester fluorinated
  • the resin is preferably chosen from the group
  • thermoplastic resins consisting of thermoplastic resins, thermoset resins, and mixtures thereof.
  • thermoset resins consisting of thermoplastic resins, thermoset resins, and mixtures thereof.
  • exemplary resin systems include epoxy, bismaleimide triazine, polyimide,
  • polyesters as well as combinations and modifications thereof.
  • the dielectric layer is a woven glass fabric reinforced high Tg
  • the dielectric layer of the thin-layer typically, the dielectric layer of the thin-layer
  • laminate sheet has a thickness from about 0.0005 inches to about 0.010 inches
  • the conductive layers are formed of conductive materials that are
  • the conductive layer is formed of
  • the conductive material is
  • a conductive metal that is selected from the group consisting of aluminum, silver,
  • copper has superior conductive properties, it is typically the material of choice and in one exemplary embodiment,
  • the conductive layer has a thickness from about 0.0001 inches to about 0.01 inches.
  • the thin-laminate sheets can be made according to standard
  • Hipot high potential (high- voltage)
  • test can be performed using a Hipot tester (e.g., QuadTech Guardian 400 AC/DC
  • a relatively high-voltage e.g., 500
  • V is applied through a high voltage probe to one of the conductive layers (e.g., the
  • the unit As soon as the unit detects the presence of this current conduction between the two conductive layers, the unit preferably generates a signal to indicate the existence of
  • the thin-laminate sheet can then be
  • the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the thin-laminate panel is eliminated. In actual use, the customer who purchases the
  • thin-laminate panel subjects the panel to further processing to form the printed
  • edges of the panel are etched away or
  • the thin-laminate sheet will fail the Hipot test due to touching of the conductive
  • a thin-laminate sheet having the configuration illustrated in Fig. 3 is
  • the first and second conductive layers 120, 140 are then disposed
  • the thin-laminate sheet is
  • TIME is set to Auto with a predetermined HOLD time period. The user uses keys
  • the arrow down key is selected to LMI ⁇ LIMIT and the limit
  • the power is turned on in the tester and the user selects HIPOT from
  • the thin-laminate sheet that is to be tested is placed on the
  • test probe e.g., a neg. probe
  • test probe e.g., a pos. probe

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé d'essai permettant de détecter des défauts dans une structure mince laminée adaptée pour être utilisée dans un certain nombre d'applications différentes, y compris la fabrication de cartes à circuit imprimé capacitives. On procède à l'essai sur la feuille mince laminée immédiatement après la lamination mais avant la formation de multiples panneaux à partir de la feuille. L'invention concerne également une feuille mince laminée construite de manière que les deux couches conductrices soient électriquement isolées l'une de l'autre le long des bords périphériques de la feuille.
PCT/US2003/026874 2002-08-26 2003-08-26 Structures laminees et procede d'essai electrique desdites structures WO2004019663A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003262924A AU2003262924A1 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40629302P 2002-08-26 2002-08-26
US60/406,293 2002-08-26

Publications (2)

Publication Number Publication Date
WO2004019663A2 true WO2004019663A2 (fr) 2004-03-04
WO2004019663A3 WO2004019663A3 (fr) 2004-04-01

Family

ID=31946964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/026874 WO2004019663A2 (fr) 2002-08-26 2003-08-26 Structures laminees et procede d'essai electrique desdites structures

Country Status (2)

Country Link
AU (1) AU2003262924A1 (fr)
WO (1) WO2004019663A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Also Published As

Publication number Publication date
WO2004019663A3 (fr) 2004-04-01
AU2003262924A8 (en) 2004-03-11
AU2003262924A1 (en) 2004-03-11

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