WO2004005589A1 - Bain pour depôt electrolytique d’or - Google Patents
Bain pour depôt electrolytique d’or Download PDFInfo
- Publication number
- WO2004005589A1 WO2004005589A1 PCT/CH2003/000400 CH0300400W WO2004005589A1 WO 2004005589 A1 WO2004005589 A1 WO 2004005589A1 CH 0300400 W CH0300400 W CH 0300400W WO 2004005589 A1 WO2004005589 A1 WO 2004005589A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gold
- bath
- bismuth
- bath according
- sulfite
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- the present invention relates to the field of baths for electrolytic deposits. It relates, more particularly, to a sulphite gold bath of the type used to deposit layers of gold that are both ductile and thick, that is to say typically more than 200 ⁇ m. These deposits are particularly well suited, in particular, to the production of conductive protuberances, known under the name of "bumps", used to connect electronic chips.
- gold has been present in electrolytic baths in the form of cyanide complexes, such as (Au (CN) 2 ) " .
- cyanide complexes such as (Au (CN) 2 ) " .
- Toxicity being a very relative concept, we will define as toxic a harmful substance in the quantities used for the intended application and as non-toxic a substance not presenting no harmfulness for this application.
- metal layer be particularly ductile, regular, with fine grains and having a very low hardness.
- the sulphite gold baths currently known provide deposits that are too hard, which requires additional heat treatment to soften them.
- they use toxic grain refiners, containing arsenic or thallium.
- the solutions obtained are aggressive and attack the substrates, especially when it comes to photoresists.
- the main object of the present invention is to provide a sulphite gold bath free of toxic compounds and making it possible to deposit particularly tender, without having to use a subsequent heat treatment.
- the pH of the bath obtained is neutral and the solution does not attack the photoresists commonly used.
- the bath according to the invention is of the type comprising, in solution in water, gold sulfite, a grain refiner chosen from soluble compounds of bismuth, tin, tellurium and selenium, a complexing agent and a conductive salt.
- This bath is characterized in that it further comprises amidosulfonic acid.
- the bath for electrolytic deposition of gold according to the invention comprises:
- a phosphonic acid derivative for example, the product known as Dequest 2010, used as complexing agent, - from 20 to 100 g / L of ammonium sulfite, used as conductive salt for plating, and
- the bath comprises: - 10 g / L of gold, in the form of gold sulfite,
- the bath obtained uses neither toxic gold salt, nor toxic grain refiner.
- it makes it possible to obtain tender deposits, typically having a hardness of between 50 and 70 Vickers, without the need for any heat treatment.
- the solution obtained does not attack the substrates on which bumps are commonly deposited and its pH is typically between 6.7 and 7.5.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60302074T DE60302074T2 (de) | 2002-07-04 | 2003-06-20 | Bad für galvanischen goldniederschlag |
AT03729763T ATE307918T1 (de) | 2002-07-04 | 2003-06-20 | Bad für galvanischen goldniederschlag |
AU2003240347A AU2003240347A1 (en) | 2002-07-04 | 2003-06-20 | Bath for gold electrodeposition |
EP03729763A EP1520063B1 (fr) | 2002-07-04 | 2003-06-20 | Bain pour depot electrolytique d'or |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02405558.4 | 2002-07-04 | ||
EP02405558A EP1378590A1 (fr) | 2002-07-04 | 2002-07-04 | Bain pour dépôts electrolytiques d'or |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004005589A1 true WO2004005589A1 (fr) | 2004-01-15 |
Family
ID=29719808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH2003/000400 WO2004005589A1 (fr) | 2002-07-04 | 2003-06-20 | Bain pour depôt electrolytique d’or |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP1378590A1 (fr) |
AT (1) | ATE307918T1 (fr) |
AU (1) | AU2003240347A1 (fr) |
DE (1) | DE60302074T2 (fr) |
ES (1) | ES2252673T3 (fr) |
WO (1) | WO2004005589A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103741181A (zh) * | 2014-01-10 | 2014-04-23 | 哈尔滨工业大学 | 一种多配位剂无氰电镀金镀液及电镀金工艺 |
CN107299366A (zh) * | 2017-08-24 | 2017-10-27 | 重庆立道表面技术有限公司 | 无氰镀铜电镀液 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005036133C5 (de) | 2005-07-26 | 2017-07-13 | Ivoclar Vivadent Ag | Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad |
KR101464343B1 (ko) * | 2013-04-02 | 2014-11-28 | 한밭대학교 산학협력단 | 범프 형성용 비시안계 금 도금욕 및 범프의 형성방법 |
CN103741180B (zh) * | 2014-01-10 | 2015-11-25 | 哈尔滨工业大学 | 无氰光亮电镀金添加剂及其应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH506628A (fr) * | 1969-08-08 | 1971-04-30 | Sel Rex Corp | Bain aqueux pour le placage électrolytique d'or ou d'alliage d'or sur un article conducteur, procédé de fabrication dudit bain aqueux et utilisation de celui-ci |
DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
DE4425110C1 (de) * | 1994-07-15 | 1995-10-26 | Heraeus Gmbh W C | Wäßriges Bad für die galvanische Abscheidung von Palladiumüberzügen, Verfahren der galvanischen Abscheidung sowie Verwendung des Bades |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH530473A (fr) * | 1969-08-19 | 1972-11-15 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'or brillant et bain électrolytique pour la mise en oeuvre de ce proédé |
DD245787A3 (de) * | 1984-10-25 | 1987-05-20 | Mikroelektronik Friedrich Enge | Bad fuer die hochgeschwindigkeitsabscheidung von gold |
US4795534A (en) * | 1986-09-25 | 1989-01-03 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
DE3905705A1 (de) * | 1989-02-24 | 1990-08-30 | Degussa | Bad zur galvanischen abscheidung von feingoldueberzuegen |
DE4226167C2 (de) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik |
CN100392155C (zh) * | 2001-02-28 | 2008-06-04 | 威兰牙科技术有限责任两合公司 | 用于电沉积金和金合金的镀液及其应用 |
-
2002
- 2002-07-04 EP EP02405558A patent/EP1378590A1/fr not_active Withdrawn
-
2003
- 2003-06-20 AU AU2003240347A patent/AU2003240347A1/en not_active Abandoned
- 2003-06-20 WO PCT/CH2003/000400 patent/WO2004005589A1/fr not_active Application Discontinuation
- 2003-06-20 EP EP03729763A patent/EP1520063B1/fr not_active Expired - Lifetime
- 2003-06-20 DE DE60302074T patent/DE60302074T2/de not_active Expired - Fee Related
- 2003-06-20 ES ES03729763T patent/ES2252673T3/es not_active Expired - Lifetime
- 2003-06-20 AT AT03729763T patent/ATE307918T1/de not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH506628A (fr) * | 1969-08-08 | 1971-04-30 | Sel Rex Corp | Bain aqueux pour le placage électrolytique d'or ou d'alliage d'or sur un article conducteur, procédé de fabrication dudit bain aqueux et utilisation de celui-ci |
DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
DE4425110C1 (de) * | 1994-07-15 | 1995-10-26 | Heraeus Gmbh W C | Wäßriges Bad für die galvanische Abscheidung von Palladiumüberzügen, Verfahren der galvanischen Abscheidung sowie Verwendung des Bades |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103741181A (zh) * | 2014-01-10 | 2014-04-23 | 哈尔滨工业大学 | 一种多配位剂无氰电镀金镀液及电镀金工艺 |
CN107299366A (zh) * | 2017-08-24 | 2017-10-27 | 重庆立道表面技术有限公司 | 无氰镀铜电镀液 |
Also Published As
Publication number | Publication date |
---|---|
EP1520063A1 (fr) | 2005-04-06 |
DE60302074D1 (de) | 2005-12-01 |
EP1378590A1 (fr) | 2004-01-07 |
ATE307918T1 (de) | 2005-11-15 |
ES2252673T3 (es) | 2006-05-16 |
EP1520063B1 (fr) | 2005-10-26 |
DE60302074T2 (de) | 2006-07-13 |
AU2003240347A1 (en) | 2004-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI391523B (zh) | 無電解鍍金浴、無電解鍍金方法及電子零件 | |
FR2699556A1 (fr) | Bains pour former un dépôt électrolytique de cuivre et procédé de dépôt électrolytique utilisant ce bain. | |
CH662583A5 (fr) | Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc. | |
EP1423557B1 (fr) | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages | |
EP1520063B1 (fr) | Bain pour depot electrolytique d'or | |
EP1272691A1 (fr) | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages | |
EP1268347B1 (fr) | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot du palladium ou d'un de ses alliages | |
EP0088465B1 (fr) | Mélange stabilisant pour un bain de cuivrage chimique | |
FR2552781A1 (fr) | Composition contenant du thallium pour detacher les depots d'or, de palladium et d'alliages palladium/nickel et procede l'utilisant | |
EP2312021B1 (fr) | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques | |
CH418085A (fr) | Electrolyte pour le dépôt galvanique d'alliages d'or | |
TWI400356B (zh) | 突起電極之形成方法及置換鍍金液 | |
FR2512845A1 (fr) | Procede pour accroitre la resistance a la corrosion d'un alliage palladium-nickel depose par electrolyse | |
EP0149830B1 (fr) | Bain électrolytique pour le dépôt de couches minces d'or pur | |
JPS5920471A (ja) | 剥離剤 | |
FR2617667A1 (fr) | Procede de fabrication d'une plaquette a circuit imprime et cette plaquette | |
FR2459299A1 (fr) | Procede pour le depot galvanoplastique d'un alliage d'or | |
CH710185B1 (fr) | Préparation pour bain galvanique d'alliage d'or et bain galvanique. | |
EP2505691A1 (fr) | Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N | |
FR2500012A1 (fr) | Bain de revetement electrolytique d'or et procede de depot | |
BE569991A (fr) | ||
BE853192Q (fr) | Procede et solution pour depot electrolytique de chrome et d'alliages de chrome | |
FR2558853A1 (fr) | Bain exempt de citrate pour deposer, par electrolyse, des alliages d'or et son procede d'utilisation | |
EP1070771A1 (fr) | Bain aqueux acide pour procédé de zincage et procédé de zincage utilisant ce bain | |
CH629260A5 (en) | Process for gold-silver electrolytic deposition, bath for its use and alloy thus obtained |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003729763 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2003729763 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 2003729763 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |