WO2003103028A1 - Dispositif de nettoyage local - Google Patents

Dispositif de nettoyage local

Info

Publication number
WO2003103028A1
WO2003103028A1 PCT/JP2002/010831 JP0210831W WO03103028A1 WO 2003103028 A1 WO2003103028 A1 WO 2003103028A1 JP 0210831 W JP0210831 W JP 0210831W WO 03103028 A1 WO03103028 A1 WO 03103028A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
clean
semiconductor
crystal manufacturing
clean air
Prior art date
Application number
PCT/JP2002/010831
Other languages
English (en)
Japanese (ja)
Inventor
Toshirou Kisakibaru
Original Assignee
Kondoh Industries, Ltd.
Cambridge Filter Japan, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kondoh Industries, Ltd., Cambridge Filter Japan, Ltd. filed Critical Kondoh Industries, Ltd.
Publication of WO2003103028A1 publication Critical patent/WO2003103028A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Definitions

  • the present invention provides a method for continuously jetting clean air on a wafer surface or a liquid crystal substrate surface of a semiconductor or liquid crystal manufacturing apparatus, or on a semiconductor or liquid crystal manufacturing line or a specific portion of a device requiring a clean atmosphere. It relates to a local cleaning device that cleans locally.
  • a clean room type is generally used in which an air purifying film is laid on the ceiling of a work area to maintain a clean environment for the entire work area.
  • cleaning is performed by clean air taken into each of the manufacturing apparatuses from a fan filter unit mounted on a ceiling of each of the manufacturing apparatuses. Has been done.
  • FIG. 8 is a schematic vertical cross-sectional view showing a state in which a robot for handling a semiconductor wafer or a liquid crystal substrate (hereinafter referred to as “workpiece”) in a conventional semiconductor or liquid crystal manufacturing apparatus is installed. That is, a fan 3 and a filter 4 are respectively installed on a ceiling surface in a semiconductor or liquid crystal manufacturing apparatus 2a installed in a clean room 1 to form a fan filter unit 5, and the semiconductor or liquid crystal manufacturing apparatus 2a is formed.
  • workpiece a robot for handling a semiconductor wafer or a liquid crystal substrate
  • a mouth bot 10 having an upper holding plate 9 provided with an arm 8 for handling a workpiece 7 is provided below the semiconductor or liquid crystal manufacturing apparatus 2 a.
  • the workpiece 7 is handled by the arm 8 of the robot 10 in the cleaning air 6 blown out from the fan-fill unit 5. It is configured to be.
  • FIG. 9 is a schematic vertical cross-sectional view showing a state where a workpiece is placed on an opening provided in a conventional semiconductor or liquid crystal manufacturing apparatus. That is, as shown in FIG. 8, the fan 3 and the filter 4 are respectively installed on the ceiling surface of the semiconductor or liquid crystal manufacturing apparatus 2 b installed in the clean room 1 and the fan filter unit. In this case, a clean air 6 is blown into the half barrel or the liquid crystal manufacturing apparatus 2b, and the recess 12 of the loader unit 11 installed in the semiconductor or liquid crystal manufacturing apparatus 2b is covered. The workpiece 7 is placed.
  • FIG. 10 is a schematic longitudinal sectional view showing a state in which a workpiece is placed on a processing table in a conventional semiconductor or liquid crystal manufacturing apparatus. That is, in the same manner as shown in FIG. 8, the fan 3 and the filter 4 are respectively installed on the ceiling surface of the semiconductor or liquid crystal manufacturing apparatus 2c installed in the clean room 1 and the fan filter unit 5 A clean air 6 is blown into the semiconductor or liquid crystal manufacturing apparatus 2c, and an arm 8 for handling a workpiece 7 is provided on an upper holding plate below the semiconductor or liquid crystal manufacturing apparatus 2c.
  • the robot 10 provided in 9 and the processing table 13 for processing the workpiece 7 are respectively installed. The workpiece 7 is handled by the arm 8 and transferred to the processing table 13 for processing.
  • the processed workpiece 7 is configured to be handled from the processing table 13 via the arm 8 .
  • the conventional semiconductor or liquid crystal manufacturing apparatus 2 a shown in FIG. Workpiece on 7
  • the purity of the semiconductor or liquid crystal manufacturing apparatus 2b is maintained by the clean air 6 inside the semiconductor or liquid crystal manufacturing apparatus 2b. Due to the provision of the surface 12, air stagnation 14 occurs in the depression 12, and the dust 15 in the depression 12 stagnates and adheres to the workpiece 7.
  • the method of purifying the air with the clean air taken into each of the apparatuses from the fan filter unit attached to each of the ceilings has a large size. There is a problem that it is difficult to control the air flow in each device, and it is difficult to completely prevent dust generated in each device from adhering to the surface of a wafer or a liquid crystal substrate to be handled.
  • the present invention has been made to solve the above-mentioned problem, and specifies a semiconductor or liquid crystal manufacturing apparatus on a wafer surface or a liquid crystal substrate surface, a semiconductor or liquid crystal manufacturing line, and other devices requiring a clean atmosphere.
  • the purpose is to provide a local cleaning device that cleans only a part of the device locally, giving the degree of freedom in the installation location and installation method of the clean air blowing device.
  • the present invention relates to a semiconductor or liquid crystal manufacturing apparatus, a semiconductor or liquid crystal manufacturing line, or a local cleaning apparatus for a device requiring a clean atmosphere, the clean air being connected to an air supply device and a flexible tube.
  • the jetting device is installed on the workpiece or in a specific part of the equipment requiring a clean atmosphere, and the clean air jetting device continuously jets the clean air, so that the jetting device jets the wafer surface or the liquid crystal substrate surface.
  • FIG. 1 is a schematic perspective view showing the entire local cleaning apparatus A of the present invention.
  • FIG. 2 is a schematic bottom view of the ejection opening of the clean air ejection device in the local cleaning device of the present invention.
  • FIG. 3 is a schematic bottom view showing another embodiment of the ejection opening of the clean air ejection device in the local cleaning apparatus of the present invention.
  • FIG. 4 is a schematic bottom view showing still another embodiment of the ejection opening of the clean air ejection device in the local cleaning apparatus of the present invention.
  • FIG. 5 is a schematic longitudinal sectional view showing an example in which the local cleaning device of the present invention is attached to a robot installed in a semiconductor or liquid crystal manufacturing device.
  • FIG. 6 is a schematic longitudinal sectional view showing an example in which the local cleaning device of the present invention is attached to a loader unit installed in a semiconductor or liquid crystal manufacturing device.
  • FIG. 7 is a schematic longitudinal sectional view showing an example in which the local cleaning apparatus of the present invention is mounted on a processing table installed in a semiconductor or liquid crystal manufacturing apparatus.
  • FIG. 8 is a schematic longitudinal sectional view showing a conventional semiconductor or liquid crystal manufacturing apparatus provided with a robot.
  • FIG. 9 is a schematic vertical sectional view showing a conventional semiconductor or liquid crystal manufacturing apparatus provided with a loader unit.
  • FIG. 10 is a schematic longitudinal sectional view showing a conventional semiconductor or liquid crystal manufacturing apparatus provided with a processing table.
  • A is a local cleaning device
  • 2a to 2c are semiconductor or liquid crystal manufacturing devices
  • 7 is a workpiece
  • 21 is an air supply device
  • 22 is a clean air jet device
  • 23 is Each shows a flexible tube.
  • FIG. 1 is a schematic perspective view showing the entire local cleaning apparatus A of the present invention.
  • the local cleaning device A is configured such that an air supply device 21 and a clean air ejection device 22 are connected to a flexible tube 23 such as a flexible tube or a flexible duct.
  • the air supply device 21 and the clean air ejection device 22 are formed separately so that they can be installed in a narrow and limited place.
  • the air supply device 21 is not particularly limited, but it is preferable to use a thin one. Therefore, as shown in FIG. It is preferable to form with.
  • reference numeral 26 denotes a module for driving the sirocco fan 24.
  • the clean air jetting device 22 is formed by a jetting cylinder 27 formed in a required shape and a filter 29 provided in the jetting opening 28.
  • the air supply port 30 opened in the air supply device 21 and the suction port 31 opened in the clean air ejection device 22 are connected by a flexible tube 23.
  • the suction port 31 of the clean air ejection device 22 is opened above the ejection tube 27, but depending on the installation location of the clean air ejection device 22, the ejection tube
  • the suction port 31 can be opened at an arbitrary position, such as the side surface of 27.
  • the air 32 sucked from the air inlet 25 of the air supply device 21 is pressurized by the sirocco fan 24 and exhausted from the air inlet 30, and from the inlet 31 via the flexible tube 23. After being introduced into the ejection tube 27 and dust is removed by the filter 29, it is ejected as clean air 33. Then, the clean air 33 is jetted to the surface of a workpiece 7 (a wafer is shown in FIG. 1) such as a wafer or a liquid crystal substrate, or to the surface of a machine requiring a cleaning atmosphere. Can be kept clean.
  • a workpiece 7 a wafer is shown in FIG. 1
  • the air supply device and the clean air ejection device are integrally formed, and there are many restrictions on the installation location.
  • FIGS. 2, 3 and 4 are schematic bottom views showing the shape of the ejection opening 28 of the ejection cylinder 27 of the clean air ejection device 22.
  • FIG. The shape shown in Fig. 2 is a general circular shape for supplying clean air to the surface of a wafer or liquid crystal substrate.
  • the shape shown in Figure 3 is half It is used for supplying clean air to conductors or liquid crystal manufacturing equipment, semiconductor or liquid crystal manufacturing lines, and other corners of equipment that require a clean atmosphere.
  • Fig. 4 is for supplying clean air to the irregularly shaped gap. Since the shape of the ejection opening 28 can be arbitrarily set as shown in FIGS. 2 to 4, the device of the present invention can be applied to local clean of any space.
  • FIG. 5 is a schematic vertical sectional view showing an example in which the local cleaning apparatus A of the present invention is mounted on a robot 10 installed in a semiconductor or liquid crystal manufacturing apparatus 2a. That is, an air supply device 21, preferably a sirocco fan 24, is mounted on an upper holding plate 9 holding an arm 8 above a robot 10 installed in a semiconductor or liquid crystal manufacturing device 2 a installed in a clean room 1.
  • the sirocco fan 24 is connected and fixed to the clean air jetting device 22 via a flexible tube 23, while being fixed with the air inlet 25 facing upward. It faces the upper surface of the workpiece 7 disposed in the second ejection cylinder 27.
  • Part of the clean air 6 that has been blown out of the fan filter unit 5 is sucked from the intake port 25 of the white fan 24 and is sent to the clean air blowing device 22 through the flexible tube 23.
  • the air is sent, and is further purified by the fill tube 29 at the tip of the jetting cylinder 27 to become high-purity air 33 and is continuously jetted to the surface of the workpiece 7 so as to keep the surface clean. Is formed.
  • FIG. 6 is a schematic longitudinal sectional view showing an example in which the local cleaning apparatus A of the present invention is mounted on a loader section 11 installed in a semiconductor or liquid crystal manufacturing apparatus 2b. That is, on the upper surface of the loader section 11 installed in the semiconductor or liquid crystal manufacturing apparatus 2 b installed in the clean room 1, the air supply device 21, preferably a sirocco fan 24, has the intake port 25 facing upward. At the same time, the clean air jet device 22 is installed on the ceiling surface of the depression 12 of the loader section 11, and the clean air jet device 22 and the sirocco fan 24 are flexible tubes 23.
  • the filter 29 disposed in the ejection cylinder 27 of the clean air ejection device 22 faces the upper surface of the workpiece 7 placed in the depression 12.
  • a part of the air 32 of the clean air 6 ejected from the fan-fill unit 5 is sucked from the intake port 25 of the white fan 24 and is passed through the flexible tube 23.
  • the air is sent to the clean air jetting device 22 and further purified by the filter 29 at the tip of the jetting cylinder 27 to become high clean air 33 and is jetted continuously to the surface of the workpiece 7. It is formed to keep the surface clean.
  • FIG. 7 is a schematic longitudinal sectional view showing an example in which the local cleaning apparatus A of the present invention is mounted on a processing table 13 installed in a semiconductor or liquid crystal manufacturing apparatus 2c.
  • the semiconductor or liquid crystal manufacturing apparatus 2c installed in the clean room 1 is formed in two stages, and the local cleaning device A is attached to the lower stage.
  • the semiconductor or liquid crystal manufacturing apparatus 2c is divided into an upper chamber 31 and a lower chamber 31 by a floor 30, and the upper chamber S1 is provided with a fan-fill unit 5 on the ceiling surface as in the conventional case, and is mounted on the floor 30.
  • the robot 10 and the processing table 13 are installed in each.
  • a robot 10 and a processing table 13 are installed, and an air supply device 21, preferably a sirocco fan is installed in a clean room 1 outside the semiconductor or liquid crystal manufacturing device 2c. While the sirocco fan 24 is installed, the sirocco fan 24 cleans the inside of the semiconductor or liquid crystal manufacturing apparatus 2c through the flexible tube 23 penetrating the side wall S3 of the semiconductor or liquid crystal manufacturing apparatus 2c.
  • the filter 29 connected to the air jetting device 22 and disposed in the jet cylinders 2 and 7 of the clean air jetting device 22 is placed on the upper surface of the workpiece 7 placed on the processing table 13 described above. I'm facing.
  • the local cleaning device A of the present invention is Alternatively, an example in which the present invention is applied to a liquid crystal manufacturing apparatus is illustrated. Although not shown, the present invention can also be applied to a case where a specific part of a semiconductor or liquid crystal manufacturing line or a device requiring a clean atmosphere other than the semiconductor or liquid crystal manufacturing apparatus is locally cleaned.
  • the air supply device and the clean air ejection device are separated, and both are connected by a flexible tube, so that the air supply device and the clean air ejection device are connected to each other on a wafer surface or a liquid crystal substrate in a semiconductor or liquid crystal manufacturing apparatus, or
  • the clean air jetting device By installing the above-mentioned clean air jetting device in a specific part of a semiconductor or liquid crystal manufacturing line or other equipment that requires a clean atmosphere, the clean air is continuously blown out, so that only the necessary parts are locally exposed. It can be cleaned.
  • the air can be further purified and the surface of the workpiece can be kept clean with ultra-high clean air.
  • the size of the device can be reduced, and the installation location and the installation method of the clean air ejection device can be increased.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ventilation (AREA)
  • Duct Arrangements (AREA)
  • Liquid Crystal (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Selon l'invention, la surface d'une plaquette ou d'un substrat cristallin liquide ou d'une partie spécifique d'un dispositif nécessitant une atmosphère propre est nettoyée localement. Un dispositif de jet d'air (22) relié par un tube flexible (23) à un dispositif d'alimentation en air (21) est installé sur un ouvrage ou sur une partie spécifique d'un dispositif nécessitant une atmosphère propre de façon que le dispositif de jet d'air (22) pulvérise de l'air propre de façon continue et nettoie localement la surface d'une plaquette ou d'un substrat cristallin liquide ou d'une partie spécifique du dispositif nécessitant une atmosphère propre.
PCT/JP2002/010831 2002-05-31 2002-10-18 Dispositif de nettoyage local WO2003103028A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002159129A JP2004003723A (ja) 2002-05-31 2002-05-31 局所クリーン化装置
JP2002-159129 2002-05-31

Publications (1)

Publication Number Publication Date
WO2003103028A1 true WO2003103028A1 (fr) 2003-12-11

Family

ID=29706511

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010831 WO2003103028A1 (fr) 2002-05-31 2002-10-18 Dispositif de nettoyage local

Country Status (3)

Country Link
JP (1) JP2004003723A (fr)
TW (1) TWI221756B (fr)
WO (1) WO2003103028A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105135585A (zh) * 2015-08-31 2015-12-09 西安建筑科技大学 一种形成空气池气流组织的双侧通风装置及其控制方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60187839U (ja) * 1984-05-24 1985-12-12 進和テツク株式会社 クリ−ンベンチ
JPH05192782A (ja) * 1992-01-21 1993-08-03 Fanuc Ltd レーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60187839U (ja) * 1984-05-24 1985-12-12 進和テツク株式会社 クリ−ンベンチ
JPH05192782A (ja) * 1992-01-21 1993-08-03 Fanuc Ltd レーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105135585A (zh) * 2015-08-31 2015-12-09 西安建筑科技大学 一种形成空气池气流组织的双侧通风装置及其控制方法
CN105135585B (zh) * 2015-08-31 2017-11-28 西安建筑科技大学 一种形成空气池气流组织的双侧通风装置及其控制方法

Also Published As

Publication number Publication date
TWI221756B (en) 2004-10-01
JP2004003723A (ja) 2004-01-08

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