WO2003081406A1 - Systeme de refroidissement pour parties d'ordinateur mettant en oeuvre des elements thermoelectriques - Google Patents

Systeme de refroidissement pour parties d'ordinateur mettant en oeuvre des elements thermoelectriques Download PDF

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Publication number
WO2003081406A1
WO2003081406A1 PCT/KR2002/000783 KR0200783W WO03081406A1 WO 2003081406 A1 WO2003081406 A1 WO 2003081406A1 KR 0200783 W KR0200783 W KR 0200783W WO 03081406 A1 WO03081406 A1 WO 03081406A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat exchange
cooling system
sensing
sink
Prior art date
Application number
PCT/KR2002/000783
Other languages
English (en)
Inventor
Kang-Young Lee
Young-Ho Kim
Original Assignee
Ec Tech Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ec Tech Co., Ltd. filed Critical Ec Tech Co., Ltd.
Priority to AU2002255372A priority Critical patent/AU2002255372A1/en
Publication of WO2003081406A1 publication Critical patent/WO2003081406A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control

Definitions

  • the present invention relates to a cooling system for computer parts using thermoelectric elements, and more particularly, to a cooling system for computer parts using thermoelectric elements which includes a heat exchange unit for cooling the computer parts in a computer's main body by dissipating heat generated from the computer parts upon drive of a computer, so as to lower the temperature of the computer's main body.
  • Cooling methods used to solve the above problem include a method in which heat sinks are coupled to the computer parts in the computer's main body to cool the computer parts, respectively, and a method in which a water cooling jacket is mounted on a CPU and cooling water is circulated therein to cool the CPU.
  • thermoelectric element there is another cooling method in which a thermoelectric element is used.
  • a heat absorption portion of the thermoelectric element is in direct contact with a computer part, while heat radiation fins are coupled to a heat radiation portion of the thermoelectric element.
  • heat radiation fins are coupled to a heat radiation portion of the thermoelectric element.
  • water condensate is formed on the heat absorption portion due to temperature difference between the heat absorption portion and the exterior air and comes in contact with a main board circuit of the computer.
  • electrical shocks and malfunctions may be generated.
  • An object of the present invention is to provide a cooling system for computer parts using thermoelectric elements, in which all the computer parts within a PC case can be cooled at one time by providing cooled air for the respective computer parts within the PC case using a heat exchange means.
  • Another object of the present invention is to provide a cooling system for computer parts using thermoelectric elements, in which the temperature of a cool sink is prevented from reaching dew point by checking the cooling temperature through a sensing means so as to prevent malfunctions of the computer parts.
  • a further object of the present invention is to provide a cooling system for computer parts using thermoelectric elements, in which a heat insulation plate and heat insulation spacers are provided between a cool sink and a hot sink of a heat exchange unit so as to reduce any heat loss.
  • a cooling system for computer parts using thermoelectric elements comprising a heat exchange means for supplying cooled air to the interior of a PC case; a sensing means for sensing operation conditions of a blower fan and a heat dissipation fan in the heat exchange means and supercooling and overheating of a computer's main body; a control means for controlling the operation conditions of the heat exchange means in response to sensing signals from the sensing means; a power supply means for supplying power to the heat exchange means and the control means; and a status display means for displaying malfunction status checked by the sensing means.
  • FIG. 1 is a view generally showing a system according to one embodiment of the present invention
  • FIG. 2 is a view showing a system according to another embodiment of the present invention.
  • FIGS. 3a and 3b are flowcharts of a cooling system for computer parts using thermoelectric elements according to the present invention.
  • FIG. 4a is an exploded perspective view of a heat exchange unit according to one embodiment of the present invention.
  • FIG. 4b is a sectional view showing an assembled state of the heat exchange unit shown in FIG. 4a;
  • FIG. 5a is an exploded perspective view of a heat exchange unit according to another embodiment of the present invention.
  • FIG. 5b is a sectional view showing an assembled state of the heat exchange unit shown in FIG. 5a;
  • FIG. 6a is an exploded perspective view of a heat exchange unit according to a further embodiment of the present invention.
  • FIG. 6b is a sectional view showing an assembled state of the heat exchange unit shown in FIG. 6a;
  • FIG. 7 is a perspective view of the interior of a PC case in which a cooling system according to one embodiment of the present invention is mounted at a lower portion in the PC case;
  • FIG. 8 is a perspective view of the interior of a PC case in which a cooling system according to another embodiment of the present invention is mounted at the exterior of the PC case;
  • FIG. 9 is a perspective view of the interior of a PC case in which a cooling system according to a further embodiment of the present invention is mounted at a bay of the PC case.
  • FIG. 1 is a view generally showing a system according to one embodiment of the present invention.
  • a cooling system for computer parts using thermoelectric elements according to this embodiment of the present invention comprises a heat exchange means 100 for supplying cooled air to the interior of a PC case; a sensing means 500 for sensing operation conditions of a blower fan 120 and a heat dissipation fan 130 in the heat exchange means 100 and supercooling and overheating of a computer's main body; a control means 200 for controlling the operation conditions of the heat exchange means 100 in response to sensing signals from the sensing means 500; a power supply means 300 for supplying power to the heat exchange means 100 and the control means 200; and a status display means 400 for displaying malfunction status checked by the sensing means 500.
  • the heat exchange means 100 includes a heat exchange unit 110, the blower fan 120, the heat dissipation fan 130 and a blower duct 140.
  • the heat exchange unit 110 includes a hot sink 112 having rectangular heat insulation protrusions 116 at the inside thereof for radiating absorbed heat; a cool sink 111 for generating cooled air; thermoelectric elements 113 stacked on the heat insulation protrusions 116, respectively, for taking heat from the cool sink 111; and heat insulation spacers 115 for forming a space to prevent any heat conduction.
  • the surface area of the cool sink 111 is about 0.49 m 2
  • its coefficient of thermal conductivity is about 20.00 W/m 2° C .
  • the blower fan 120 serves to suck up the cooled air from the cool sink 111, while the heat dissipation fan 130 serves to dissipate heat from the hot sink 112 to the exterior.
  • the heat exchange unit 110 may further include a heat insulation plate
  • the status display means 400 includes an alarm unit 410 operating in response to a malfunction signal from the sensing means 500, and a display unit 420 for displaying a temperature measured by the sensing means.
  • the sensing means 500 includes a fan operation monitoring sensor for sensing the operation conditions of the blower fan 120 and the heat dissipation fan 130 in the heat exchange means 100, and a temperature sensor for sensing the supercooling and overheating of the computer's main body.
  • thermoelectric elements 113 When a direct electric current from the power supply means 300 is applied to the thermoelectric elements 113, heat from the cool sink 111 is taken by the hot sink 112 with a heat transfer phenomenon and thus the cool sink is cooled, and the hot sink 112 receives the heat from the cool sink 111 and radiates the heat.
  • the heat transfer phenomenon means that heat from a cool sink is transferred to a hot sink when a direct electric current power is applied to a thermoelectric element.
  • the blower fan 120 positioned at an outlet side of the cool sink 111 sucks up the cooled air from the cool sink 111 and then sends the cooled air through the blower duct 140 to the respective computer parts within the PC case.
  • the blower duct 140 is a passage for guiding the cooled air to the respective computer parts.
  • the heat dissipation fan 130 positioned below the hot sink 112 serves to dissipate heat from the hot sink 112 to the exterior.
  • temperature sensors installed at inlet sides of the blower duct 140 and the cool sink 111 measure the cooling temperature and the exterior air temperature
  • fan operation sensing sensors installed within the blower fan 120 and the heat dissipation fan 130 for sensing the operations of the fans sense stops of the fans and transmit fan stop signals to the sensing means 500.
  • the control means 200 controls the operation of the heat exchange means 100 in response to the signals from by the sensing means 500.
  • FIG. 2 is a view of a system according to another embodiment of the present invention.
  • a cooling system for computer parts using thermoelectric elements according to this embodiment of the present invention comprises the heat exchange means 100 for supplying the cooled air to the interior of the PC case; the sensing means 500 for sensing the operation conditions of a blower fan 122 and the heat dissipation fan 130 within the heat exchange means 100 and the overheating of the hot sink 112 in the heat exchange means 100; the power supply means 300 for supplying power to the heat exchange means 100; and the status display means 400 for displaying the malfunction status checked by the sensing means 500.
  • the heat exchange means 100 includes the heat exchange unit 110, the blower fan
  • the heat exchange unit 110 has the same constitution as FIG. 1.
  • the blower fan 122 is positioned at the inlet side of the cool sink 111, and serves to guide the exterior air to the cool sink 111 so that the exterior air is converted into cooled air by passing through the cool sink 111.
  • the surface area of the cool sink 111 is about 0.39 m 2
  • its coefficient of thermal conductivity is about 20.00 W/m 2° C.
  • the heat dissipation fan 130 is positioned at an inlet side of the hot sink 112, and serves to discharging overheated air within the PC case to the exterior of the PC case and simultaneously to dissipate heat from the hot sink 112 by passing the overheated air through the hot sink 112.
  • the status display means 400 includes a malfunction sensing unit 440 for sensing stops of the fans, an alarm unit 410 for raising an alarm upon generation of fan stop signals, and a lamp unit 430 operating upon overheating of the hot sink 112.
  • the sensing means 500 includes the fan operation sensing sensors for sensing the stops of the fans, and a temperature sensor for sensing the temperature of the interior of the heat exchange means 100.
  • FIGS. 3a and 3b are flowcharts of the cooling system for the computer parts using the thermoelectric elements according to the present invention.
  • the blower fan 120 and the heat dissipation fan 130 are driven by application of an electric current (S100), and the control means 200 checks whether or not the blower fan 120 and the heat dissipation fan 130 are normally driven (SI 10).
  • SI 10 an electric current
  • RMP repetitions per minute
  • An alarm is raised when the blower fan 120 or the heat dissipation fan 130 is not normally driven (SI 12), and the cooling temperature, the CPU temperature and the exterior/interior air temperatures in the PC case are measured when the fans are normally driven (SI 14).
  • the measured temperatures are compared with relevant predetermined temperatures (SI 16).
  • power supplied to the thermoelectric elements 113 is cut off and the alarm is raised (SI 18, S120).
  • the measured temperatures are displayed on the display unit 420 (S122).
  • step S116 the cooling temperature, the CPU temperature and the exterior/interior air temperatures in the PC case are compared with the predetermined cooling temperature, CPU temperature and exterior/interior air temperatures in the PC case, respectively (S116).
  • steps S110 to S122 are operated by periods, the malfunction status of the cooling system can be instantly checked.
  • step SI 14 further comprises a step of checking the presence of the dew point (FIG. 3b).
  • the cooling temperature the CPU temperature and the exterior/interior air temperatures in the PC case have been measured (SI 14)
  • the measured cooling temperature is compared with the exterior air temperature (S114-1) and the cooling temperature is checked whether or not it is the dew point of the exterior air (S114-2). If the cooling temperature is the dew point, the alarm is raised (S114-3). Otherwise, the procedure proceeds to step S116.
  • FIG. 4a is an exploded perspective view of a heat exchange unit according to one embodiment of the present invention
  • FIG. 4b is a sectional view showing an assembled state of the heat exchange unit according to this embodiment of the present invention.
  • the hot sink 112 comprises heat radiation fins 112a at the outside thereof and a sink 112b at the inside thereof.
  • the heat sink 112b includes a plurality of threaded holes 117 arranged in the longitudinal direction at the center of the inside thereof and heat insulation protrusions 116 spaced apart from one another at a constant interval.
  • the cool sink 111 comprises cooling fins Ilia at the outside thereof and a cooling plate 111b at the inside thereof.
  • the cooling fin Ilia and the cooling plate 111b are formed with a plurality of threaded holes 118.
  • a predetermined space is created as much as the length of the spacers 115. The space provides a heat insulation effect of reducing any heat loss between the cool sink 111 and the hot sink 112.
  • FIG. 5a is an exploded perspective view of a heat exchange unit according to another embodiment of the present invention
  • FIG. 5b is a sectional view showing an assembled state of the heat exchange unit according to this embodiment of the present invention.
  • a heat insulation plate 114 having the same thickness as the total thickness of one heat insulation protrusion 116 and one thermoelectric element 113 is positioned between the hot sink 112 and the cool sink 111.
  • the heat insulation plate 114 is further provided with throug holes 119 into which the heat insulation protrusions 116 and the thermoelectric elements 113 are fitted at positions corresponding to the heat insulation protrusions 116 and the thermoelectric elements 113.
  • the heat exchange unit 110 shown in FIGS. 5a and 5b has the same constitution as the heat exchange unit 110 shown in FIG. 4 except that it has the heat insulation plate 114, the detailed description thereof will be omitted.
  • FIG. 6a is an exploded perspective view of a heat exchange unit according to a further embodiment of the present invention.
  • FIG. 6b is a sectional view showing an assembled state of the heat exchange unit according to this embodiment of the present invention.
  • the heat insulation protrusions 116 are formed traversely at a constant interval on the heat sink 112b, and heat insulation plates 114 have the same thickness as the heat insulation protrusions 116, respectively, and are seated between the heat insulation protrusions 116 disposed at the constant interval. In the meantime, since the heat insulation plates 114 have the same thickness as the heat insulation protrusions 116, a predetermined space is created between the heat insulation plate 114 and the cool sink 111. A double-layered structure of the heat insulation plate 114 and the space further enhances a heat insulation effect.
  • FIG. 7 is a perspective view of the interior of a PC case in which a cooling system according to one embodiment of the present invention is mounted at a lower portion in the PC case.
  • the heat exchange means 100 is positioned integrally at a lower or upper end of the PC case to supply the cooled air through the blower duct 140 to the respective computer parts (hereinafter, it is referred as an integral-type).
  • FIG. 7 is a perspective view of the interior of a PC case in which a cooling system according to one embodiment of the present invention is mounted at a lower portion in the PC case.
  • the heat exchange means 100 is positioned integrally at a lower or upper end of the PC case to supply the cooled air through the blower duct 140 to the respective computer parts (hereinafter, it is referred as an integral-type).
  • FIG. 7 is a perspective view of the interior of a PC case in which a cooling system according to one embodiment of the present invention is mounted at a lower portion in the PC case.
  • the heat exchange means 100 is positioned integrally
  • FIG. 8 is a perspective view of the interior of a PC case in which a cooling system according to another embodiment of the present invention is mounted at the exterior of the PC case.
  • the heat exchange means 100 is positioned at the exterior of the PC case to supply the cooled air through the blower duct 140 to the respective computer parts (hereinafter, it is referred as an external-type).
  • the heat exchange means since the heat exchange means is mounted at the exterior of the PC case, it can be conveniently installed without exchanging the existing computer case.
  • FIG. 9 is a perspective view of the interior of a PC case in which a cooling system according to a further embodiment of the present invention is mounted at a bay of the PC case. Since the heat exchange means 100 is positioned at a bay of the PC case (hereinafter, it is referred as an internal-type), the maximum cooling efficiency can be obtained even with a narrow space.
  • the heat exchange means 100 mounted at the bay of the PC case is effective to cool a specific part in the computer's main body.
  • Table 1 shows product specifications and performance of the integral-type, external-type and internal-type cooling systems.
  • any heat loss can be prevented by providing the heat insulation plate(s) and the heat insulation spacers between the cool sink and the hot sink, and in that heat is prevented from being transferred to the heat exchange unit by providing the heat insulation protrusions for the hot sink, thereby enhancing a cooling effect.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Computing Systems (AREA)
  • Quality & Reliability (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système de refroidissement pour des parties d'ordinateur mettant en oeuvre des éléments thermoélectriques, et plus spécifiquement, un système de refroidissement pour parties d'ordinateur mettant en oeuvre des éléments thermoélectriques, qui comprend une unité d'échange thermique destinée à refroidir les parties d'ordinateur dans un corps principal d'ordinateur en dissipant la chaleur générée par ces parties d'ordinateur après la mise en marche de cet ordinateur, de façon à abaisser la température du corps principal d'ordinateur. Afin d'atteindre les objectifs susmentionnés, le système de refroidissement pour parties d'ordinateur mettant en oeuvre des éléments thermoélectriques de cette invention comprend un moyen d'échange thermique destiné à amener de l'air refroidi à l'intérieur d'un boîtier d'ordinateur personnel (PC), un moyen de détection destiné à détecter les conditions de fonctionnement d'un ventilateur soufflant et d'un ventilateur dissipateur de chaleur situé dans le moyen d'échange thermique et à sous-refroidir et à surchauffer un corps principal d'ordinateur, un moyen de commande destiné à commander les conditions de fonctionnement du moyen d'échange thermique en réponse à des signaux de détection provenant du moyen de détection, un moyen d'alimentation destiné à fournir de la puissance au moyen d'échange thermique et au moyen de commande, et un moyen d'affichage d'état destiné à afficher un état de dysfonctionnement vérifié à l'aide du moyen de détection. Le système de cette invention présente l'avantage consistant en ce que toutes les parties de l'ordinateurs situées dans un boîtier de PC peuvent être refroidies, grâce à l'air refroidi amené à l'intérieur du boîtier du PC à l'aide du moyen d'échange thermique.
PCT/KR2002/000783 2002-03-22 2002-04-26 Systeme de refroidissement pour parties d'ordinateur mettant en oeuvre des elements thermoelectriques WO2003081406A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002255372A AU2002255372A1 (en) 2002-03-22 2002-04-26 Cooling system for computer parts using thermoelectric elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2002/15663 2002-03-22
KR1020020015663A KR100387358B1 (en) 2002-03-22 2002-03-22 System for cooling computer component using thermoelectric element

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WO2003081406A1 true WO2003081406A1 (fr) 2003-10-02

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US8249825B2 (en) 2009-05-08 2012-08-21 American Power Conversion Corporation System and method for predicting cooling performance of arrangements of equipment in a data center
US8315841B2 (en) 2005-05-02 2012-11-20 American Power Conversion Corporation Methods and systems for managing facility power and cooling
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US8355890B2 (en) 2009-05-08 2013-01-15 American Power Conversion Corporation System and method for predicting maximum cooler and rack capacities in a data center
US8424336B2 (en) 2006-12-18 2013-04-23 Schneider Electric It Corporation Modular ice storage for uninterruptible chilled water
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
US8639482B2 (en) 2005-05-02 2014-01-28 Schneider Electric It Corporation Methods and systems for managing facility power and cooling
US8688413B2 (en) 2010-12-30 2014-04-01 Christopher M. Healey System and method for sequential placement of cooling resources within data center layouts
US9519517B2 (en) 2009-02-13 2016-12-13 Schneider Electtic It Corporation Data center control
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
US9778718B2 (en) 2009-02-13 2017-10-03 Schneider Electric It Corporation Power supply and data center control
US9830410B2 (en) 2011-12-22 2017-11-28 Schneider Electric It Corporation System and method for prediction of temperature values in an electronics system
US9952103B2 (en) 2011-12-22 2018-04-24 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
US9996659B2 (en) 2009-05-08 2018-06-12 Schneider Electric It Corporation System and method for arranging equipment in a data center
US10001761B2 (en) 2014-12-30 2018-06-19 Schneider Electric It Corporation Power consumption model for cooling equipment
US10210288B2 (en) 2012-12-27 2019-02-19 Schneider Electric It Corporation Systems and methods of visualizing airflow
US11076507B2 (en) 2007-05-15 2021-07-27 Schneider Electric It Corporation Methods and systems for managing facility power and cooling

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WO2006025689A1 (fr) * 2004-09-01 2006-03-09 Jong Kyu Lee Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique, un ensemble de refroidissement a air et une conduite
KR100836335B1 (ko) 2006-06-21 2008-06-09 현대자동차주식회사 펠티에 모듈을 이용한 차량용 고성능 ｉｃ 방열장치 및 그제어방법
KR101118153B1 (ko) * 2010-01-08 2012-03-12 서창환 냉각공기를 컴퓨터 본체 내에 유입시켜 냉각하는 장치
KR101118152B1 (ko) * 2010-01-08 2012-03-12 서창환 냉각공기를 컴퓨터 본체 내에 유입시켜 냉각하는 시스템 장치
KR101854153B1 (ko) * 2017-10-30 2018-05-03 (주)아이브리지닷컴 서버컴퓨터
CN110831402A (zh) * 2019-10-17 2020-02-21 珠海格力电器股份有限公司 一种电控箱的散热装置、电控箱及散热方法

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US8315841B2 (en) 2005-05-02 2012-11-20 American Power Conversion Corporation Methods and systems for managing facility power and cooling
US9115916B2 (en) 2006-08-15 2015-08-25 Schneider Electric It Corporation Method of operating a cooling system having one or more cooling units
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US9080802B2 (en) 2006-12-18 2015-07-14 Schneider Electric It Corporation Modular ice storage for uninterruptible chilled water
US8424336B2 (en) 2006-12-18 2013-04-23 Schneider Electric It Corporation Modular ice storage for uninterruptible chilled water
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
US11076507B2 (en) 2007-05-15 2021-07-27 Schneider Electric It Corporation Methods and systems for managing facility power and cooling
US11503744B2 (en) 2007-05-15 2022-11-15 Schneider Electric It Corporation Methods and systems for managing facility power and cooling
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