WO2006025689A1 - Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique, un ensemble de refroidissement a air et une conduite - Google Patents

Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique, un ensemble de refroidissement a air et une conduite Download PDF

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Publication number
WO2006025689A1
WO2006025689A1 PCT/KR2005/002872 KR2005002872W WO2006025689A1 WO 2006025689 A1 WO2006025689 A1 WO 2006025689A1 KR 2005002872 W KR2005002872 W KR 2005002872W WO 2006025689 A1 WO2006025689 A1 WO 2006025689A1
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WO
WIPO (PCT)
Prior art keywords
computer
cooling
duct
thermoelectric element
heat
Prior art date
Application number
PCT/KR2005/002872
Other languages
English (en)
Inventor
Jong Kyu Lee
Original Assignee
Jong Kyu Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jong Kyu Lee filed Critical Jong Kyu Lee
Publication of WO2006025689A1 publication Critical patent/WO2006025689A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management

Definitions

  • the present invention relates to a computer cooling device using a thermoelectric element, an air cooling kit and a duct, and more particularly, to a device for cooling a computer using a thermoelectric element, an air cooling kit and a duct, in which a duct is mounted to the rear and right side surfaces of a computer case, with an air cooling kit comprising a thermoelectric element, a cooling unit and a heat radiating unit positioned at a side of the duct, so that air introduced into an air path defined in the duct can be cooled by the cooling unit and then flow into the computer case to decrease the temperature inside the computer.
  • a computer for home or industrial use operates in a state in which it is constituted by a combination of a number of semiconductors and other peripheral devices.
  • a cooling system such as a fan, etc. which employs forced air circulation is adopted.
  • a cooling device which comprises a combination of a heat radiating plate and a fan is inde ⁇ pendently provided. Also, for other component elements, a cooling device such as a heat radiating plate, and the like, is provided.
  • VME Very Module Eurocard
  • VME rack system A system to which the VME is applied is called a VME rack system.
  • the conventional structure of the VME rack system comprises a back panel section 50 defined with a plurality of slots 55 in which various boards can be mounted, and a plurality of guides 60 opened on the left and right side walls of a computer case and respectively corresponding to the slots 55.
  • VME rack system When a CPU board, an FO board, etc. are additionally mounted to the VME rack system, the VME rack system is regarded as the same kind as a conventional computer system. Therefore, the VME rack system is not separately distinguished in the present specification and will be simply referred to as a computer in the following descriptions.
  • an object of the present invention is to provide a device for cooling a computer using a thermoelectric element, an air cooling kit and a duct, in which a duct is mounted to the rear and right side surfaces of a computer case, with an air cooling kit using the Peltier effect of a thermoelectric element positioned at a side of the duct, so that air introduced into an air path defined in the duct can be cooled by a cooling unit and then flow into the computer case to decrease the temperature inside the computer.
  • Another object of the present invention is to provide a device for cooling a computer using a thermoelectric element, an air cooling kit and a duct, which can increase the inside temperature of a computer using the Peltier effect of a ther ⁇ moelectric element, so that the device can be employed in an environment where the temperature surrounding the computer is remarkably low and it is necessary to raise the temperature inside the computer.
  • a device for cooling a computer having a back panel section defined with a plurality of slots in which various boards and add-on cards can be mounted, and a plurality of guides opened on at least one of left and right side walls of a computer case and respectively corresponding to the slots, the device comprising a duct mounted to rear and right side surfaces of the computer case and covered with a heat insulation material on inner surfaces thereof, the duct defining an air path therein; and an air cooling kit mounted through a side wall of the duct, the air cooling kit comprising temperature sensors for sensing temperatures inside and outside the computer, a thermoelectric element having a heat absorption side and a heat radiation side which respectively perform a heat absorbing operation and a heat radiating operation depending upon inputs from electrodes connected to the heat absorption side and the heat radiation side of the thermoelectric element respectively, a heat radiating unit positioned outside the duct, the heat radiating unit comprising a heat radiating plate which is
  • the device for cooling a computer using a thermoelectric element, an air cooling kit and a duct provides advantages in that a duct is mounted to the rear and right side surfaces of a computer case, with an air cooling kit using the Peltier effect of a ther ⁇ moelectric element positioned at a side of the duct, so that air introduced into an air path defined in the duct can be cooled by a cooling unit and then flow into the computer case to decrease the temperature inside the computer.
  • the device for cooling a computer using a thermoelectric element, an air cooling kit and a duct provides advantages in that the inside temperature of a computer can be increased using the Peltier effect of a ther ⁇ moelectric element so that the device can be employed in an environment where the temperature surrounding the computer is remarkably low and it is necessary to raise the temperature inside the computer.
  • FIG. 1 is a perspective view illustrating a computer equipped with a device for cooling a computer using a thermoelectric element, an air cooling kit and a duct in accordance with an embodiment of the present invention
  • FlG. 2 is a plan view of the computer according to the present invention.
  • FlG. 3 is a left side view of the computer according to the present invention.
  • FlG. 4 is a right side view of the computer according to the present invention.
  • FlG. 5 is a plan view illustrating an air path defined in the computer which is equipped with the device for cooling a computer using a thermoelectric element, an air cooling kit and a duct according to the present invention
  • FlG. 6 is a control flow chart of the cooling device according to the present invention.
  • FlG. 7 is a plan view illustrating a conventional computer.
  • FlG. 1 is a perspective view illustrating a computer equipped with a device for cooling a computer using a thermoelectric element, an air cooling kit and a duct in accordance with an embodiment of the present invention
  • FlG. 2 is a plan view of the computer according to the present invention
  • FlG. 3 is a left side view of the computer according to the present invention
  • FlG. 4 is a right side view of the computer according to the present invention
  • FlG. 5 is a plan view illustrating an air path defined in the computer which is equipped with the device for cooling a computer using a thermoelectric element, an air cooling kit and a duct according to the present invention.
  • VME rack system is not separately distinguished in the present specification and will be simply referred to as a computer in the following descriptions.
  • a device for cooling a computer using a ther ⁇ moelectric element, an air cooling kit and a duct in accordance with an embodiment of the present invention comprises a duct 150 mounted to rear and right side surfaces of a computer case 10, covered with a heat insulation material 100 on inner surfaces thereof and defining an air path therein, and an air cooling kit 200 for cooling air introduced into the air path.
  • the air cooling kit 200 includes temperature sensors 210, a cooling unit 240, a thermoelectric element 250, a heat radiating unit 230, and a control unit 260.
  • the inner surfaces of the computer case 10 be covered with an inside heat insulation material 110 so as to block heat transfer from the outside to the inside of the computer case 10.
  • the duct 150 is formed to extend from the rear surface to the right side surface of the computer case 10, and is defined with the air path which allows outside air introduced therein to flow through a plurality of guides 60 defined in the right side wall of the computer case 10.
  • FlG. 5 illustrates both outside air flow 'a' which is introduced into the duct 150 and air flow 'b' into the heat radiating unit 230 of the air cooling kit 200.
  • the inside heat insulation material 110 and the heat insulation material 100 cover the inner surfaces of the computer case 10 and the duct 150, re ⁇ spectively, to block heat transfer from the outside.
  • the heat insulation material 100 which covers the inner surfaces of the duct 150 a portion of the heat insulation material 100 which is placed on the guides 60 defined on the right side wall of the computer case 10 may be removed, if appropriate, to improve cooling efficiency.
  • the corresponding portion of the heat insulation material 100 is defined with a plurality of air vents so that air can reliably flow from the duct 150 through the guides 60 into the inside of the computer case 10 without being obstructed.
  • the air cooling kit 200 includes the temperature sensors 210 for sensing the temperatures inside and outside the computer case 10, the heat radiating unit 230 positioned outside the duct 150, the cooling unit 240 positioned inside the duct 150, the thermoelectric element 250 having a heat radiation side which is connected to the heat radiating unit 230 and a heat absorption side which is connected to the cooling unit 240, to perform a heat absorbing operation and a heat radiating operation depending upon the current application thereto, and the control unit 260 for comparing the temperatures sensed by the temperature sensors 210 with a pre ⁇ determined temperature range and controlling the operation of the thermoelectric element 250, the cooling unit 240 and the heat radiating unit 230.
  • the temperature sensors 210 function to sense the temperatures inside and outside the computer case 10 and transmit the sensed temperatures to the control unit 260 which will be described later in detail. It is preferred that the positions and the number of the temperature sensors 210 be determined in consideration of the kind of a computer to be used.
  • the thermoelectric element 250 is used to efficiently cool air flowing through the duct 150.
  • a thermoelectric element is a generic term for an element which uses various effects obtained through the interaction of heat and electricity.
  • thermoelectric element 250 comprises a
  • Peltier element exhibiting the Peltier effect which causes a phenomenon such that, when the distal ends of two different kinds of metals serving as terminals are connected with each other and current is applied to them, one terminal performs a heat absorbing operation and the other terminal performs a heat radiating operation depending upon the current application direction.
  • the cooling unit 240 is arranged inside the duct 150 and connected to the heat absorption side of the thermoelectric element 250 so as to cool air introduced into and flowing through the duct 150.
  • the cooling unit 240 be composed of a cooling plate having a plurality of protuberances which transfers heat through contact with air.
  • the heat radiating unit 230 is arranged outside the duct 150 and is connected to the heat radiation side of the thermoelectric element 250 to dissipate heat generated in the thermoelectric element 250, thereby ensuring efficient operation of the thermoelectric element 250. It is preferred that the heat radiating unit 230 be composed of a heat radiating plate 236, which transfers heat through contact with air, and a heat radiating fan 235, which causes forced convection.
  • a plurality of heat radiating fans 235 may be used to suit the environmental cir ⁇ cumstances of the computer.
  • thermoelectric element 250 thermoelectric element 250
  • heat radiating unit 230 are electrically connected with one another to be controlled in their operation by control signals from the control unit 260.
  • the temperature sensors 210 transmit sensed temperature signals to the control unit 260.
  • control unit 260 controls the operation of the thermoelectric element 250 depending upon temperatures sensed by the temperature sensors 210. It is preferred that the temperature of the thermoelectric element 250 be controlled through an automatic switching type on/off control method which employs the difference between inside and outside temperatures or a con ⁇ ventional PWM (pulse width modulation) control method.
  • PWM pulse width modulation
  • thermoelectric element 250 If the positive and negative poles inputted to the thermoelectric element 250 are reversed, heat is generated in the cooling unit 240 and the temperature inside the computer case 10 increases.
  • thermoelectric element 250 Due to this fact, when the temperature outside the computer case 10 is abnormally low under extraordinary environmental circumstances, by reversing the positive and negative poles inputted to the thermoelectric element 250, the temperature inside the computer case 10 can be increased to ensure reliable operation of the computer.
  • the method comprises a temperature sensing step of sensing the temperatures inside and outside the computer case 10 using the temperature sensors 210, and a first comparison step of comparing the inside and outside temperatures sensed in the temperature sensing step.
  • thermoelectric element 250 When it is judged in the first comparison step that the inside temperature is higher than the outside temperature, the thermoelectric element 250, the cooling unit 240 and the heat radiating unit 230 are operated to decrease the temperature inside the computer case 10.
  • conditional branching is effected once more in a second comparison step as will be described below.
  • the difference Tl between the temperatures inside and outside the computer case 10 is compared with a predetermined temperature T2.
  • the predetermined temperature T2 can be changed depending upon the current average humidity.
  • thermoelectric element 250 When it is judged in the second comparison step that the difference Tl between the inside and outside temperatures is greater than the predetermined temperature T2, the operation of the thermoelectric element 250, the cooling unit 240 and the heat radiating unit 230 is interrupted. When it is judged in the second comparison step that the difference Tl between the inside and outside temperatures is smaller than the pre ⁇ determined temperature T2, the thermoelectric element 250, the cooling unit 240 and the heat radiating unit 230 are operated to decrease the temperature inside the computer case 10.
  • the pre ⁇ determined temperature T2 is flexibly changed depending upon the average humidity, which basically varies.
  • the pre ⁇ determined temperature T2 is 3-4 °C.
  • the predetermined temperature T2 can be appropriately changed to conform with environmental circumstances, in particular, humidity.
  • the difference Tl between the temperatures inside and outside the computer case 10 be measured using the variation in electric resistance depending upon temperature.
  • control unit 260 it is possible to drive the computer cooling device by the
  • thermoelectric element 250 PWM control method using the thermoelectric element 250. This PWM control method will be described below.
  • the PWM control method comprises a temperature sensing step of sensing the temperature inside the computer case 10 using the temperature sensor 210 and judging whether or not the sensed temperature is higher than a predetermined temperature.
  • the thermoelectric element 250 is operated to a preset limit temperature which is preset in advance for the sensed temperature, and the heat radiating unit 230 and the cooling unit 240 are operated to cool the space inside the computer case 10.
  • thermoelectric element 250 and heat radiating fan 235 are interrupted.
  • thermoelectric element 250 In order to control the output of the thermoelectric element 250 by comparing the predetermined temperature and the sensed temperatures, it is preferable to use the PWM control method.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention se rapporte à un dispositif destiné à refroidir un ordinateur en utilisant un élément thermoélectrique, un ensemble de refroidissement à air et une conduite. Une conduite est montée sur les cotés arrière et latéraux d'un boîtier d'ordinateur, l'ensemble de refroidissement à air comprenant un élément thermoélectrique, une unité de refroidissement et une unité de refroidissement à air, disposée sur un côté de la conduite, de manière à ce que l'air pénétrant dans une voie à air délimitée à l'intérieur de la conduite puisse être refroidi par l'unité de refroidissement et s'écouler à l'intérieur du boîtier d'ordinateur pour réduire la température à l'intérieur de l'ordinateur. L'unité de refroidissement et l'unité de refroidissement à air sont conçues de manière à utiliser l'effet Peltier de l'élément thermoélectrique pour réduire ainsi efficacement la température à l'intérieur de l'ordinateur.
PCT/KR2005/002872 2004-09-01 2005-08-30 Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique, un ensemble de refroidissement a air et une conduite WO2006025689A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20040069462 2004-09-01
KR10-2004-0069462 2004-09-01

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Publication Number Publication Date
WO2006025689A1 true WO2006025689A1 (fr) 2006-03-09

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PCT/KR2005/002872 WO2006025689A1 (fr) 2004-09-01 2005-08-30 Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique, un ensemble de refroidissement a air et une conduite
PCT/KR2005/002871 WO2006025688A1 (fr) 2004-09-01 2005-08-30 Dispositif de refroidissement pour ordinateur utilisant un element thermoelectrique

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WO (2) WO2006025689A1 (fr)

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
KR101380752B1 (ko) * 2007-03-21 2014-04-02 삼성전자 주식회사 컴퓨터
KR100967441B1 (ko) * 2008-06-27 2010-07-01 한국기계연구원 열전소자를 이용한 컴퓨터 내장형 냉각장치
KR100919525B1 (ko) * 2008-11-13 2009-10-01 한선화 펠티어소자를 이용한 고효율 수배전반
KR200467249Y1 (ko) * 2011-07-08 2013-06-03 주식회사에스디에스산업 추가 냉각수단이 내장된 컴퓨터의 쿨러 제어장치
KR101360423B1 (ko) * 2011-12-08 2014-02-13 기아자동차주식회사 전기차량용 배터리 열교환시스템
KR101339346B1 (ko) * 2013-07-23 2013-12-09 이우근 컴퓨터 냉각장치
KR20180046542A (ko) * 2016-10-28 2018-05-09 주식회사 현대아이티 옥외용 정보 디스플레이 장치의 전원 시스템
KR102414154B1 (ko) 2020-05-06 2022-06-28 주식회사 월드와이드메모리 열전 효과를 이용한 팬 구동 장치

Citations (4)

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Publication number Priority date Publication date Assignee Title
KR19990016782A (ko) * 1997-08-20 1999-03-15 전주범 열전냉각기가 구비된 냉장장치
JP2000165077A (ja) * 1998-11-24 2000-06-16 Matsushita Refrig Co Ltd 電子機器用放熱装置
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
KR100387358B1 (en) * 2002-03-22 2003-06-12 Ec Tech Co Ltd System for cooling computer component using thermoelectric element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200250196Y1 (ko) * 2001-06-29 2001-11-16 에이스텍 주식회사 컴퓨터의 중앙처리장치 냉각 시스템
KR200261263Y1 (ko) * 2001-10-12 2002-01-19 변상훈 반도체 열전소자를 이용한 방열 컴퓨터케이스

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990016782A (ko) * 1997-08-20 1999-03-15 전주범 열전냉각기가 구비된 냉장장치
JP2000165077A (ja) * 1998-11-24 2000-06-16 Matsushita Refrig Co Ltd 電子機器用放熱装置
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
KR100387358B1 (en) * 2002-03-22 2003-06-12 Ec Tech Co Ltd System for cooling computer component using thermoelectric element

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Publication number Publication date
KR20060050828A (ko) 2006-05-19
KR20060050829A (ko) 2006-05-19
WO2006025688A1 (fr) 2006-03-09

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