WO2003077313A3 - Multilayered ceramic substrate for integrated power components and method for the production of said substrate - Google Patents

Multilayered ceramic substrate for integrated power components and method for the production of said substrate Download PDF

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Publication number
WO2003077313A3
WO2003077313A3 PCT/FR2003/000743 FR0300743W WO03077313A3 WO 2003077313 A3 WO2003077313 A3 WO 2003077313A3 FR 0300743 W FR0300743 W FR 0300743W WO 03077313 A3 WO03077313 A3 WO 03077313A3
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WO
WIPO (PCT)
Prior art keywords
substrate
production
ceramic substrate
conductive
integrated power
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Application number
PCT/FR2003/000743
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French (fr)
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WO2003077313A2 (en
Inventor
Pascal Henquenet
Jean-Pierre Bertinet
Original Assignee
Thales Sa
Pascal Henquenet
Jean-Pierre Bertinet
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Application filed by Thales Sa, Pascal Henquenet, Jean-Pierre Bertinet filed Critical Thales Sa
Priority to AU2003233367A priority Critical patent/AU2003233367A1/en
Publication of WO2003077313A2 publication Critical patent/WO2003077313A2/en
Publication of WO2003077313A3 publication Critical patent/WO2003077313A3/en

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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a ceramic substrate (1) consisting of a multilayered structure, comprising electric interconnections and integrated components, characterized in that it also comprises at least one cavity (2) filled with a conductive deposit (3) on at least one portion of the depth thereof, said conductive deposit consisting of a heat sink for receiving a power component. Advantageously, the conductive deposit is electrolytically obtained at low cost in a collective manner. The invention also relates to a module integrating a power component at conductive-deposit level, in addition to the electronic circuit wherein the module is associated with a printed circuit.
PCT/FR2003/000743 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate WO2003077313A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003233367A AU2003233367A1 (en) 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0203119A FR2837061A1 (en) 2002-03-11 2002-03-11 CERAMIC MULTI-LAYERED SUBSTRATE FOR POWER COMPONENT, ELECTRONIC MODULE AND CIRCUIT COMPRISING THE SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE
FR02/03119 2002-03-11

Publications (2)

Publication Number Publication Date
WO2003077313A2 WO2003077313A2 (en) 2003-09-18
WO2003077313A3 true WO2003077313A3 (en) 2004-07-15

Family

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Application Number Title Priority Date Filing Date
PCT/FR2003/000743 WO2003077313A2 (en) 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate

Country Status (3)

Country Link
AU (1) AU2003233367A1 (en)
FR (1) FR2837061A1 (en)
WO (1) WO2003077313A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10328285A1 (en) * 2003-06-23 2005-02-10 Korsten & Goossens Ohg circuit board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333237A2 (en) * 1984-05-18 1989-09-20 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
EP0427265A2 (en) * 1989-11-09 1991-05-15 Ibiden Co., Ltd. Electronic part mounting board and method of manufacturing the same
EP0476971A2 (en) * 1990-09-18 1992-03-25 Ngk Insulators, Ltd. Ceramic packages and ceramic wiring board
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
JPH11191603A (en) * 1997-12-26 1999-07-13 Sanyo Electric Co Ltd Semiconductor integrated circuit and its manufacture
WO2001026152A1 (en) * 1999-09-30 2001-04-12 Hitachi, Ltd. Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333237A2 (en) * 1984-05-18 1989-09-20 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
EP0427265A2 (en) * 1989-11-09 1991-05-15 Ibiden Co., Ltd. Electronic part mounting board and method of manufacturing the same
EP0476971A2 (en) * 1990-09-18 1992-03-25 Ngk Insulators, Ltd. Ceramic packages and ceramic wiring board
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
JPH11191603A (en) * 1997-12-26 1999-07-13 Sanyo Electric Co Ltd Semiconductor integrated circuit and its manufacture
WO2001026152A1 (en) * 1999-09-30 2001-04-12 Hitachi, Ltd. Semiconductor device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
OZMAT B ET AL: "A NEW POWER MODULE PACKAGING TECHNOLOGY FOR ENHANCED THERMAL PERFORMANCE", ITHERM 2000. 7TH. INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMRCHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. LAS VEGAS, NV, MAY 23-26, 2000, INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, NEW YORK, NY: IEEE, US, ISBN: 0-7803-5913-5, XP000958892 *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *
RAM PANICKER M P ET AL: "THERMAL SUBSTRATES: A NEW MICROWAVE SUBSTRATE TECHNOLOGY FOR THERMAL MANAGEMENT AND LOW PARASITIC ELEMENTS", MICROWAVE JOURNAL, HORIZON HOUSE. DEDHAM, US, VOL. 33, NR. 10, PAGE(S) 99,103-105, ISSN: 0192-6225, XP000174994 *

Also Published As

Publication number Publication date
WO2003077313A2 (en) 2003-09-18
AU2003233367A1 (en) 2003-09-22
AU2003233367A8 (en) 2003-09-22
FR2837061A1 (en) 2003-09-12

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