EP1494277A3 - Module with a built-in semiconductor and method for producing the same - Google Patents
Module with a built-in semiconductor and method for producing the same Download PDFInfo
- Publication number
- EP1494277A3 EP1494277A3 EP04014685A EP04014685A EP1494277A3 EP 1494277 A3 EP1494277 A3 EP 1494277A3 EP 04014685 A EP04014685 A EP 04014685A EP 04014685 A EP04014685 A EP 04014685A EP 1494277 A3 EP1494277 A3 EP 1494277A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor device
- built
- module
- semiconductor
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012792 core layer Substances 0.000 abstract 1
- 238000000280 densification Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003190879 | 2003-07-03 | ||
JP2003190879 | 2003-07-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1494277A2 EP1494277A2 (en) | 2005-01-05 |
EP1494277A3 true EP1494277A3 (en) | 2007-08-15 |
Family
ID=33432339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04014685A Withdrawn EP1494277A3 (en) | 2003-07-03 | 2004-06-23 | Module with a built-in semiconductor and method for producing the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US7141884B2 (en) |
EP (1) | EP1494277A3 (en) |
CN (1) | CN1577736A (en) |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3813944B2 (en) * | 2003-04-28 | 2006-08-23 | 松下電器産業株式会社 | Imaging device |
FI20031341A (en) * | 2003-09-18 | 2005-03-19 | Imbera Electronics Oy | Method for manufacturing an electronic module |
CN1774965A (en) * | 2004-03-30 | 2006-05-17 | 松下电器产业株式会社 | Module component and method for manufacturing the same |
US20050224967A1 (en) * | 2004-04-01 | 2005-10-13 | Brandenburg Scott D | Microelectronic assembly with underchip optical window, and method for forming same |
US20050258533A1 (en) * | 2004-05-21 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device mounting structure |
FI117814B (en) * | 2004-06-15 | 2007-02-28 | Imbera Electronics Oy | A method for manufacturing an electronic module |
US20090026567A1 (en) * | 2004-07-28 | 2009-01-29 | Industrial Technology Research Institute | Image sensor package structure and method for fabricating the same |
JP4575071B2 (en) * | 2004-08-02 | 2010-11-04 | 新光電気工業株式会社 | Manufacturing method of electronic component built-in substrate |
TWI253700B (en) * | 2004-08-03 | 2006-04-21 | Ind Tech Res Inst | Image sensor module packaging structure and method thereof |
JP4528062B2 (en) * | 2004-08-25 | 2010-08-18 | 富士通株式会社 | Semiconductor device and manufacturing method thereof |
DE102004046227B3 (en) * | 2004-09-22 | 2006-04-20 | Infineon Technologies Ag | Method for producing a semiconductor component with through contacts through a plastic housing composition and corresponding semiconductor component |
JP2006128625A (en) * | 2004-09-30 | 2006-05-18 | Oki Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
KR100616670B1 (en) * | 2005-02-01 | 2006-08-28 | 삼성전기주식회사 | Image sensor module of chip scale and method of fabricating the same |
JP2008544512A (en) * | 2005-06-16 | 2008-12-04 | イムベラ エレクトロニクス オサケユキチュア | Circuit board structure and manufacturing method thereof |
FI122128B (en) * | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Process for manufacturing circuit board design |
FI119714B (en) | 2005-06-16 | 2009-02-13 | Imbera Electronics Oy | Circuit board structure and method for manufacturing a circuit board structure |
JP4722690B2 (en) * | 2005-12-12 | 2011-07-13 | 富士通セミコンダクター株式会社 | Semiconductor device and manufacturing method thereof |
JPWO2007069427A1 (en) * | 2005-12-15 | 2009-05-21 | パナソニック株式会社 | Electronic component built-in module and manufacturing method thereof |
FI20060256L (en) * | 2006-03-17 | 2006-03-20 | Imbera Electronics Oy | Circuit board manufacturing and the circuit board containing the component |
JP4757079B2 (en) * | 2006-04-03 | 2011-08-24 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
US8174119B2 (en) * | 2006-11-10 | 2012-05-08 | Stats Chippac, Ltd. | Semiconductor package with embedded die |
JP2008198916A (en) * | 2007-02-15 | 2008-08-28 | Spansion Llc | Semiconductor device and manufacturing method thereof |
US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
US7675131B2 (en) * | 2007-04-05 | 2010-03-09 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabricating the same |
JP5215587B2 (en) * | 2007-04-27 | 2013-06-19 | ラピスセミコンダクタ株式会社 | Semiconductor device |
TWI455672B (en) * | 2007-07-06 | 2014-10-01 | Murata Manufacturing Co | A method for forming a hole for connecting a conductor for a layer, a method for manufacturing a resin substrate and a component-mounted substrate, and a method of manufacturing a resin substrate and a component |
JP5215605B2 (en) * | 2007-07-17 | 2013-06-19 | ラピスセミコンダクタ株式会社 | Manufacturing method of semiconductor device |
US7933128B2 (en) * | 2007-10-10 | 2011-04-26 | Epson Toyocom Corporation | Electronic device, electronic module, and methods for manufacturing the same |
US7847387B2 (en) * | 2007-11-16 | 2010-12-07 | Infineon Technologies Ag | Electrical device and method |
WO2009090172A2 (en) * | 2008-01-14 | 2009-07-23 | Oerlikon Trading Ag, Trübbach | Apparatus and method for manufacturing fast and low cost electrical contacts to solar modules |
US7956453B1 (en) * | 2008-01-16 | 2011-06-07 | Amkor Technology, Inc. | Semiconductor package with patterning layer and method of making same |
JP5690466B2 (en) * | 2008-01-31 | 2015-03-25 | インヴェンサス・コーポレイション | Manufacturing method of semiconductor chip package |
KR100972431B1 (en) * | 2008-03-25 | 2010-07-26 | 삼성전기주식회사 | Embedded printed circuit board and manufacturing method thereof |
JP2009246104A (en) * | 2008-03-31 | 2009-10-22 | Kyushu Institute Of Technology | Electronic component for wiring and its manufacturing method |
JP5195903B2 (en) * | 2008-03-31 | 2013-05-15 | 株式会社村田製作所 | Electronic component module and method for manufacturing the electronic component module |
US8084301B2 (en) * | 2008-09-11 | 2011-12-27 | Sanyo Electric Co., Ltd. | Resin sheet, circuit device and method of manufacturing the same |
JP5372579B2 (en) * | 2009-04-10 | 2013-12-18 | 新光電気工業株式会社 | Semiconductor device, manufacturing method thereof, and electronic device |
JP2010278667A (en) * | 2009-05-27 | 2010-12-09 | Fujifilm Corp | Solid-state imaging unit, image capturing apparatus, and method of fixing solid-state image sensor |
US9355962B2 (en) * | 2009-06-12 | 2016-05-31 | Stats Chippac Ltd. | Integrated circuit package stacking system with redistribution and method of manufacture thereof |
TWI405306B (en) | 2009-07-23 | 2013-08-11 | Advanced Semiconductor Eng | Semiconductor package, manufacturing method thereof and chip-redistribution encapsulant |
KR20110039879A (en) * | 2009-10-12 | 2011-04-20 | 삼성전기주식회사 | A printed circuit board comprising embeded electronic component within and a method for manufacturing the same |
US20110084372A1 (en) | 2009-10-14 | 2011-04-14 | Advanced Semiconductor Engineering, Inc. | Package carrier, semiconductor package, and process for fabricating same |
US8837159B1 (en) * | 2009-10-28 | 2014-09-16 | Amazon Technologies, Inc. | Low-profile circuit board assembly |
US8378466B2 (en) | 2009-11-19 | 2013-02-19 | Advanced Semiconductor Engineering, Inc. | Wafer-level semiconductor device packages with electromagnetic interference shielding |
JP5665020B2 (en) * | 2009-12-22 | 2015-02-04 | 国立大学法人九州工業大学 | Manufacturing method of electronic parts for wiring |
TWI469289B (en) * | 2009-12-31 | 2015-01-11 | 矽品精密工業股份有限公司 | Semiconductor package structure and fabrication method thereof |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
US8372689B2 (en) | 2010-01-21 | 2013-02-12 | Advanced Semiconductor Engineering, Inc. | Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof |
US8368187B2 (en) | 2010-02-03 | 2013-02-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die |
US8320134B2 (en) * | 2010-02-05 | 2012-11-27 | Advanced Semiconductor Engineering, Inc. | Embedded component substrate and manufacturing methods thereof |
TWI411075B (en) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | Semiconductor package and manufacturing method thereof |
JP2011222946A (en) * | 2010-03-26 | 2011-11-04 | Sumitomo Bakelite Co Ltd | Circuit board, semiconductor device, method of manufacturing circuit board and method of manufacturing semiconductor device |
US8624374B2 (en) | 2010-04-02 | 2014-01-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof |
KR101085733B1 (en) * | 2010-05-28 | 2011-11-21 | 삼성전기주식회사 | Printed circuit board having electronic component and method for manufacturing thereof |
US8188591B2 (en) | 2010-07-13 | 2012-05-29 | International Business Machines Corporation | Integrated structures of high performance active devices and passive devices |
US8847376B2 (en) * | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
KR20120026855A (en) | 2010-09-10 | 2012-03-20 | 삼성전기주식회사 | Embedded ball grid array substrate and manufacturing method thereof |
US8941222B2 (en) | 2010-11-11 | 2015-01-27 | Advanced Semiconductor Engineering Inc. | Wafer level semiconductor package and manufacturing methods thereof |
US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
US8867219B2 (en) | 2011-01-14 | 2014-10-21 | Harris Corporation | Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices |
US20120217396A1 (en) * | 2011-02-24 | 2012-08-30 | Remote Technologies, Inc. | Flexible and convenient ir emitter device |
US8487426B2 (en) | 2011-03-15 | 2013-07-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with embedded die and manufacturing methods thereof |
JP5946520B2 (en) * | 2011-05-19 | 2016-07-06 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Optoelectronic device and method of manufacturing optoelectronic device |
US9252172B2 (en) | 2011-05-31 | 2016-02-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region |
KR101218989B1 (en) * | 2011-07-15 | 2013-01-21 | 삼성전기주식회사 | Semiconductor package and manufacturing method thereof |
TWI497668B (en) * | 2011-07-27 | 2015-08-21 | 矽品精密工業股份有限公司 | Semiconductor package and method of forming same |
EP2745324A2 (en) * | 2011-08-19 | 2014-06-25 | Imi Usa, Inc. | Flip-chip bonded imager die |
TWI455381B (en) * | 2011-09-15 | 2014-10-01 | Lextar Electronics Corp | Package structure of semiconductor light emitting element |
US9564413B2 (en) | 2011-09-15 | 2017-02-07 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus |
US9553162B2 (en) | 2011-09-15 | 2017-01-24 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus |
US20130186676A1 (en) * | 2012-01-20 | 2013-07-25 | Futurewei Technologies, Inc. | Methods and Apparatus for a Substrate Core Layer |
TWI445469B (en) * | 2012-05-25 | 2014-07-11 | Unimicron Technology Corp | Sensing device package structure and method of fabricating the same |
US20150198484A1 (en) * | 2012-07-06 | 2015-07-16 | Pricer Ab | Electronic shelf label with an optical arrangement |
US9236652B2 (en) * | 2012-08-21 | 2016-01-12 | Raytheon Company | Broadband array antenna enhancement with spatially engineered dielectrics |
JP5831401B2 (en) | 2012-08-24 | 2015-12-09 | 三菱電機株式会社 | Semiconductor device |
US9293404B2 (en) * | 2013-01-23 | 2016-03-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pre-applying supporting materials between bonded package components |
JP2014154594A (en) * | 2013-02-05 | 2014-08-25 | Ibiden Co Ltd | Electronic component built-in wiring board |
US9000344B2 (en) * | 2013-03-15 | 2015-04-07 | Sensors Unlimited, Inc. | Focal plane array periphery through-vias for read out integrated circuit |
US9276030B2 (en) * | 2013-03-15 | 2016-03-01 | Sensors Unlimited, Inc. | Read out integrated circuit input/output routing on permanent carrier |
EP2797105B1 (en) * | 2013-04-26 | 2018-08-15 | Amsterdam Scientific Instruments Holding B.V. | Detection of ions in an ion trap |
WO2014203603A1 (en) * | 2013-06-18 | 2014-12-24 | 株式会社村田製作所 | Method for manufacturing multi-layer resin substrate |
CN104640350B (en) * | 2013-11-11 | 2018-04-20 | 日月光半导体制造股份有限公司 | Circuit board module |
SG10201400396WA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and stacked package module with the same |
TWI517775B (en) * | 2014-03-06 | 2016-01-11 | 相互股份有限公司 | Printed circuit board and method thereof |
CN105336723B (en) | 2014-07-28 | 2018-09-14 | 通用电气公司 | Semiconductor module, semiconductor module block assembly and semiconductor device |
DE102014112540A1 (en) * | 2014-09-01 | 2016-03-03 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US20160240457A1 (en) * | 2015-02-18 | 2016-08-18 | Altera Corporation | Integrated circuit packages with dual-sided stacking structure |
US10177130B2 (en) * | 2015-04-01 | 2019-01-08 | Bridge Semiconductor Corporation | Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener |
JP2016219707A (en) * | 2015-05-25 | 2016-12-22 | 富士電機株式会社 | Semiconductor device and manufacturing method of the same |
US10325783B2 (en) * | 2015-06-09 | 2019-06-18 | Infineon Technologies Ag | Semiconductor device including structure to control underfill material flow |
CN105552024B (en) * | 2016-03-14 | 2018-07-06 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display device |
DE102016213878B3 (en) * | 2016-07-28 | 2017-11-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Housing for a microchip with a structured layer composite and manufacturing method therefor |
US9960328B2 (en) * | 2016-09-06 | 2018-05-01 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US10644046B2 (en) * | 2017-04-07 | 2020-05-05 | Samsung Electronics Co., Ltd. | Fan-out sensor package and optical fingerprint sensor module including the same |
US10446504B2 (en) * | 2017-05-18 | 2019-10-15 | Xintec Inc. | Chip package and method for forming the same |
CN108971628B (en) | 2017-05-31 | 2021-02-02 | 博世电动工具(中国)有限公司 | Electric tool |
JP6635605B2 (en) * | 2017-10-11 | 2020-01-29 | 国立研究開発法人理化学研究所 | Current introduction terminal, pressure holding device and X-ray imaging device having the same |
CN109979890A (en) * | 2017-12-28 | 2019-07-05 | 凤凰先驱股份有限公司 | Electronic packing piece and its preparation method |
TWI672786B (en) * | 2017-12-28 | 2019-09-21 | 英屬開曼群島商鳳凰先驅股份有限公司 | Electronic package and method of manufacture |
WO2019194539A1 (en) * | 2018-04-04 | 2019-10-10 | 엘지이노텍 주식회사 | Thermoelectric element |
CN113013130A (en) * | 2019-12-20 | 2021-06-22 | 奥特斯科技(重庆)有限公司 | Component carrier with dual dielectric layers and method for manufacturing the same |
US11183765B2 (en) | 2020-02-05 | 2021-11-23 | Samsung Electro-Mechanics Co., Ltd. | Chip radio frequency package and radio frequency module |
US11101840B1 (en) * | 2020-02-05 | 2021-08-24 | Samsung Electro-Mechanics Co., Ltd. | Chip radio frequency package and radio frequency module |
TWI767835B (en) * | 2021-09-07 | 2022-06-11 | 恆勁科技股份有限公司 | Fingerprint recognition module packaging structure and manufacturing method thereof |
US20240038683A1 (en) * | 2022-07-28 | 2024-02-01 | Nxp B.V. | Semiconductor device with stress relief feature and method therefor |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5617131A (en) * | 1993-10-28 | 1997-04-01 | Kyocera Corporation | Image device having a spacer with image arrays disposed in holes thereof |
US5766982A (en) * | 1996-03-07 | 1998-06-16 | Micron Technology, Inc. | Method and apparatus for underfill of bumped or raised die |
EP0920058A2 (en) * | 1997-11-25 | 1999-06-02 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
JPH11274734A (en) * | 1998-03-20 | 1999-10-08 | Sony Corp | Electronic circuit device and its manufacture |
US6093972A (en) * | 1997-05-19 | 2000-07-25 | Motorola, Inc. | Microelectronic package including a polymer encapsulated die |
WO2001001497A1 (en) * | 1999-06-29 | 2001-01-04 | Honeywell Inc. | Hermetic chip-scale package for photonic devices |
US6351390B1 (en) * | 1996-12-17 | 2002-02-26 | Laboratorium Fur Physikalische Elektronik Institut Fur Quantenelektronik | Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly |
EP1304742A2 (en) * | 2001-10-18 | 2003-04-23 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
JP2003179356A (en) * | 2001-09-27 | 2003-06-27 | Matsushita Electric Ind Co Ltd | Insulating sheet and multilayer wiring board as well as method of manufacturing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3598060B2 (en) | 1999-12-20 | 2004-12-08 | 松下電器産業株式会社 | CIRCUIT COMPONENT MODULE, MANUFACTURING METHOD THEREOF, AND RADIO DEVICE |
US6538210B2 (en) | 1999-12-20 | 2003-03-25 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module, radio device having the same, and method for producing the same |
DE60128656T2 (en) * | 2000-02-25 | 2007-10-04 | Ibiden Co., Ltd., Ogaki | MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF |
JP4004705B2 (en) | 2000-02-29 | 2007-11-07 | 松下電器産業株式会社 | Imaging device and imaging device assembling method |
-
2004
- 2004-06-22 US US10/872,727 patent/US7141884B2/en not_active Expired - Fee Related
- 2004-06-23 EP EP04014685A patent/EP1494277A3/en not_active Withdrawn
- 2004-06-30 CN CNA200410063214XA patent/CN1577736A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5617131A (en) * | 1993-10-28 | 1997-04-01 | Kyocera Corporation | Image device having a spacer with image arrays disposed in holes thereof |
US5766982A (en) * | 1996-03-07 | 1998-06-16 | Micron Technology, Inc. | Method and apparatus for underfill of bumped or raised die |
US6351390B1 (en) * | 1996-12-17 | 2002-02-26 | Laboratorium Fur Physikalische Elektronik Institut Fur Quantenelektronik | Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly |
US6093972A (en) * | 1997-05-19 | 2000-07-25 | Motorola, Inc. | Microelectronic package including a polymer encapsulated die |
EP0920058A2 (en) * | 1997-11-25 | 1999-06-02 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
JPH11274734A (en) * | 1998-03-20 | 1999-10-08 | Sony Corp | Electronic circuit device and its manufacture |
WO2001001497A1 (en) * | 1999-06-29 | 2001-01-04 | Honeywell Inc. | Hermetic chip-scale package for photonic devices |
JP2003179356A (en) * | 2001-09-27 | 2003-06-27 | Matsushita Electric Ind Co Ltd | Insulating sheet and multilayer wiring board as well as method of manufacturing the same |
EP1304742A2 (en) * | 2001-10-18 | 2003-04-23 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
CN1577736A (en) | 2005-02-09 |
US20050001331A1 (en) | 2005-01-06 |
US7141884B2 (en) | 2006-11-28 |
EP1494277A2 (en) | 2005-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1494277A3 (en) | Module with a built-in semiconductor and method for producing the same | |
KR102332362B1 (en) | Ultra-thin embedded semiconductor device package and method of manufacturing therof | |
EP1505858A3 (en) | Circuit module and manufacturing method thereof | |
CN102119588B (en) | Method for manufacturing module with built-in component, and module with built-in component | |
EP1646271A3 (en) | Control device and method of manufacturing thereof | |
EP1460688A3 (en) | Resin sealed electronic assembly and method of manufacturing the same | |
CN110517991B (en) | Metal ceramic module and manufacturing method thereof, circuit board module and manufacturing method thereof | |
EP1107306A4 (en) | Semiconductor package, semiconductor device, electronic device and production method for semiconductor package | |
EP1111674A3 (en) | Circuit component built-in module, radio device having the same, and method for producing the same | |
EP1990831A3 (en) | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | |
US20110088936A1 (en) | Method for manufacturing an electronic assembly | |
CN103021982B (en) | Integrated circuit and manufacturing method | |
EP2290682A3 (en) | Package with a chip embedded between two substrates and method of manufacturing the same | |
EP3633716A1 (en) | Package with embedded electronic component being encapsulated in a pressureless way | |
CN108366494B (en) | Solid state transition piece convertible to viscous state for embedding a component in a component carrier | |
EP1724832A3 (en) | Multilayer module formed of modules stacked on top of each other and method of manufacturing the same | |
CN107968055B (en) | Packaging method of semiconductor device | |
EP1069811A3 (en) | Multi-layer wiring board and method for manufacturing the same | |
CN109640521A (en) | Manufacture the method and component load-bearing part with the component load-bearing part of embedded cluster | |
CN105210462A (en) | Method for manufacturing component-embedded substrate, and component-embedded substrate | |
JP2004055967A (en) | Manufacturing method of board with built-in electronic component | |
US11058004B2 (en) | Metallic layer as carrier for component embedded in cavity of component carrier | |
Lee et al. | Coin insertion technology for PCB thermal solution | |
EP1628509A3 (en) | Electronic module with form in-place pedestal | |
JP3885169B2 (en) | Semiconductor device manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 31/0232 20060101ALI20070710BHEP Ipc: H01L 31/0203 20060101ALI20070710BHEP Ipc: H01L 25/10 20060101ALI20070710BHEP Ipc: H01L 23/055 20060101AFI20040909BHEP |
|
AKX | Designation fees paid | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20080102 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: 8566 |