AU2003233367A8 - Multilayered ceramic substrate for integrated power components and method for the production of said substrate - Google Patents

Multilayered ceramic substrate for integrated power components and method for the production of said substrate

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Publication number
AU2003233367A8
AU2003233367A8 AU2003233367A AU2003233367A AU2003233367A8 AU 2003233367 A8 AU2003233367 A8 AU 2003233367A8 AU 2003233367 A AU2003233367 A AU 2003233367A AU 2003233367 A AU2003233367 A AU 2003233367A AU 2003233367 A8 AU2003233367 A8 AU 2003233367A8
Authority
AU
Australia
Prior art keywords
substrate
production
integrated power
power components
multilayered ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003233367A
Other versions
AU2003233367A1 (en
Inventor
Jean-Pierre Bertinet
Pascal Henquenet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
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Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Publication of AU2003233367A1 publication Critical patent/AU2003233367A1/en
Publication of AU2003233367A8 publication Critical patent/AU2003233367A8/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2003233367A 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate Abandoned AU2003233367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0203119A FR2837061A1 (en) 2002-03-11 2002-03-11 CERAMIC MULTI-LAYERED SUBSTRATE FOR POWER COMPONENT, ELECTRONIC MODULE AND CIRCUIT COMPRISING THE SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE
FR02/03119 2002-03-11
PCT/FR2003/000743 WO2003077313A2 (en) 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate

Publications (2)

Publication Number Publication Date
AU2003233367A1 AU2003233367A1 (en) 2003-09-22
AU2003233367A8 true AU2003233367A8 (en) 2003-09-22

Family

ID=27763729

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003233367A Abandoned AU2003233367A1 (en) 2002-03-11 2003-03-07 Multilayered ceramic substrate for integrated power components and method for the production of said substrate

Country Status (3)

Country Link
AU (1) AU2003233367A1 (en)
FR (1) FR2837061A1 (en)
WO (1) WO2003077313A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10328285A1 (en) * 2003-06-23 2005-02-10 Korsten & Goossens Ohg circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333237A3 (en) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
JP2813682B2 (en) * 1989-11-09 1998-10-22 イビデン株式会社 Substrate for mounting electronic components
US5294750A (en) * 1990-09-18 1994-03-15 Ngk Insulators, Ltd. Ceramic packages and ceramic wiring board
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
JPH11191603A (en) * 1997-12-26 1999-07-13 Sanyo Electric Co Ltd Semiconductor integrated circuit and its manufacture
JP4480818B2 (en) * 1999-09-30 2010-06-16 株式会社ルネサステクノロジ Semiconductor device

Also Published As

Publication number Publication date
AU2003233367A1 (en) 2003-09-22
WO2003077313A3 (en) 2004-07-15
WO2003077313A2 (en) 2003-09-18
FR2837061A1 (en) 2003-09-12

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