WO2003071636A1 - Elektrotechnisches gerät - Google Patents
Elektrotechnisches gerät Download PDFInfo
- Publication number
- WO2003071636A1 WO2003071636A1 PCT/EP2003/000712 EP0300712W WO03071636A1 WO 2003071636 A1 WO2003071636 A1 WO 2003071636A1 EP 0300712 W EP0300712 W EP 0300712W WO 03071636 A1 WO03071636 A1 WO 03071636A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- housing
- chamber
- contact pins
- opening
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/933—Special insulation
- Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive
Definitions
- the invention relates to an electrotechnical device.
- Modern electrotechnical devices e.g. Measuring devices usually have several components. These components, e.g. Sensors, electronic assemblies, etc., are preferably modular today.
- a modular structure allows the device to be offered in a large number of different variants without all variants having to be available in sufficient quantities. Only the components that are combined as required need to be in stock.
- a modular structure offers advantages in manufacturing.
- a special variant of the device can be produced from the components in a short time. The components are preferably connected to one another by simple plug connections.
- a potting material e.g. a silicone rubber, for example to prevent moisture penetration.
- the potting material is poured into the device in the liquid state. If the liquid casting compound reaches the area of electrical plug-in connections, the quality of an electrical connection between the contacts to be connected by the plug-in connection can be impaired or even permanently disturbed by the potting material.
- the invention consists in an electrotechnical device
- a second component arranged in the housing, which has a base on which contact plugs are provided at the end for receiving the contact pins,
- the housing is filled with a potting material from a side opposite the opening of the chamber.
- the first component is an electronic assembly.
- the second component is a sensor assembly.
- the chamber is a two-component injection molded part which, at the points where the contact pins penetrate the rear wall, consists of a plastic with a lower Shore hardness.
- the rear wall of the chamber is self-sealing where the contact pins penetrate through the plastic with a low Shore hardness.
- the invention consists in a method for filling an electrotechnical device according to the invention with a potting material, in which
- the unit is placed in an upright position with the opening of the chamber facing downwards and the rear wall of the chamber facing upwards, and
- the potting material is filled in from above, - So that an existing inside the chamber plug connection between the contact pins and the contact plugs is covered by the chamber and an area of the plug connection is spared from the potting material.
- FIG. 1 shows an exploded view of an electrotechnical device
- Fig. 2 shows a section through the housing with two components connected by a plug connection
- FIG. 3 shows a section through the housing with the two components, the section plane being rotated by 90 ° with respect to the section plane shown in FIG. 2.
- FIG. 1 shows an exploded view of an electrical device according to the invention.
- the exemplary embodiment shown is an electromechanical fill level sensor for determining and / or monitoring a predetermined fill level in a container, such as is used in measurement and control technology.
- the device has a housing 1.
- the housing 1 is designed as a screw-in piece with a threaded section 3 and a hexagon head 5.
- a cylindrical interior of the housing 1 is hollow and closed at its lower end by a membrane 7. Ends of two vibrating rods 9 are formed on the membrane 7.
- the level sensor is fastened in an internally threaded opening of a container wall in such a way that the vibrating rods protrude into the interior of the container and come into contact with a filling material in the container when it reaches the predetermined filling level.
- a first component 11 and a second component 13 of the electrotechnical device are arranged in the interior.
- the first component 11 is an electronic assembly in the exemplary embodiment shown. It essentially consists of an electronic circuit arranged on two printed circuit boards 15.
- the first component 11 has at least one contact pin 17 projecting at the end. In the illustrated embodiment, a plurality of contact pins 17 are arranged in a double row.
- the second component 13 is e.g. a sensor assembly.
- the sensor assembly comprises an electromechanical converter. This consists e.g. of piezoelectric elements arranged in a stack.
- the electromechanical converter contains an excitation and a reception converter. When an AC voltage is applied to the excitation transducer, it sets the membrane 7 in vibrations, which in turn are transmitted to the vibrating rods 9, so that these vibrations are perpendicular to the longitudinal axis thereof. If mechanical vibrations act on the receiving transducer, these generate an electrical alternating voltage with the frequency of the vibration.
- the electronic assembly contains an amplifier which receives the AC voltage generated by the receive converter at the input and transmits the amplified AC voltage to the excitation converter at the output.
- the mechanical vibration system formed by the membrane 7 and the vibrating rods 9 via the electromechanical transducer in the feedback circuit of the amplifier, so that it excites to vibrations with its own resonance frequency. If the vibrating rods 9 are not in contact with the filling material, the natural frequency of the mechanical vibration system is higher than when the vibrating rods 9 are immersed in the filling material.
- the electronics module assigned to the sensor module contains an additional evaluation circuit which determines whether the frequency of the alternating voltage emitted by the amplifier is above or below a predetermined threshold value.
- the first and the second component 11, 13 are both arranged in the housing 1.
- the second component 13 comprises a base element 18 and a base 19 molded thereon.
- contact plugs 21 are arranged at the ends, which are provided for receiving the contact pins 17.
- FIGS. 2 and 3 show two sections of the device shown in FIG. 1. For the sake of clarity, the vibrating rods 9 are not shown. The cuts are in cutting planes that are rotated 90 ° against each other.
- An insert 23 is arranged in the housing 1.
- the insert 23 serves to receive the first component 11.
- the insert 23 has an almost cylindrical section 25, into which the electronic assembly is inserted through an end-side first opening 27.
- a holder for the printed circuit boards 15 is provided in the cylindrical section 25.
- the cylindrical section 25 is closed by a rear wall 29.
- a closed chamber 31 is formed on the cylindrical section 25 on a side of the rear wall 29 opposite the first opening 27.
- the chamber 31 preferably forms a two-component injection molded part which, at the points where the contact pins 17 penetrate the rear wall 29, consists of a plastic with a lower Shore hardness.
- the chamber 31 can be an integral part of the insert 23, which is then preferably designed entirely as a two-component injection molded part.
- the rear wall 29 of the chamber 31 is preferably formed from a plastic with a lower Shore hardness where the contact pins 17 penetrate it.
- a soft plastic encloses the Contact pins 17 closely and is therefore self-sealing in the area of the contact pins 17. This offers the advantage that no measures are required to achieve an airtight seal. The sealing is brought about simply by inserting the contact pins 17.
- the insert 23 is e.g. made of polycarbonate (PC) and as a soft plastic, e.g. a thermoplastic polymer.
- PC polycarbonate
- soft plastic e.g. a thermoplastic polymer.
- the choice of plastic for insert 23 is relatively free.
- the choice of the soft plastic is limited to those materials which ensure an airtight self-sealing where the contact pins 17 penetrate them.
- the chamber 31 has an opening 33 arranged opposite the rear wall 29, into which the base 19 of the second component 13 is inserted.
- the contact pins 17 are inserted through the rear wall 29 opposite the opening 33 into the contact plug 21 of the base 19.
- the housing 1 is filled with a potting material from a side opposite the opening 33 of the chamber 31.
- the potting material is shown in the figures as hatching composed of horizontal dashed lines.
- Suitable potting material is e.g. a gel-like two-component silicone rubber that is liquid after mixing the two components and then vulcanized by addition crosslinking.
- the device is filled with potting material by placing the device in an upright position.
- the opening 33 of the chamber 31 points downwards and the rear wall 29 of the chamber 31 points upwards.
- the potting material is filled into the housing 1 from above in this position.
- the terms above and below refer to the filling positions shown in the drawing.
- the potting material flows into the housing and penetrates through the opening 27 into the insert 23.
- the cylindrical region 25 is completely filled with potting material.
- potting material flows around the insert 23 and reaches the base element 18 of the second component 13 in this way. If the base element 18 has openings for this, interior spaces of the base element 18 can also be filled with potting material.
- the potting material slowly fills the entire interior of the device from the bottom up and closes the chamber 31 when climbing up.
- the chamber 31 forms a protective sleeve on which the potting material flows off on the outside.
- No potting material can penetrate from below through the opening 33 either, since the enclosed air counteracts this. Just like a cup that is immersed in water with the opening facing downwards, the pressure of the enclosed air also prevents liquid from penetrating here. Sealing of the opening 33 is not necessary.
- the plug connection existing in the interior of the chamber 31 between the contact pins 17 and the contact plugs 21 is covered by the chamber 31.
- the area of the plug connection is therefore left free from the potting material.
- the device can also have two or more plug connections between individual components which are spared from potting material in the manner according to the invention. To do this, it is only necessary to arrange the orientations of the individual chambers so that their rear walls point in the same direction.
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Casings For Electric Apparatus (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Seal Device For Vehicle (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50313664T DE50313664D1 (de) | 2002-02-23 | 2003-01-24 | Elektrotechnisches gerät |
EP03742500A EP1476923B1 (de) | 2002-02-23 | 2003-01-24 | Elektrotechnisches gerät |
US10/503,087 US6991475B2 (en) | 2002-02-23 | 2003-01-24 | Electrotechnical device |
AU2003247310A AU2003247310A1 (en) | 2002-02-23 | 2003-01-24 | Electrotechnical device |
AT03742500T ATE508500T1 (de) | 2002-02-23 | 2003-01-24 | Elektrotechnisches gerät |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10207762.2 | 2002-02-23 | ||
DE10207762A DE10207762A1 (de) | 2002-02-23 | 2002-02-23 | Elektrotechnisches Gerät |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003071636A1 true WO2003071636A1 (de) | 2003-08-28 |
Family
ID=27674898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/000712 WO2003071636A1 (de) | 2002-02-23 | 2003-01-24 | Elektrotechnisches gerät |
Country Status (7)
Country | Link |
---|---|
US (1) | US6991475B2 (de) |
EP (1) | EP1476923B1 (de) |
CN (1) | CN100352107C (de) |
AT (1) | ATE508500T1 (de) |
AU (1) | AU2003247310A1 (de) |
DE (2) | DE10207762A1 (de) |
WO (1) | WO2003071636A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007011378A1 (en) * | 2004-09-27 | 2007-01-25 | Lockheed Martin Corporation | Rugged, removable, electronic device |
DE102007009403A1 (de) | 2007-02-23 | 2008-08-28 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
DE102007036456A1 (de) | 2007-08-03 | 2009-02-05 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
EP2269845A3 (de) * | 2009-07-03 | 2011-03-02 | WESTFALIA - Automotive GmbH | Steckdose einer Anhängekupplung |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005128870A (ja) * | 2003-10-24 | 2005-05-19 | Jatco Ltd | 車両の制御装置 |
TWI352463B (en) * | 2008-01-23 | 2011-11-11 | Waterproof connector and method for the same | |
DE102008022371A1 (de) * | 2008-05-06 | 2009-11-12 | Endress + Hauser Gmbh + Co. Kg | Vergussdichte Steckverbindung |
DE102013217892A1 (de) | 2012-12-20 | 2014-06-26 | Continental Teves Ag & Co. Ohg | Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung |
HUE031423T2 (en) * | 2013-01-30 | 2017-07-28 | Grieshaber Vega Kg | Adapter with mechanical connection surface for connection to meter housing |
JP6384383B2 (ja) | 2015-03-30 | 2018-09-05 | 株式会社デンソー | 電子装置 |
TWI569529B (zh) * | 2015-10-06 | 2017-02-01 | 飛宏科技股份有限公司 | 電源插頭裝置及其製造方法 |
DE102017119358A1 (de) * | 2017-08-24 | 2019-02-28 | Endress+Hauser SE+Co. KG | Modulares Feldgerät |
DE102017218659B3 (de) * | 2017-10-19 | 2019-04-25 | Audi Ag | Verfahren zur Herstellung einer elektronischen Komponente, insbesondere einer Mechatronikkomponente sowie verfahrensgemäß hergestellte elektronische Komponente |
DE102022104763A1 (de) | 2022-02-28 | 2023-08-31 | Endress+Hauser SE+Co. KG | Modulares Feldgerät |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0991307A2 (de) * | 1998-09-11 | 2000-04-05 | Meggitt Mobrey Limited | Gehäuse für elektronische Bauteile und Verfahren zum Zusammenbauen ein solches Gehäuse |
EP1076479A1 (de) * | 1999-07-23 | 2001-02-14 | Ford Motor Company | Integrierte Sensor- und Steuerungsanordnung und Verfahren zu deren Herstellung |
US20010038883A1 (en) * | 2000-05-05 | 2001-11-08 | Gebhard Balluff Gmbh & Co. | Hermetically encapsulated sensor and process for its production |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335932A (en) * | 1980-02-29 | 1982-06-22 | Amp Incorporated | Elastomeric potting shell |
GB2076843B (en) * | 1980-05-20 | 1983-11-16 | Standard Telephones Cables Ltd | Hydrophobic gel composition |
DE3818499A1 (de) * | 1988-05-31 | 1989-12-07 | Ifm Electronic Gmbh | Elektronisches schaltgeraet, insbesondere naeherungsschalter |
DE4023792C2 (de) * | 1990-07-26 | 2000-05-11 | Siemens Ag | Verfahren zur Herstellung eines Näherungsschalters mit Befestigungshülse |
JPH05226051A (ja) * | 1992-02-07 | 1993-09-03 | Ichikoh Ind Ltd | バルブソケットのシール方法および同シール構造 |
DE19504608C2 (de) * | 1995-02-11 | 2002-03-21 | Balluff Gebhard Feinmech | Positionssensor und Verfahren zur Herstellung desselben |
EP0766073B1 (de) * | 1995-09-28 | 2002-01-02 | Endress + Hauser GmbH + Co. | Elektronikgehäuse |
CN2264405Y (zh) * | 1995-11-29 | 1997-10-08 | 黄维枢 | 户外式低压电流互感器 |
CN1167423A (zh) * | 1996-06-03 | 1997-12-10 | 陶夏根 | 电子线路(或电子产品)的常温封固 |
DE19852730C2 (de) * | 1998-11-16 | 2001-08-16 | Harting Kgaa | Baugruppe zur gas- und flüssigkeitsdichten Durchführung elektrischer Leiter aus einem Halteteil und einem darin eingegossenen Kontaktstift |
US6854996B2 (en) * | 2002-12-20 | 2005-02-15 | Tyco Electronics Corporation | Electrical connectors and methods for using the same |
-
2002
- 2002-02-23 DE DE10207762A patent/DE10207762A1/de not_active Withdrawn
-
2003
- 2003-01-24 DE DE50313664T patent/DE50313664D1/de not_active Expired - Lifetime
- 2003-01-24 AU AU2003247310A patent/AU2003247310A1/en not_active Abandoned
- 2003-01-24 US US10/503,087 patent/US6991475B2/en not_active Expired - Lifetime
- 2003-01-24 EP EP03742500A patent/EP1476923B1/de not_active Expired - Lifetime
- 2003-01-24 WO PCT/EP2003/000712 patent/WO2003071636A1/de not_active Application Discontinuation
- 2003-01-24 AT AT03742500T patent/ATE508500T1/de active
- 2003-01-24 CN CNB038044188A patent/CN100352107C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0991307A2 (de) * | 1998-09-11 | 2000-04-05 | Meggitt Mobrey Limited | Gehäuse für elektronische Bauteile und Verfahren zum Zusammenbauen ein solches Gehäuse |
EP1076479A1 (de) * | 1999-07-23 | 2001-02-14 | Ford Motor Company | Integrierte Sensor- und Steuerungsanordnung und Verfahren zu deren Herstellung |
US20010038883A1 (en) * | 2000-05-05 | 2001-11-08 | Gebhard Balluff Gmbh & Co. | Hermetically encapsulated sensor and process for its production |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007011378A1 (en) * | 2004-09-27 | 2007-01-25 | Lockheed Martin Corporation | Rugged, removable, electronic device |
DE102007009403A1 (de) | 2007-02-23 | 2008-08-28 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
DE102007009403B4 (de) | 2007-02-23 | 2022-05-05 | Endress+Hauser SE+Co. KG | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
DE102007036456A1 (de) | 2007-08-03 | 2009-02-05 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
DE102007036456B4 (de) | 2007-08-03 | 2021-12-16 | Endress+Hauser SE+Co. KG | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße |
EP2269845A3 (de) * | 2009-07-03 | 2011-03-02 | WESTFALIA - Automotive GmbH | Steckdose einer Anhängekupplung |
EP2671740A3 (de) * | 2009-07-03 | 2014-05-21 | WESTFALIA - Automotive GmbH | Steckdose einer Anhängekupplung |
Also Published As
Publication number | Publication date |
---|---|
EP1476923A1 (de) | 2004-11-17 |
US6991475B2 (en) | 2006-01-31 |
US20050255733A1 (en) | 2005-11-17 |
CN100352107C (zh) | 2007-11-28 |
AU2003247310A1 (en) | 2003-09-09 |
DE50313664D1 (de) | 2011-06-16 |
DE10207762A1 (de) | 2003-09-04 |
EP1476923B1 (de) | 2011-05-04 |
CN1639924A (zh) | 2005-07-13 |
ATE508500T1 (de) | 2011-05-15 |
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