WO2003048912A1

WO2003048912A1 - Heat sink in notebook computer

Info

Publication number: WO2003048912A1
Application number: PCT/KR2002/002171
Authority: WO
Inventors: Bong Young Kim
Original assignee: Bong Young Kim
Priority date: 2001-12-03
Filing date: 2002-11-21
Publication date: 2003-06-12
Also published as: KR200268632Y1

Abstract

The present invention relates to a notebook personal computer. In detail, the present invention relates to a heat sink method used for heat dissipating from a high heat-generating components such as a cpu, a vga chip, a north bridge chip in a notebook personal computer. In the present invention, the chips are arranged on a system circuit board which is located in lid of a notebook pc. Especially the top portion of a chips positioned toward the inner side of a back section of the lid and thermally coupled. In addition to, a heat cut sheet is disposed between the lcd pannel and the system circuit board for a prevention of high heat transferring. Main purpose of this invention is an efficient heat radiating in a notebook personal computer.

Description

DESCRIPTION HEAX SINK IN NOTEBOOK COMPUTER 1 - Tecl n i csi 1 Field.

The present invention relates to a Notebook Personal Computer(notebook pc). More particularly, the present invention relates to an effective heat dissipation of chips such as a microprocessor(cpu),a vga chip,a north bridge chip mounted on a system circuit board in a notebook pc. 2. Background At—t - All notebook pc radiates an huge amount of high heat during use. As a result,this high heat caused many problems in a notebook pc. Accordingly all notebook pc have to diffuse quickly this high heat radiated by chips on a system circuit board from inside to outside for securring of the normal operation. On the purpose of,some conventional methods are used. One is using only a heat sink device attached on the chips on a system circuit board. In this manner,the high heat radiated by chips on a system circuit board once diffused to inside of the notebook pc by heat sink device attached on the chips, and dissipated by the air circulation in a pc. This method is useful for a low performance computing but useless for a high performance computing because the amount of high heat radiated by chips on a system circuit board in a high performance computing is much higher than a low performance computing. Another is using heat transfer device such as a heat pipe with a cooling fan. In this manner, the high heat radiated by chips on a system circuit board transferred through heat pipe to a cooling fan. and the cooling fan dissipate the transferred high heat to outside of the notebook pc. This is more effective than using only a heat sink device. But this method has an another problems. That is an extened thermal transfer path which is reduce the efficient heat transferring especially in complex circumstances like a notebook pc,and an undesirable battery power consumption which makes a short operating time of the notebook pc ,and a fan noise. A third is using a heat transfer device such as a heat pipe without a cooling fan. Instead, In this manner,the high heat radiated by chips on a system circuit is transferred from chips through the heat pipe to a base hinge, and the high heat reached the base hinge move through a hinge connection to a lid hinge,then diffused. This method use the hinges as a heat sink device but the efficiency of heat dissipation is low. Because, though the high heat radiated by chips on a system circuit board can be moved easily from the chips through the heat pipe to the base hinge but the narrow contacting surface of the hinges prevent the hinges from efficient thermal conducting. A fourth is using a heat transfer device like a heat pipe with an auxiliry heat sink device like a heat spreader, This method is more effective than using a heat pipe with the inges in heat dissipation. But as the requirement of the wide space of a heat spreader, it makes an another problem. That is a difficulty of rayoutting the heat spreader in a narrow and complex inside of the notebook pc. Thus,all the above described conventional methods have many problems such as an inefficient heat dissipation or an undesirable battery power consumption by the cooling fan or a cooling fan noise or the difficulty of rayoutting notebook pc design or a trouble of the cooling fan or the errors caused by the cooling fan troubles. Some examples of these conventional methods are shown in U.S. PAT. No.5224913,5568360,5598320,5673176,5734550,5703609 ,5796578,5969939,6038128, 6049469,6058009,6084769,6122167,6125035,6134104,6141215,6170563,6175493,

556191943,6219233, 6222264,6226178,6227286,6345664,6359780,6362959,6377456, 6400563,6460608 and U.S. PAT.Appl .No.20010007525,20010023591 ,20010023759, 20020029868,20020093790. As the many problems in conventional heat dissipation methods, it is desirable to provide an effective method of heat dissipation in a notebook pc.

60 The amount of radiated heat is continues to increase and the size of notebook pc continues to minimize in these days.

Accordingly it is an object of the present invention to provide an efficient heat dissipation. And an another object of the present invention is to provide a noiseless and low cost heat dissipation for a high performance

65 computing in a notebook pc.

3.Disclosure o-F -fclne nvem-tiom A system circuit board 40 located in a lid 50 of the notebook pc 100 shown in FIG. 1. Liquid Crystal Display Panel(lcd panel )20,display device, is located in lid 50 of the notebook pc 100. A heat cut sheet 30 is disposed

70 between the system circuit board 40 and the led panel 20. A high-heat generating components such as a cpu 41,a north bridge chip 42,a vga chip 43 are arranged and operatively mounted on the one side 401 of the system circuit board 40. As shown in FIG. 2.,the top portion 411 of cpu 41 and the top portion 421 of north bridge chip 42 and the top portion 431 of vga

75 chip 43 are contacted with the inner side 521 of the back section 52 of the lid 50.And the outside 522 of the back section 52 is exposed to atmosphere. The lid ^"50 is consists of a front section 51 and a back section 52. The base 10 supports the lid 50. In the present invention,the operational high heat generated by chip a cpu 41

80 directly transferred to the inner side 521 of a back section 52 of lid 50 via the top portion 411 of cpu 41. The operational high heat generated by a north bridge chip 42 directly transferred to the inner side 521 of a back section 52 of lid 50 via the top portion 421 of north bridge chip 42. The operational high heat generated by a vga chip 43 also directly transferred

85 the inner side 521 of a back section 52 of lid 50 via the top portion 431 of vga chip 43.The operational high heat which is transferred from a cpu 41, a north bridge chip 42,a vga chip 43 immediately would be dissipated through the outside 522 of a back section 52 of lid 50 to atmosphere. Because the out side side 522 of a back section 52 of lid 50 has a more wide surface

90 than the conventional methods.

The present invention works as a most efficient heat dissipation method. So the present invention have several merits in contrast to the conventional heat sink methods in a notebook pc. The present invention has the short heat transfer path which makes a most quick heat dissipation.

95 In addition to, the present invention can reduce the heat sink cost for the heat sink devices such as a heat sink member,a heat pipe,an auxiliry heat sink device,a cooling fan are nonessential.and can reduce the power consumption ,and can reduce the noise of a fan operating,and can reduce the notebook pc troubles occurred by a fan trouble,and can reduce the trouble occurred by a 100 high heat circulation which could damage other electronic components inside a notebook pc,and can reduce the time and difficulty in notebook pc assembling, and can reduce the errors occured in a notebook pc,and make it easy to design the notebook pc for the rayout of heat transfer path is need not considerable. 4.Brie-f Description o-F Tine Drawings.

105 FIG. 1 is a rear view in perspective of embodying the principles of the present invention.

FIG. 2 is a sectional perspective view illustrating an important portion of the present invention. 5. Best Mode -F Carrying Out Invention.

110 In desirable embodiment of the present invention,the heat cut sheet has a characteristic of a high efficiency heat cutting with electromagnetic shield for protecting the led panel.To dispose an element between the top portion of the chips and the inner side of a back section of lid for overcoming the gap of chip thickness. In addition,the element has a resilience for prevent

115 the chips from imposing the high pressure in notebook pc assembling and has a high thermal conductivity for the most heat dissipation. It is desirable that the back section of the lid made by a high thermal conductivity material like an aluminum.

Claims

CLAIMS .What is claimed is,

1. A system circuit board located in a lid of the notebook pc. A heat cut sheet is disposed between the system circuit board and the led panel located in a lid. A high-heat generating components such as a cpu,a vga chip are arranged and operatively mounted on the one side of the system circuit board.

The top portions of chips are contacted with the inner side of a back section of the lid.