WO2003046510A3 - A shadow-creating apparatus - Google Patents

A shadow-creating apparatus Download PDF

Info

Publication number
WO2003046510A3
WO2003046510A3 PCT/US2002/036619 US0236619W WO03046510A3 WO 2003046510 A3 WO2003046510 A3 WO 2003046510A3 US 0236619 W US0236619 W US 0236619W WO 03046510 A3 WO03046510 A3 WO 03046510A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
shadow
side walls
spaced
cavity
Prior art date
Application number
PCT/US2002/036619
Other languages
French (fr)
Other versions
WO2003046510A2 (en
WO2003046510B1 (en
WO2003046510A9 (en
Inventor
Malcolm V Hawkes
Jon Stuart Wright
Robert S Burgoyne
Jeffrey L Fish
Original Assignee
Electro Scient Ind Inc
Malcolm V Hawkes
Jon Stuart Wright
Robert S Burgoyne
Jeffrey L Fish
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc, Malcolm V Hawkes, Jon Stuart Wright, Robert S Burgoyne, Jeffrey L Fish filed Critical Electro Scient Ind Inc
Priority to AU2002346400A priority Critical patent/AU2002346400A1/en
Priority to KR10-2004-7005779A priority patent/KR20040062572A/en
Priority to JP2003547902A priority patent/JP2005523424A/en
Priority to DE10297486T priority patent/DE10297486T5/en
Priority to GB0407477A priority patent/GB2397172B/en
Publication of WO2003046510A2 publication Critical patent/WO2003046510A2/en
Publication of WO2003046510A3 publication Critical patent/WO2003046510A3/en
Publication of WO2003046510A9 publication Critical patent/WO2003046510A9/en
Publication of WO2003046510B1 publication Critical patent/WO2003046510B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Landscapes

  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

An apparatus (12) for accurately locating a micro-electronic chip (9) in a chip-holding cavity (28) for visual testing, the chip (9) having at least a front wall and a pair of opposed, spaced-apart side walls, wherein the front wall meets with each of the side walls to form opposed, spaced-apart first and second front edges, comprising a cavity side wall formed to juxtapositionally about at least one of the side walls of the chip, the cavity side wall having formed therein a depression creating a shadow projecting forward from the depression, wherein the first front edge of the chip (9) forms a border of the shadow to form an objectively measurable contrast in grayness between the shadow and the chip (9).
PCT/US2002/036619 2001-11-27 2002-11-14 A shadow-creating apparatus WO2003046510A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2002346400A AU2002346400A1 (en) 2001-11-27 2002-11-14 A shadow-creating apparatus
KR10-2004-7005779A KR20040062572A (en) 2001-11-27 2002-11-14 A shadow-creating apparatus
JP2003547902A JP2005523424A (en) 2001-11-27 2002-11-14 Shadow forming device
DE10297486T DE10297486T5 (en) 2001-11-27 2002-11-14 Shadow generation device
GB0407477A GB2397172B (en) 2001-11-27 2002-11-14 A shadow-creating apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33369001P 2001-11-27 2001-11-27
US60/333,690 2001-11-27

Publications (4)

Publication Number Publication Date
WO2003046510A2 WO2003046510A2 (en) 2003-06-05
WO2003046510A3 true WO2003046510A3 (en) 2003-11-27
WO2003046510A9 WO2003046510A9 (en) 2004-03-25
WO2003046510B1 WO2003046510B1 (en) 2004-04-29

Family

ID=23303855

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/036619 WO2003046510A2 (en) 2001-11-27 2002-11-14 A shadow-creating apparatus

Country Status (8)

Country Link
JP (1) JP2005523424A (en)
KR (1) KR20040062572A (en)
CN (1) CN1328775C (en)
AU (1) AU2002346400A1 (en)
DE (1) DE10297486T5 (en)
GB (1) GB2397172B (en)
TW (1) TW577163B (en)
WO (1) WO2003046510A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016190021A1 (en) * 2015-05-26 2016-12-01 住友化学株式会社 Cleanroom for polarizing plate production
CN110379784B (en) * 2019-07-23 2021-05-07 深圳市优一达电子有限公司 Semiconductor packaging structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312117A (en) * 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5543725A (en) * 1993-08-25 1996-08-06 Sunright Limited Reusable carrier for burn-in/testing on non packaged die

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680602B2 (en) * 1987-11-28 1994-10-12 株式会社村田製作所 Electronic component chip holding jig and electronic component chip handling method
US5673799A (en) * 1995-06-05 1997-10-07 Chip Star Inc. Machine for testing and sorting capacitor chips and method of operating same
KR100766095B1 (en) * 1997-06-12 2007-10-11 가부시키가이샤 니콘 Substrate for device manufacturing, process for manufacturing the substrate, and method of exposure using the substrate
GB2349205B (en) * 1999-04-19 2003-12-31 Applied Materials Inc Method and apparatus for detecting that two moveable members are correctly positioned relatively to one another
AU2000251587A1 (en) * 2000-05-23 2001-12-03 Electro Scientific Industries, Inc. Inspection machine for surface mount passive component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312117A (en) * 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5543725A (en) * 1993-08-25 1996-08-06 Sunright Limited Reusable carrier for burn-in/testing on non packaged die

Also Published As

Publication number Publication date
WO2003046510A2 (en) 2003-06-05
CN1575513A (en) 2005-02-02
CN1328775C (en) 2007-07-25
GB2397172A (en) 2004-07-14
AU2002346400A1 (en) 2003-06-10
GB2397172B (en) 2005-05-11
AU2002346400A8 (en) 2003-06-10
TW577163B (en) 2004-02-21
JP2005523424A (en) 2005-08-04
GB0407477D0 (en) 2004-05-05
WO2003046510B1 (en) 2004-04-29
DE10297486T5 (en) 2004-12-02
KR20040062572A (en) 2004-07-07
WO2003046510A9 (en) 2004-03-25
TW200301008A (en) 2003-06-16

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