WO2003034483A1 - Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme - Google Patents
Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme Download PDFInfo
- Publication number
- WO2003034483A1 WO2003034483A1 PCT/JP2002/010682 JP0210682W WO03034483A1 WO 2003034483 A1 WO2003034483 A1 WO 2003034483A1 JP 0210682 W JP0210682 W JP 0210682W WO 03034483 A1 WO03034483 A1 WO 03034483A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- treatment subject
- elevating mechanism
- space
- push
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
La présente invention concerne un mécanisme élévateur d'élément à traiter capable d'empêcher une déviation de position d'un élément à traiter lorsque cet élément est placé sur une table, par l'évacuation rapide du gaz présent dans l'espace situé derrière l'élément à traiter. Ce mécanisme élévateur d'élément à traiter comprend une table (38) placée sur une cuve (22) de traitement dont on peut faire le vide et formée d'une pluralité de trous d'insertion (50) d'axe, avec des axes (52) pousseurs verticalement mobiles insérés dans ces trous d'insertion d'axe. Ces axes pousseurs sont déplacés verticalement par un élément pousseur, plaçant ainsi l'élément (W) à traiter sur la table. L'axe pousseur est formé avec un passage (66) de communication destiné à établir une communication entre un espace (S1) et un espace (S2), respectivement situés au dessus de la table et sous la table. Le gaz présent dans l'espace situé derrière l'élément à traiter est rapidement évacué, ce qui empêche une déviation de position de l'élément à traiter.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/492,979 US20050000450A1 (en) | 2001-10-16 | 2002-10-15 | Treatment subject elevating mechanism, and treating device using the same |
JP2003537113A JP4260630B2 (ja) | 2001-10-16 | 2002-10-15 | 被処理体の昇降機構及びこれを用いた処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001318636 | 2001-10-16 | ||
JP2001/318636 | 2001-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003034483A1 true WO2003034483A1 (fr) | 2003-04-24 |
Family
ID=19136302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/010682 WO2003034483A1 (fr) | 2001-10-16 | 2002-10-15 | Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050000450A1 (fr) |
JP (1) | JP4260630B2 (fr) |
KR (1) | KR100666764B1 (fr) |
CN (1) | CN1331208C (fr) |
WO (1) | WO2003034483A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086427A (ja) * | 2004-09-17 | 2006-03-30 | Nikon Corp | 基板保持方法とその装置及び露光装置 |
JP2008004575A (ja) * | 2006-06-20 | 2008-01-10 | Tokyo Ohka Kogyo Co Ltd | 支持ピン |
WO2010032750A1 (fr) * | 2008-09-16 | 2010-03-25 | 東京エレクトロン株式会社 | Appareil de traitement de substrat et table de placement de substrat |
JP2010073751A (ja) * | 2008-09-16 | 2010-04-02 | Tokyo Electron Ltd | プラズマ処理装置および基板載置台 |
JP2015023041A (ja) * | 2013-07-16 | 2015-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007088894A1 (fr) * | 2006-01-31 | 2007-08-09 | Tokyo Electron Limited | Appareil de traitement de substrat, table de placement de substrat employee lors du traitement et element expose au plasma |
DE102007022431A1 (de) * | 2007-05-09 | 2008-11-13 | Leybold Optics Gmbh | Behandlungssystem für flache Substrate |
KR101406172B1 (ko) * | 2013-01-08 | 2014-06-12 | (주)에스티아이 | 반도체 웨이퍼의 연속 처리 장치 및 방법 |
KR102097109B1 (ko) * | 2013-01-21 | 2020-04-10 | 에이에스엠 아이피 홀딩 비.브이. | 증착 장치 |
US10857655B2 (en) * | 2013-03-13 | 2020-12-08 | Applied Materials, Inc. | Substrate support plate with improved lift pin sealing |
US9991153B2 (en) * | 2013-03-14 | 2018-06-05 | Applied Materials, Inc. | Substrate support bushing |
US10163676B2 (en) * | 2013-06-27 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and system for preventing backside peeling defects on semiconductor wafers |
DE102016212780A1 (de) * | 2016-07-13 | 2018-01-18 | Siltronic Ag | Vorrichtung zur Handhabung einer Halbleiterscheibe in einem Epitaxie-Reaktor und Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht |
GB201709446D0 (en) * | 2017-06-14 | 2017-07-26 | Semblant Ltd | Plasma processing apparatus |
KR102058034B1 (ko) | 2017-11-30 | 2019-12-20 | 피에스케이홀딩스 (주) | 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛 |
CN114008734A (zh) * | 2019-06-19 | 2022-02-01 | 朗姆研究公司 | 在传送衬底期间使用真空 |
JP2021097162A (ja) * | 2019-12-18 | 2021-06-24 | 東京エレクトロン株式会社 | 基板処理装置及び載置台 |
KR20210089079A (ko) * | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 채널형 리프트 핀 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63142829A (ja) * | 1986-12-05 | 1988-06-15 | Nippon Telegr & Teleph Corp <Ntt> | 基板吸着固定装置 |
EP0623947A1 (fr) * | 1993-05-05 | 1994-11-09 | Applied Materials, Inc. | Procédé et dispositif pour assurer le transfert thermique vers un substrat entier ou en provenant pendant le traitement d'un corps semi-conducteur |
JPH0722496A (ja) * | 1993-06-29 | 1995-01-24 | Nikon Corp | 基板の吸着保持装置 |
JPH07263523A (ja) * | 1994-03-24 | 1995-10-13 | Kawasaki Steel Corp | ウェーハ載置台 |
JPH0982594A (ja) * | 1995-09-18 | 1997-03-28 | Kokusai Electric Co Ltd | 半導体製造装置における室内減圧方法 |
JP2001024047A (ja) * | 1999-07-07 | 2001-01-26 | Applied Materials Inc | 基板支持装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
JP3602324B2 (ja) * | 1998-02-17 | 2004-12-15 | アルプス電気株式会社 | プラズマ処理装置 |
JP2000286242A (ja) * | 1999-03-31 | 2000-10-13 | Tokyo Electron Ltd | プラズマ処理装置 |
JP3398936B2 (ja) * | 1999-04-09 | 2003-04-21 | 日本エー・エス・エム株式会社 | 半導体処理装置 |
JP3459790B2 (ja) * | 1999-05-18 | 2003-10-27 | 山形日本電気株式会社 | 除電機能付静電チャック及び静電チャックの除電方法 |
JP4418051B2 (ja) * | 1999-06-16 | 2010-02-17 | 平田機工株式会社 | 熱処理装置 |
JP2001240247A (ja) * | 2000-03-01 | 2001-09-04 | Ishikawajima Harima Heavy Ind Co Ltd | コンテナヤードにおけるコンテナの管理装置および管理方法 |
JP3736264B2 (ja) * | 2000-02-29 | 2006-01-18 | セイコーエプソン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
-
2002
- 2002-10-15 JP JP2003537113A patent/JP4260630B2/ja not_active Expired - Fee Related
- 2002-10-15 KR KR1020047005522A patent/KR100666764B1/ko not_active IP Right Cessation
- 2002-10-15 WO PCT/JP2002/010682 patent/WO2003034483A1/fr active Application Filing
- 2002-10-15 CN CNB028249267A patent/CN1331208C/zh not_active Expired - Fee Related
- 2002-10-15 US US10/492,979 patent/US20050000450A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63142829A (ja) * | 1986-12-05 | 1988-06-15 | Nippon Telegr & Teleph Corp <Ntt> | 基板吸着固定装置 |
EP0623947A1 (fr) * | 1993-05-05 | 1994-11-09 | Applied Materials, Inc. | Procédé et dispositif pour assurer le transfert thermique vers un substrat entier ou en provenant pendant le traitement d'un corps semi-conducteur |
JPH0722496A (ja) * | 1993-06-29 | 1995-01-24 | Nikon Corp | 基板の吸着保持装置 |
JPH07263523A (ja) * | 1994-03-24 | 1995-10-13 | Kawasaki Steel Corp | ウェーハ載置台 |
JPH0982594A (ja) * | 1995-09-18 | 1997-03-28 | Kokusai Electric Co Ltd | 半導体製造装置における室内減圧方法 |
JP2001024047A (ja) * | 1999-07-07 | 2001-01-26 | Applied Materials Inc | 基板支持装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086427A (ja) * | 2004-09-17 | 2006-03-30 | Nikon Corp | 基板保持方法とその装置及び露光装置 |
JP2008004575A (ja) * | 2006-06-20 | 2008-01-10 | Tokyo Ohka Kogyo Co Ltd | 支持ピン |
WO2010032750A1 (fr) * | 2008-09-16 | 2010-03-25 | 東京エレクトロン株式会社 | Appareil de traitement de substrat et table de placement de substrat |
JP2010073751A (ja) * | 2008-09-16 | 2010-04-02 | Tokyo Electron Ltd | プラズマ処理装置および基板載置台 |
JP2015023041A (ja) * | 2013-07-16 | 2015-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US20050000450A1 (en) | 2005-01-06 |
KR100666764B1 (ko) | 2007-01-09 |
KR20050036858A (ko) | 2005-04-20 |
JPWO2003034483A1 (ja) | 2005-02-03 |
CN1331208C (zh) | 2007-08-08 |
JP4260630B2 (ja) | 2009-04-30 |
CN1605125A (zh) | 2005-04-06 |
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