WO2003025676A1 - Materiau pour la formation de motif, et procede relatif a la formation de motif - Google Patents

Materiau pour la formation de motif, et procede relatif a la formation de motif Download PDF

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Publication number
WO2003025676A1
WO2003025676A1 PCT/JP2002/009381 JP0209381W WO03025676A1 WO 2003025676 A1 WO2003025676 A1 WO 2003025676A1 JP 0209381 W JP0209381 W JP 0209381W WO 03025676 A1 WO03025676 A1 WO 03025676A1
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
forming
forming material
chemical formula
formula
Prior art date
Application number
PCT/JP2002/009381
Other languages
English (en)
French (fr)
Inventor
Shinji Kishimura
Masayuki Endo
Masaru Sasago
Mitsuru Ueda
Tsuyohiko Fujigaya
Original Assignee
Matsushita Electric Industrial Co.,Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co.,Ltd. filed Critical Matsushita Electric Industrial Co.,Ltd.
Priority to EP02765525A priority Critical patent/EP1403711A4/en
Priority to US10/415,272 priority patent/US7041428B2/en
Priority to JP2003529245A priority patent/JP3893380B2/ja
Priority to KR10-2003-7008720A priority patent/KR100524448B1/ko
Publication of WO2003025676A1 publication Critical patent/WO2003025676A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
PCT/JP2002/009381 2001-09-13 2002-09-12 Materiau pour la formation de motif, et procede relatif a la formation de motif WO2003025676A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02765525A EP1403711A4 (en) 2001-09-13 2002-09-12 STRUCTURE EDUCATION MATERIAL AND STRUCTURAL EDUCATION METHOD
US10/415,272 US7041428B2 (en) 2001-09-13 2002-09-12 Pattern-forming material and method of forming pattern
JP2003529245A JP3893380B2 (ja) 2001-09-13 2002-09-12 パターン形成材料及びパターン形成方法
KR10-2003-7008720A KR100524448B1 (ko) 2001-09-13 2002-09-12 패턴형성재료 및 패턴형성방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-277589 2001-09-13
JP2001277589 2001-09-13

Publications (1)

Publication Number Publication Date
WO2003025676A1 true WO2003025676A1 (fr) 2003-03-27

Family

ID=19102094

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009381 WO2003025676A1 (fr) 2001-09-13 2002-09-12 Materiau pour la formation de motif, et procede relatif a la formation de motif

Country Status (7)

Country Link
US (1) US7041428B2 (ja)
EP (1) EP1403711A4 (ja)
JP (1) JP3893380B2 (ja)
KR (1) KR100524448B1 (ja)
CN (1) CN100337161C (ja)
TW (1) TW589514B (ja)
WO (1) WO2003025676A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016071207A (ja) * 2014-09-30 2016-05-09 Jsr株式会社 感放射線性樹脂組成物、レジストパターン形成方法、重合体及び化合物
JP2016170360A (ja) * 2015-03-13 2016-09-23 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI278012B (en) * 2001-09-13 2007-04-01 Matsushita Electric Ind Co Ltd Pattern forming material and method of pattern formation
JP4133399B2 (ja) * 2003-02-10 2008-08-13 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
EP1505439A3 (en) * 2003-07-24 2005-04-20 Fuji Photo Film Co., Ltd. Positive photosensitive composition and method of forming resist pattern
JP5035562B2 (ja) * 2007-08-22 2012-09-26 信越化学工業株式会社 パターン形成方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0773478A1 (en) * 1995-11-10 1997-05-14 Matsushita Electric Industrial Co., Ltd. Patterning material and patterning method
EP0791856A2 (en) * 1996-02-26 1997-08-27 Matsushita Electric Industrial Co., Ltd. Pattern forming material and pattern forming method
JPH11218926A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd パターン形成方法
JP2000330289A (ja) * 1999-03-12 2000-11-30 Matsushita Electric Ind Co Ltd パターン形成方法
US20020081524A1 (en) * 2000-12-22 2002-06-27 Yasunori Uetani Chemical amplifying type positive resist composition
JP2002322217A (ja) * 2001-04-26 2002-11-08 Shin Etsu Chem Co Ltd 高分子化合物、化学増幅レジスト材料及びパターン形成方法
JP2002333715A (ja) * 2000-09-26 2002-11-22 Fuji Photo Film Co Ltd ポジ型レジスト組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689289A (en) * 1986-04-30 1987-08-25 General Electric Company Block polymer compositions
JPH09189998A (ja) * 1995-11-10 1997-07-22 Matsushita Electric Ind Co Ltd パターン形成材料及びパターン形成方法
JP3273897B2 (ja) * 1996-02-26 2002-04-15 松下電器産業株式会社 パターン形成材料及びパターン形成方法
JP3198915B2 (ja) * 1996-04-02 2001-08-13 信越化学工業株式会社 化学増幅ポジ型レジスト材料
ATE237830T1 (de) * 1996-09-02 2003-05-15 Ciba Sc Holding Ag Alkylsulfonyloxime für i-line-photoresists hoher auflösung und empfindlichkeit
US6576392B1 (en) * 1996-12-07 2003-06-10 Fuji Photo Film Co., Ltd. Positive photoresist composition
DK199901098A (da) * 1998-08-18 2000-02-19 Ciba Sc Holding Ag Sylfonyloximer til i-linie-fotoresists med høj følsomhed og høj resisttykkelse
TWI264442B (en) * 2002-03-25 2006-10-21 Shinetsu Chemical Co Novel esters, polymers, resist compositions and patterning process

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0773478A1 (en) * 1995-11-10 1997-05-14 Matsushita Electric Industrial Co., Ltd. Patterning material and patterning method
EP0791856A2 (en) * 1996-02-26 1997-08-27 Matsushita Electric Industrial Co., Ltd. Pattern forming material and pattern forming method
JPH11218926A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd パターン形成方法
JP2000330289A (ja) * 1999-03-12 2000-11-30 Matsushita Electric Ind Co Ltd パターン形成方法
JP2002333715A (ja) * 2000-09-26 2002-11-22 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US20020081524A1 (en) * 2000-12-22 2002-06-27 Yasunori Uetani Chemical amplifying type positive resist composition
JP2002322217A (ja) * 2001-04-26 2002-11-08 Shin Etsu Chem Co Ltd 高分子化合物、化学増幅レジスト材料及びパターン形成方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1403711A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016071207A (ja) * 2014-09-30 2016-05-09 Jsr株式会社 感放射線性樹脂組成物、レジストパターン形成方法、重合体及び化合物
JP2016170360A (ja) * 2015-03-13 2016-09-23 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法
JP7129272B2 (ja) 2017-09-15 2022-09-01 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法

Also Published As

Publication number Publication date
KR20030082560A (ko) 2003-10-22
JPWO2003025676A1 (ja) 2004-12-24
TW589514B (en) 2004-06-01
US7041428B2 (en) 2006-05-09
CN100337161C (zh) 2007-09-12
KR100524448B1 (ko) 2005-10-26
EP1403711A1 (en) 2004-03-31
CN1524200A (zh) 2004-08-25
EP1403711A4 (en) 2007-12-12
US20040029035A1 (en) 2004-02-12
JP3893380B2 (ja) 2007-03-14

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