WO2003021651A1 - Fluide de polissage conçu pour un film metallique et procede de production d'un substrat semi-conducteur au moyen de ce fluide de polissage - Google Patents

Fluide de polissage conçu pour un film metallique et procede de production d'un substrat semi-conducteur au moyen de ce fluide de polissage Download PDF

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Publication number
WO2003021651A1
WO2003021651A1 PCT/JP2002/008135 JP0208135W WO03021651A1 WO 2003021651 A1 WO2003021651 A1 WO 2003021651A1 JP 0208135 W JP0208135 W JP 0208135W WO 03021651 A1 WO03021651 A1 WO 03021651A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing fluid
semiconductor substrate
metallic film
same
producing semiconductor
Prior art date
Application number
PCT/JP2002/008135
Other languages
English (en)
French (fr)
Inventor
Hideaki Takahashi
Koshi Okita
Kuon Miyazaki
Takayuki Matsuda
Original Assignee
Asahi Kasei Chemicals Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corporation filed Critical Asahi Kasei Chemicals Corporation
Priority to US10/486,726 priority Critical patent/US20050176250A1/en
Priority to JP2003525895A priority patent/JPWO2003021651A1/ja
Priority to KR10-2004-7002227A priority patent/KR20040030100A/ko
Publication of WO2003021651A1 publication Critical patent/WO2003021651A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
PCT/JP2002/008135 2001-08-16 2002-08-08 Fluide de polissage conçu pour un film metallique et procede de production d'un substrat semi-conducteur au moyen de ce fluide de polissage WO2003021651A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/486,726 US20050176250A1 (en) 2001-08-16 2002-08-08 Polishig fluid for metallic films and method for producing semiconductor substrate using the same
JP2003525895A JPWO2003021651A1 (ja) 2001-08-16 2002-08-08 金属膜用研磨液及びそれを用いた半導体基板の製造方法
KR10-2004-7002227A KR20040030100A (ko) 2001-08-16 2002-08-08 금속막용 연마액 및 그를 이용한 반도체 기판의 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-246898 2001-08-16
JP2001246898 2001-08-16
JP2001361030 2001-11-27
JP2001-361030 2001-11-27

Publications (1)

Publication Number Publication Date
WO2003021651A1 true WO2003021651A1 (fr) 2003-03-13

Family

ID=26620573

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008135 WO2003021651A1 (fr) 2001-08-16 2002-08-08 Fluide de polissage conçu pour un film metallique et procede de production d'un substrat semi-conducteur au moyen de ce fluide de polissage

Country Status (4)

Country Link
US (1) US20050176250A1 (ja)
JP (1) JPWO2003021651A1 (ja)
KR (1) KR20040030100A (ja)
WO (1) WO2003021651A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007512966A (ja) * 2003-11-12 2007-05-24 ダウ グローバル テクノロジーズ インコーポレイティド 低圧力化学機械平坦化のための材料及び方法
US7419910B2 (en) * 2003-11-27 2008-09-02 Kabushiki Kaisha Toshiba Slurry for CMP, polishing method and method of manufacturing semiconductor device
WO2016021708A1 (ja) * 2014-08-07 2016-02-11 日立化成株式会社 タングステン用研磨剤、研磨剤用貯蔵液及び研磨方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
JP4026573B2 (ja) * 2003-09-24 2007-12-26 株式会社デンソー 電子装置を収納するパッケージの製造方法
TWI282801B (en) * 2004-05-06 2007-06-21 Mitsui Chemicals Inc Slurry for polishing use
US20060008578A1 (en) * 2004-07-09 2006-01-12 Jin-Shou Fang Method of fabricating electrode structure of field-emission display
JP5026710B2 (ja) * 2005-09-02 2012-09-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP4799122B2 (ja) * 2005-10-20 2011-10-26 株式会社東芝 Ｃｕ膜の研磨方法および半導体装置の製造方法
ES2356109T3 (es) * 2007-02-14 2011-04-05 Mallinckrodt Baker, Inc. Formulaciones basadas en oxometalato activadas por peróxido para la eliminación de residuos de grabado.
JP4696086B2 (ja) * 2007-02-20 2011-06-08 信越半導体株式会社 シリコン単結晶ウエーハの仕上げ研磨方法及びシリコン単結晶ウエーハ
DE102008056086A1 (de) * 2008-11-06 2010-05-12 Gp Solar Gmbh Additiv für alkalische Ätzlösungen, insbesondere für Texturätzlösungen sowie Verfahren zu dessen Herstellung
US20130217231A1 (en) * 2010-10-05 2013-08-22 Basf Se Chemical mechanical polishing (cmp) composition
US8853076B2 (en) 2012-09-10 2014-10-07 International Business Machines Corporation Self-aligned contacts
JP6592998B2 (ja) * 2015-07-10 2019-10-23 日立化成株式会社 タングステン用研磨剤、研磨剤用貯蔵液及び研磨方法
CN108350344B (zh) * 2015-10-23 2021-02-12 霓达杜邦股份有限公司 研磨用组合物
CN109987575A (zh) * 2017-12-29 2019-07-09 中芯国际集成电路制造(上海)有限公司 一种mems器件及制备方法、电子装置
EP3816259A4 (en) * 2019-09-17 2021-10-13 AGC Inc. ABRASIVE AGENT, GLASS GRINDING PROCESS AND GLASS PRODUCTION PROCESS

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116942A (ja) * 1997-10-14 1999-04-27 Fujimi Inc 研磨用組成物
WO2000013217A1 (fr) * 1998-08-31 2000-03-09 Hitachi Chemical Company, Ltd. Liquide abrasif pour le polissage de metaux et procede correspondant
JP2000119639A (ja) * 1998-10-12 2000-04-25 Kao Corp 研磨液組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116942A (ja) * 1997-10-14 1999-04-27 Fujimi Inc 研磨用組成物
WO2000013217A1 (fr) * 1998-08-31 2000-03-09 Hitachi Chemical Company, Ltd. Liquide abrasif pour le polissage de metaux et procede correspondant
JP2000119639A (ja) * 1998-10-12 2000-04-25 Kao Corp 研磨液組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007512966A (ja) * 2003-11-12 2007-05-24 ダウ グローバル テクノロジーズ インコーポレイティド 低圧力化学機械平坦化のための材料及び方法
US7419910B2 (en) * 2003-11-27 2008-09-02 Kabushiki Kaisha Toshiba Slurry for CMP, polishing method and method of manufacturing semiconductor device
WO2016021708A1 (ja) * 2014-08-07 2016-02-11 日立化成株式会社 タングステン用研磨剤、研磨剤用貯蔵液及び研磨方法
JP2017183297A (ja) * 2014-08-07 2017-10-05 日立化成株式会社 タングステン用研磨剤、研磨剤用貯蔵液及び研磨方法

Also Published As

Publication number Publication date
JPWO2003021651A1 (ja) 2004-12-24
KR20040030100A (ko) 2004-04-08
US20050176250A1 (en) 2005-08-11

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