WO2003014177A1 - Composition de resine, composition de reserve de soudage et article durci obtenu a partir de ces compositions - Google Patents

Composition de resine, composition de reserve de soudage et article durci obtenu a partir de ces compositions Download PDF

Info

Publication number
WO2003014177A1
WO2003014177A1 PCT/JP2002/008025 JP0208025W WO03014177A1 WO 2003014177 A1 WO2003014177 A1 WO 2003014177A1 JP 0208025 W JP0208025 W JP 0208025W WO 03014177 A1 WO03014177 A1 WO 03014177A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
composition
cured article
resistance
solder resist
Prior art date
Application number
PCT/JP2002/008025
Other languages
English (en)
French (fr)
Inventor
Hiroo Koyanagi
Toru Ozaki
Minoru Yokoshima
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to KR10-2004-7000994A priority Critical patent/KR20040024871A/ko
Priority to US10/485,004 priority patent/US20050004288A1/en
Priority to EP02755859A priority patent/EP1416003A4/en
Publication of WO2003014177A1 publication Critical patent/WO2003014177A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
PCT/JP2002/008025 2001-08-07 2002-08-06 Composition de resine, composition de reserve de soudage et article durci obtenu a partir de ces compositions WO2003014177A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2004-7000994A KR20040024871A (ko) 2001-08-07 2002-08-06 수지 조성물, 솔더 레지스트용 조성물 및 이들의 경화물
US10/485,004 US20050004288A1 (en) 2001-08-07 2002-08-06 Resin composition, composition for solder resist, and cured article obtained therefrom
EP02755859A EP1416003A4 (en) 2001-08-07 2002-08-06 RESIN COMPOSITION, WELDING RESERVE COMPOSITION, AND CURED ARTICLE OBTAINED THEREFROM

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239412 2001-08-07
JP2001-239412 2001-08-07

Publications (1)

Publication Number Publication Date
WO2003014177A1 true WO2003014177A1 (fr) 2003-02-20

Family

ID=19070172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008025 WO2003014177A1 (fr) 2001-08-07 2002-08-06 Composition de resine, composition de reserve de soudage et article durci obtenu a partir de ces compositions

Country Status (6)

Country Link
US (1) US20050004288A1 (ja)
EP (1) EP1416003A4 (ja)
KR (1) KR20040024871A (ja)
CN (1) CN1268664C (ja)
TW (1) TW591040B (ja)
WO (1) WO2003014177A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017536265A (ja) * 2014-11-24 2017-12-07 スリーディー システムズ インコーポレーテッド ３ｄプリント用の液状ゴムを含むインク

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1818366A4 (en) * 2004-10-07 2009-03-04 Hitachi Chemical Co Ltd RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL AND LIGHT WAVE GUIDE THEREWITH
CN100358953C (zh) * 2005-05-23 2008-01-02 容大油墨（惠州）有限公司 一种液态感光防焊油墨及其电路板
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
JP4979963B2 (ja) * 2006-03-10 2012-07-18 株式会社Ａｄｅｋａ 光学材料用硬化性組成物及び光導波路
JP2008243957A (ja) * 2007-03-26 2008-10-09 Nitto Denko Corp 配線回路基板の製法
JP2012063645A (ja) * 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9635962B2 (en) 2012-04-12 2017-05-02 Cabeau, Inc. Travel pillow with lateral and rear support bar and a flat and thin back
JP6255112B2 (ja) * 2013-11-26 2017-12-27 ノバルティス アーゲー 金属酸化物分散体およびその使用
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP6275620B2 (ja) * 2014-10-17 2018-02-07 日本化薬株式会社 感光性樹脂組成物及びその硬化物
CN110527350B (zh) * 2019-08-26 2022-04-15 鹤山市炎墨科技有限公司 一种高耐热高交联度光固化阻焊油墨及其制备方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0624824A1 (en) * 1993-05-10 1994-11-17 Nippon Kayaku Kabushiki Kaisha Resist ink composition and cured article prepared therefrom
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JPH08134331A (ja) * 1994-11-08 1996-05-28 Dainippon Ink & Chem Inc 光硬化性樹脂組成物および可撓性ソルダーレジストインキ
JPH0912654A (ja) * 1995-06-26 1997-01-14 Nippon Kayaku Co Ltd エネルギー線硬化性樹脂組成物及びその硬化物
JPH10316729A (ja) * 1997-05-20 1998-12-02 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JPH117130A (ja) * 1997-06-17 1999-01-12 Nippon Kayaku Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物
JPH11171970A (ja) * 1997-12-05 1999-06-29 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JPH11181040A (ja) * 1997-12-22 1999-07-06 Nippon Kayaku Co Ltd 樹脂組成物、その硬化物及びプリント配線板
JPH11189631A (ja) * 1997-12-26 1999-07-13 Nippon Kayaku Co Ltd 樹脂組成物、その硬化物及びプリント配線板
JPH11242331A (ja) * 1998-02-24 1999-09-07 Hitachi Chem Co Ltd 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP2000128957A (ja) * 1998-10-28 2000-05-09 Nicca Chemical Co Ltd ソルダーフォトレジストインキ組成物
JP2000281738A (ja) * 1999-03-31 2000-10-10 Nippon Kayaku Co Ltd 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0624824A1 (en) * 1993-05-10 1994-11-17 Nippon Kayaku Kabushiki Kaisha Resist ink composition and cured article prepared therefrom
JPH0841146A (ja) * 1994-07-27 1996-02-13 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
JPH08134331A (ja) * 1994-11-08 1996-05-28 Dainippon Ink & Chem Inc 光硬化性樹脂組成物および可撓性ソルダーレジストインキ
JPH0912654A (ja) * 1995-06-26 1997-01-14 Nippon Kayaku Co Ltd エネルギー線硬化性樹脂組成物及びその硬化物
JPH10316729A (ja) * 1997-05-20 1998-12-02 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JPH117130A (ja) * 1997-06-17 1999-01-12 Nippon Kayaku Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物
JPH11171970A (ja) * 1997-12-05 1999-06-29 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JPH11181040A (ja) * 1997-12-22 1999-07-06 Nippon Kayaku Co Ltd 樹脂組成物、その硬化物及びプリント配線板
JPH11189631A (ja) * 1997-12-26 1999-07-13 Nippon Kayaku Co Ltd 樹脂組成物、その硬化物及びプリント配線板
JPH11242331A (ja) * 1998-02-24 1999-09-07 Hitachi Chem Co Ltd 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP2000128957A (ja) * 1998-10-28 2000-05-09 Nicca Chemical Co Ltd ソルダーフォトレジストインキ組成物
JP2000281738A (ja) * 1999-03-31 2000-10-10 Nippon Kayaku Co Ltd 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1416003A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017536265A (ja) * 2014-11-24 2017-12-07 スリーディー システムズ インコーポレーテッド ３ｄプリント用の液状ゴムを含むインク
US11292927B2 (en) 2014-11-24 2022-04-05 3D Systems, Incorporated Inks comprising liquid rubber for 3D printing
US11479683B2 (en) 2014-11-24 2022-10-25 3D Systems, Inc. Inks comprising liquid rubber for 3D printing

Also Published As

Publication number Publication date
CN1268664C (zh) 2006-08-09
EP1416003A1 (en) 2004-05-06
TW591040B (en) 2004-06-11
CN1538978A (zh) 2004-10-20
EP1416003A4 (en) 2006-05-03
US20050004288A1 (en) 2005-01-06
KR20040024871A (ko) 2004-03-22

Similar Documents

Publication Publication Date Title
WO2003014177A1 (fr) Composition de resine, composition de reserve de soudage et article durci obtenu a partir de ces compositions
EP1296188A3 (en) Photosensitive resin composition and printed wiring board
MY143183A (en) Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
EP1818350A4 (en) EPOXY RESIN COMPOSITION FOR PREIMPREGNE, PREIMPREGNE AND MULTILAYER CARD FOR PRINTED CIRCUIT
WO2000009581A3 (en) Viscosity modifier for thermosetting resin composition
TW200610775A (en) Curable resin composition and its use
PT1412445E (pt) Endurecedores de poliamina modificada por poli-silazano para resinas epoxi
EP1548043A4 (en) EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR SEALING
MY124259A (en) Epoxy resin composition for encapsulating photosemiconductor element photosemiconductor device
WO2003025043A1 (en) Resin composition for optical-semiconductor encapsulation
TWI400292B (zh) Used in glass fiber laminates high glass transition temperature resin varnish composition
TW200745211A (en) Resin composition for forming insulating layer
EP0383178A3 (en) Curable dielectric polyphenylene ether-polyepoxide compositions
EP1174456A3 (en) High tg potting compound
WO2002024772A3 (en) Metal amine complex containing fluoropolymer compositions
EP0835892A4 (en) EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARDS AND LAMINATE BOARDS PRODUCED THEREFOR
JP2009019171A (ja) ダイボンディングペースト
JPS646944A (en) Heat resistant photosensitive resin composition
WO2002025378A1 (fr) Composition de resine durcissant sous ultraviolets et encre resistant au photo-soudage contenant cette composition
EP1296189A3 (en) Photosensitive resin composition and printed wiring board
RU2003106554A (ru) Эпоксидная клеевая композиция, препрег на ее основе и изделие, выполненное из него
EP1020456A4 (en) POLYHYDRIC PHENOLS, EPOXIDE RESINS, EPOXIDE RESIN COMPOSITION AND HARDENED PRODUCTS
EP1420048A3 (en) Metal laminate
JPS56152832A (en) Flexible epoxy resin composition
MY131899A (en) Phenol resin, epoxy resin, production method therefor, and epoxy resin compositions

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN KR

Kind code of ref document: A1

Designated state(s): CN KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020047000994

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2002755859

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2002815438X

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 10485004

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2002755859

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2002755859

Country of ref document: EP