WO2003005793A2 - Choice of reference markings for enabling fast estimating of the position of an imaging device - Google Patents

Choice of reference markings for enabling fast estimating of the position of an imaging device Download PDF

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Publication number
WO2003005793A2
WO2003005793A2 PCT/IB2002/002837 IB0202837W WO03005793A2 WO 2003005793 A2 WO2003005793 A2 WO 2003005793A2 IB 0202837 W IB0202837 W IB 0202837W WO 03005793 A2 WO03005793 A2 WO 03005793A2
Authority
WO
WIPO (PCT)
Prior art keywords
group
markings
board
imaging device
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2002/002837
Other languages
English (en)
French (fr)
Other versions
WO2003005793A3 (en
Inventor
Nicolas Villain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to JP2003511609A priority Critical patent/JP2004536300A/ja
Priority to US10/482,141 priority patent/US7477774B2/en
Priority to DE60238407T priority patent/DE60238407D1/de
Priority to EP02745737A priority patent/EP1407647B1/en
Publication of WO2003005793A2 publication Critical patent/WO2003005793A2/en
Publication of WO2003005793A3 publication Critical patent/WO2003005793A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts

Definitions

  • this subset image may be strip-shaped, having a relatively small size in the direction parallel to the nominal orientation of the selected segment.
  • the step of selecting groups to serve as a reference involves a step of rejecting candidate reference groups made up of straight-line segments that are shorter than twice the maximal positioning error distance.
  • an image of an example of the board can be generated using an imaging device, and the selection based on analysis of this image data.
  • the camera is aligned with an example of the circuit board in question, with a certain degree of accuracy (STEP 2).
  • This alignment may typically involve displacement of the camera or movement of a conveyor belt (carrying circuit boards) relative to a stationary camera.
  • the camera is aligned with the site where the first electronic component should be placed on the circuit board (STEP 3).
  • the camera is carried by the robot that will physically place the electronic components on the circuit board, and the positional relationship between the camera's field of view and the placement device on the robot arm is known.
  • the positioning error may involve an error in translation or rotation of the camera relative to the board and vice versa.
  • step T4 it is next determined (in step T5 of Fig. 2) whether or not there are any other segments in the error window that could be confused with the candidate segment. More particularly, for a candidate group consisting of a single segment, it is checked whether this segment is the only one having its orientation or is the first/last segment encountered when scanning the error window in a specified direction. For a candidate group consisting of several segments it is checked whether this group is the only one in the error window having its orientation and spacing and/or whether this is the first/last group in the error window.
  • the apparatus incorporates means 150 for acquiring digital image data, and a digital processing system 120 for processing this data according to the processing method above-described.
  • the image data acquisition means 150 may incorporate the above-described camera or may be an interface (physical, or software-implemented) receiving image data from the camera.
  • the digital processing system 120 may be adapted both to perform the initial selection of reference groups of markings and to perform the processing involved in detecting and localizing the reference groups and calculating the estimate of the position of the camera's field of view.
  • the initial selection of reference groups of markings may be made by a separate processing apparatus. In the latter case, the digital processing system 120 is provided with data at least identifying the selected reference groups and indicating their nominal locations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Input (AREA)
PCT/IB2002/002837 2001-07-04 2002-07-04 Choice of reference markings for enabling fast estimating of the position of an imaging device Ceased WO2003005793A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003511609A JP2004536300A (ja) 2001-07-04 2002-07-04 画像装置の位置の迅速な判断を可能にする基準のしるしの選択
US10/482,141 US7477774B2 (en) 2001-07-04 2002-07-04 Choice of reference markings for enabling fast estimating of the position of an imaging device
DE60238407T DE60238407D1 (de) 2001-07-04 2002-07-04 Auswahl von referenzmarken zur schnellschätzung der position eines bildaufnahmegeräts
EP02745737A EP1407647B1 (en) 2001-07-04 2002-07-04 Choice of reference markings for enabling fast estimating of the position of an imaging device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01401790.9 2001-07-04
EP01401790 2001-07-04

Publications (2)

Publication Number Publication Date
WO2003005793A2 true WO2003005793A2 (en) 2003-01-16
WO2003005793A3 WO2003005793A3 (en) 2003-05-08

Family

ID=8182793

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/002837 Ceased WO2003005793A2 (en) 2001-07-04 2002-07-04 Choice of reference markings for enabling fast estimating of the position of an imaging device

Country Status (5)

Country Link
US (1) US7477774B2 (https=)
EP (1) EP1407647B1 (https=)
JP (1) JP2004536300A (https=)
DE (1) DE60238407D1 (https=)
WO (1) WO2003005793A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004086843A1 (en) 2003-03-28 2004-10-07 Koninklijke Philips Electronics N.V. Method of determining at least one marking element on a substrate
EP2881226A4 (en) * 2012-08-02 2017-01-11 Fuji Machine Mfg. Co., Ltd. Work machine provided with articulated robot and electric component mounting machine

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005229111A (ja) * 2004-02-13 2005-08-25 Assembleon Nv 基体上の少なくとも１つの部品配置位置を推定する方法及びかかる方法を実施する装置
US9046890B2 (en) * 2008-09-05 2015-06-02 Fanuc Robotics America, Inc. Line tracking data over Ethernet
JP2011082243A (ja) * 2009-10-05 2011-04-21 Panasonic Corp 部品実装装置および部品実装装置における実装状態検査方法
WO2011108276A1 (ja) 2010-03-05 2011-09-09 パナソニック株式会社 立体撮像装置、および立体撮像方法
US9049434B2 (en) * 2010-03-05 2015-06-02 Panasonic Intellectual Property Management Co., Ltd. 3D imaging device and 3D imaging method
US9188849B2 (en) 2010-03-05 2015-11-17 Panasonic Intellectual Property Management Co., Ltd. 3D imaging device and 3D imaging method
JP2011191943A (ja) * 2010-03-12 2011-09-29 Omron Corp 画像処理装置および画像処理プログラム
EP2749843A1 (en) * 2012-12-28 2014-07-02 GN Store Nord A/S Method for filtering and selecting geographical points of interest and mobile unit corresponding thereto
CN111263141B (zh) * 2020-02-21 2021-11-02 深圳创维－Rgb电子有限公司 摄像头检测方法、装置、生产线系统
CN113794875B (zh) * 2021-11-15 2022-02-18 浪潮软件股份有限公司 一种重大项目现场视频偏移智能巡检的方法及装置
CN118470281B (zh) * 2024-06-04 2025-02-28 华翌智能装备(杭州)有限公司 一种pcb板电子元器件自动检测用最优点位计算方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794608A (en) * 1980-12-03 1982-06-12 Nec Corp Defect detecting method for printed wiring
US4860374A (en) * 1984-04-19 1989-08-22 Nikon Corporation Apparatus for detecting position of reference pattern
JPH07234943A (ja) * 1994-02-23 1995-09-05 Matsushita Electric Ind Co Ltd 位置認識方法及びその装置
US5974169A (en) * 1997-03-20 1999-10-26 Cognex Corporation Machine vision methods for determining characteristics of an object using boundary points and bounding regions
US6324299B1 (en) * 1998-04-03 2001-11-27 Cognex Corporation Object image search using sub-models
GB9828109D0 (en) * 1998-12-19 1999-02-17 Kestra Ltd Inspection equipment and methods of inspection
US6542630B1 (en) * 1999-09-14 2003-04-01 Teradyne, Inc. Inspecting component placement relative to component pads
US6577758B1 (en) * 1999-09-24 2003-06-10 Cognex Technology And Investment Corporation Image position detection technique in which input parameters can be easily determined
US6748104B1 (en) * 2000-03-24 2004-06-08 Cognex Corporation Methods and apparatus for machine vision inspection using single and multiple templates or patterns
JP4740405B2 (ja) * 2000-11-09 2011-08-03 東京エレクトロン株式会社 位置合わせ方法及びプログラム記録媒体
US6915008B2 (en) * 2001-03-08 2005-07-05 Point Grey Research Inc. Method and apparatus for multi-nodal, three-dimensional imaging
US7110591B2 (en) * 2001-03-28 2006-09-19 Siemens Corporate Research, Inc. System and method for recognizing markers on printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004086843A1 (en) 2003-03-28 2004-10-07 Koninklijke Philips Electronics N.V. Method of determining at least one marking element on a substrate
US7360716B2 (en) 2003-03-28 2008-04-22 Assembleon B.V. Method of determining at least one marking element on a substrate
EP2881226A4 (en) * 2012-08-02 2017-01-11 Fuji Machine Mfg. Co., Ltd. Work machine provided with articulated robot and electric component mounting machine

Also Published As

Publication number Publication date
US20040151363A1 (en) 2004-08-05
DE60238407D1 (de) 2011-01-05
US7477774B2 (en) 2009-01-13
JP2004536300A (ja) 2004-12-02
EP1407647A2 (en) 2004-04-14
EP1407647B1 (en) 2010-11-24
WO2003005793A3 (en) 2003-05-08

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