WO2003003481A2 - Verfahren zur herstellung eines polymerfreien bereichs auf einem substrat - Google Patents
Verfahren zur herstellung eines polymerfreien bereichs auf einem substrat Download PDFInfo
- Publication number
- WO2003003481A2 WO2003003481A2 PCT/DE2002/002205 DE0202205W WO03003481A2 WO 2003003481 A2 WO2003003481 A2 WO 2003003481A2 DE 0202205 W DE0202205 W DE 0202205W WO 03003481 A2 WO03003481 A2 WO 03003481A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- polymer
- layer
- peeling layer
- diode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000899 Gutta-Percha Substances 0.000 claims description 2
- 229920000459 Nitrile rubber Polymers 0.000 claims description 2
- 240000000342 Palaquium gutta Species 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 229920002367 Polyisobutene Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004815 dispersion polymer Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 229920000588 gutta-percha Polymers 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001195 polyisoprene Polymers 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 53
- 238000004528 spin coating Methods 0.000 description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920002098 polyfluorene Polymers 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
Definitions
- the invention relates to a method for producing polymer-free regions on a substrate, the use of an exfoliating layer for producing polymer-free regions on a substrate, and a product produced according to this method.
- OLEDs organic, light-emitting diodes
- Philips Journal of Research, Vol. 51, No. 4, 461 describes processes and suitable materials for the production of organic light-emitting diodes (OLED).
- OLEDs consist of several organic polymer layers that are on a substrate, for. B. glass, are arranged.
- a hermetically sealed encapsulation of the OLED is necessary since calcium in particular, but also the polymers, react with oxygen and water, so that degradation phenomena often occur in commercially available OLEDs, which significantly shorten the lifespan of such OLEDs .
- the individual polymer layers are applied to the diode by means of a spin coating process in which polymer solutions are homogeneously distributed over the entire substrate surface.
- a glass cap is glued to the top polymer layer arranged on the substrate.
- the adhesion of polymer layers to glass is not sufficient to ensure permanent gluing of the glass cap.
- the polymer layer acts as Release agent so that it is not possible to glue the glass cap to the polymer layer of the substrate.
- the polymer layers are mechanically removed by scratching or ablated by means of laser radiation to produce a glass-glass connection between the glass cap and the glass substrate at the corresponding locations on the substrate, this leads to the formation of particles which the OLED can damage.
- laser ablation is too slow and complex for technical applications with high throughput.
- the object of the present invention is to overcome the disadvantages in the prior art and to provide a method which enables hermetically sealed packaging of a diode in a reproducible manner.
- the object according to the invention is achieved by a method by means of which a polymer-free area is generated on a substrate, at least one peeling layer being applied to the substrate and / or to a polymer layer arranged on the substrate at the points where, by removing the peeling layer removed, a polymer-free area is formed on the substrate.
- the hermetically sealed connection of the diode protective cap to the substrate can be achieved physically and / or chemically by means of an adhesive.
- Preferred adhesives include, for example, light-curing epoxy resins. These can be applied by dispensing or screen printing.
- the diodes such as OLEDs, which are hermetically encapsulated by the method according to the invention, have a high storage stability and pass so-called 85/85 tests in a reproducible manner, i.e. storage at a relative humidity of 85% and a temperature of 85 ° C.
- the method according to the invention can be used to produce polymer-free bond areas on the substrate, for example diode substrate, by applying the peeling layer at the locations on the diode substrate where the bonding takes place.
- the substrate and the diode protective cap are preferably made of glass, such as sodalime glass, ceramic and / or polymer. It is preferred that the diode protective cap and the substrate have the same coefficient of expansion. The following combinations are preferred:
- Suitable substrate polymer films preferably include polyethylene terephthalate, polyethylene, polyether sulfone and / or polyether ketone. The substrate polymers do not fall under the term “polymer-free", which is generated by peeling off the peeling layer.
- the thickness of the substrate and the diode protective cap is usually in the range between 0.5 mm - 2 mm. But it can also be ⁇ 0.5 mm or> 2 mm.
- the area of the substrate is preferably in the range 5 5 mm 2 - 150 x 150 mm 2 . But it can also be ⁇ 5 x 5 mm 2 or> 150 x 150 mm 2 .
- the protective cap can cover the substrate completely or incompletely.
- the substrate has an anode, preferably an indium tin oxide anode, and the light-emitting layer has a cathode, preferably a Ca cathode, on at least one surface side.
- anode preferably an indium tin oxide anode
- the light-emitting layer has a cathode, preferably a Ca cathode, on at least one surface side.
- the peeling layer can be used in different ways. On the one hand, it can be used, for example, as a protective layer, ie corresponding substrate locations where the peeling layer is present are not covered by the polymer during spin coating and / or the underlying polymer layer (s) are / are also removed when the peeling layer is peeled off. On the other hand, the peeling layer can to be used to peel off an underlying polymer layer (s). For this purpose it is applied to the polymer layer at the appropriate points or areas to be removed.
- the peeling layer is characterized in that the polymer component to be removed adheres better to it than to the substrate / protective cap from which it is to be removed.
- the peeling layer (s) can be applied by spraying, by brushing on, by means of a dispenser or by means of screen printing, the areas on the substrate to which the peeling layer is to be applied preferably being defined using a template.
- the peeling layer can be formed from a water-based polymer dispersion and / or from an organic polymer solution, the peeling layer preferably being based on a rubber comprising gutta-percha, nitrile rubber, polyisoprene, polybutadiene and / or polyisobutylene. After drying on a substrate, these dispersions or solutions give rise to an elastic film which can be easily removed from the substrate surface without tearing or tearing.
- the peeling layer is usually dried in the temperature range of 20 ° C - 100 ° C.
- the thickness of the peeling layer is preferably ⁇ 1 ⁇ m -> 100 ⁇ m, preferably 5 ⁇ m - 80 ⁇ m, more preferably 10 ⁇ m - 60 ⁇ m and even more preferably 20 ⁇ m - 50 ⁇ m.
- the peeling layer can be removed as a whole or only selectively by peeling and / or by vacuum, for example by means of a vacuum sealing lip.
- the polymer layer (s) which according to the invention can be removed at least in regions by means of the peeling layer can be one or more diode layer (s), in particular a hole conductor layer, for example made of PEDOT or polyaniline, an emitter layer, for example made of polyfluorene or a poly (p-phenylene vinylene) derivative and / or an electron conducting layer , for example act from polybenzoxazole .
- a hole conductor layer for example made of PEDOT or polyaniline
- an emitter layer for example made of polyfluorene or a poly (p-phenylene vinylene) derivative and / or an electron conducting layer , for example act from polybenzoxazole .
- a preferred embodiment of the present invention relates to a diode, preferably an OLED, hermetically sealed with a protective cap on a substrate, which can be produced by the method according to the invention.
- Another preferred embodiment has a substrate on which a diode with an ITO anode, an HTL
- FIG. 1 shows a substrate with a peeling layer and a spin coating layer.
- FIG. 2 shows a substrate with a polymer layer and a peeling layer applied thereon.
- Example 1 A peeling frame is used as a protective layer on a glass substrate on which the OLED is built, at the points where a glass-glass-tight connection is to be made later. frame for the substrate surface. A latex masking agent is preferably used for this. The application is carried out by hand using a template. The thickness of the peeling layer is chosen so that a subsequent spin coating process is not affected. The layer thickness is advantageously in the range of 10-100 ⁇ m.
- the cap geometry determines the geometry of the peeling frame. In the present case it is a rectangle with an edge length of 20 x 40 mm and a width of 2 mm.
- Edge length 20 x 40 mm and width 2 mm preserved with sharp edges and corners (see Figure 1).
- the PEDOT layer is now dried at 200 ° C for 2 minutes.
- a polyfluorene layer is applied to the substrate obtained according to Example 1 (see Figure 1) e.g. applied by spin coating at 2000 rps for 20 seconds from xylene solution. After the polymer layer has dried on, the peeling frame is reapplied in line with the PE-DOT-free area of the substrate. A latex masking agent is used for this. The application takes place e.g. B. by hand using a template. After the peeling frame has dried at room temperature or higher, the peeling frame is pulled off. Here, the underlying polyfluorene layer is peeled off with the peeling frame due to its adhesion. The result is a polymer-free frame with an edge length of 20 x 40 mm and a width of 2 mm with sharp edges and corners. In the area of this frame can now be hermetically sealed
- Glass-glass connection are made, in the present case by gluing a glass protective cap using a light-curing tendency adhesive based on epoxy resin. Before bonding, a calcium layer with a thickness of 100 ⁇ m is evaporated as a cathode.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/481,848 US7026186B2 (en) | 2001-06-27 | 2002-06-17 | Method for producing polymer-free area on a substrate |
EP02747223A EP1399980A2 (de) | 2001-06-27 | 2002-06-17 | Verfahren zur herstellung eines polymerfreien bereichs auf einem substrat |
JP2003509555A JP2004531043A (ja) | 2001-06-27 | 2002-06-17 | 基板上にポリマーの無い領域を製造する方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10130992.9 | 2001-06-27 | ||
DE10130992A DE10130992B4 (de) | 2001-06-27 | 2001-06-27 | Verfahren zur Herstellung einer hermetisch dichten Verbindung zwischen einem Substrat und einer Dioden-Schutzkappe |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003003481A2 true WO2003003481A2 (de) | 2003-01-09 |
WO2003003481A3 WO2003003481A3 (de) | 2003-07-31 |
Family
ID=7689640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002205 WO2003003481A2 (de) | 2001-06-27 | 2002-06-17 | Verfahren zur herstellung eines polymerfreien bereichs auf einem substrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US7026186B2 (de) |
EP (1) | EP1399980A2 (de) |
JP (1) | JP2004531043A (de) |
DE (1) | DE10130992B4 (de) |
WO (1) | WO2003003481A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008047144A1 (en) * | 2006-10-20 | 2008-04-24 | 3T Technologies Limited | Methods and apparatus for the manufacture of microstructures |
PL422152A1 (pl) * | 2017-07-10 | 2019-01-14 | Zachodniopomorski Uniwersytet Technologiczny W Szczecinie | Sposób otrzymywania cienkich powłok z kompozytów polimerowych zawierających napełniacz węglowy |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7532932B2 (en) * | 2005-03-08 | 2009-05-12 | Kenergy, Inc. | Implantable medical apparatus having an omnidirectional antenna for receiving radio frequency signals |
DE102006027292B4 (de) * | 2006-06-13 | 2010-06-17 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer strukturierten Schichtfolge auf einem Substrat |
RU2495515C2 (ru) * | 2008-11-03 | 2013-10-10 | Кембридж Энтерпрайз Лимитед | Способ формирования рельефа из электронного или фотонного материала |
KR101676094B1 (ko) | 2013-04-15 | 2016-11-14 | 주식회사 엘지화학 | 트렌치 구조물을 이용한 패턴 형성방법, 이를 이용하여 형성된 패턴, 이를 이용한 태양전지 제조방법 및 이를 이용하여 형성된 태양전지 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001018886A2 (de) * | 1999-09-09 | 2001-03-15 | Siemens Aktiengesellschaft | Organische lichtemittierende diode und herstellungsverfahren |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10261486A (ja) | 1997-03-19 | 1998-09-29 | Idemitsu Kosan Co Ltd | 有機el発光装置の製造方法 |
JP3757613B2 (ja) * | 1998-04-16 | 2006-03-22 | 住友化学株式会社 | パターン化された有機薄膜の製造方法、パターン化された有機薄膜を含む有機エレクトロルミネッセンス素子およびその製造方法 |
-
2001
- 2001-06-27 DE DE10130992A patent/DE10130992B4/de not_active Expired - Lifetime
-
2002
- 2002-06-17 US US10/481,848 patent/US7026186B2/en not_active Expired - Lifetime
- 2002-06-17 JP JP2003509555A patent/JP2004531043A/ja active Pending
- 2002-06-17 EP EP02747223A patent/EP1399980A2/de not_active Withdrawn
- 2002-06-17 WO PCT/DE2002/002205 patent/WO2003003481A2/de active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001018886A2 (de) * | 1999-09-09 | 2001-03-15 | Siemens Aktiengesellschaft | Organische lichtemittierende diode und herstellungsverfahren |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14, 31. Dezember 1998 (1998-12-31) -& JP 10 261486 A (IDEMITSU KOSAN CO LTD), 29. September 1998 (1998-09-29) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02, 29. Februar 2000 (2000-02-29) -& JP 11 307246 A (SUMITOMO CHEM CO LTD), 5. November 1999 (1999-11-05) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008047144A1 (en) * | 2006-10-20 | 2008-04-24 | 3T Technologies Limited | Methods and apparatus for the manufacture of microstructures |
PL422152A1 (pl) * | 2017-07-10 | 2019-01-14 | Zachodniopomorski Uniwersytet Technologiczny W Szczecinie | Sposób otrzymywania cienkich powłok z kompozytów polimerowych zawierających napełniacz węglowy |
Also Published As
Publication number | Publication date |
---|---|
US20040171255A1 (en) | 2004-09-02 |
EP1399980A2 (de) | 2004-03-24 |
DE10130992A1 (de) | 2003-01-23 |
JP2004531043A (ja) | 2004-10-07 |
DE10130992B4 (de) | 2006-02-23 |
US7026186B2 (en) | 2006-04-11 |
WO2003003481A3 (de) | 2003-07-31 |
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