WO2002103271A1 - Verfahren zur herstellung von wärmetauschern im sinterverfahren - Google Patents
Verfahren zur herstellung von wärmetauschern im sinterverfahren Download PDFInfo
- Publication number
- WO2002103271A1 WO2002103271A1 PCT/DE2002/002192 DE0202192W WO02103271A1 WO 2002103271 A1 WO2002103271 A1 WO 2002103271A1 DE 0202192 W DE0202192 W DE 0202192W WO 02103271 A1 WO02103271 A1 WO 02103271A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat exchanger
- cooling
- heat exchangers
- exchangers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
Definitions
- the invention relates to a method for producing heat exchangers for cooling, in particular of heat-developing media, such as, for example
- Such heat exchangers have long been required for cooling heat-generating media. They are used, for example, in microprocessors to conduct the heat away from the semiconductor. The heat is released via the heat exchanger to the air surrounding the heat exchanger.
- the heat exchanger usually consists of a good heat-conducting material. Metals such as aluminum or copper are preferably used for this.
- the surface of the heat exchanger is relatively large in order to optimally transfer the heat to the
- heat exchangers so that they have cooling fins for enlarging the surface.
- a fan is often used in addition to removing the waste heat.
- These heat exchangers are also coupled to other cooling systems, such as in the refrigerator.
- Heat exchangers are known in which the heat exchanger has a metal core with cooling fins, the surface being roughened or a metal layer being sintered on.
- Sintering is the caking of fine-grained or powdery materials
- a heat sink is described in German published patent application DE 199 34 554 A1, which has sintered parts which form a porous sintered structure through which the cooling medium can flow, which favors its uniform distribution in the heat sink.
- Such sintered parts are also particularly easy to manufacture in the required shapes.
- the heat sink consists of several parts, namely those which are sintered and those which are not sintered. In the manufacture of such heat exchangers, this means that several different work steps are required for this. For this reason in particular, this drives up the costs for such a product.
- the object of the invention is therefore to produce an inexpensive heat exchanger which has better heat dissipation than the known heat exchangers without the volume increasing, for example for additional surfaces.
- the object is achieved in that in a process for the production of heat exchangers for cooling, in particular of heat-developing media, such as, for example, semi-conductor processors or high-power lamps of the type mentioned, the heat exchanger is produced entirely by the sintering process.
- the invention is based on the principle of increasing the surface of the heat exchanger and producing it in the simplest possible way.
- the surface area is increased by the manufacturing method according to the invention, since the heat exchanger is now completely sintered.
- the basic elementary spheres from which the heat exchanger is baked remain in their basic structure throughout the entire body of the heat exchanger. This not only creates an enlarged surface on the outside, but also on the inside of the heat exchanger. The enlarged surface serves for additional heat dissipation.
- a metal or a metal alloy has proven to be a particularly suitable material for sintering and for the production of heat exchangers.
- Heat exchanger for cooling in particular of heat-developing media, such as semiconductors or high-performance lamps, solved, according to a Method of the preceding claims is produced. Surprisingly, it turns out that by using the method according to the invention, the heat exchanger can remove considerably more heat than usual.
- the heat exchanger has cooling fins and / or cooling rods and / or cooling channels. This creates additional surfaces, which leads to even better heat dissipation to the cooling medium.
- the heat dissipation is advantageously accelerated in the device according to the invention if suitable ventilation means are provided which guide the air heated to the heat exchanger away from the latter.
- An electrically driven fan can easily exchange the heated air for cooler air.
- An advantageous embodiment of the device according to the invention results if a holder for the heat exchanger is provided. This measure allows such a device to be attached, for example, to a microprocessor.
- Peltier element is provided for an advantageous embodiment of the device according to the invention. This Peltier element can also extract heat from the body to be cooled and use the
- Fig. 1 shows in a schematic diagram a fully sintered according to the invention
- Heat exchangers with cooling rods are Heat exchangers with cooling rods.
- Fig. 2 shows in a schematic diagram a fully sintered according to the invention
- Fig. 1 denotes a heat exchanger.
- the heat exchanger is sintered from copper granules.
- the copper granulate is baked together during sintering.
- Sintering involves the caking of fine-grained or powdery materials under the influence of heat by melting the goods superficially under the influence of heat, possibly prior shaping, e.g. by pressing, understood.
- the sintering temperature must be so high that the individual grains of the starting material are welded together by an interface reaction.
- the heat exchanger 10 is manufactured in a mold. It is intended for a semiconductor chip.
- the present heat exchanger 10 has a basic body 12. On its lower side 14, the basic body 12 of the heat exchanger 10 is connected to a Peltier element 16. Contact surface 16 of the Peltier element 16 is completely in contact with the side 14 of the basic body 12. On the upper side 18 of the basic body 12 cooling rods 20 are arranged at certain intervals.
- a ventilation system 22 removes warm air that has formed.
- Metal balls 24 is made.
- FIG. 2 shows a schematic diagram of a fully sintered heat exchanger 26 according to the invention, but this time instead of the cooling rods 20 (cf. FIG. 1) with cooling fins 28 and a fan 30.
- the heat exchanger 26 has a basic body 34 on which the cooling fins 28 are arranged , Grundkö ⁇ er 34 and cooling fins 28, ie the entire heat exchanger 26, are all made of sintered copper granules.
- the caked balls 36 are indicated in Fig. 2.
- a microprocessor 32 is cooled by the heat exchanger 26.
- the underside 38 of the heat exchanger 26 is therefore completely in contact with one of the surfaces 40 of the microprocessor 32.
- the electrically driven fan blows the heated air away between the cooling fins and adds new and cool air from the outside for cooling.
- the surface area is increased enormously compared to conventional heat exchangers.
- the cooling performance is therefore not infrequently improved by up to 30% compared to the prior art.
- the sintered cooling rods 20 or cooling fins 28 help to additionally enlarge the surface.
- the heat exchangers 10 and 26 are each sintered in a mold so that manufacture can be carried out easily. There are now fewer work steps compared to heat exchangers made of several parts. This saves enormous manufacturing costs.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10292664T DE10292664D2 (de) | 2001-06-15 | 2002-06-14 | Verfahren zur Herstellung von Wärmetauschern im Sinterverfahren |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10129047 | 2001-06-15 | ||
DE10129047.0 | 2001-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002103271A1 true WO2002103271A1 (de) | 2002-12-27 |
Family
ID=7688389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002192 WO2002103271A1 (de) | 2001-06-15 | 2002-06-14 | Verfahren zur herstellung von wärmetauschern im sinterverfahren |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10292664D2 (de) |
WO (1) | WO2002103271A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008031266A1 (de) * | 2008-07-02 | 2010-01-14 | Eads Deutschland Gmbh | Thermogenerator |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0356745A1 (de) * | 1988-08-20 | 1990-03-07 | Schwäbische Hüttenwerke Gesellschaft mit beschränkter Haftung | Vorrichtung zur Wärmeübertragung |
US5133403A (en) * | 1988-10-19 | 1992-07-28 | Hitachi, Ltd. | Cooling arrangement for semiconductor devices and method of making the same |
US5205353A (en) * | 1989-11-30 | 1993-04-27 | Akzo N.V. | Heat exchanging member |
US5552634A (en) * | 1993-12-14 | 1996-09-03 | Lsi Logic Corporation | Method and apparatus for dissipating heat in an electronic device |
DE20008938U1 (de) * | 2000-05-19 | 2000-08-31 | Pepatec Gmbh | Wärmetauscher sowie Vorrichtung zum Temperieren einer Fläche oder eines Volumens |
DE19934554A1 (de) | 1999-07-22 | 2001-01-25 | Michael Stollenwerk | Wärmetauscher |
-
2002
- 2002-06-14 WO PCT/DE2002/002192 patent/WO2002103271A1/de not_active Application Discontinuation
- 2002-06-14 DE DE10292664T patent/DE10292664D2/de not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0356745A1 (de) * | 1988-08-20 | 1990-03-07 | Schwäbische Hüttenwerke Gesellschaft mit beschränkter Haftung | Vorrichtung zur Wärmeübertragung |
US5133403A (en) * | 1988-10-19 | 1992-07-28 | Hitachi, Ltd. | Cooling arrangement for semiconductor devices and method of making the same |
US5205353A (en) * | 1989-11-30 | 1993-04-27 | Akzo N.V. | Heat exchanging member |
US5552634A (en) * | 1993-12-14 | 1996-09-03 | Lsi Logic Corporation | Method and apparatus for dissipating heat in an electronic device |
DE19934554A1 (de) | 1999-07-22 | 2001-01-25 | Michael Stollenwerk | Wärmetauscher |
DE20008938U1 (de) * | 2000-05-19 | 2000-08-31 | Pepatec Gmbh | Wärmetauscher sowie Vorrichtung zum Temperieren einer Fläche oder eines Volumens |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008031266A1 (de) * | 2008-07-02 | 2010-01-14 | Eads Deutschland Gmbh | Thermogenerator |
DE102008031266B4 (de) * | 2008-07-02 | 2013-05-29 | Eads Deutschland Gmbh | Verwendung eines Thermogenerators an einem Luftfahrzeug |
Also Published As
Publication number | Publication date |
---|---|
DE10292664D2 (de) | 2004-04-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1124259B1 (de) | Kühlvorrichtung für ein Hochleistungs-Halbleitermodul | |
EP0086013B1 (de) | Werkstoff, welcher mindestens teilweise aus einer einen Einweg-Gedächtniseffekt zeigenden Komponenten aufgebaut ist und Verfahren zu dessen Herstellung | |
EP0356745A1 (de) | Vorrichtung zur Wärmeübertragung | |
DE60200818T2 (de) | Herstellungsverfahren für einen Wärmetauscher | |
DE10393588T5 (de) | Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch | |
DE69916456T2 (de) | Hochleitfähige aluminumlegierung für kühlrippen | |
AT413163B (de) | Kühlvorrichtung für einen chip sowie verfahren zur herstellung | |
DE202006021052U1 (de) | Wärmerohr-Kühlvorrichtung | |
EP3698400B1 (de) | Verfahren zum erzeugen eines kühlkörpers auf einer elektronischen baugruppe | |
DE102015215570A1 (de) | Kühlkörper für eine elektronische Komponente und Verfahren zu deren Herstellung | |
DE1501590A1 (de) | Waermetauscher und Verfahren zu dessen Herstellung | |
WO2005081371A2 (de) | Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen | |
EP1430530B1 (de) | Wärmetauscher | |
DE60126282T2 (de) | Adsorptionskältevorrichtung | |
DE112005000773T5 (de) | Wärmetauscher-Rohr, Wärmetauscher und Verfahren zum Herstellen derselben | |
DE112004002839T5 (de) | Vorrichtung für den Wärmetransport und Verfahren zu dessen Herstellung | |
DE4142406A1 (de) | Verfahren zur herstellung von waermeuebertragungsvorrichtungen, und werkzeuge zur durchfuehrung des verfahrens | |
DE2554990A1 (de) | Elektrode fuer die elektrische widerstandsschweissung | |
DE1952441C3 (de) | Supraleiter | |
DE1608196A1 (de) | Verbundmetall zur Herstellung von Rippen fuer Waermeaustauscher | |
WO2002103271A1 (de) | Verfahren zur herstellung von wärmetauschern im sinterverfahren | |
DE19934554A1 (de) | Wärmetauscher | |
DE10152589A1 (de) | Kühlerplatte und Verfahren zu ihrer Herstellung | |
DE60204446T2 (de) | Wärmeabführungselement für ein elektronisches gerät und verfahren zu seiner herstellung | |
DE3426916A1 (de) | Verfahren zur herstellung eines verbundwerkstoffes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
REF | Corresponds to |
Ref document number: 10292664 Country of ref document: DE Date of ref document: 20040429 Kind code of ref document: P |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10292664 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: JP |