Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

• the present invention relates to an automatic continuous wafer processing system in which a series of processes for processing wafers are performed without exposing the wafers to air, and to a wafer processing method for using the above system.
• a series of processes for continuously processing wafers are needed to produce semiconductor chips.
• the processes are largely divided into four processes of a photo process, an etching process, a diffusion process, and a thin film depositing process. Since the respective processes should be performed in different conditions, a large number of process modules for performing these processes are needed The process modules are efficiently arranged by the category of process in a large space, forming a process module line
• a wafer is sequentially transferred from one process module to another process module, manually or by a robot in a production line, during which the above processes are performed.
• an object of the present invention to provide an automatic continuous wafer processing system which can reduce the space occupied by modules in a production line and the time taken for transferring a wafer from one process module to another process module, by incorporating a plurality of process modules performing a series of continuous processes in a semiconductor manufacturing process, and a wafer processing method for using the above system.
• an automatic continuous wafer processing system comprising at least two track module units including a track main body where a first track path through which a wafer passes is formed in the front side thereof, a plurality of process modules coupled in a cluster at the side portion of the track main body to process the wafer that is taken in, and a track reciprocating robot moving in a horizontal direction in the track main body to transfer the wafer to the process modules, a wafer distribution tower including a tower main body where dist ⁇ bution paths are formed in the same number of the track module units, an aligner fixed in the tower main body to recognize a degree of misalignment of the wafer that is inserted and generate corresponding information, and an elevating robot installed in the tower main body to be capable of moving up and down to take the wafer from the aligner and move the wafer up and down to a position corresponding to each of the distribution paths, and load lock units in the same number of the track module units, installed between the track module units and the wafer distribution tower, to temporarily keep the wa
• the wafer dist ⁇ bution tower comprises at least one load port module where a FOUP for accommodating wafers waiting for processes or completed the processes is installed, and that a fan filter for removing foreign material included in air taken in is installed at the wafer distribution tower.
• the elevating robot comprises a robot main body moving in a vertical direction in the tower main body, a rotation shaft rotating on the robot main body, an arm installed at the rotation shaft, and a finger performing a joint movement with respect to the arm and taking the wafer.
• the load lock units comprise a load lock main body installed to connect the first track path and the distribution path, a cool station installed in the load lock main body and having a plurality of slots formed therein where the wafers are accommodated and cooling the accommodated wafers, an elevator to move the cool station up and down to an appropriate height at which the track reciprocating robot or the elevating robot takes the wafer, a first load lock vat valve to open and close the distribution paths, and a second load lock vat valve to open and close the first track paths
• the track reciprocating robot comprises a robot main body moving along a horizontal guide installed in a horizontal direction in the track main body, a first arm horizontally rotating on the robot main body, a second arm performing a joint movement with respect to the first arm, and a finger performing a joint movement with respect to the second arm and taking the wafer
• a method of processing a wafer using a wafer processing system including at least two track module units comprising a track main body where a first track path through which the wafer passes is formed in the front side thereof, a plurality of process modules coupled to the side portion of the track main body in a cluster to process the wafer taken in, and a track reciprocating robot moving in a horizontal direction in the track main body to transfer the wafer to the process modules, and load lock units in the same number of the track module units, installed at the track module units corresponding to the respective first track paths to temporarily keep the wafer passing through the first track path, the process modules having a sequential relationship for process of the wafer and being sequentially arranged clockwise or counterclockwise around the track main body, the
• FIG. 1 is a perspective view of an automatic continuous wafer i s processing system according to the present invention
• FIG. 2 is a perspective view of the automatic continuous wafer processing system of FIG 1 , viewed from a different angle,
• FIG 3 is a perspective view of a wafer distribution tower of FIG 1 ,
• FIG. 4 is a perspective view of a track main body of FIG 2, 20
• FIG 5 is a perspective view showing the inside of the track mam body of FIG 4,
• FIG 6 is a perspective view showing the inside of a load lock unit of FIG 2,
• FIG 7 is a view showing the state in which a process module of 25 FIG 1 is coupled to the track main body
• FIG 8 is an exploded perspective view of a preferred embodiment of the process module of FIG 7, and
• FIG 9 is a sectional view of the preferred embodiment of the process module of FIG 7 0 Best mode for carrying out the Invention
• FIG 1 is a perspective view of an automatic continuous wafer processing system according to the present invention
• FIG 2 is a perspective view of the automatic continuous wafer processing system of FIG 1 , viewed from a different angle
• FIG 3 is a perspective view of a wafer distribution tower of FIG 1
• FIG 4 is a perspective view of a track mam body of FIG 2
• FIG 5 is a perspective view showing the inside of the track main body of FIG 4
• FIG 6 is a perspective view showing the inside of a load lock unit of FIG 2
• an automatic continuous wafer processing system includes at least two track module units 10 and 20 where a plurality of process modules, i e , first, second, third, and fourth process modules in the present preferred embodiment, are installed, a wafer distribution tower 30 having distribution paths in the same number of the track module units 10 and 20, and load lock units 40 and 50 in the same number of the track module units 10 and 20 installed between the track module units 10 and 20 and the wafer distribution tower 30
• the wafer distribution tower 30 is for transfer of wafers between the load lock units 40 and 50 and FOUPs 36a and 37a installed at first and second load port modules 36 and 37 which will be described later
• Each of the load lock units 40 and 50 is for transfer of wafers between the wafer distribution tower 30 in a ready state and the track module units 10 and 20 maintained in a vacuum state and further separates the track module units 10 and 20 from the wafer distribution tower 30
• the number of the track module units are limited to 2 - upper and lower track module units 10 and 20.
• the number of the distribution paths are limited to 2 — upper and lower distribution paths 31a and 31 b.
• the number of the load lock units are limited to 2 - upper and lower load lock units 40 and 50.
• the number of the track module units and the distribution paths can be 3 or 4 or more and accordingly the same number of the load lock units as that of the distribution paths can be adopted.
• the upper track module unit 10 includes an upper track main body 11 where a first upper track path 12 through which a wafer w passes is formed at the front side thereof and at least one second upper track path, i.e., four second upper track paths 13a, 13b, 13c, and 13d in the present preferred embodiment, through which the wafer w passes is formed at the side thereof.
• a horizontal guide 14 is installed in a horizontal direction in the track main body 11.
• a track reciprocating robot 15 moving in the horizontal direction is installed on the horizontal guide 14 to transfer the wafer w to the first upper track path 12 or the second upper track paths 13a, 13b, 13c, and 13d.
• the track reciprocating robot 15 includes a robot main body 15a moving on and along the horizontal guide 14, a first arm 15b horizontally rotating on the robot main body 15a, a second arm 15c performing a joint movement with respect to the first arm 15b, and a finger 15d performing a joint movement with respect to the second arm 15c to take the wafer w.
• the track reciprocating robot 15 reciprocates along the horizontal guide 14 and transfers the wafer w provided to the upper load lock unit 40 or to first, second, third, and fourth process modules 100a, 100b, 100c, and 10Od to be described later.
• the first, second, third, and fourth process modules 100a, 100b, 100c, and 100d performing a series of processes to process the wafer w supplied from the side of the upper track main body 11 are coupled to the second upper track paths 13a, 13b, 13c, and 13d in a cluster, respectively.
• the first, second, third, and fourth process modules 100a, 100b, 100c, and 100d have a sequential processing relationship for wafer processing and are sequentially arranged clockwise or counterclockwise.
• a module vat valve 101 for opening and shutting a wafer transfer opening 116 to be described later and the second upper track paths 13a, 13b, 13c, and 13d is installed between the upper track main body 11 and each of the first, second, third, and fourth process modules 100a, 100b, 100c, and 100d.
• the function and structure of each process module are determined according to the process that is continuously performed.
• a track vacuum pump 16 for producing a vacuum inside the track main body 11 is connected through a pumping line 150.
• a degree of a vacuum in the process module is 10 "2 Torr, for example, the track vacuum pump 16 is maintained by the track vacuum pump 16 to be slightly higher than 10 '2 Torr.
• the module vat valve 101 is open after the process is complete, the gas remaining in the process module is prevented from being exhausted to the upper track main body 11 so that the upper track main body 11 is prevented from being contaminated. Since the track vacuum pump 16 is well known, a detailed description thereof is omitted herein.
• the lower track module unit 20 includes a lower track main body 21 having the same structure and function as those of the upper track module unit 10, a first lower track path 22, a second lower track path, a horizontal guide, a track reciprocating robot, first, second, third, and fourth process modules 105a, 105b, and 105c coupled to the side of the lower track main body , and a track vacuum pump (not shown). Since the above structure of the lower track module unit 20 is the same as that of the upper track module unit 10, a detailed description thereof is omitted herein.
• the wafer distribution tower 30 includes a tower mam body 31 where upper and lower distribution paths 31 a and 31 b through which the wafer w passes are formed at an side surface thereof, an aligner 32 fixed inside the tower main body 31 to accurately place the wafer w on the load lock units 40 and 50, a cylinder 34a installed in the tower main body 31 in a vertical direction and having a vertical moving shaft34a' moving up and down, a horizontal guide 34b for moving the cylinder 34a in a horizontal direction, and an elevating robot 35 fixed on the vertical moving shaft 34a' and moving up and down to take the wafer w from the aligner 32 and place the wafer w to a position corresponding to each of the upper and lower distribution paths 31 a and 31 b.
• the elevating robot 35 includes a robot main body 35a moving along with the vertical moving shaft 34a', a rotation shaft 35b rotating on the robot main body 35a, an arm 35c installed at the rotation shaft 35b, and a finger 35d performing a joint movement with respect to the arm 35c to take the wafer w
• a slot 32a into which the wafer w transferred by the elevating robot 35 is inserted is formed in the aligner 32
• the aligner 32 recognizes a degree of misalignment of the wafer w inserted in the slot 32a and provides corresponding information to the elevating robot 35 so that the wafer w can be accurately transferred to the load lock unit Since the aligner 32 is well known, a detailed description thereof is omitted herein
• a panel 38 is installed at the tower main body 31 to prevent an inner space of the tower mam body 31 from being exposed to the outside
• the upper load lock unit 40 includes a load lock main body 41 installed between the upper track module unit 10 and the wafer distribution tower 30 to connect the first upper track path 12 and the upper distribution path 31 a, and a cool station 42 installed inside the load lock mam body 41 , having a plurality of slots where the wafer w is accommodated, and formed of a metallic material for cooling the wafer w accommodated therein.
• An elevator 44 for moving the cool station 42 up and down to an appropriate height at which the track reciprocating robot 15 or the elevating robot 35 takes the wafer w is installed at the load lock main body 41 , as shown in FIG 6
• An inert gas intake pipe (not shown) is installed at the side portion of the load lock mam body 41.
• the inert gas such as Ar is injected into the upper load lock mam body 41 through the inert gas intake pipe so that the wafer w accommodated in the cool station 42 is cooled down
• the inert gas intake pipe can be used as a means for making the inside of the upper load lock mam body 41 under the atmospheric pressure
• a first load lock vat valve 45 for opening and shutting the upper distribution path 31 a and a second load lock vat valve 46 for opening and shutting the first upper track path 12 are installed at the upper load lock mam body 41
• a load lock vacuum pump 47 for producing a vacuum in the upper load lock unit 40 is connected to a predetermined portion of the load lock main body 41.
• the lower load lock unit 50 includes a load lock main body (not shown) installed between the lower track module unit 20 and the wafer distribution tower 30 so that the first lower track path 22 and the lower distribution path 31 b, a cool station, an elevator, a first load lock vat valve, and a second load lock vat valve which have the same structures and functions as those described in the upper load lock unit 40. Since the above elements are described in the above, detailed descriptions thereof are omitted herein. All of the above-described constituent elements are controlled by a system control portion 200.
• each process module must be determined such that a particular process can be performed with respect to a wafer
• the structure of all process modules can be made to be the same or different according to the process.
• the structure of a process module for example, a thin film forming module for performing a thin film forming process, is described below with reference to FIGS 7 through 9
• a first process module 100a is installed at the upper track mam body 11 corresponding to the second upper track path 13a
• the first process module 100a includes a reactor block 110 where the wafer w transferred by the track reciprocating robot 15 through the wafer transfer opening 116 when the module vat valve 101 is open, a shower head plate 120 coupled to the reactor block 1 10, a diffusion plate 130 installed at the shower head plate 120 for injecting a reaction gas and/or inert gas supplied from a reaction gas supplying portion (not shown), a wafer block 140 installed inside the reactor block 110 for accommodating the wafer w, and an exhaust portion (not shown) connected to the reactor block 110 for exhausting the gas in the reactor block 1 10 to the outside.
• a first connection line 121 for transferring a first reaction gas and/or inert gas being supplied to the diffusion plate 130 and a second connection line 122 for transferring a second reaction gas and/or inert gas to the diffusion plate 130 are installed at the shower head plate 120.
• the first and second connection pipes 1 1 1 and 1 12 are connected to a reaction gas supply portion (not shown).
• the diffusion plate 130 located inside the reactor block 110 when the shower head plate 120 covers the reactor block 1 10 includes a plurality of injection holes 131 for injecting the first reaction gas and/or inert gas supplied through the first connection line 121 toward the upper portion of the wafer w and a plurality of nozzles 133 for injecting the second reaction gas and/or inert gas supplied through the second connection line 122 toward the outer circumference of the wafer w
• a plurality of heaters H to increase the temperature of the inside are installed in the process module
• the wafer w is transferred through the wafer transfer opening 1 16 and placed on the wafer block 140 in a state in which the reactor block 1 10 is heated to a predetermined temperature
• the first reaction gas and/or inert gas is injected onto the upper portion of the wafer w through the first connection pipe 1 1 1 - the first connection line 121 - the injection holes 131 while the second reaction gas and/or inert gas is injected toward the inner side surface of the reactor block 1 10 through the second connection pipe 1 12 -> the second connection line 122 - the nozzles 133
• the first and second reaction gases form a thin film on the wafer w and process resultants or gases unused in the deposition of a thin film are exhausted through an exhaust hole (not shown) and a pumping port 115.
• the present invention can continuously perform a series of processes with respect to a wafer by adopting a plurality of process modules which are well known and have the same or different structure as or from the above description, for example, 8 process modules in the present preferred embodiment.
• Air where foreign material is removed by the fan filter 39 is supplied into the wafer distribution tower 30 to maintain a clean state in the wafer distribution tower 30.
• a predetermined vacuum state is maintained in the upper and lower track main bodies 11 and 21 by the track vacuum pumps 16.
• a plurality of wafers are accommodated in the FOUP 36a of the first load port module 36.
• the elevating robot 35 is moved by the vertical moving shaft 34a' and the horizontal guide 34b to a position corresponding to the first load port module 36
• One wafer w is taken from the FOUP 36a of the first load port module 36 by moving the rotation shaft 35b, the arm 35c, and the finger 35d
• the elevating robot 35 is moved to a position corresponding to the aligner 32 to insert the wafer w into the slot 32a of the aligner 32.
• the aligner 32 recognizes a degree of misalignment of the inserted wafer w and provides corresponding information to the elevating robot 35 so that the elevating robot 35 can accurately align and transfer the wafer w to the load lock units 40 and 50
• the elevating robot 35 takes the wafer w from the aligner 32 by moving the rotation shaft 35b, the arm 35c, and the finger 35d and moves to a position corresponding to the upper distribution path 31 a
• the first load lock vat valve 45 is lowered to open the upper distribution path 31 a.
• the elevating robot 35 moves the rotation shaft 35b, the arm 35c, and the finger 35d to insert the wafer w into the slot of the cool station 42 through the upper distribution path 31 a, avoiding the slots where other wafers are already inserted to perform a process and escapes from the upper load lock unit 40 by folding the arm 35c and the finger 35d.
• the first load lock vat valve 45 ascends to close the upper distribution path 31 a.
• a valve (not shown) connected to the load lock vacuum pump 47 is open and the inside of the load lock main body 41 is made in a vacuum state to be the same as the upper track main body 1 1 .
• the second load lock vat valve 46 descends to open the first upper track path 12.
• the track reciprocating robot 15 is moved to a position corresponding to the first upper track path 12 along the horizontal guide 14.
• the track reciprocating robot 15 unfolds the first arm 15b, the second arm 15c, and the finger 15d to take the wafer w from the slot of the cool station 42
• the second load lock vat valve 46 ascends to close the first upper track path 12
• the track reciprocating robot 15 moving along the horizontal guide 14 transfers the wafer w to a position corresponding to the second upper track path 13a
• the module vat valve 101 of the first process module 100a descends to open the wafer transfer opening 1 16
• the track reciprocating robot 15 places the wafer w on the wafer block 110 by unfolding the first and second arms 15b and 15c and the finger 15d. After supplying the wafer w, the track reciprocating robot 15 folds the first and second arms 15b and 15c and the finger 15d and completely escapes from the first process module 100a. Next, the module vat valve 101 ascends to close the wafer transfer opening 116. Then, a particular process is performed at the first process module 100a.
• the module vat valve 101 descends to open the wafer transfer opening 116.
• the track reciprocating robot 15 takes the wafer w from the first process module 100a.
• the track reciprocating robot 15 transfers the wafer w to a position corresponding to the second upper track path 13b and repeats the above-described action to supply the wafer w to the second process module 100b A subsequent particular process is performed at the second process module 100b
• the track reciprocating robot 15 takes the wafer w from the second process module 100b and repeats the above-described action to sequentially supply the wafer w to the third and fourth process modules 100c and 100d where particular processes are performed
• the track reciprocating robot 15 takes the wafer w from the fourth process module 100d and returns to a position corresponding to the first upper track path 12 Then, the second load lock vat valve 46 descends and the track reciprocating robot 15 inserts the wafer w to which particular processes are sequentially performed into the slot of the cool station 42 of the upper load lock unit
• the elevator 44 is operated to ascend the cool station 42 so that the wafer w to which particular processes are sequentially performed is sequentially inserted into an empty slot.
• the upper distribution path 31 a is closed.
• the wafer in the cool station 42 in the load lock main body 41 is appropriately cooled by operating an inert gas intake line (not shown). Then, the pressure in the load lock main body 41 is made to be the atmospheric pressure which is the pressure in the wafer distribution tower 30.
• the first load lock vat valve 45 descends, the elevating robot 35 moves to take the wafer w which completed the sequential processes from the cool station 42 and accommodate the wafer w in the FOUP 37a of the second load port module 37 or the FOUP 36a of the first load port module 36.
• the wafers return to the same slots of the respective FOUPs from which they have been taken.
• the lower track module unit 50 can be operated in a similar but independent manner to the operation of the upper track module unit 40.
• a plurality of process modules for performing a series of continuous processes are incorporated and the track module units which are realized by coupling the process modules are stacked so that productivity can be improved and the amount of production per unit area can be increased.
• the number of particles falling onto the wafer is reduced or an oxide film generated on the wafer by air can be minimized.
• a production yield can be improved.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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Citations (4)

• 2001
  • 2001-03-10 KR KR1020010012438A patent/KR20020072448A/ko not_active IP Right Cessation
• 2002
  • 2002-03-09 WO PCT/KR2002/000411 patent/WO2002073664A1/en not_active Application Discontinuation

Patent Citations (4)

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