WO2002025777A2 - Contacts secs (non-soudés) pour raccordements électriques courants forts des alimentations électriques - Google Patents

Contacts secs (non-soudés) pour raccordements électriques courants forts des alimentations électriques Download PDF

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Publication number
WO2002025777A2
WO2002025777A2 PCT/US2001/029501 US0129501W WO0225777A2 WO 2002025777 A2 WO2002025777 A2 WO 2002025777A2 US 0129501 W US0129501 W US 0129501W WO 0225777 A2 WO0225777 A2 WO 0225777A2
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WO
WIPO (PCT)
Prior art keywords
bus
end portion
substrate
power module
compliant
Prior art date
Application number
PCT/US2001/029501
Other languages
English (en)
Other versions
WO2002025777A3 (fr
Inventor
Scott Parkhill
Sayeed Aymed
Fred Flett
Original Assignee
Ecostar Electric Drive Systems L.L.C.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ecostar Electric Drive Systems L.L.C. filed Critical Ecostar Electric Drive Systems L.L.C.
Priority to AU2002224327A priority Critical patent/AU2002224327A1/en
Publication of WO2002025777A2 publication Critical patent/WO2002025777A2/fr
Publication of WO2002025777A3 publication Critical patent/WO2002025777A3/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/665—Bias feed arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09345—Power and ground in the same plane; Power planes for two voltages in one plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of electronics. More specifically, the invention relates to electric connections used in power modules.
  • An inverter is commonly used to convert direct current (“DC”) to alternating current (“AC") to power a three-phase load, such as a three-phase motor, or, alternatively, to convert AC from a three-phase source to DC.
  • the inverter commonly contains six switches.
  • Power modules often contain one or more pairs of complementary switches.
  • the power module typically includes silicon dice on substrates that are secured to the module baseplate.
  • Each switching pair has a positive or "high” side switch and a negative or “low” side switch for controlling the flow of electric current.
  • Each switching pair is referred to herein as a "half bridge.”
  • the "high side” of the bridge contains the positive switches, and the "low side” contains the negative switches.
  • switch is meant a switching device such as an insulated gate bipolar transistor (“IGBT”) or Bipolar Junction Transistor (“BJT”) or Metal Oxide Semiconductor Field Effect Transistor (“MOSFET”), either singly or in parallel.
  • IGBT insulated gate bipolar transistor
  • BJT Bipolar Junction Transistor
  • MOSFET Metal Oxide Semiconductor Field Effect Transistor
  • Elements may be described herein as "positive” or “negative.”
  • An element described as “positive” is shaped and positioned to be at a higher relative voltage than elements described as “negative” when the power module is connected to a power source.
  • “Positive” elements are positioned to have an electrical connection that is connectable to the positive terminal of a power source, while “negative” elements are positioned to have an electrical connection that is connectable to a negative terminal, or ground, of the power source.
  • “positive” elements are located or connected to the high side of the power module and “negative” elements are located or connected to the low side of the power module.
  • the high side switches are on one side of the module opposite the corresponding low side switches.
  • a positive DC lead from a power source such as a battery is connected to a conducting layer in the high side of the substrate.
  • a negative DC lead from the power source is connected to a conducting layer in the low side of the substrate.
  • the high side switches control the flow of current from the conducting layers of each high side substrate to output leads.
  • Output leads called “phase terminals” transfer alternating current from the three pairs of switches, or half bridges, to the motor.
  • Power modules typically have three half bridges combined into a single three- phase switching module, or single half-bridge modules that may be linked together to form a three-phase inverter.
  • the same DC to AC conversion may be accomplished using any number of half bridges, which correspond to a phase, and each switching pair may contain any number of switching devices.
  • all examples herein use a common three phase/three switching pair configuration.
  • the invention disclosed herein may be applied to a power module having any number of switches.
  • the present invention provides an electrical connector for use in a power module that utilizes a press contact to avoid the use of wire bonding or direct soldered contacts.
  • Such electrical connectors are useful in power modules where power module components, such as the DC bus, are incorporated into the power module to reduce voltage overshoots and increase switching efficiency. Connections are made between various components in the power module by pressing a connector between two components.
  • an electrical connector for use in a power module includes a first end portion for forming an electrical connection with as substrate, a second end portion, and a compliant portion situated between the first and second end.
  • the compliant portion includes a compressed position and a decompressed position.
  • the first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.
  • the first end portion extends outward from the second end portion. In yet another aspect, the first end portion extends inward from the second end portion. In still another aspect, the compliant portion is curved. In one aspect of the invention, the electrical connector includes a system for compressing the compliant portion from the uncompressed position to a compressed position. In one embodiment, the system includes downward pressure applied to the compliant portion, h another embodiment, the system includes a component placed on the second end portion for exerting downward pressure to the compliant portion. In yet another embodiment, the system includes a fastener.
  • the present invention is directed to a DC bus for use in a power module.
  • the DC bus includes a positive DC conductor bus plate and a negative DC conductor bus plate.
  • a connector is fastenable from at lease one of the positive or negative DC conductor bus plates.
  • the connector includes a first end portion for forming an electrical connection with as substrate, a second end portion, and a compliant portion situated between the first and second end.
  • the compliant portion includes a compressed position and a decompressed position.
  • the first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.
  • the connector and DC Bus disclosed herein provide a connection between electrical components in a power module that does not require wire bonding or soldering.
  • the invention provides for relatively easy assembly and reduced cost of manufacture.
  • the invention may be utilized in any power module configuration.
  • the present invention is particularly useful in power modules where power module components, such as the DC bus, are incorporated into the power module to reduce voltage overshoots and increase switching efficiency.
  • Figure 1 is an overhead view of the top of the power module.
  • Figure 2 is a perspective view of the power module.
  • Figure 3 is a perspective view of the power module without its top portion and with the substrates exposed.
  • Figure 4 is a perspective view of the power module with the substrate removed.
  • Figure 5 is an overhead view of the power module with the substrate removed.
  • Figure 6 is a side view of a power module configured for wire bonded or soldered comiections.
  • Figure 7 is a side view of a power module configured for wire bonded or soldered connections.
  • Figure 8 is a side view of a power module configured for wire bonded or soldered connections.
  • Figure 9 is a side view of a power module configured for solderless connections.
  • Figure 10 is a side view of a power module configured for solderless connections.
  • Figure 11 is a side view of a power module configured for solderless connections.
  • Figure 12 is a cross-sectional side view of the power module view through the DC bus. Terminals.
  • Figure 13 is a cross-sectional side view of the power module.
  • Figure 14 is a top sectional view of the printed circuit board.
  • Figure 15 is a top section view of the power module below the printed circuit board.
  • Figure 16 is a bottom view of the leadframe.
  • Figure 17 is a perspective view of the DC bus and phase terminals.
  • Figure 18 is a side view of the connection between the phase terminal and the substrate.
  • Figure 19 is a side view of the connection between the DC bus and the substrate.
  • Figure 20 is a side view of the connection between the phase conducting layers in the power module.
  • Figure 21 is a side view of a connector in a decompressed position.
  • Figure 22 is a side view of a connector in a compressed position.
  • Figure 23 is a side view of a connector in a decompressed position.
  • Figure 24 is a side view of a connector in a compressed position.
  • Figure 25 is a cross-sectional view of an embodiment of a connector.
  • Figure 26 is a top plan view of an embodiment of a connector.
  • a connector in an embodiment in accordance with the invention, includes a compliant portion. When the compliant portion is in a compressed position, an electrical connection may be made between a substrate and a first end portion of the connector.
  • a power module with three phase terminals for use with a three-phase motor and having three bridges, each with two switching pairs.
  • the disclosed connectors and DC bus could be used on a power module with any number of phase terminals and bridges, and having any number of switching pairs. Nonetheless, for ease of description, reference is made to a three-phase power module.
  • the module has three positive leads 21 that are connectable to a power source, such as a battery, and three negative leads 23 that are likewise connectable to the negative terminal of a power source such as a battery, or ground.
  • the module has three sets of phase terminals 15, 17, and 19.
  • the cover 16 power module is held in place by adhesive.
  • the module is attached to a coolant header or mounting by fasteners (not shown) through bushings 13.
  • the fasteners are bolts, but other types of fasteners can be substituted therefore, as will be readily apparent to those of ordinary skill in the art.
  • a non-conducting strip 25 holds leads 21 and 23 in place by providing a raised portion into which the leads 21 and 23 may be bolted.
  • the positive leads 21 and negative leads 23 carry direct current from a battery source to the module.
  • the power module converts the direct current to alternating current, or alternating current to direct current.
  • a three- phase module such as that shown in Figure 1, there are at lease three phase terminals 15, 17 and 19 through which the resulting alternating current flows.
  • Figure 2 is a perspective view of the power module 29.
  • the module has a module frame 11 and top cover 10, which are preferably composed of plastic.
  • the bottom portion is the cooling header 27 of the module, into which a cooling liquid enters, circulates through, and exits, for cooling the module.
  • FIG. 1 Sandwiched between the module frame 11 and the cooling header 27 middle portion is the base plate, which contains the printed circuit board, substrate, and switching devices, and is not shown in this view.
  • Figure 2 shows the positive leads 21 and negative leads 23, and phase terminals 15, 17, and 19.
  • the module frame 11 is bolted to the cooling header 27 with bolts through bushings 13.
  • FIG 3 is a perspective view of the power module, shown without its top cover portion 10 and with the printed circuit board removed.
  • the power module in Figure 3 is configured for wire bond or soldered connectors between the various electrical components.
  • the DC bus 31 has a separate positive bus plate and a negative bus plate, as is better illustrated in Figures 7-8, and 9-11, 19 and 20.
  • the DC bus 31 is arranged perpendicular to the substrate 107.
  • the substrate has conducting layers separated by an insulating layer for carrying and controlling a current flow.
  • the substrate 107 has a high side 101 and a low side 103.
  • Switches 33 which can be IGBTs, MOS, or MOSFETs, and diodes 35 for controlling current flow are electrically connected to the substrate 107.
  • the switches 33 are preferably IGBTs.
  • the switches 33 and diodes 35 are electrically connected, preferably by wire bonding.
  • direct current flows from a power source such as a battery to the positive DC leads 21 and to the DC conductor bus plates 31.
  • Current flows to a conducting layer in the high side 101 of the power module.
  • the current flows through the switches 33 and diodes 35 on the high side 101 through a conducting plate 37.
  • the conducting plate 37 is connected to a conducting layer in the low side 103 of the power module by a connection located through a cut-out passage 39 underneath the bus bar.
  • Current then flows from the conducting layer on the low side 103 through one of the sets of phase terminals 15, 17, or 19 to a three-phase motor (not shown).
  • Current from the motor flows back to another set of phase terminals 15, 17, or 19, where it flows from the conducting layer on the low side 103 through the low side switches 33, 35 to the negative lead 23 of the bus bar 31 and back to the power source.
  • FIG. 3 also shows pairs of phase terminals 15, 17, and 19. Three single phase terminals may be substituted for phase terminal pairs 15, 17, and 19. Alternatively, each phase terminal grouping, shown as pairs 15, 17, and 19, may include more than two phase terminals. Pairs of phase terminals 15, 17, and 19 are used for ease of connecting to switches 33 on the high side 103 of the power module.
  • Three positive DC leads 21 and three negative DC leads 23 are also shown.
  • Each lead 21 and 23 is placed central to a switching substrate corresponding to each of the phase terminals 15, 17, or 19. Although other lead configurations are possible, this placement of DC leads 21 and 23 provides for more uniform current flow as opposed to previous modules having only a single DC lead.
  • Figure 4 is a perspective view of the leadframe, shown with the substrate removed and with connectors for making an electrical connection according to the present invention that avoid wire bonding and soldering techniques. Phase terminals 15, 17, and 19 and leads 21 and 23 are shown.
  • the DC bus 31 is placed in the center of the module, however, other configurations are possible.
  • Connectors 203 are configured to connect the phase conducting layers of the high side 101 and low side 103 substrates.
  • Connectors 201 are electrically connected to the DC Bus 31 for forming an electrical connection to the low side 103 of the substrate.
  • Figure 5 is an overhead view of the leadframe shown with the substrate removed. Phase terminals 15, 17 and 19, positive leads 21, and negative leads 23 are shown. Connectors 203 and 204, which are joined together, are placed for connecting phase conducting layers between the high side 101 and the low side 103 of the substrate. Connectors 201 are placed for connecting the negative DC bus plate of the DC bus 31 to the low side 103 of the substrate. Connectors 205 are placed for connecting the positive DC bus plate of the DC bus 31 to the high side 101 of the substrate.
  • Figures 6, 7, and 8 are side views of a power module configured for wire bonded or soldered connections.
  • FIG 6 is a side view of the power module, with DC leads 21 and 23, phase terminal 15, and module frame 11.
  • the bottom cooling header 27 includes an intake for coolant 91 and an outlet for coolant 93.
  • FIG 7 a cross-sectional front view of the power module with cooling intake 91 and outlet 93 is shown.
  • the cooling header 27 includes a cavity 95 through which a coolant, such as water, may flow.
  • the cavity 95 includes thermal conducting projections 111.
  • the cooling header 27 is fastened to the base plate 61, which supports the high side switching assembly 55 and low side switching assembly 53.
  • the high side switching assembly 55 and low side switching assembly 53 comprise a single half bridge.
  • the phase terminal 15 is also shown.
  • Figure 7 illustrates the cross section of the DC bus at the point having DC leads 21 and 23.
  • the DC bus has a positive conductor plate 59 arranged parallel to a negative conductor plate 57.
  • An electrically insulating layer 51 preferably made from plastic or tape, is placed between the positive bus plate 59 and the negative bus plate 57. Alternatively, enough space may be left between the plates 57 and 59 to provide an insulating layer of air or silicone gel.
  • the electrically insulating layer 51 permits more uniform spacing and closer spacing between the positive and negative buses, 59 and 57, respectively. Thus, counter flow of current is permitted, thereby canceling the magnetic fields and their associated inductances, h addition, the parallel bus plates 57 and 59 create capacitance.
  • a capacitor dampens voltage overshoots that are caused by the switching process.
  • the DC bus plates 57 and 59 create a magnetic field cancellation as a result of the counter flow of current, and capacitance damping as a result of also establishing a functional capacitance between them.
  • Figure 5 shows the DC bus plates 57 and 59 placed perpendicular to the high side substrate 55 and low side substrate 53, however, the DC bus plates 57 and 59 may also be placed parallel to the substrates 53 and 55 and still achieve counter flow of current and reduced inductances.
  • the cooling system is further illustrated in Figure 7. Heat produced by the power module is conducted through the base plate 61 and the conducting projections
  • Coolant flows into the coolant intake 91, through the cavities 95, and out coolant outlet 93, thereby dissipating heat energy from the power module.
  • Figures 9, 10, and 11 are side views of a power module configured for solderless connections with the substrate removed.
  • positive terminal 21, negative terminal 23, and phase terminal 17 are shown.
  • the positive phase terminal 21 is electrically connected to a positive DC bus plate 59
  • the negative phase terminal 23 is electrically connected to a negative DC bus plate 57.
  • the positive DC bus plate 59 and the a negative DC bus plate 57 are separated by an insulating layer 51.
  • Connectors 201, 203, 204, 205 and 207 are configured for forming an electrical connection to the substrate of the power module.
  • Connector 207 electrically connects phase terminal 17 to the substrate
  • connector 205 electrically connects the positive DC bus plate 59 to the substrate
  • connector 201 electrically connects the negative DC bus plate 57 to the substrate.
  • Connectors 203 and 204 electrically connects the phase conducting layers between the substrates.
  • FIG 10 illustrates the electrical connection between phase terminal 15 and connector 207. Specifically, the phase terminal 15 is connected to connection 207 by a vertical plate 209 for electrical connection.
  • Figure 12 a cross-sectional side view of the power module viewed through the DC bus terminals is shown.
  • the coolant cavity 95 runs the length of the module to outtake 93.
  • the high side substrate switches 55 are shown inside the module 29 with positive DC leads 21.
  • Figure 13 is a cross-sectional side view of the power module viewed through the phase terminals 15, 17, and 19 and depicting negative DC bus leads 23.
  • Figure 14 is a top section view of the printed circuit board illustrating switching devices 33 and diodes 35 on the substrate of the module as viewed through cutouts in the printed circuit board.
  • the positive DC bus plate 59 and the negative DC bus plate 57 are also shown in the horizontal section.
  • a top section view of the module below the printed circuit board is shown.
  • the positive DC bus plate 59 and the negative DC bus plate 57 are allowed to extend into a low side slot in the middle of the module cover.
  • the DC bus plate has openings for a passage 39 from the high side 101 to the low side 103. Switches 33 and diodes 35 are shown on a substrate.
  • the current must be able to flow from the conducting layer on the high side 101 of the substrate to the conducting layer on the low side 103 of the substrate.
  • the current flows from a conducting layer of the substrate on the high side 101, through the switches 33 and diodes 35 to the conducting plate 37.
  • the conducting plate 37 is connected through the passage 39 to a plate 73 on the low side 103 of the module.
  • Connectors 203 and 204 electrically connect the phase conducting layer of the high side 101 of the substrate and the low side 103 of the substrate.
  • Connectors 207 electrically connect phase terminals (not shown in Figure 16) to the substrate.
  • Connectors 201 electrically connect the negative DC bus plate (not shown in Figure
  • connectors 205 electrically connect the positive DC bus plate (not shown in Figure 16) to the substrate.
  • Figure 17 is a perspective view of the DC bus and phase terminals. Phase terminals 15, 17, and 19 are connected by vertical plate 209 to connectors 207. Positive leads 21 and negative leads 23 are shown connected to the DC bus 31.
  • Connector 205 is electrically connected to the negative bus plate (not shown in Figure
  • Connector 201 is electrically connected to the positive bus plate 59 for forming a connection with a substrate.
  • Connector 203 is positioned to form a connection between the phase conducting layers on either side of the DC bus 31.
  • Figure 18 is a side view of the connection between the phase terminal and the substrate.
  • Phase terminal 19 is connected by a vertical plate 209 and a horizontal plate 211 to connector 207.
  • Connector 207 is configured for placement on a substrate.
  • Figure 19 is a side view of the connection between the DC bus and the substrate.
  • Positive DC terminal 21 is electrically connected to positive bus plate 59, which in turn, is electrically connected to connector 205.
  • Negative DC terminal 23 is electrically connected to negative DC bus plate 57, which is electrically connected to connector 201.
  • connectors 205 and 201 electrically connect with a substrate.
  • Figure 20 is a side view of the connection between the phase conducting layers in the power module. The phase conducting layers of the power module are conducting plates 37 and 73 shown in Figure 15. Referring back to Figure 20, positive DC terminal 21 is electrically connected to positive DC bus plate 59, and negative DC terminal 23 is electrically connected to negative DC bus plate 57.
  • the positive DC bus plate 59 and the negative DC bus plate 57 are not electrically connected to connectors 203 and 204.
  • Connectors 203 and 204 form a connection passing under the positive DC bus plate 59 and the negative DC bus plate 57.
  • the configuration of connectors 203 and 204 allow a connection between the phase conducting layer of both sides of the power module.
  • Figure 21 is a side view of a connector in a decompressed position.
  • the connector 205 includes a first end portion 225 for forming an electrical connection with a substrate and a second end portion 221.
  • the connector 205 includes a compliant portion 223.
  • the compliant portion 223 and the first end portion 225 extend inward from the second end portion 221.
  • the compliant portion 223 is curved.
  • Figure 22 is a side view of a connector in a compressed position.
  • the connector 205 includes a first end portion 225 for forming an electrical connection with a substrate and a second end portion 221.
  • the connector 205 includes a compliant portion 223.
  • the curvature of the compliant portion 223 is greater in the compressed position illustrated in Figure 22 than in the decompressed position shown in Figure 21.
  • Figure 23 is a side view of a connector in a decompressed position.
  • the com ector 201 includes a first end portion 225 for forming an electrical connection with a substrate and a second end portion 221.
  • the connector 201 includes a compliant portion 223.
  • the compliant portion 223 and the first end portion 225 extend outwards from the second end portion 221.
  • the compliant portion 223 is curved.
  • Figure 24 is a side view of a connector in a compressed position.
  • the connector 201 includes a first end portion 225 for forming an electrical connection with a substrate and a second end portion 221.
  • the connector 201 includes a compliant portion 223.
  • the curvature of the compliant portion 223 is greater in the compressed position illustrated in Figure 23 than in the decompressed position shown in Figure 24.
  • the compliant portion 223 illustrated in Figures 21-24 may be moved from the decompressed positions shown in Figures 21 and 23 to the compressed positions shown in Figures 22 and 24 by downward pressure applied to the compliant portion.
  • the downward pressure may be applied directly to the compliant portion, or indirectly from any part of the connector.
  • power module components such as the module top or the DC bus plate, may be fitted against the connector to force the connector from a compressed position to a decompressed position.
  • Figure 25 is a cross sectional view of an embodiment of the invention.
  • Two connectors 201 form an electrical connection between a first substrate 251a and a second substrate 251b.
  • the substrate is supported by a base plate 257.
  • a fastener 253 is fastened on top of the connectors 201.
  • the connectors 201 are held in a compressed position by the fastener 253.
  • the fastener 253 may be a threaded fastener, such as a bolt and a screw.
  • Figure 26 is a top plan view of an embodiment of a connector 201.
  • the connector 201 includes an opening 261 through which a fastener may be placed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention concerne un connecteur électrique pour bloc d'alimentation électrique. Il comporte une première extrémité se raccordant électriquement à un substrat, une seconde extrémité, et une zone de compliance entre les deux extrémités. Cette zone de compliance admet une position comprimée et une position détendue. La première extrémité est configurée de façon à réaliser une connexion électrique avec un substrat dès lors que la zone de compliance est en position comprimée.
PCT/US2001/029501 2000-09-20 2001-09-20 Contacts secs (non-soudés) pour raccordements électriques courants forts des alimentations électriques WO2002025777A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002224327A AU2002224327A1 (en) 2000-09-20 2001-09-20 Press (non-soldered) contacts for high current electrical connections in power modules

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US23399600P 2000-09-20 2000-09-20
US23399200P 2000-09-20 2000-09-20
US23399300P 2000-09-20 2000-09-20
US23399500P 2000-09-20 2000-09-20
US23399400P 2000-09-20 2000-09-20
US60/233,993 2000-09-20
US60/233,994 2000-09-20
US60/233,992 2000-09-20
US60/233,995 2000-09-20
US60/233,996 2000-09-20

Publications (2)

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WO2002025777A2 true WO2002025777A2 (fr) 2002-03-28
WO2002025777A3 WO2002025777A3 (fr) 2002-08-15

Family

ID=27540023

Family Applications (4)

Application Number Title Priority Date Filing Date
PCT/US2001/029502 WO2002025703A2 (fr) 2000-09-20 2001-09-20 Modèle de bus courant continu au niveau du substrat réduisant l'inductance du module
PCT/US2001/029501 WO2002025777A2 (fr) 2000-09-20 2001-09-20 Contacts secs (non-soudés) pour raccordements électriques courants forts des alimentations électriques
PCT/US2001/029504 WO2002025704A2 (fr) 2000-09-20 2001-09-20 Modèle de bus courant continu de module à base de réseau de conducteurs destiné à atténuer l'inductance du module
PCT/US2001/029503 WO2002025732A2 (fr) 2000-09-20 2001-09-20 Atténuation du parasitage électromagnétique dans les modules d'alimentation électrique par utilisation de condensateurs intégrés au niveau du substrat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2001/029502 WO2002025703A2 (fr) 2000-09-20 2001-09-20 Modèle de bus courant continu au niveau du substrat réduisant l'inductance du module

Family Applications After (2)

Application Number Title Priority Date Filing Date
PCT/US2001/029504 WO2002025704A2 (fr) 2000-09-20 2001-09-20 Modèle de bus courant continu de module à base de réseau de conducteurs destiné à atténuer l'inductance du module
PCT/US2001/029503 WO2002025732A2 (fr) 2000-09-20 2001-09-20 Atténuation du parasitage électromagnétique dans les modules d'alimentation électrique par utilisation de condensateurs intégrés au niveau du substrat

Country Status (3)

Country Link
US (3) US20020034088A1 (fr)
AU (4) AU2002211246A1 (fr)
WO (4) WO2002025703A2 (fr)

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WO2002025703A3 (fr) 2002-09-06
AU2002211245A1 (en) 2002-04-02
US6636429B2 (en) 2003-10-21
US20020034088A1 (en) 2002-03-21
AU2001294613A1 (en) 2002-04-02
WO2002025732A2 (fr) 2002-03-28
US20020111050A1 (en) 2002-08-15
AU2002211246A1 (en) 2002-04-02
WO2002025732A3 (fr) 2002-11-21
WO2002025704A3 (fr) 2002-09-06
WO2002025777A3 (fr) 2002-08-15
WO2002025704A2 (fr) 2002-03-28
US6793502B2 (en) 2004-09-21
WO2002025703A2 (fr) 2002-03-28
AU2002224327A1 (en) 2002-04-02
US20020126465A1 (en) 2002-09-12

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