WO2002023203A1 - Prise de vérification pour dispositifs électroniques - Google Patents

Prise de vérification pour dispositifs électroniques Download PDF

Info

Publication number
WO2002023203A1
WO2002023203A1 PCT/US2001/041451 US0141451W WO0223203A1 WO 2002023203 A1 WO2002023203 A1 WO 2002023203A1 US 0141451 W US0141451 W US 0141451W WO 0223203 A1 WO0223203 A1 WO 0223203A1
Authority
WO
WIPO (PCT)
Prior art keywords
test socket
lcc
cavity
test
electronic device
Prior art date
Application number
PCT/US2001/041451
Other languages
English (en)
Inventor
Mark S. Lewis
Simon Wood
Ron Burke
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Publication of WO2002023203A1 publication Critical patent/WO2002023203A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Abstract

L'invention concerne une prise de vérification pour dispositifs électroniques, laquelle comprend un plancher, un certain nombre de parois se dressant à partir de ce plancher et définissant une cavité surdimensionnée qui sépare lesdites parois, de sorte que les ébarbures formées sur le dispositif tiennent à l'intérieur de la cavité surdimensionnée, et un certain nombre de touches d'emboîtement qui font saillie à partir d'une paroi vers l'intérieur de façon qu'elles se logent dans des entailles du dispositif afin d'emboîter ce dernier avec la cavité surdimensionnée.
PCT/US2001/041451 2000-09-14 2001-07-27 Prise de vérification pour dispositifs électroniques WO2002023203A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66188600A 2000-09-14 2000-09-14
US09/661,886 2000-09-14

Publications (1)

Publication Number Publication Date
WO2002023203A1 true WO2002023203A1 (fr) 2002-03-21

Family

ID=24655507

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/041451 WO2002023203A1 (fr) 2000-09-14 2001-07-27 Prise de vérification pour dispositifs électroniques

Country Status (1)

Country Link
WO (1) WO2002023203A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009067238A1 (fr) * 2007-11-25 2009-05-28 Advanced Micro Devices, Inc. Connecteur de boîtier à multiples dimensions
CN111834817A (zh) * 2019-04-18 2020-10-27 泰克元有限公司 电子部件测试用分选机的插入件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
DE19513275A1 (de) * 1994-06-27 1996-01-11 Hewlett Packard Co Sondenadapter zum Testen von IC-Bausteinen
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
DE19513275A1 (de) * 1994-06-27 1996-01-11 Hewlett Packard Co Sondenadapter zum Testen von IC-Bausteinen
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009067238A1 (fr) * 2007-11-25 2009-05-28 Advanced Micro Devices, Inc. Connecteur de boîtier à multiples dimensions
GB2467473A (en) * 2007-11-25 2010-08-04 Global Foundries Inc Multiple size package socket
US7955892B2 (en) 2007-11-25 2011-06-07 Globalfoundries Inc. Multiple size package socket
KR101193230B1 (ko) * 2007-11-25 2012-10-19 글로벌파운드리즈 인크. 다중 사이즈 패키지 소켓
CN101919321B (zh) * 2007-11-25 2013-06-05 格罗方德半导体公司 多尺寸封装件插座
CN111834817A (zh) * 2019-04-18 2020-10-27 泰克元有限公司 电子部件测试用分选机的插入件

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