WO2002019401A1 - Procede et dispositif d'exposition - Google Patents

Procede et dispositif d'exposition Download PDF

Info

Publication number
WO2002019401A1
WO2002019401A1 PCT/JP2001/007306 JP0107306W WO0219401A1 WO 2002019401 A1 WO2002019401 A1 WO 2002019401A1 JP 0107306 W JP0107306 W JP 0107306W WO 0219401 A1 WO0219401 A1 WO 0219401A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
exposure
row
shot regions
scan
Prior art date
Application number
PCT/JP2001/007306
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kenji Nishi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU2001280175A priority Critical patent/AU2001280175A1/en
Priority to KR10-2003-7002843A priority patent/KR20030028826A/ko
Publication of WO2002019401A1 publication Critical patent/WO2002019401A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
PCT/JP2001/007306 2000-08-29 2001-08-27 Procede et dispositif d'exposition WO2002019401A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2001280175A AU2001280175A1 (en) 2000-08-29 2001-08-27 Exposure method and device
KR10-2003-7002843A KR20030028826A (ko) 2000-08-29 2001-08-27 노광방법 및 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-258539 2000-08-29
JP2000258539 2000-08-29

Publications (1)

Publication Number Publication Date
WO2002019401A1 true WO2002019401A1 (fr) 2002-03-07

Family

ID=18746840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/007306 WO2002019401A1 (fr) 2000-08-29 2001-08-27 Procede et dispositif d'exposition

Country Status (4)

Country Link
KR (1) KR20030028826A (ko)
AU (1) AU2001280175A1 (ko)
TW (1) TW538448B (ko)
WO (1) WO2002019401A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057263A1 (ja) * 2004-11-25 2006-06-01 Nikon Corporation 移動体システム、露光装置及びデバイス製造方法
CN113307115A (zh) * 2020-02-27 2021-08-27 株式会社日立制作所 测量装置、电梯系统以及测量方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640840B (zh) * 2007-12-28 2018-11-11 日商尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
KR101594713B1 (ko) 2014-12-22 2016-02-17 주식회사 포스코 오버런 검출 장치 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0951054A1 (en) * 1996-11-28 1999-10-20 Nikon Corporation Aligner and method for exposure
EP1111471A2 (en) * 1999-12-21 2001-06-27 Asm Lithography B.V. Lithographic projection apparatus with collision preventing positioning device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0951054A1 (en) * 1996-11-28 1999-10-20 Nikon Corporation Aligner and method for exposure
EP1111471A2 (en) * 1999-12-21 2001-06-27 Asm Lithography B.V. Lithographic projection apparatus with collision preventing positioning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057263A1 (ja) * 2004-11-25 2006-06-01 Nikon Corporation 移動体システム、露光装置及びデバイス製造方法
JPWO2006057263A1 (ja) * 2004-11-25 2008-06-05 株式会社ニコン 移動体システム、露光装置及びデバイス製造方法
JP4807629B2 (ja) * 2004-11-25 2011-11-02 株式会社ニコン 露光装置及びデバイス製造方法
CN113307115A (zh) * 2020-02-27 2021-08-27 株式会社日立制作所 测量装置、电梯系统以及测量方法

Also Published As

Publication number Publication date
TW538448B (en) 2003-06-21
AU2001280175A1 (en) 2002-03-13
KR20030028826A (ko) 2003-04-10

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