WO2002019401A1 - Exposure method and device - Google Patents
Exposure method and device Download PDFInfo
- Publication number
- WO2002019401A1 WO2002019401A1 PCT/JP2001/007306 JP0107306W WO0219401A1 WO 2002019401 A1 WO2002019401 A1 WO 2002019401A1 JP 0107306 W JP0107306 W JP 0107306W WO 0219401 A1 WO0219401 A1 WO 0219401A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- exposure
- row
- shot regions
- scan
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001280175A AU2001280175A1 (en) | 2000-08-29 | 2001-08-27 | Exposure method and device |
KR10-2003-7002843A KR20030028826A (en) | 2000-08-29 | 2001-08-27 | Exposure method and device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000258539 | 2000-08-29 | ||
JP2000-258539 | 2000-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002019401A1 true WO2002019401A1 (en) | 2002-03-07 |
Family
ID=18746840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/007306 WO2002019401A1 (en) | 2000-08-29 | 2001-08-27 | Exposure method and device |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20030028826A (en) |
AU (1) | AU2001280175A1 (en) |
TW (1) | TW538448B (en) |
WO (1) | WO2002019401A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006057263A1 (en) * | 2004-11-25 | 2006-06-01 | Nikon Corporation | Mobile body system, exposure apparatus, and method of producing device |
CN113307115A (en) * | 2020-02-27 | 2021-08-27 | 株式会社日立制作所 | Measuring device, elevator system and measuring method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI547769B (en) * | 2007-12-28 | 2016-09-01 | 尼康股份有限公司 | An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method |
KR101594713B1 (en) | 2014-12-22 | 2016-02-17 | 주식회사 포스코 | Apparatus for detecting overrun and method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0951054A1 (en) * | 1996-11-28 | 1999-10-20 | Nikon Corporation | Aligner and method for exposure |
EP1111471A2 (en) * | 1999-12-21 | 2001-06-27 | Asm Lithography B.V. | Lithographic projection apparatus with collision preventing positioning device |
-
2001
- 2001-08-27 KR KR10-2003-7002843A patent/KR20030028826A/en not_active Application Discontinuation
- 2001-08-27 WO PCT/JP2001/007306 patent/WO2002019401A1/en active Application Filing
- 2001-08-27 AU AU2001280175A patent/AU2001280175A1/en not_active Abandoned
- 2001-08-28 TW TW090121151A patent/TW538448B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0951054A1 (en) * | 1996-11-28 | 1999-10-20 | Nikon Corporation | Aligner and method for exposure |
EP1111471A2 (en) * | 1999-12-21 | 2001-06-27 | Asm Lithography B.V. | Lithographic projection apparatus with collision preventing positioning device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006057263A1 (en) * | 2004-11-25 | 2006-06-01 | Nikon Corporation | Mobile body system, exposure apparatus, and method of producing device |
JPWO2006057263A1 (en) * | 2004-11-25 | 2008-06-05 | 株式会社ニコン | Mobile system, exposure apparatus, and device manufacturing method |
JP4807629B2 (en) * | 2004-11-25 | 2011-11-02 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
CN113307115A (en) * | 2020-02-27 | 2021-08-27 | 株式会社日立制作所 | Measuring device, elevator system and measuring method |
Also Published As
Publication number | Publication date |
---|---|
TW538448B (en) | 2003-06-21 |
AU2001280175A1 (en) | 2002-03-13 |
KR20030028826A (en) | 2003-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003100837A3 (en) | Large substrate test system | |
EP1102311A3 (en) | Method of and apparatus for dynamic alignment of substrates | |
JP5032170B2 (en) | Inspection device | |
EP1324022A4 (en) | Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface | |
HK1219172A1 (en) | Exposure apparatus, exposure method and device manufacturing method | |
AU6388700A (en) | Method and apparatus for determining phase shifts and trim masks for an integrated circuit | |
EP1260822A3 (en) | Automatic test equipment for semiconductor device | |
WO2002025723A3 (en) | Lateral shift measurement using an optical technique | |
WO2008031031A3 (en) | Cartesian cluster tool configuration for lithography type processes | |
TW200719095A (en) | Exposure apparatus, exposure method and device manufacturing method | |
EP0810632A3 (en) | Method and apparatus for transferring wafers in a wafer processing facility | |
EP1098359A4 (en) | Scanning aligner, method of manufacture thereof, and method of manufacturing device | |
AU5067898A (en) | Aligner and method for exposure | |
WO2002075783A8 (en) | Wafer level interposer | |
WO2003038888A3 (en) | Method and apparatus for cascade control using integrated metrology | |
WO2002019401A1 (en) | Exposure method and device | |
US5532114A (en) | Method of forming a photoresist pattern in a semiconductor device | |
WO2003029822A1 (en) | Specific binding analyzer and method of analyzing specific binding | |
WO2002012870A3 (en) | System and method for inspecting bumped wafers | |
MY122198A (en) | Semiconductor device manufacturing method. | |
EP1304726A3 (en) | Device and method for receiving and for processing a thin wafer | |
WO2002063680A3 (en) | Compact stacked electronic package | |
WO2003010802A1 (en) | Stage apparatus, exposure system and exposure method, and device production method | |
WO2002013244A3 (en) | Apparatus and method for handling and testing of wafers | |
WO2002023621A3 (en) | Method and apparatus for fast automated failure classification for semiconductor wafers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020037002843 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037002843 Country of ref document: KR |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |