WO2002002297A1 - Procede d'assemblage - Google Patents
Procede d'assemblage Download PDFInfo
- Publication number
- WO2002002297A1 WO2002002297A1 PCT/JP2001/005728 JP0105728W WO0202297A1 WO 2002002297 A1 WO2002002297 A1 WO 2002002297A1 JP 0105728 W JP0105728 W JP 0105728W WO 0202297 A1 WO0202297 A1 WO 0202297A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bonding
- mold
- molded body
- molded article
- pressure
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000002347 injection Methods 0.000 claims abstract description 33
- 239000007924 injection Substances 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims description 33
- 238000010304 firing Methods 0.000 claims description 19
- 239000005011 phenolic resin Substances 0.000 claims description 17
- 229920001568 phenolic resin Polymers 0.000 claims description 16
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 239000012298 atmosphere Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 10
- 238000001746 injection moulding Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 238000000748 compression moulding Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000000071 blow moulding Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000001415 gene therapy Methods 0.000 description 1
- 238000010353 genetic engineering Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0063—Joining parts moulded in separate cavities facing before assembling, i.e. bringing the parts opposite to each other before assembling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/767—Printing equipment or accessories therefor
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/602—Making the green bodies or pre-forms by moulding
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
Definitions
- the present invention relates to a method for producing a molded article having a hollow portion. More specifically, a molding that is small enough to be unsuitable for prototyping and requires a cavity
- a hollow molded article is manufactured by a method such as blow molding in which a gas such as air or nitrogen gas is blown into a molded article while extruding a resin.
- a method of bonding the individual molded bodies using an adhesive, or joining them using a method such as ultrasonic wave or melting is used.
- Such blow molding, bonding, and joining techniques are effective for relatively large moldings, but are not suitable for molding fine and precise structures.
- blow molded articles have the disadvantage that the thickness of the resin varies depending on the gas pressure and amount, and a precise shape cannot be formed inside.
- the method of bonding is that if the amount of the adhesive is small, the sealing property is lost. If the amount of adhesive is too large, the adhesive will protrude to fill the necessary space, and foreign matter such as dust will adhere to the bonding surface, making it impossible to bond. . These are major issues when considering mass production. Since it is necessary to provide a separate bonding process, there are also problems such as high cost of process management.
- a molded article for producing the above-mentioned devices such as medical, bio, and micropumps
- those having chemical resistance, biologic stability, and strength are required.
- Examples of such a compact include a carbon compact formed from a high-density polycrystalline force obtained from Pitch Coats, or a thermosetting resin powder, which is molded at a high pressure while being heated by a compression molding method, followed by firing. And carbonized products obtained by carbonization.
- these compacts have a problem that the powder is not completely filled and a ridge between the particles is formed, so that a grain boundary, which is the contour of the powder, is likely to be generated. These grain boundaries tend to cause cracks in the molded body, causing problems such as a decrease in strength.
- the present invention has been made for the purpose of solving the above problems, and the above problems can be solved by the present invention. That is, the present invention provides the following steps:
- a step of fixing the injection molded body (a) at a position (scheduled bonding position) molded by a molding die;
- the present invention relates to a method for producing a molded article having a hollow portion containing:
- the molded article (b) is an injection molded article (b ′), and the surface to be bonded of the injection molded article (a) or (b ′) protrudes and the pressure at the time of adhesion is reduced to the surface to be bonded. Is sufficiently transmitted to the mold and excess pressure is released at the mold parting surface.
- the pressure at the time of bonding is a pressure of an ejector pin, a pressure of a piezo element set in a mold, or a pressure by an external pressure generating means connected to the mold.
- the method includes (5) a step of subjecting the adhesive surface to an ultraviolet ray treatment, a laser single beam treatment, and / or an adhesion aid treatment.
- the present invention further comprises the following steps:
- the present invention relates to a method for producing a carbon molded body having a hollow portion.
- Figure 1 is a schematic diagram showing the micropump discharge section plate and its configuration. You.
- FIG. 2 is a schematic diagram of a mold used in the present invention.
- FIG. 3 is a view showing the operation of the mold when the opening and closing opening of the mold 20 is opened.
- FIG. 4 is a schematic view showing the operation when positioning the upper member and the lower member to be bonded.
- FIG. 5 is a schematic diagram showing a state in which the upper member and the lower member are bonded after positioning.
- FIG. 6 is a schematic diagram showing the ink jet head and its configuration.
- FIG. 7 shows a schematic diagram of the creation of an inkjet head.
- FIG. 8 is a schematic diagram of positioning for bonding an ink jet head.
- FIG. 9 is a schematic diagram showing a state where the ink chamber 1 and the vibration film are bonded after positioning.
- FIG. 10 is a schematic diagram showing that the parting line of the diaphragm is shifted by a distance P.
- FIG. 11 is a schematic diagram showing a state where the ink chamber 1 set at the bonding position and the vibration film are in contact with each other.
- FIG. 12 is a schematic diagram showing a state where the ink champer and the vibration film are adhered.
- the injection molded article (a) is molded by a molding die (adhesion schedule). Position), the molded body (b) is placed and moved to this position, the molded body (b) is positioned at the bonding expected position, and the mold is closed and bonded.
- the resin used for the injection molded article (a) and the molded article (b) adhered thereto there is no limitation, and examples thereof include thermoplastic resins and thermosetting resins (for example, epoxy resins, phenol resins, and unsaturated polyester resins). It is preferable that the same resin is used for the injection molded body (a) and the molded body (b) to be bonded.
- the molded article (b) may be a molded article obtained by molding such as extrusion molding, compression molding, injection molding, transfer molding, and blow molding. However, in order to efficiently perform integral molding, an injection molded article is required. Is more preferable. In particular, when molding and bonding are performed in the same mold, it is preferable to perform injection molding with the same resin.
- the molded article (b) may be a molded article (b) previously molded in another mold.
- the preformed surface (adhesion aid treatment, ultraviolet irradiation treatment, laser beam irradiation treatment, etc.) is applied to the bonding surface of the obtained molded body (b), and then bonded to the injection molded body (a). You can also.
- molded body (b) a sheet or the like formed by punching a mold may be used.
- thermosetting resin When using the injection molded article (a) and the injection molded article (b '), it is preferable to use the same thermosetting resin, and it is preferable to use a phenolic resin, in consideration of the adhesion efficiency and the strength.
- a carbon molded body when used, it is preferable to use a granular phenolic resin. Spherical, especially spherical, phenolic resins are more preferred.
- a carbon molded body obtained by molding a carbon molded body made of high-density polycrystalline carbon or a thermosetting resin powder at a high pressure while heating by a compression molding method, followed by firing and carbonization.
- the powder is not completely filled, and a ridge between the particles is formed, so that a grain boundary, which is the contour of the powder, is likely to be generated, and a crack is easily generated in the formed body, resulting in problems such as a decrease in strength.
- a granular resin is used and injection-molded, it is finely filled, so that no grain boundaries are formed after firing, and a strong molded body can be obtained.
- the injection molded body (a) and the molded body (b) are bonded to each other by fixing the injection molded body (a) at a position (planned bonding position) where the injection molded body (a) is molded by a molding die, and molding at the planned bonding position.
- the body (b) is placed and moved in the molding die to be positioned at the bonding expected position, and then the die is closed and the tightening force at this time is used.
- Adhesion aids such as spraying can be used.
- the injection-molded articles (a) and (b) are the same resin as such an adhesion aid, the same resin is used to perform fusion bonding at the time of adhesion, so that strong adhesion is obtained. It is.
- the mold release agent When a mold release agent is used during molding, the mold release agent may precipitate on the bonding surface and hinder the bonding.Therefore, the bonding surface is treated with laser light irradiation, ultraviolet irradiation, etc., or the release agent is removed. May be treated with methylene dichloride (adhesion aid), and then the mold may be tightened and bonded using the tightening force.
- the bonding surface is treated with laser light irradiation, ultraviolet irradiation, etc., or the release agent is removed. May be treated with methylene dichloride (adhesion aid), and then the mold may be tightened and bonded using the tightening force.
- the clamping force of the mold is sufficient, but the pressure of the agitator bin and the metal It is preferable to use the pressure of a piezo element set in the mold or the pressure from an external pressure generating means connected to the mold.
- both the injection-molded product (a) and the molded product (b) are injection-molded products made of a true spherical phenolic resin
- the phenolic resin is finely filled and, when fired, forms grain boundaries.
- a carbon molded body having a strong bond can be obtained.
- the firing is performed in an inert gas atmosphere. Prior to firing, the shape may be corrected. Straightening is performed by pressing using a heated mold or a heated jig.
- the inert gas used for firing is not particularly limited as long as it is a gas that does not react with carbon at a high temperature, but argon gas, nitrogen gas, and the like are preferable in terms of availability.
- the firing of the phenolic resin is performed at 500 to 200 ° C.
- the carbon molded body can be a vitreous (firing temperature around 800 ° C) or amorphous (firing temperature around 1500 ° C) carbon molded body.
- the rate of temperature rise during firing is preferably 30 to 70 ° CZ.
- firing is performed at 150 to 160 ° C. at a heating rate of 50 ° C./min.
- a molded article having improved chemical strength, chemical resistance, heat resistance, and biochemical stability can be obtained.
- a phenolic resin is used, it is preferably in the form of granules, and among the granules, a spherical shape is more preferable.
- a truly spherical phenolic resin may be used.
- the granular phenolic resin can be obtained by a method such as suspension polymerization.
- the resin has a particle size of 2 to 500 // m, preferably 5 to 50 ⁇ m, most preferably 5 to 10 ⁇ m.
- the carbon compact obtained by firing shrinks and becomes smaller. This means that in the process up to the injection molding bonding, the shape is large, the mold and the like can be made large, and the bonding area is large, so it is easy to handle. It is also a very good point in making precision parts.
- the bonding method of the present invention is bonding performed in a mold, and is a method of filling a resin with a resin by injection, opening the mold after molding to some extent, and bonding with another member. If an adhesive aid is used, it is possible to perform bonding even after the resin has hardened considerably after filling the molding resin into the mold. In addition, since bonding is performed by the mold during molding, the irregularities in dimensions due to shrinkage after molding and the misalignment that occur in the conventional method of taking out from the mold and bonding after cooling are eliminated. In addition, since an adhesive is not necessarily required, problems when using the adhesive (for example, generation of burrs, poor sealing performance, etc.) do not occur.
- the bonding method of the present invention it is possible to achieve a precise (100 ⁇ m or less bonding width) and a head ink of a micropipeter or an on-demand ink jet printer which requires a complete seal.
- Ultra-precision bonding such as bonding between the chamber and the vibrating membrane is also possible, and an easily and completely sealed bonded body can be obtained.
- the compression molding method cannot flow the resin to the fine parts, whereas the injection molding method completely melts the resin and melts the metal. Since the resin is injected into the mold by applying pressure, a molded article having a complicated shape can be easily manufactured, and the subsequent process of the present invention mass-produces a component made of the same pressure-resistant molded article.
- Example 1 Creation of micro pump discharge section plate
- micro-pump discharge plate of micro-droplet discharge device Will be described.
- the micropump discharge plate 1 shown in FIG. 1 (a) includes a lower member 2 shown in FIG. 1 (b) and an upper member 3 shown in FIG. 1 (c).
- the upper member 3 having a fine structure shown in FIG. 1 (c) can be obtained, for example, by inserting a molding piece produced by a rigging process into a mold and performing injection molding. In addition to the rigging process, the molding piece can be produced by electric discharge heating, cutting, or a combination thereof.
- the mold 20 includes a core base 17, a core 16 provided on the core base 17, an upper mold 15 and a die 19.
- Pressure generating means 8 is provided at a portion of the core base 17 that contacts the mold 2 of the lower member 2 provided on the core 16. Further, on both sides of the mold 2 of the lower member 2, reference pins 6 and 7 for positioning are provided, and fitting holes 9 and 10 provided on the die 19 for positioning are provided respectively. , ⁇ is fitted.
- a spool 4 for injecting resin and a runner 5 are detachably attached to the upper mold 15, and the upper mold 3 of the upper member 3 and the mold 2 of the lower member 2 provided on the die 19 are attached to the upper mold 15.
- Supply resin also, fitting holes 12 and 13 for positioning are provided on both sides of the mold 3 of the upper member 3.
- the fitting holes 12 and 13 are provided at the same interval and the same size as the fitting holes 9 and 10, respectively. Therefore, the reference pins 6 and 7 are fitted into the fitting holes 12 and 13 respectively.
- Molds 2 and 3 ' are formed so that the resin molded by each mold is pressed at an accurate position to form a precise molded body.
- the upper mold 15 has an opening / closing opening 18. By opening the opening / closing opening 18, the die 19 rises, and accordingly, the fitting holes 9 and 10 rise. Associate pins 6 and 7 are exposed.
- the die 19 is connected to an actuator 14 connected to the driving means 11. Move die 19 to the left in Fig. 2 By moving 1 2 and 1 3 to the positions of reference pins 6 and 7, respectively, and closing the opening 18, the fitting holes 1 2 and 13 are inserted into the reference pins 6 and 7, respectively. Is done.
- a method of manufacturing the micropump discharge section plate 1 shown in FIG. 1 will be described using the mold 20 having such a configuration.
- thermosetting resin is injected into the mold 3 of the upper member 3 and the mold 2 ′ of the lower member 2 provided on the die 19 through the spool 4 and the runner 5 shown in FIG.
- the mold 2 of the lower member 2 is located at a fixed position, and a pressure generating means 8 is provided below the mold 2 ′ as necessary.
- the lower member 2 does not need to be taken out of the mold, and is fixed at the formed position (position to be bonded).
- opening the opening and closing opening 18 of the upper mold 15 raises the die 19 as shown in FIG.
- the fitting holes 9 and 10 rise, and the reference pins 6 and 7 are exposed from the fitting holes 9 and 10.
- the runner gate 21 including the spool 4 and the runner 5 which are detachably attached is removed.
- the die 14 is pushed by the actuator 14 in the direction of the arrow (from right to left in the drawing), and the reference pins 6 and 7 arranged on the core 16 are pressed. It is positioned so that the fitting holes 12 and 13 are located at the positions. That is, positioning is performed.
- the obtained micro pump discharge section plate 1 can be fired if necessary.
- a carbon molded body having a hollow portion is obtained.
- a molded body with improved chemical strength, chemical resistance, heat resistance, biochemical stability, and mechanical strength is obtained.
- the ink jet head 30 in FIG. 6A is an ultra-precision ink jet head, and is composed of an ink chamber 31 (FIG. 6 (b)) and a vibration film 32 (FIG. 6 (c)).
- the ink chamber 31 has a nozzle 31a, an ink chamber 31b, a restrictor 31c, and an ink supply chamber 31d.
- the size of the nozzle 31a is 20 to 50 ⁇ m in diameter.
- the size of the ink chamber 31b is about lmmX O. ImmXO.
- the restrictor 31c is a very small one having a width of about 0.03mm and a depth of about 0.03mm.
- the diaphragm 32 has a foot portion 32a.
- the ink chamber 31 for filling and printing the ink in such a small space is formed of resin, and is adhered to the vibration film 32 (32a is a foot portion) in a mold, so that the ink jet head 30 is formed. Created.
- FIG. 7 shows a device substantially similar to that of FIG. 2, in which resin is injected through a spool 4 and a runner 5 which are detachably attached to a mold 31 of an ink chamber 31 and a mold 32 of a diaphragm 32. It is a device for molding. Reference pins 6 and 7 for positioning are provided on both sides of the mold 31 of the ink chamber 31, respectively, and are respectively fitted into fitting holes 9 and 10 provided on the die 19 for positioning. Have been. Fitting holes 12 and 13 for positioning are provided on both sides of the mold 32 ′ of the diaphragm 32. The fitting holes 12 and 13 are provided at the same interval and the same size as the fitting holes 9 and 10, respectively.
- the upper mold 15 has an opening / closing opening 18. By opening the opening / closing opening 18, the die 19 rises, and accordingly, the fitting holes 9 and 10 rise. Associate pins 6 and 7 are exposed.
- the die 19 is connected to an actuator 14 connected to the driving means 11.
- the raised die 19 is moved to the left in FIG. 7, the fitting holes 12 and 13 are moved to the positions of the reference pins 6 and 7, respectively, and the opening / closing opening 18 is closed.
- the mating holes 12 and 13 are inserted into the reference pins 6 and 7, respectively, and the mold 32 of the diaphragm 32 is positioned.
- thermosetting resin is injected into the mold 31 'of the ink chamber 31 and the mold 3'2 of the diaphragm 32 provided in the die 19 through the spool 4 and the runner 5 shown in FIG.
- the mold 31 of the ink chamber 31 is located at a fixed position, and a pressure generating means 8 is provided below the mold 31 'as necessary.
- the ink chamber 131 does not need to be taken out of the mold, and is fixed at a formed position (position to be bonded).
- the die 19 has good precision, for example, a groove.
- a working guide is provided.
- the parting line of the vibrating membrane 32 is shifted to the die side by a distance P as shown in FIG. That is, in FIG. 10, the parting line is shifted upward by P.
- the distance P is generally 5 to 15 ⁇ , but is not limited.
- FIG. 11 shows a state in which the ink chamber 131 set at the bonding position and the vibration film 32 are in contact with each other.
- the parting line of the vibrating membrane 32 moves upward by the distance ⁇ , only the resulting protrusion ⁇ ⁇ ⁇ becomes the bonding pressure, and the compression deformation is also this amount.
- the bonding pressure is applied by the clamping force of the mold, all the extra pressure generated by the clamping force of the mold is absorbed by the butting portion between the die and the core, and the force actually applied to the bonding surface during bonding is Appropriate pressure and no extra deformation.
- a pressure such as a pressure generated by an ejecting operation or a pressure generated by a piezo element or the like by the external pressure generating means 8
- bonding can be performed with an appropriate pressure.
- the obtained ultra-precision inkjet head can be fired to obtain a carbon molded body in the same manner as in Example 1.
- FIG. Outlet plate 1 Using a phenolic resin (manufactured by Kanebo Co., Ltd .: trade name Bellpearl S890) and the apparatus shown in FIG. Outlet plate 1 was made.
- the injection molding temperature was 120 ° C. Under an argon atmosphere, the temperature was raised to 1600 ° C at a heating rate of 50 ° C / min and baked at 1600 ° C for 2 hours. The cooling was performed at a cooling rate of 10 ° CZ. By this firing, the shrinkage of the micropump discharge plate 1 was 20% based on the value before firing.
- the bulk density after firing was 1.50, and the porosity was 0. Industrial applicability
- the method of the present invention can be easily and completely bonded because the bonding can be performed in the molding die. Also, there is an advantage that it is not necessary to prepare jigs and tools for bonding and no special equipment as bonding equipment is required. Furthermore, when bonding, the positioning of the molded object to be bonded is performed reliably, so compared to the conventional method of removing the molded body and then performing bonding, it is very much more effective for bonding precise and fine parts. This is an effective method. When a phenolic resin is used, it can be carbonized by further firing after bonding. Carbonized moldings have excellent chemical resistance, are biochemically stable, have very good heat resistance, and have great industrial value.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002506911A JP3909353B2 (ja) | 2000-07-03 | 2001-07-02 | 接着方法 |
AU2001267905A AU2001267905A1 (en) | 2000-07-03 | 2001-07-02 | Bonding method |
EP01945768A EP1310348A4 (en) | 2000-07-03 | 2001-07-02 | ASSEMBLY PROCESS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000201565 | 2000-07-03 | ||
JP2000-201565 | 2000-07-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002002297A1 true WO2002002297A1 (fr) | 2002-01-10 |
Family
ID=18699235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/005728 WO2002002297A1 (fr) | 2000-07-03 | 2001-07-02 | Procede d'assemblage |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030107159A1 (ja) |
EP (1) | EP1310348A4 (ja) |
JP (1) | JP3909353B2 (ja) |
AU (1) | AU2001267905A1 (ja) |
WO (1) | WO2002002297A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011083959A (ja) * | 2009-10-15 | 2011-04-28 | Ube Machinery Corporation Ltd | 中空体製品の成型用金型及び成型方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1468748A1 (en) * | 2003-04-15 | 2004-10-20 | Microflow Engineering SA | Low-cost liquid droplet spray device and nozzle body |
US20120061274A1 (en) * | 2010-09-14 | 2012-03-15 | Tyco Healthcare Group Lp | Hardpack Needle Package Laser Heat Seal |
ITUB20151845A1 (it) * | 2015-07-02 | 2017-01-02 | Tommaso Pardini | procedimento per la realizzazione di corpi in materiale plastico |
Citations (5)
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US4803021A (en) * | 1986-02-14 | 1989-02-07 | Amoco Corporation | Ultraviolet laser treating of molded surfaces |
JPH0716945A (ja) * | 1993-06-30 | 1995-01-20 | Japan Steel Works Ltd:The | 中空体製品の成形方法および成形用金型 |
JP2614923B2 (ja) * | 1989-12-26 | 1997-05-28 | 宇部興産株式会社 | ポリフェニレンサルファイド成形品の接着方法 |
US5747631A (en) * | 1993-08-11 | 1998-05-05 | Unitika Ltd. | Precursor of amorphous carbon molded article |
JPH10166449A (ja) * | 1996-12-09 | 1998-06-23 | Nissan Motor Co Ltd | 樹脂成形品の溶着接合装置および同溶着接合方法 |
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GB1351760A (en) * | 1970-11-13 | 1974-05-01 | Exxon Research Engineering Co | Process and apparatus for producing hollow articles |
DE2320299A1 (de) * | 1973-04-21 | 1974-11-07 | Schildkroet Spielwaren | Verfahren und vorrichtung zum herstellen von tischtennisbaellen |
IT1219120B (it) * | 1988-03-18 | 1990-05-03 | Dario Orsini | Procedimento di stampaggio ad iniezione di manufatti cavi di materiale polimerico per il contenimento ed il convogliamento a tenuta di fluidi e manufatti ottenuti con detto procedimento |
US4904326A (en) * | 1988-09-01 | 1990-02-27 | Mitsubishi Pencil Co., Ltd. | Process of making a hollow structure of carbon material |
JPH02102012A (ja) * | 1988-10-11 | 1990-04-13 | Sony Corp | 部品成形組立装置 |
JP3088779B2 (ja) * | 1991-05-24 | 2000-09-18 | 古河電気工業株式会社 | 光コネクタ用フェルールの成形金型 |
JP3304832B2 (ja) * | 1997-07-29 | 2002-07-22 | 東芝機械株式会社 | 中空成形品の多段成形方法および射出成形機 |
US6074510A (en) * | 1997-08-21 | 2000-06-13 | Hitachi Koki Co., Ltd. | Method for adhering together members molded from synthetic resin |
JPH11198183A (ja) * | 1998-01-12 | 1999-07-27 | Nissan Motor Co Ltd | スタック成形方法および装置 |
-
2001
- 2001-07-02 AU AU2001267905A patent/AU2001267905A1/en not_active Abandoned
- 2001-07-02 WO PCT/JP2001/005728 patent/WO2002002297A1/ja active Search and Examination
- 2001-07-02 EP EP01945768A patent/EP1310348A4/en not_active Withdrawn
- 2001-07-02 US US10/332,025 patent/US20030107159A1/en not_active Abandoned
- 2001-07-02 JP JP2002506911A patent/JP3909353B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US4803021A (en) * | 1986-02-14 | 1989-02-07 | Amoco Corporation | Ultraviolet laser treating of molded surfaces |
JP2614923B2 (ja) * | 1989-12-26 | 1997-05-28 | 宇部興産株式会社 | ポリフェニレンサルファイド成形品の接着方法 |
JPH0716945A (ja) * | 1993-06-30 | 1995-01-20 | Japan Steel Works Ltd:The | 中空体製品の成形方法および成形用金型 |
US5747631A (en) * | 1993-08-11 | 1998-05-05 | Unitika Ltd. | Precursor of amorphous carbon molded article |
JPH10166449A (ja) * | 1996-12-09 | 1998-06-23 | Nissan Motor Co Ltd | 樹脂成形品の溶着接合装置および同溶着接合方法 |
Non-Patent Citations (1)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011083959A (ja) * | 2009-10-15 | 2011-04-28 | Ube Machinery Corporation Ltd | 中空体製品の成型用金型及び成型方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3909353B2 (ja) | 2007-04-25 |
EP1310348A1 (en) | 2003-05-14 |
EP1310348A4 (en) | 2006-04-12 |
US20030107159A1 (en) | 2003-06-12 |
AU2001267905A1 (en) | 2002-01-14 |
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