WO2001097281A3 - Verfahren zur bearbeitung eines wafers - Google Patents
Verfahren zur bearbeitung eines wafers Download PDFInfo
- Publication number
- WO2001097281A3 WO2001097281A3 PCT/DE2001/002150 DE0102150W WO0197281A3 WO 2001097281 A3 WO2001097281 A3 WO 2001097281A3 DE 0102150 W DE0102150 W DE 0102150W WO 0197281 A3 WO0197281 A3 WO 0197281A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- processing
- supporting
- joining layer
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zur Bearbeitung eines scheibenförmigen Wafers (1) bei welchem unter Zwischenlagerung einer Schutzschicht (4) auf einen Wafer (1) ein Träger-Wafer (2) aufgebracht wird. Der Träger-Wafer (2) wird mit dem Wafer (1) mittels einer Verbindungsschicht (5) lösbar verbunden. An der freiliegenden Scheibenseite des Wafers (1) werden Bearbeitungsschritte durchgeführt, wonach der Träger-Wafer (2) durch Entfernen der Verbindungsschicht (5) vom Wafer (1) abgelöst wird.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000129035 DE10029035C1 (de) | 2000-06-13 | 2000-06-13 | Verfahren zur Bearbeitung eines Wafers |
DE10029035.3 | 2000-06-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001097281A2 WO2001097281A2 (de) | 2001-12-20 |
WO2001097281A3 true WO2001097281A3 (de) | 2002-04-11 |
Family
ID=7645529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/002150 WO2001097281A2 (de) | 2000-06-13 | 2001-06-10 | Verfahren zur bearbeitung eines wafers |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10029035C1 (de) |
WO (1) | WO2001097281A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10156465C1 (de) * | 2001-11-16 | 2003-07-10 | Infineon Technologies Ag | Waferanordnung und Verfahren zur Herstellung einer Bondverbindung |
DE10232914B4 (de) * | 2002-07-19 | 2004-11-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wiederverwendbarer Trägerwafer und Verfahren zur Herstellung desselben |
DE10238601A1 (de) * | 2002-08-22 | 2004-03-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Handhabungswafer zur Handhabung von Substraten |
US9111982B2 (en) | 2012-04-25 | 2015-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer assembly with carrier wafer |
DE102012107899B4 (de) * | 2012-04-25 | 2014-07-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Waferanordnung mit Trägerwafer und Herstellungsverfahren dafür |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3632074A (en) * | 1967-10-09 | 1972-01-04 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
AT324435B (de) * | 1968-10-28 | 1975-08-25 | Joseph Lucas Ind | Verfahren zur herstellung von halbleiterbauelementen |
US3947303A (en) * | 1974-07-30 | 1976-03-30 | Semikron, Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Method for producing a surface stabilizing protective layer in semiconductor devices |
US4023997A (en) * | 1967-10-09 | 1977-05-17 | Western Electric Company, Inc. | Method of placing an oriented array of devices on a releasable mounting |
EP0325704A2 (de) * | 1988-01-27 | 1989-08-02 | General Instrument Corporation | Prozess zur gleichzeitigen Herstellung einer Mehrzahl von Halbleiterbauelementen aus einer einzigen Scheibe |
EP0844648A1 (de) * | 1996-06-07 | 1998-05-27 | Rohm Co., Ltd. | Halbleiterbaustein und verfahren zu dessen herstellung |
EP0977240A1 (de) * | 1998-07-30 | 2000-02-02 | IMEC vzw | System, Verfahren und Vorrichtung Zur Bearbeitung von Halbleitern |
FR2792440A1 (fr) * | 1999-04-19 | 2000-10-20 | Schlumberger Systems & Service | Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3524301A1 (de) * | 1985-07-06 | 1987-01-15 | Semikron Gleichrichterbau | Verfahren zum herstellen von halbleiterelementen |
-
2000
- 2000-06-13 DE DE2000129035 patent/DE10029035C1/de not_active Expired - Fee Related
-
2001
- 2001-06-10 WO PCT/DE2001/002150 patent/WO2001097281A2/de active Search and Examination
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3632074A (en) * | 1967-10-09 | 1972-01-04 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
US4023997A (en) * | 1967-10-09 | 1977-05-17 | Western Electric Company, Inc. | Method of placing an oriented array of devices on a releasable mounting |
AT324435B (de) * | 1968-10-28 | 1975-08-25 | Joseph Lucas Ind | Verfahren zur herstellung von halbleiterbauelementen |
US3947303A (en) * | 1974-07-30 | 1976-03-30 | Semikron, Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Method for producing a surface stabilizing protective layer in semiconductor devices |
EP0325704A2 (de) * | 1988-01-27 | 1989-08-02 | General Instrument Corporation | Prozess zur gleichzeitigen Herstellung einer Mehrzahl von Halbleiterbauelementen aus einer einzigen Scheibe |
EP0844648A1 (de) * | 1996-06-07 | 1998-05-27 | Rohm Co., Ltd. | Halbleiterbaustein und verfahren zu dessen herstellung |
EP0977240A1 (de) * | 1998-07-30 | 2000-02-02 | IMEC vzw | System, Verfahren und Vorrichtung Zur Bearbeitung von Halbleitern |
FR2792440A1 (fr) * | 1999-04-19 | 2000-10-20 | Schlumberger Systems & Service | Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire |
Also Published As
Publication number | Publication date |
---|---|
DE10029035C1 (de) | 2002-02-28 |
WO2001097281A2 (de) | 2001-12-20 |
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