WO2001069989A1 - Packaging structure and method - Google Patents
Packaging structure and method Download PDFInfo
- Publication number
- WO2001069989A1 WO2001069989A1 PCT/US2001/007579 US0107579W WO0169989A1 WO 2001069989 A1 WO2001069989 A1 WO 2001069989A1 US 0107579 W US0107579 W US 0107579W WO 0169989 A1 WO0169989 A1 WO 0169989A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bumps
- chip
- substrate
- interconnect points
- alloy
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001566605A JP4958363B2 (en) | 2000-03-10 | 2001-03-09 | Packaging structure and method |
EP01916518A EP1264520A4 (en) | 2000-03-10 | 2001-03-09 | Packaging structure and method |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US18856800P | 2000-03-10 | 2000-03-10 | |
US60/188,568 | 2000-03-10 | ||
US09/802,375 US20020014702A1 (en) | 2000-03-10 | 2001-03-09 | Packaging structure and method |
US09/802,375 | 2001-03-09 |
Publications (1)
Publication Number | Publication Date |
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WO2001069989A1 true WO2001069989A1 (en) | 2001-09-20 |
Family
ID=26884224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2001/007579 WO2001069989A1 (en) | 2000-03-10 | 2001-03-09 | Packaging structure and method |
Country Status (6)
Country | Link |
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US (5) | US20020014702A1 (en) |
EP (1) | EP1264520A4 (en) |
JP (1) | JP4958363B2 (en) |
KR (1) | KR100865424B1 (en) |
TW (1) | TW484215B (en) |
WO (1) | WO2001069989A1 (en) |
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Also Published As
Publication number | Publication date |
---|---|
US20120049357A1 (en) | 2012-03-01 |
US20020014702A1 (en) | 2002-02-07 |
EP1264520A1 (en) | 2002-12-11 |
US8119450B2 (en) | 2012-02-21 |
JP4958363B2 (en) | 2012-06-20 |
US20120217635A9 (en) | 2012-08-30 |
US9312150B2 (en) | 2016-04-12 |
US20090227072A1 (en) | 2009-09-10 |
TW484215B (en) | 2002-04-21 |
KR20020089388A (en) | 2002-11-29 |
EP1264520A4 (en) | 2007-02-28 |
JP2003533870A (en) | 2003-11-11 |
US20060255474A1 (en) | 2006-11-16 |
US20120013005A1 (en) | 2012-01-19 |
US20130113093A9 (en) | 2013-05-09 |
KR100865424B1 (en) | 2008-10-24 |
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