CN113894398A - Method and device for improving NTC resistance welding reliability - Google Patents
Method and device for improving NTC resistance welding reliability Download PDFInfo
- Publication number
- CN113894398A CN113894398A CN202111241970.7A CN202111241970A CN113894398A CN 113894398 A CN113894398 A CN 113894398A CN 202111241970 A CN202111241970 A CN 202111241970A CN 113894398 A CN113894398 A CN 113894398A
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- metal layer
- electrode metal
- ntc
- ntc resistor
- glue
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- 238000003466 welding Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 89
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- 239000003292 glue Substances 0.000 claims description 44
- 238000003825 pressing Methods 0.000 claims description 10
- 230000004907 flux Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 229920004482 WACKER® Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 238000002844 melting Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 7
- 230000008569 process Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/30—Features relating to electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Details Of Resistors (AREA)
Abstract
The invention provides a method and a device for improving NTC resistance welding reliability, wherein the method comprises the following steps: respectively placing a solder on the first electrode metal layer and the second electrode metal layer; fixing the bottom middle part of the NTC resistor on an insulating layer between a first electrode metal layer and a second electrode metal layer; and the welding solder is used for welding and fixing two ends of the NTC resistor on the first electrode metal layer and the second electrode metal layer respectively. According to the invention, the bottom middle part of the NTC resistor is fixed on the insulating layer, so that the NTC resistor is not easy to slide and shift, when the two ends of the NTC resistor are subjected to temperature rise welding, the fixing force of the bottom middle part of the NTC resistor enables the NTC resistor not to tilt at one end due to inconsistent melting speeds of the solders at the two ends, and the welding quality of the NTC resistor welded on the insulating layer of the lining plate is effectively ensured.
Description
Technical Field
The invention relates to the technical field of NTC resistance welding, in particular to a method and a device for improving the reliability of NTC resistance welding.
Background
In an IGBT application system, one of the most critical parameters is the temperature of an IGBT chip, and in order to ensure the safe and reliable operation of the system, the junction temperature of the chip must be controlled within a certain temperature range. The temperature of the chip is directly measured by the integrated sensor on the chip, so that the effective area of the chip is occupied, and the current carrying capacity is reduced.
In practical applications, an NTC resistor (negative temperature coefficient thermistor) is provided in the IGBT module to monitor the temperature. When the temperature of the NTC resistance sensing module is increased, the resistance of the NTC resistance sensing module is reduced, and the junction temperature of the chip is judged by monitoring the resistance value change of the NTC resistance sensing module.
In the packaging process of the IGBT module, the NTC resistor is mounted on the module by a welding method, and the NTC resistor is drum-shaped, has small volume and is easy to slide, so that the position of the NTC resistor is deviated or lost in the welding process, and the junction temperature of a chip cannot be monitored.
The NTC resistor is limited by the tool, so that the NTC resistor is prevented from sliding, but the melting speeds of solders at two ends of the NTC resistor are inconsistent in the welding process, so that one end of the NTC resistor is tilted, a current loop cannot be formed, and the resistance value change of the NTC resistor cannot be detected.
Disclosure of Invention
The embodiment of the invention provides a method for improving the reliability of NTC resistance welding, and aims to solve the technical problems that in the NTC resistance welding process, the melting speeds of solders at two ends of an NTC resistor are inconsistent, so that one end of the NTC resistor is tilted, a current loop cannot be formed, and the change of the resistance value of the NTC resistor cannot be detected.
In a first aspect, the present invention provides a method for improving reliability of NTC resistance welding, comprising the steps of:
respectively placing a solder on the first electrode metal layer and the second electrode metal layer;
fixing the bottom middle part of the NTC resistor on an insulating layer between a first electrode metal layer and a second electrode metal layer;
and the welding solder is used for welding and fixing two ends of the NTC resistor on the first electrode metal layer and the second electrode metal layer respectively.
In some embodiments, the step of fixing the bottom middle portion of the NTC resistor on the insulating layer between the first electrode metal layer and the second electrode metal layer includes the following steps:
and fixing the bottom middle part of the NTC resistor on the insulating layer between the first electrode metal layer and the second electrode metal layer in an adhesive manner.
In some embodiments, the step of fixing the bottom middle part of the NTC resistor on the insulating layer between the first electrode metal layer and the second electrode metal layer by gluing specifically includes the following steps:
sucking and filling glue into the injector;
dripping the glue sucked and poured into the first electrode metal layer and the second electrode metal layer on the insulating layer through an injector;
and (3) fixing the glue at the middle part of the bottom of the NTC resistor on the dripped glue.
In some embodiments, the glue is WACKER 988 or Trust X-32-3439, and the dripping amount of the glue is 0.1 μ L-1.0 μ L.
In some embodiments, the step of "fixing the bottom middle part of the NTC resistor on the dropped glue" specifically includes the following steps:
and applying pressure to fix the middle glue of the bottom of the NTC resistor on the dripped glue.
In some embodiments, the step of pressing to fix the middle-bottom glue of the NTC resistor on the dropped glue includes the following steps:
the upper part of the NTC resistor is sucked through the suction nozzle, the two ends of the NTC resistor are respectively and correspondingly placed on the welding flux, and the pressing is carried out to ensure that the middle part of the bottom of the NTC resistor is contacted with the dripped glue.
In some embodiments, the solder is solder ribbon or solder paste.
In some embodiments, the solder is SAC305 or SnSb5 and has a thickness of 0.01mm to 0.3 mm.
In a second aspect, the invention provides a device applying the method for improving reliability of NTC resistance welding, which includes an electrode metal layer and an insulating layer, wherein the electrode metal layer includes a first electrode metal layer and a second electrode metal layer, and the first electrode metal layer and the second electrode metal layer are fixed above the insulating layer in a spaced connection manner.
In some embodiments, the insulating plate further comprises a heat conducting metal layer, and the heat conducting metal layer is welded and fixed below the insulating plate.
The technical scheme provided by the invention has the beneficial effects that:
according to the invention, the bottom middle part of the NTC resistor is fixed on the insulating layer, so that the NTC resistor is not easy to slide and shift, when the two ends of the NTC resistor are subjected to temperature rise welding, the fixing force of the bottom middle part of the NTC resistor enables the NTC resistor not to tilt at one end due to inconsistent melting speeds of the solders at the two ends, and the welding quality of the NTC resistor welded on the insulating layer of the lining plate is effectively ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for improving reliability of NTC resistance welding according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating an apparatus for improving reliability of NTC resistance welding according to an embodiment of the present invention;
fig. 3 is a schematic diagram of another application of the apparatus for improving NTC resistance welding reliability according to the embodiment of the present invention.
In the figure:
1. a heat-conducting metal layer; 2. an insulating layer; 31. a first electrode metal layer; 32. a second electrode metal layer; 4. a liner plate; 5. glue; 6. an injector; 7. welding flux; 8. an NTC resistor; 9. a suction nozzle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides a method for improving the welding reliability of an NTC resistor, which can solve the technical problem that the melting speed of solder 7 at two ends of the NTC resistor 8 is inconsistent in the welding process of the NTC resistor 8, so that one end of the NTC resistor 8 is tilted, a current loop cannot be formed, and the resistance value change of the NTC resistor 8 cannot be detected.
Referring to fig. 1, the present invention provides a method for improving reliability of NTC resistance welding, including the following steps:
s1, placing a solder 7 on the first electrode metal layer 31 and the second electrode metal layer 32 respectively;
s2, fixing the bottom middle part of the NTC resistor 8 on the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32;
s3, the solder 7 is used to solder and fix the two ends of the NTC resistor 8 to the first electrode metal layer 31 and the second electrode metal layer 32.
According to the invention, the bottom middle part of the NTC resistor 8 is fixed on the insulating layer 2, so that the NTC resistor is not easy to slide and shift, when the two ends of the NTC resistor 8 are subjected to heating welding, the fixing force of the bottom middle part of the NTC resistor 8 ensures that the NTC resistor 8 does not generate force due to inconsistent melting speeds of the solders 7 at the two ends, so that one end of the NTC resistor 8 is tilted, and the welding quality of the NTC resistor 8 welded on the insulating layer 2 of the lining plate 4 is effectively ensured.
In one embodiment, the step of fixing the bottom middle portion of the NTC resistor 8 on the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32 includes the following steps:
the bottom middle part of the NTC resistor 8 is fixed to the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32 by means of gluing.
The bottom middle part of the NTC resistor 8 is fixed on the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32 in an adhesion mode, the pulling force of the solidified glue 5 is utilized to provide enough pulling force for the two ends of the NTC resistor 8, in the temperature rising welding process, the two ends of the NTC resistor 8 cannot be melted at different speeds due to the two welding materials 7, so that one end of the NTC resistor 8 is tilted, the welding quality of the NTC resistor 8 welded on the insulating layer 2 of the lining plate 4 is affected, a current loop cannot be formed, and the resistance value change of the NTC resistor 8 cannot be detected. The fixing mode is simple and convenient to realize and is beneficial to large-scale popularization and application in processing. In a more specific embodiment, the step of fixing the bottom middle portion of the NTC resistor 8 on the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32 by gluing specifically includes the following steps:
the injector 6 sucks and pours the glue 5;
dripping the glue 5 sucked and poured into the glue into the insulating layer 2 between the first electrode metal layer 31 and the second electrode metal layer 32 through the injector 6;
and the bottom middle part of the NTC resistor 8 is glued and fixed on the dripped glue 5.
Inhale through syringe 6 and irritate glue 5 reentrant mode instils into, be favorable to accurate control glue 5's processing volume of instiling, be convenient for process accurate control.
In one embodiment, the glue 5 is WACKER 988 or Trust X-32-3439, and the dropping amount of the glue 5 is 0.1 μ L-1.0 μ L. The NTC resistor 8 is bonded to the substrate by a bonding method, and the bonding method is characterized in that the bonding method can form enough tension to prevent one end of the NTC resistor 8 from being tilted during welding to influence the formation of a current loop.
In an embodiment, the step of "gluing and fixing the bottom middle part of the NTC resistor 8 on the dripped glue 5" specifically includes the following steps:
and applying pressure to glue and fix the bottom middle part of the NTC resistor 8 on the dripped glue 5.
In an embodiment, the step of pressing to glue and fix the bottom middle part of the NTC resistor 8 on the dropped glue 5 includes the following steps:
sucking the upper part of the NTC resistor 8 through a suction nozzle 9, correspondingly placing two ends of the NTC resistor 8 on the welding materials 7 respectively, and applying pressure to enable the bottom middle part of the NTC resistor 8 to be in contact with the dripped glue 5. The NTC resistor 8 is adsorbed by the suction nozzle 9, so that the fine and precise operation control of the NTC resistor 8 is facilitated. Meanwhile, the middle part of the NTC resistor 8 is bonded and fixed on the insulating layer 2 by applying pressure, and the dripped glue 5 expands under the applied pressure to form a more stable and larger-area glue surface so as to form better pulling force on two ends of the NTC resistor 8.
In an embodiment, the solder 7 is a solder strip or a solder paste as long as it can perform the function of soldering and fixing the two ends of the NTC resistor 8 to the corresponding electrode metal layers.
In some embodiments, the material of the solder 7 is SAC305 or SnSb5, and the thickness of the solder 7 is 0.01mm-0.3mm to achieve sufficient soldering connection force and ensure soldering quality.
Based on the same inventive concept, please refer to fig. 2 and 3, the present invention provides a device applying the method for improving NTC resistance welding reliability as described above, including a backing plate 4, where the backing plate 4 provides a connection support platform for a chip and related electronic components and plays a role in heat conduction.
In an embodiment, the lining plate 4 includes an electrode metal layer and an insulating layer 2, the electrode metal layer includes a first electrode metal layer 31 and a second electrode metal layer 32, and the first electrode metal layer 31 and the second electrode metal layer 32 are fixed above the insulating layer 2 in a spaced connection.
In one embodiment, the insulating plate further comprises a heat-conducting metal layer 1, and the heat-conducting metal layer 1 is welded and fixed below the insulating plate. The heat-conducting metal layer 1 is used for conducting welding heat to the welding flux 7 through the heat-conducting metal layer 1 and heating and melting the welding flux 7; the heat conducting metal layer 1 is also used for dissipating heat generated during the operation of the chip.
In one embodiment, the heat conductive metal layer 1 is made of copper. The first electrode metal layer 31 and the second electrode metal are both made of copper.
In one embodiment, the gap between the first electrode metal layer 31 and the second electrode metal layer 32 is 0.05mm to 0.3 mm. The gap between the two provides a containing and curing space for the dripped glue 5.
In one embodiment, the material of the insulating layer 2 is aluminum oxide, aluminum nitride or silicon nitride.
In one embodiment, the insulating layer 2 and the electrode metal layer, and the insulating layer 2 and the heat conductive metal layer 1 are connected by DBC (direct copper bonding) or AMB (active metal brazing).
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method for improving reliability of NTC resistance welding is characterized by comprising the following steps:
respectively placing a solder on the first electrode metal layer and the second electrode metal layer;
fixing the bottom middle part of the NTC resistor on an insulating layer between a first electrode metal layer and a second electrode metal layer;
and the welding solder is used for welding and fixing two ends of the NTC resistor on the first electrode metal layer and the second electrode metal layer respectively.
2. The method for improving the reliability of NTC resistance welding according to claim 1, wherein the step of fixing the bottom middle portion of the NTC resistor on the insulating layer between the first electrode metal layer and the second electrode metal layer comprises the steps of:
and fixing the bottom middle part of the NTC resistor on the insulating layer between the first electrode metal layer and the second electrode metal layer in an adhesive manner.
3. The method for improving the reliability of NTC resistance welding according to claim 2, wherein the step of adhesively fixing the bottom middle portion of the NTC resistor to the insulating layer between the first electrode metal layer and the second electrode metal layer comprises the steps of:
sucking and filling glue into the injector;
dripping the glue sucked and poured into the first electrode metal layer and the second electrode metal layer on the insulating layer through an injector;
and (3) fixing the glue at the middle part of the bottom of the NTC resistor on the dripped glue.
4. The method for improving the reliability of NTC resistance welding according to claim 3, wherein the glue is WACKER 988 or Trust X-32-3439, and the dropping amount of the glue is 0.1 μ L-1.0 μ L.
5. The method for improving the reliability of the NTC resistance welding according to claim 3, wherein the step of fixing the bottom middle part glue of the NTC resistor on the dripped glue water comprises the following steps:
and applying pressure to fix the middle glue of the bottom of the NTC resistor on the dripped glue.
6. The method for improving the reliability of the NTC resistance welding according to claim 5, wherein the step of applying pressure to glue and fix the bottom middle part of the NTC resistor on the dripped glue water comprises the following steps:
the upper part of the NTC resistor is sucked through the suction nozzle, the two ends of the NTC resistor are respectively and correspondingly placed on the welding flux, and the pressing is carried out to ensure that the middle part of the bottom of the NTC resistor is contacted with the dripped glue.
7. The method for improving NTC resistance welding reliability of claim 1, wherein the solder is solder ribbon or solder paste.
8. The method for improving the reliability of NTC resistance welding of claim 7, wherein the material of the solder is SAC305 or SnSb5, and the thickness of the solder is 0.01mm-0.3 mm.
9. An apparatus for applying the method for improving reliability of NTC resistance welding according to any one of claims 1 to 5, comprising an electrode metal layer and an insulating layer, wherein the electrode metal layer comprises a first electrode metal layer and a second electrode metal layer, and the first electrode metal layer and the second electrode metal layer are connected and fixed on the insulating layer at intervals.
10. The apparatus of claim 9, further comprising a layer of thermally conductive metal, the soldering of the layer of thermally conductive metal being secured to the underside of the insulating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111241970.7A CN113894398A (en) | 2021-10-25 | 2021-10-25 | Method and device for improving NTC resistance welding reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111241970.7A CN113894398A (en) | 2021-10-25 | 2021-10-25 | Method and device for improving NTC resistance welding reliability |
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| Publication Number | Publication Date |
|---|---|
| CN113894398A true CN113894398A (en) | 2022-01-07 |
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| CN202111241970.7A Pending CN113894398A (en) | 2021-10-25 | 2021-10-25 | Method and device for improving NTC resistance welding reliability |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020014702A1 (en) * | 2000-03-10 | 2002-02-07 | Nazir Ahmad | Packaging structure and method |
| CN103201829A (en) * | 2010-11-04 | 2013-07-10 | 半导体元件工业有限责任公司 | Circuit device and method for manufacturing same |
| CN106057386A (en) * | 2016-07-07 | 2016-10-26 | 安徽晶格尔电子有限公司 | Ultrathin NTC (negative temperature coefficient) thermistor with single-side electrodes |
| CN206312676U (en) * | 2016-12-26 | 2017-07-07 | 山东航天正和电子有限公司 | The fixed metal foil resistor of extraction electrode spacing |
| CN110268220A (en) * | 2017-02-09 | 2019-09-20 | Ckd株式会社 | Base board checking device |
| US20200015396A1 (en) * | 2017-04-13 | 2020-01-09 | Ckd Corporation | Component mounting system and adhesive inspection device |
-
2021
- 2021-10-25 CN CN202111241970.7A patent/CN113894398A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020014702A1 (en) * | 2000-03-10 | 2002-02-07 | Nazir Ahmad | Packaging structure and method |
| CN103201829A (en) * | 2010-11-04 | 2013-07-10 | 半导体元件工业有限责任公司 | Circuit device and method for manufacturing same |
| CN106057386A (en) * | 2016-07-07 | 2016-10-26 | 安徽晶格尔电子有限公司 | Ultrathin NTC (negative temperature coefficient) thermistor with single-side electrodes |
| CN206312676U (en) * | 2016-12-26 | 2017-07-07 | 山东航天正和电子有限公司 | The fixed metal foil resistor of extraction electrode spacing |
| CN110268220A (en) * | 2017-02-09 | 2019-09-20 | Ckd株式会社 | Base board checking device |
| US20200015396A1 (en) * | 2017-04-13 | 2020-01-09 | Ckd Corporation | Component mounting system and adhesive inspection device |
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Application publication date: 20220107 |
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