WO2001059829A2 - Procede de montage de circuits integres sur un support conducteur et support en resultant - Google Patents
Procede de montage de circuits integres sur un support conducteur et support en resultant Download PDFInfo
- Publication number
- WO2001059829A2 WO2001059829A2 PCT/FR2001/000368 FR0100368W WO0159829A2 WO 2001059829 A2 WO2001059829 A2 WO 2001059829A2 FR 0100368 W FR0100368 W FR 0100368W WO 0159829 A2 WO0159829 A2 WO 0159829A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- frame
- conductors
- internal
- conductor
- support
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Definitions
- the invention relates to a method for mounting integrated circuits on a support, for example of the ribbon type, using the technology commonly called TAB (Tape Automated Bonding).
- TAB Tape Automated Bonding
- the integrated circuits form thin wafers of semiconductor material, for example made of silicon, of square or rectangular shape and provided with aluminum connection pads.
- the integrated circuits are generally mounted on one face of a ceramic, for example of alumina, which is crossed by copper conductors to lead to connection pads on the face of the ceramic opposite to that supporting the integrated circuits.
- the junction between the pads of an integrated circuit and the conductors passing through the ceramic is done by wire connection technology, called "Wire Bonding", making it possible to connect the connection pads of the integrated circuit to the connection pads of the supporting ceramic the integrated circuit and forming with the cover which protects the assembly forming a case of integrated circuits.
- the housing thus formed is then connected to a printed circuit by TAB technology by establishing electrical connections using a structure of conductors of a TAB support between the connection pads passing through the ceramic and the conductive tracks provided on the printed circuit board.
- TAB technology This type of technology is shown in connection with FIG. 4A and is also known from the applicant's patent EP 0 812237.
- thermocompression technique In general to weld the conductive tapes on the integrated circuit without additives, the thermocompression technique is used which makes it possible to diffuse the materials at a temperature of approximately 500 ° and to link them together.
- This soldering technology can be used on the printed circuit or on the integrated circuit box having connection balls (bumps) in gold, gilded copper or nickel-gold, equipped with its alumina ceramic. It is also used directly on integrated circuits but it may damage the circuits when there is excess heating.
- US Pat. No. 5,612,259 proposes a method for fixing TAB tape to a semiconductor package.
- This welding technology does not support a difficult environment. Indeed, experience has shown that this bonding technology subjected to operating temperatures of 175 ° for several years and vibrations generated failures in the operation of the material resulting from the breaks in the welds caused by the mass of the ceramic.
- connection pads require a predetermined fixed potential contact, usually ground, on their face opposite to the active face which carries the connection pads.
- An object of the invention is to be able to make the desired mass contact simply by TAB technology.
- Another object of the invention is to be able to form, by TAB technology, an assembly forming a housing of several integrated circuits.
- Another object of the invention is to provide a link of integrated circuits with the printed circuit supporting a difficult environment in which the circuits are subjected to temperatures of the order of 175 ° and to vibrations.
- the subject of the invention is a method of mounting at least one integrated circuit on a support, the integrated circuit having an active face provided with connection pads and an opposite face having an electrical contact surface, the method comprising the formation of '' a support including an insulating substrate forming at least one frame supporting a plurality of first conductors extending outside the frame, in at least one area internal to the frame designed to receive at least the integrated circuit, by internal ends having a dimension adapted to said studs, and the connection by welding of the internal ends of the first conductors to the studs of at least the integrated circuit, the method being characterized in that the formation of the support further comprises the formation of at least one second conductor extending outside the frame by an end internal to the frame having a larger area than those of the internal ends of the first conductors and in that the method further comprises the connection of the internal end of at least the second conductor to said contact surface of at least the integrated circuit and the folding of the internal end at least the second conductor to allow said connections of the internal ends of the first conductors and at
- the invention also relates to a support for at least one integrated circuit having an active face provided with connection pads and an opposite face having an electrical contact surface, the support comprising an insulating substrate forming at least one frame supporting first conductors extending outside the frame and inside it by internal ends connected to the studs of at least the integrated circuit, characterized in that the frame also supports at least one second conductor extending outside the frame by an internal end having a larger surface than those of the internal ends of the first conductors and connected to said contact surface of at least the integrated circuit.
- Another subject of the invention is a support for several integrated circuits each having an active face provided with connection pads, the support comprising an insulating substrate forming at least one frame supporting first conductors extending outside the frame and inside this by internal ends connected to the pads of at least the integrated circuit, characterized in that a part of the first conductors is disposed between at least two of the integrated circuits inside the frame so that their internal ends are divide into zones corresponding to the locations of the integrated circuits inside the frame.
- FIG. 1 shows a sectional view of the mounting tool for integrated circuits according to the method of the invention
- - Figure 2 shows a top view of the support used in the mounting method according to the invention
- - Figure 3 shows a sectional view of the integrated circuits assembled on the TAB tape according to the invention, itself assembled to a printed circuit
- FIG. 4A shows a sectional view of a semiconductor package of the prior art
- - Figure 4B shows a top view of the integrated circuits on the alumina ceramic once the cover removed in the housing of Figure 4A;
- FIG. 4C shows a schematic plan of the arrangement of integrated circuits constituting the housing of Figure 4A; and - Figure 5 shows an alternative embodiment of the connection of the external conductors of the support according to the invention to a printed circuit.
- integrated circuits for example made of silicon, (1 1, 1 1 a, 1 1 b, 1 1 c, 1 1 d, 1 1 e, 1 1f) are mounted on a ceramic (10) at the locations (a, b, c, d, e, f) shown in Figure 4C.
- This ceramic (10) is provided at its periphery with connection pads (15, 13), which pass through the thickness of the ceramic and are made of gold.
- the integrated circuits (1 1 a to 1 1 e, FIG. 4B) each have aluminum contact pads which are connected to the contact pads (15, 13) of the ceramic. (10) by wire bonding technology, as shown in FIG. 4B, by conductive wires (14, 12) for each integrated circuit (11 a to 11f).
- the integrated circuit package is then connected by its external connection pads (15, 13) to a spider formed in a ribbon, which is itself connected to a printed circuit (7).
- spider By spider, the skilled person includes a conventional TAB support whose copper conductors having a thickness of about 17 to 70 microns and a variable width as required are called spider legs and form ribbons. Part of these tapes is supported by an electrically insulating substrate made of a flexible organic material such as for example a polyimide.
- the ends of the conductive tapes located outside the frame are made free after cutting and removal of a peripheral frame used to position the assembly during the mounting operations.
- the free ends towards the inside of the conductors are represented in FIG. 4A by the reference (22i), the free ends on the outside by the reference (22e); between these two ends of the same conductor is formed the area (22) in which the conductor rests on the polyimide substrate (21) generally in the form of a frame.
- the conductors (22) are extended by a part which, at the start, is made integral with a second frame made of insulating substrate and which, after cutting, makes it possible to obtain the free external legs (22e) of the spider.
- the technology of the prior art poses the problems that we have seen previously and particularly when the housing consists of an alumina substrate (10) on which different integrated circuits provide different functionalities. In this case, the technology of the prior art is not directly applicable on integrated circuits because these can include honeycomb structures which are very fragile and would not resist soldering at temperatures of 500 °. .
- the box has six integrated circuits (11a to 11f) and the example taken to illustrate the invention uses a method of mounting of these integrated circuits using the TAB bumpless technique to withstand a difficult environment in temperature and vibration.
- the invention consists, as shown with the aid of FIGS. 1 to 3, of placing the integrated circuits (1 1 a to 11 f) on a support plate (6) provided with suction channels (61 to 64) intended to maintain in place by suction each integrated circuit (11a to 11f) during the soldering operation of the internal ends of the spider's conductors, ends which have the letter i at the end of their references.
- suction channels 61 to 64
- known means make it possible to ensure precise relative positioning of the spider and of the internal ends of its conductors with respect to the integrated circuits mounted on the plate.
- the outer ends, as shown in Figure 2 have the letter e in their references.
- the first letter following the reference number indicates the integrated circuit to which the reference relates and to which the referenced conductor of the spider is connected.
- Figures 1 and 3 show a sectional view respectively of the mounting tool for Figure 1 and the circuits assembled on the tape for Figure 3, along the cutting axis AA of Figure 2.
- Figure 2 shows a top view of the support constituting the spider once the peripheral strip of substrate supporting the conductors is cut so as to release the ends of the conductors constituting the external ends relative to the frame (21) of the substrate constituting the body of the spider .
- the ends which, at the start, are not free and are not external are represented in FIG. 2 and in the other figures with the reference e so as to make the reader understand that these, at the end mounting, are external and are connected to the conductive tracks (71, 72) of the printed circuit (7) of Figure 3.
- the substrate (21) is, as shown in Figure 2, divided into as many areas as integrated circuits elementary and comprises, for example, six zones in which the six integrated circuits will be successively implanted (11a- 11 f). In each of the respective zones, the internal free ends of the conductor structure (22) open towards the interior of the zone. Thus, in zone a, it can be seen that there is a first internal conductor (221 ai), a second internal conductor (222ai) and an internal area (223ai) for connection to the ground of the integrated circuit.
- Each of the inner ends is extended on the substrate (21) by parts of conductors bearing the respective references (221 a, 222a, 223a) and which extend outside the substrate (21) by respective outer ends (221 ae , 222ae, 223ae).
- the conductor (222ai) is also common to a conductor (222bi) coming from a zone b and which is extended by the conductor (222ab) to lead into zone b by the internal conductor (222bi).
- This common part is supported by a strip of substrate (212), which is L-shaped and delimits in the lower left corner of the frame a square surface area within which will be positioned the integrated circuit a.
- This strip (212) also makes it possible to support between the integrated circuits 11a and 11c a conductor (221c) which ends inwards by the end (221 ci) and outwards by the end (221 ce ).
- the inner end (221 ci) of this conductor is oriented in a direction perpendicular to the direction corresponding to the end (221 ce).
- the inner ends (222ai and 222bi) of the conductors are oriented perpendicular to the common outer end (222abe).
- the adjacent areas c and e are separated from the two adjacent areas d and f using a strip of insulating substrate (210) in the shape of a T, the central leg of which is connected, in the area adjacent to the integrated circuits 11c and 11 e, at the longitudinal side (21 L) of the frame (21) oriented downwards with respect to the figure orientation of the sheet and the horizontal bar is connected on its right to the vertical lateral side (21 LV) of the frame (21) when the latter is viewed in accordance with the orientation of the reference in the figure.
- the T-shaped insulating strip (210) thus delimits a closed quadrilateral in which the zone e is situated, an open quadrilateral in which the zone c is located and a large rectangle open on the side opening into the zone b and successively constituting the zones d and f.
- zone c two internal conductors (222ci, 223ci) open perpendicular to the lower longitudinal side and are extended on the substrate (21) by a single conductor (222c) to terminate outside the substrate by a single external conductor ( 222ce).
- a conductor (224ci) On the horizontal bar of the T opposite the longitudinal side (21 L) opens, perpendicular to this bar, a conductor (224ci), which is extended on this bar of the T on the central bar by a conductor (224c) which opens towards the outside by the free conductor (224ce).
- a first conductor (221 ei) emerges inside this zone and is extended on the substrate by the conductor (221 e) to finish outside by the conductor (221 ee).
- the interior conductors have a width at least 2 to 3 times smaller than the portion of conductor traversing the substrate or emerging outside the substrate, and constituting the external conductors.
- the only exception is the conductive pads (223ai, 223di, 223fi, 223ei) which open into the central parts of the respective zones (a, d, f, e,) and which make it possible to constitute the grounding contacts of the components. integrated circuits.
- a conductive pad (223ei) opens onto the substrate by the conductor (223e) and outside of it by the conductor (223ee).
- This conductive pad (223ei) is framed, on the one hand by the first internal conductor (221 ei), and on the other hand by a second internal conductor (222ei), which is arranged perpendicular to the right lateral side of the insulating frame (21 ).
- zone f is also constituted an internal conductive pad (223fi), which is connected to a conductor (223f) of the substrate which opens out through an external conductor (223fe) outside the substrate.
- the internal conductor (221 fi) opens perpendicular to the T bar (210) and extends onto the T bar connected to the right lateral side of the frame by a conductor (221 f), which opens outside the insulating frame (21) by an external conductor ( 221 fe).
- This conductive pad (223fi) is surrounded by a first internal conductor (221 fi) and by a second internal conductor (222fi), which opens perpendicular to the upper longitudinal side of the frame (21).
- This or these conductors (221 fi, 222fi) can initially be integral with the adjacent conductive pad and cut to make the pad independent of the adjacent conductors so as to allow the conductive pad to be folded.
- This second internal conductor (222fi) extends over the upper lateral side of the frame by a conductor (222f) and ends outside by the conductor (222fe).
- a range inside the zone d constituted by the conductor (223di) bypasses the second internal conductor (222di) and comes to open on the upper longitudinal side of the insulating frame (21) by a conductor (223d) which ends at the outside by the conductor (223de).
- the second internal contact (222di) is extended on the substrate by the conductor (222d) and outside of it by the conductor (222de).
- the first internal conductor (221 di) of the zone d is extended by the conductor (221 d) and ends with the conductor (221 de).
- the internal ends of the spider constituting the conductive areas (223ai, 223di, 223ei, 223fi) for connection to the ground are bent and the inner ends of the conductors forming narrow ends of dimension smaller than that of the external conductors and of the connection conductors between the exterior and the interior are connected, as shown in FIG. 1, to the aluminum connection pads (111 a) of the respective integrated circuit (11a-11f).
- the internal conductors (221 bi, 222bi) are connected to the aluminum studs (1 13b, 111 b) of the integrated circuit (11 b) and the connection pad (114b) of gold-coated aluminum formed on the integrated circuit (11 b) is connected by soldering thermosonic at the internal end (224bi) of the copper conductor (224b), the external end (224be) of which will then be connected, by thermocompression welding, to the conductive pad (71) of the printed circuit (7, FIG. 3) .
- the pads for connection to the ground of the integrated circuits (11 a, 11d, 11 e, 1 1f) are bent so as to be applied to the face of the integrated circuit which is opposite to the face comprising the connection pads of the internal conductors.
- These ranges (223ai, 223ei, 223fi and 223di) are electrically connected by an adhesive on the back of the semiconductor and make it possible to provide the connection to the ground of the integrated circuit.
- FIG. 5 represents an alternative embodiment of the connection of the external conductors to the conductive tracks (72, 71) of the printed circuit (7).
- This connection can be made by welding with a ball (8), as shown in this figure.
- This connection with ball (8) can be used to superimpose several spiders according to the invention, each being connected to several integrated circuits.
- a part (2) of the external frame (23) of the insulating substrate will be kept and this part of the frame (23) will be pierced with holes (230) of sufficient size to ensure electrical contact between the ball (8) and the end (223ae) of the respective conductor.
- the TAB tape must include the routing between the various integrated circuits and the conductive tracks provided on the printed circuit corresponding to the arrangement of the contacts on a final box.
- the assembly thus produced on a flexible tape makes it possible to keep, for the whole, dimensions corresponding to those of the ceramic casing originally provided, without this having the drawbacks mentioned above.
- the accessibility of the conductors makes it possible to test each of the circuits formed on the integrated circuits and at each circuit location. whose rear face must be connected, there is a connection pad which is cut and then folded, so as not to interfere with the transfer to the active face.
- the assembly is protected by embedding the connections and the unprotected parts of the conductors in a resin (30), as shown in FIG. 4A.
- the widths of the internal ends of the conductors are of the order of 50 microns and allow ILB (Inner Lead Bonding) fixation while the widths of the external ends allowing the OLB (Outer Lead Bonding) fixation are of the order of 130 microns, that is to say 2 to 3 times wider than the internal ends.
- the copper layer constituting the conductors has a thickness of 25 microns with a gold finish with a thickness of about 1 micron.
- the substrate (21) is made of polyimide and has a thickness of 50 microns.
- the welding points are made by applying the electrode transmitting thermosonic energy with a force of 60 grams for a time of 60 milliseconds for a displacement of 1 to 2 ⁇ m, and a power of 70 Volt-Amperes which allows to produce local heating of the order of 80 ° ensuring the connection between aluminum, gold and copper.
- the assembly is delivered in the form of a ribbon replacing a ceramic circuit and allows, for example, to perform a folding to provide circuits in the form of an accordion integrating the most diverse functions in a folded and overmolded manner, thus making it possible to associate microcontroller and memory functions or blocks of multiple memories together.
- the device in its simplest form allows placement as close as possible to the measurement points and associated amplifiers or in places requiring great compactness.
- the support tool (6) in the form of a plate can be made integral with the integrated circuits that it supports.
- the support tool is provided with openings or cutouts allowing the passage and placement of the conductors ending in the pads conductive (223ai, 223di, 223ei, 223fi) for grounding the respective components (11 a, 1 1d, 11 e, 11f).
- the assembly according to the invention can make it possible to assemble the components on a flexible insulating support which can be folded in the form of an accordion or sheaf with other flexible assemblies to make a 3D assembly using BGA technology ( Bail Grid Array).
- mounting integrated circuits on a flexible ribbon-type support comprises the following steps:
- a step of forming a spider consisting of an insulating frame supporting a plurality of conductors having ends internal to the frame and ends external to the frame;
- the method comprises a step of folding an internal conductor, the end of which defines a larger surface than that of the other internal conductors and a step, after removal of the plate, of connection of the range of this internal conductor. to the face of the integrated circuit which is opposite to the face provided with studs for connection with the other internal conductors.
- the steps of moving the weld head bring it into zones adjacent to two components.
- the internal ends of the conductors have a width two to three times less than the width of the conductors supported by the insulating frame or external ends.
- the external ends after having been cut to be released from a second frame surrounding the first frame are connected by thermocompression welding to the conductive tracks of a printed circuit.
- the ultrasonic welding of the ends of the internal conductors of gilded copper is carried out metal on metal by soldering this end of gilded copper with the connection pads of aluminum formed directly on the integrated circuits.
- the semiconductor components are mounted on a plate made integral with the integrated circuits, the plate being provided with openings or cutouts allowing the passage and the positioning of the conductors ending in the conductive pads (223ai, 223di , 223ei, 223fi) to earth the respective components (1 1 a, 1 1 d, 1 1 e, 1 1f).
- the support comprises extensions of the insulating material forming the frame of the spider, these extensions extending towards the inside of the frame and having the purpose of supporting the internal conductor (s) passing in an area adjacent to the minus two semiconductor components.
- the extensions can be in the form of L and / or T and / or cross.
- the invention therefore relates to a method of mounting at least one integrated circuit (1 1 a-1 1f) on a support, the integrated circuit having an active face provided with connection pads and a opposite face having an electrical contact surface, the method comprising forming a support including an insulating substrate (21) forming at least one frame supporting a plurality of first conductors (22) extending out of the frame, in at least one area internal to the frame designed to receive at least the integrated circuit, by internal ends (221 ai-221fi) having a dimension adapted to said studs, and the connection by welding the ends internal of the first conductors to the pads of at least the integrated circuit.
- the formation of the support further comprises the formation of at least a second conductor extending out of the frame by an end internal to the frame having a surface (223ai, 223di, 223ei, 223fi) larger than that of the ends internal of the first conductors and in that the method further comprises connecting the internal end of at least the second conductor to said contact surface of at least the integrated circuit and bending the internal end of at least minus the second conductor to allow said connections of the internal ends of the first conductors and at least the second conductor.
- the first conductors and at least the second conductor are formed from a conductive layer.
- the internal end of at least the second conductor is integral with the internal end of at least one of the first conductors and the internal end at least the second conductor is detached from the internal end of at least one of the first conductors to allow folding of the internal end of at least the second conductor.
- the support being intended for mounting several integrated circuits inside the frame
- the method can also comprise the arrangement of a part of the first conductors so that their internal ends are distributed in zones (af) corresponding to the locations of the circuits. integrated inside the frame and the arrangement of at least the second conductor so that the internal end corresponds to a zone (af) provided for one of said integrated circuits in the frame.
- the invention also relates to a support for at least one integrated circuit (1 1 a-1 1f) having an active face provided with connection pads and an opposite face having an electrical contact surface, the support comprising an insulating substrate.
- the frame further supports at least one second conductor extending outside the frame by an internal end having a surface (223ai, 223di, 223ei, 223fi) larger than that of the internal ends of the first conductors and connected to said contact surface of at least the integrated circuit.
- the first conductors when several integrated circuits are mounted inside the frame, a portion of the first conductors is disposed between at least two of the integrated circuits inside the frame so that their internal ends are distributed in corresponding zones (af) at the locations of the integrated circuits inside the frame and at least the second conductor is arranged so that its internal end corresponds to a zone (af) provided for one of said integrated circuits in the frame.
- the internal end of at least the second conductor comprises a tab which is wider than the internal end of the first conductors and ending in an even wider contact area provided for connection to the contact surface of an integrated circuit.
- the conductors carried by the frame have external ends intended for the external connection of the support on a plate, to a printed circuit for example.
- the invention also relates to a support for several integrated circuits (1 1 a-1 1f) each having an active face provided with connection pads, the support comprising an insulating substrate (21) forming at least one frame supporting first conductors (22) extending out of the frame and inside of it by internal ends (221ai-221fi) connected to the pads of at least the integrated circuit.
- a portion of the first conductors is disposed between at least two of the integrated circuits inside the frame so that their internal ends are distributed in zones (af) corresponding to the locations of the integrated circuits inside the frame.
- Part of the inner ends of the first conductors can extend inside the frame, being supported by at least one extension (210, 212) of the substrate inside the frame.
- the inner ends of the first conductors may have a width two to three times greater than the width of the parts of these conductors which are supported by the frame.
- the internal ends of the first conductors can be connected to the studs by ultrasonic welding.
- the conductors carried by the frame may have external ends intended for the external connection of the support, to a printed circuit for example.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR00/01662 | 2000-02-10 | ||
FR0001662A FR2805083A1 (fr) | 2000-02-10 | 2000-02-10 | Procede de montage et de fabrication de circuits integres sur un support et support en resultant |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001059829A2 true WO2001059829A2 (fr) | 2001-08-16 |
WO2001059829A3 WO2001059829A3 (fr) | 2002-03-28 |
Family
ID=8846857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2001/000368 WO2001059829A2 (fr) | 2000-02-10 | 2001-02-08 | Procede de montage de circuits integres sur un support conducteur et support en resultant |
Country Status (2)
Country | Link |
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FR (1) | FR2805083A1 (fr) |
WO (1) | WO2001059829A2 (fr) |
Citations (8)
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EP0207852A1 (fr) * | 1985-06-26 | 1987-01-07 | Bull S.A. | Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques |
JPH01310589A (ja) * | 1988-06-08 | 1989-12-14 | Seiko Instr Inc | 積重基板の表裏導通構造 |
US4917286A (en) * | 1987-05-20 | 1990-04-17 | Hewlett-Packard Company | Bonding method for bumpless beam lead tape |
EP0498446A2 (fr) * | 1991-02-08 | 1992-08-12 | Kabushiki Kaisha Toshiba | Dispositif encapsulé à plusieurs puces semi-conductrices et procédé pour sa fabrication |
US5612259A (en) * | 1993-07-29 | 1997-03-18 | Kabushiki Kaisha Toshiba | Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame |
FR2749974A1 (fr) * | 1996-06-13 | 1997-12-19 | Bull Sa | Procede de montage d'un circuit integre sur un support et support en resultant |
US5917242A (en) * | 1996-05-20 | 1999-06-29 | Micron Technology, Inc. | Combination of semiconductor interconnect |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5702527A (en) * | 1995-02-22 | 1997-12-30 | Minnesota Mining And Manufacturing Company | Restricted flow die |
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2000
- 2000-02-10 FR FR0001662A patent/FR2805083A1/fr not_active Withdrawn
-
2001
- 2001-02-08 WO PCT/FR2001/000368 patent/WO2001059829A2/fr active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2805083A1 (fr) | 2001-08-17 |
WO2001059829A3 (fr) | 2002-03-28 |
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